WO2007136230A1

WO2007136230A1 - Plating type optical filter and the method thereof

Info

Publication number: WO2007136230A1
Application number: PCT/KR2007/002513
Authority: WO
Inventors: Dong-Hyeong Lee; Young-Su Kim; Dug-Jo Kim; Sung-Jin Ryu; Eun-Gi Kim
Original assignee: Lg Micron Ltd.
Priority date: 2006-05-23
Filing date: 2007-05-23
Publication date: 2007-11-29
Also published as: KR20070113161A

Abstract

This invention relates to a plating type optical filter and a method of manufacturing the same, and in particular, to a plating type optical filter, manufactured using a plating process to thus be thin and highly light-transmissive, and to a method of manufacturing the same. The plating type optical filter includes a transparent substrate, a metal seed layer formed on the transparent substrate, and an electroplating layer formed on the metal seed layer. In this invention, because no adhesive is used, conventional problems caused by the use of an adhesive, including low transparency and poor light transmission of an optical filter, are solved. The plating process is applied to thus prevent the unnecessary waste of material, which is usual in a lamination process, therefore improving product performance and realizing cost reduction, resulting in increased product competitiveness.

Description

PLATING TYPE OPTICAL FILTER AND THE METHOD

THEREOF

Technical Field

[1] The present invention relates to a plating type optical filter and a method of manufacturing the same, and more particularly, to a plating type optical filter, which is manufactured using a plating process to thus be relatively thin and highly light- transmissive, and to a method of manufacturing the same. Background Art

[2] A quick glance reveals that people live daily with the use of displays, including TV sets, mobile phones, notebook computers, monitors, and telematics devices for vehicles.

[3] Among such displays, a plasma display panel (hereinafter referred to as "PDP" and a liquid crystal display (hereinafter referred to as "LCD" are receiving attention as next- generation displays that will dominate the world's display markets.

[4] However, most displays emit electromagnetic waves, which are harmful to the human body and cause malfunctions of various electronic apparatuses. In particular, in the case of the PDP, because it realizes an image using high voltage and high frequencies applied for plasma discharge, it emits greater quantities of electromagnetic waves than conventional CRTs or LCDs.

[5] Thus, in such a PDP, an optical filter is mainly used, and has various functions including an electromagnetic wave blocking function, a near-infrared ray blocking function, a color correction function, and an anti-reflecting function. Depending on the extent to which the electromagnetic waves are blocked, a Cu mesh film or a conductive film is used. For a household PDP, a Cu mesh film is particularly useful.

[6] FIGS. 1 and 2 are a perspective view illustrating a conventional optical filter, which is manufactured using a lamination process, and a view illustrating the manufacturing process thereof, respectively.

[7] As illustrated in FIGS. 1 and 2, the conventional optical filter manufactured using a lamination process includes a piece of polyethylene terephthalate (PET) 50, an adhesive 60 applied on the PET 50, and electrolytic copper foil 70 adhered to the PET 50 using the adhesive 60.

[8] The electrolytic copper foil 70 functions to block electromagnetic waves, and the

PET 50 is responsible for supporting the electrolytic copper foil. The electrolytic copper foil 70 and the PET 50 are attached to each other using the adhesive 60 and are then laminated in a lamination process. Here, the adhesive 60 is applied on the upper surface of the PET 50 using a coating roller 30, and the electrolytic copper foil 70 is adhered and then laminated on the PET 50 to a thickness of about 10 D using lamination rollers 40. Thereafter, photolithography and chemical etching are conducted, thereby obtaining an optical filter that meets requirements.

[9] However, the adhesive 60 used in the conventional optical filter increases the defect rate of the optical filter, unnecessarily wasting materials. Further, the adhesive 60 remaining after the photolithography and chemical etching causes haze variation in different positions, undesirably creating problems of decreasing transparency, light transmission due to light scattering, and transmission uniformity.

[10] In order to solve the problems attributable to the use of the adhesive, various processes, including an additional process for decreasing haze or for equalizing a refractive index, are further conducted, undesirably causing the other problems to increase the production time and the production costs.

[11] Further, the lamination process used in the manufacture of the conventional optical filter requires that the electrolytic copper foil 70 itself have a predetermined tensile strength. Thereby, the electrolytic copper foil 70 is provided to be much thicker than a functionally required thickness, undesirably increasing material costs.

[12] Furthermore, the lamination process used in the manufacture of the conventional optical filter entails initial loss and final loss (a piece of material about 50-100 m long is wasted) due to the process characteristics. Such loss influences the total cost, which causes the price of the product to increase, undesirably resulting in decreased product competitiveness.

[13] Therefore, the development of an optical filter for blocking electromagnetic waves, which prevents the waste of materials, thus generating economic benefits, and which does not decrease light transmission, is required now. Disclosure of Invention Technical Problem

[14] Accordingly, the present invention has been made keeping in mind the above problems occurring in the related art, and an object of the present invention is to provide a plating type optical filter, which excludes the use of an adhesive, resulting in high light transmission, and a method of manufacturing the same.

[15] Another object of the present invention is to provide a plating type optical filter, in which a lamination process, which causes materials to be wasted, is replaced with a plating process, thereby decreasing material costs, resulting in high economic benefits of products, and a method of manufacturing the same.

[16] A further object of the present invention is to provide a display, which includes the plating type optical filter having high light transmission and high economic benefits of products. Technical Solution

[17] According to an aspect of the present invention, in order to achieve the above objects, the invention provides a plating type optical filter, including a transparent substrate; a metal seed layer formed on the upper surface of the transparent substrate; and an electroplating layer formed on the upper surface of the metal seed layer.

[18] The transparent substrate is preferably a film or transparent glass.

[19] As such, between the transparent substrate and the metal seed layer, a first functional combination layer having a function of increasing adhesive performance between the transparent substrate and the metal seed layer and improving contrast is preferably further included.

[20] Here, the metal seed layer may have a thickness of 0.01 D to 2 D.

[21] The metal seed layer may be formed of copper (Cu).

[22] The metal seed layer may be formed using any one process selected from among vacuum deposition, sputtering, and electroless plating.

[23] The electroplating layer is preferably formed in a predetermined pattern shape.

[24] This pattern shape may be a lattice mesh shape.

[25] The electroplating layer preferably has surface roughness of 0.015 D to 0.5 D.

[26] As such, on the upper surface of the electroplating layer, which is rough, a second functional combination layer having a function of increasing adhesive performance and improving contrast may be formed. Such a second functional combination layer functions to prevent the generation of reflective light from the electroplating layer by light incident from outside, thus improving the contrast of the product and increasing adhesive performance.

[27] The first functional combination layer or the second functional combination layer may be formed using at least one selected from among nickel (Ni), copper (Cu), cobalt (Co), cupper II oxide (CuO), iron (Fe), nickel-phosphorus (Ni-P), phosphorus (P), tungsten (W), and chromium (Cr).

[28] Here, the first functional combination layer or the second functional combination layer may include nickel (Ni) and chromium (Cr), nickel (Ni) preferably being used in an amount of 6.0 to 9.8 mass%, and chromium (Cr) preferably being used in an amount of 0.2 to 4.0 mass%.

[29] As another example, the first functional combination layer or the second functional combination layer may include nickel (Ni) and copper (Cu), nickel (Ni) may be used in an amount of 5 to 8 mass%, and copper (Cu) may be used in an amount of 2 to 5 mass%.

[30] According to another aspect of the present invention, the invention provides a method of manufacturing a plating type optical filter, including a transparent substrate surface-treating step of treating the surface of a transparent substrate; a metal seed layer forming step of forming a metal seed layer on the upper surface of the transparent substrate; and an electroplating layer forming step of forming an electroplating layer on the upper surface of the metal seed layer.

[31] As such, between the transparent substrate surface-treating step and the metal seed layer forming step, a first functional combination layer forming step of forming a first functional combination layer having a function of increasing adhesive performance between the transparent substrate and the metal seed layer or improving contrast is preferably further included.

[32] After the electroplating layer forming step, a surface roughness imparting step of imparting surface roughness to the upper surface of the electroplating layer and an electroplating layer pattering step of patterning the electroplating layer in a predetermined pattern shape are preferably further included.

[33] As such, the surface roughness imparting step may be conducted using a surface fine etching process to impart surface roughness of 0.015 D to 0.5 D to the upper surface of the electroplating layer.

[34] In the surface fine etching process, any one chemical selected from among nitric acids, sulfuric acids, hydrochloric acids, and copper sulfates may be used.

[35] The transparent substrate surface-treating step may be conducted using ion beams.

[36] The metal seed layer forming step may be conducted using any one process selected from among vacuum deposition, sputtering, and electroless plating, to thus form a metal seed layer 0.01 D to 2 D thick.

[37] The above objects and other advantages of the present invention will be more clearly understood from the following detailed description, taken in conjunction with the accompanying drawings.

Advantageous Effects

[38] According to the plating type optical filter of the present invention and the manufacturing method thereof, the optical filter is manufactured using a plating process instead of an adhesive, and thus all transparency and light transmission compensating processes (e.g., refractive index equalizing), typically conducted in the manufacture of a conventional optical filter using an adhesive may be excluded, thereby making it possible to simplify the manufacturing process. Further, according to the prevent invention, it is possible to provide an optical filter having greatly increased transparency and light transmission compared to conventional optical filters, ultimately realizing technical effects favorable to the improvement of product techniques.

[39] In addition, according to the plating type optical filter of the present invention and the manufacturing method thereof, a lamination process, which is conventionally conducted, is replaced with a plating process, and thereby the thickness of an electroplating layer is decreased, and furthermore, material loss (wherein a piece of material about 50-100 m long is wasted), which occurred in the initial or final step of the lamination process, may be reduced, therefore gaining effects able to improve product price competitiveness.

[40] In addition, according to the plating type optical filter of the present invention and the manufacturing method thereof, in place of a blackening treatment process, which is conventionally additionally conducted to improve contrast, a first functional combination layer or a second functional combination layer is applied to thus exhibit further improved contrast and adhesive performance. Thereby, the time period and cost required for such an additional blackening treatment process may be decreased, consequently simplifying the manufacturing process and increasing product competitiveness. Brief Description of the Drawings

[41] FIG. 1 is a sectional view illustrating a conventional optical filter, which is manufactured using a lamination process;

[42] FIG. 2 is a view illustrating the process of manufacturing the optical filter of FIG. 1 ;

[43] FIG. 3 is a sectional view illustrating a plating type optical filter according to the present invention;

[44] FIG. 4 is views sequentially illustrating the process of manufacturing the optical filter of FIG. 3;

[45] FIG. 5 is a flowchart illustrating the process of manufacturing the plating type optical filter of the present invention; and

[46] FIG. 6 is magnified photographs illustrating the results of light transmission of the conventional optical filter, manufactured using a lamination process, and the plating type optical filter according to the present invention.

[47] <Description of the Reference Numerals in the Drawings>

[48] 100: plating type optical filter

[49] 110: transparent substrate

[50] 120: first functional combination layer

[51] 130: metal seed layer

[52] 140: electroplating layer

Mode for the Invention

[53] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. [54] In the drawings, FIG. 3 is a sectional view illustrating a plating type optical filter according to the present invention, FIG. 4 is views sequentially illustrating the process of manufacturing the optical filter of FIG. 3, FIG. 5 is a flowchart illustrating the process of manufacturing the plating type optical filter of the present invention, and FIG. 6 is magnified photographs illustrating the light transmission of the conventional optical filter, manufactured using a lamination process, and the plating type optical filter according to the present invention.

[55] Referring to FIGS. 3 and 4, the plating type optical filter 100 according to the preferred embodiment of the present invention includes a transparent substrate 110, a metal seed layer 130 formed on the upper surface of the transparent substrate 110, a first functional combination layer 120 formed between the transparent substrate 110 and the metal seed layer 130 to provide a function of increasing the strength of adhesion therebetween or improving contrast, and an electroplating layer 140 formed to have a predetermined pattern on the metal seed layer 130.

[56] The transparent substrate 110 is a film or a transparent glass member which functions to support the electroplating layer 140, and may be formed using a transparent member having good visible light transmission in terms of the end uses thereof. In the present invention, polyethylene terephthalate (PET) is used, but polyester, such as polyethylene naphthalate, polyolefin, such as ethylvinylacetate, polypropylene and polystyrene, polyvinyl, such as polyvinyl chloride and polyvinylidene chloride, polycarbonate, or acrylic resin may be used. In addition, any other material may be used without limitation as long as it is typically used in the art.

[57] The metal seed layer 130 is a member formed on the upper surface of the transparent substrate 110.

[58] Because the transparent substrate 110 is non-conductive, it is impossible to directly electroplate the electroplating layer 140 thereon. Thus, with the aim of solving this problem, the metal seed layer 130 is formed on the upper surface of the transparent substrate 110. In the present invention, the metal seed layer 130 is formed using copper (Cu), but any metal may be used without limitation as long as it is conductive.

[59] The metal seed layer 130 has a thickness of 0.01 D to 2 D, and the forming process thereof includes, for example, copper deposition using physical vapor deposition (PVD), sputtering using a copper target, and electroless plating following treatment in the presence of a palladium-based plating catalyst. In the present invention, sputtering is adopted.

[60] Further, between the transparent substrate 110 and the metal seed layer 130, there is the first functional combination layer 120 formed to add a function of increasing the strength of adhesion between the transparent substrate 110 and the metal seed layer 130 or improving contrast. [61] The first functional combination layer 120 may be formed using at least one selected from among nickel (Ni), copper (Cu), copper (Co), copper II oxide (CuO), iron (Fe), nickel-phosphorus (Ni-P), phosphorus (P), tungsten (W), and chromium (Cr). Here, nickel (Ni) functions to enhance the strength of adhesion to the transparent substrate 110. Further, cobalt (Co) shows a dark gray color, copper II oxide (CuO) shows a black color, iron (Fe) shows a gray color, phosphorus (P) shows a gray color, tungsten (W) shows a gray color, and chromium (Cr) shows a silvery white color (or some other color), therefore helping improve contrast.

[62] The first functional combination layer 120 preferably has two types, including a combination of 6.0-9.8 mass% of nickel (Ni) and 0.2-4.0 mass% of chromium (Cr), and a combination of 5-8 mass% of nickel (Ni) and 2-5 mass% of copper (Cu).

[63] The electroplating layer 140 is formed on the upper surface of the metal seed layer

130.

[64] The electroplating layer 140 is formed using a typical electroplating process, and the thickness thereof may range from 1 D to 10 D. In the case where the electroplating layer 140 is thinner than 1 D, an electromagnetic wave blocking function is decreased. On the other hand, in the case where the electroplating layer 140 is thicker than 10 D, the cost reduction is decreased somewhat. Thus, in the present invention, the electroplating layer 140 is formed to be 1 D to 7 D thick, and the thickness thereof may vary depending on the requirements of products in the range of 1 D to 10 D.

[65] The electroplating layer 140 may be formed in a predetermined pattern shape, and may have appropriate surface roughness, and, in the present invention, is formed in a lattice mesh pattern and has surface roughness of 0.015-0.5 D. Here, it is apparent that the mesh pattern or surface roughness of the electroplating layer 140 also varies depending on the examples. The surface roughness is formed through surface fine etching, and the use of a chemical selected from among nitric acids, sulfuric acids, hydrochloric acids, and copper sulfates is recommended.

[66] On the upper surface of the electroplating layer 140 having a predetermined surface roughness, a second functional combination layer having a function of increasing adhesive performance and improving contrast may be additionally formed. Although not shown in the drawing, the second functional combination layer may be formed using at least one selected from among nickel (Ni), copper (Cu), cobalt (Co), copper II oxide (CuO), iron (Fe), nickel-phosphorus (Ni-P), phosphorus (P), tungsten (W), and chromium (Cr).

[67] The second functional combination layer preferably has two types, including a combination of 6.0-9.8 mass% of nickel (Ni) and 0.2-4.0 mass% of chromium (Cr), and a combination of 5-8 mass% of nickel (Ni) and 2-5 mass% of copper (Cu).

[68] The second functional combination layer functions to block reflective light, which may be generated when external incident light is reflected from the electroplating layer, to thus improve the contrast of the product.

[69] That is, the first functional combination layer 120 plays a part in improving the contrast relative to light generated from plasma, and the second functional combination layer plays a role in improving contrast relative to external incident light. Further, these layers are effective in increasing overall adhesive performance.

[70] Here, in the present invention, a further advantage is also provided. That is, in place of a blackening treatment process, which is additionally conducted in the manufacture of a conventional optical filter, the first functional combination layer and the second functional combination layer may be applied, thus making it possible to impart more effects, resulting in a decreased time period and cost required for the additional blackening treatment process.

[71] In addition, the method of manufacturing the plating type optical filter according to the present invention is described below.

[72] FIG. 5 is a flowchart illustrating the process of manufacturing the plating type optical filter according to the present invention. As illustrated in FIG. 5, in order to manufacture the plating type optical filter, a transparent substrate surface-treating step (S201) for treating the surface of the transparent substrate is conducted first.

[73] In the present step (S201), ion beams are used to treat the surface of the transparent substrate. Thereby, the surface of the transparent substrate is activated to thus increase the strength of adhesion to the first functional combination layer or the metal seed layer, which is subsequently formed on the upper surface of the transparent substrate.

[74] Then, a first functional combination layer forming step (S203) of additionally forming the first functional combination layer, to increase the strength of adhesion between the transparent substrate and the metal seed layer, or to improve contrast, is conducted.

[75] In the present step (S203), the first functional combination layer may be formed using at least one selected from among nickel (Ni), copper (Cu), copper (Co), copper II oxide (CuO), iron (Fe), nickel-phosphorus (Ni-P), phosphorus (P), tungsten (W), and chromium (Cr), as mentioned above. Among these, nickel (Ni) functions to improve adhesive performance, and cobalt (Co), copper II oxide (CuO), iron (Fe), phosphorus (P), tungsten (W), and chromium (Cr) function as colored material to improve contrast.

[76] Then, a metal seed layer forming step (S205) of forming the metal seed layer on the upper surface of the transparent substrate having the first functional combination layer additionally formed thereon is conducted.

[77] In the present step (S205), the metal seed layer is formed using copper (Cu), but any metal may be used without limitation as long as it is conductive. The metal seed layer preferably has a thickness of 0.01 D to 2 D, as mentioned above. In the present invention, as the process of forming the metal seed layer, sputtering is used.

[78] Then, an electroplating layer forming step (S207) of forming the electroplating layer on the upper surface of the metal seed layer is conducted. In the present step (S207), the electroplating layer is formed to a thickness of 1 D to 10 D.

[79] Then, a surface roughness imparting step (S209) of imparting surface roughness to the upper surface of the electroplating layer is conducted.

[80] In the present step (S209), the reason why surface roughness is imparted to the upper surface of the electroplating layer is to increase strength of adhesion. In the present invention, surface fine etching is performed to thus realize surface roughness of 0.015 D to 0.5 D. Further, for the surface fine etching, any one chemical selected from among nitric acids, sulfuric acids, hydrochloric acids, and copper sulfates is used, as mentioned above.

[81] As such, the second functional combination layer may be further formed on the upper surface of the electroplating layer having surface roughness in the present step (S209). The second functional combination layer functions to increase adhesive performance and to block reflective light, which may be generated when external incident light is reflected from the electroplating layer, thus improving the contrast of the product.

[82] Then, an electroplating layer patterning step (S211) of patterning the electroplating layer in a predetermined pattern is conducted. In the present invention, a lattice mesh pattern is imparted.

[83] Turning now to FIG. 6, the results of light transmission of the conventional optical filter manufactured using a lamination process and the plating type optical filter according to the present invention are compared.

[84] In FIG. 6, (a) is optical micrographs illustrating the optical filter of the present invention, and (b) is optical micrographs illustrating the conventional optical filter.

[85] In the experimental example (a) of FIG. 6, illustrating the plating type optical filter manufactured according to the aspect of the present invention, a transparent substrate made of PET (polyethylene terephthalate) is unwound at a rate of about 1.5 m/min, irradiated with ion beams of 3 KW power to treat the surface of the transparent substrate, and then wound. Subsequently, the surface-treated transparent substrate is unwound, and is then subjected to sputtering using a Cu target under 10 torr in an argon (Ar) atmosphere, thus forming a copper (Cu) metal seed layer about 0.2 D thick. Before the metal seed layer is formed on the transparent substrate, a first functional combination layer, including Ni and Cr at a composition ratio of 8:2, is applied to a thickness of about 0.02 D on the transparent substrate. Thereafter, the transparent substrate having the metal seed layer formed thereon is unwound, degreased with a mixed solution of copper sulfate and an additive, fed into an electroplating bath 30 m long at a rate of 1 m/min, and then immersed therein, thus realizing electroplating. As the electrode, a phosphorus -containing copper electrode is used, and as the plating solution, a copper electroplating solution (available from Orchem) is used, thus forming an electroplating layer 3 D thick, after which the substrate is wound. Then, the transparent substrate having the electroplating layer formed thereon is unwound at a rate of 0.5 m/min, and is then surface-treated with a mixture solution including 3% sulfuric acid and 1% nitric acid (124SL, available from Orchem), thus imparting the electroplating layer with surface roughness (Ra) of about 0.015 D, after which photolithography and etching are performed, thereby manufacturing a plating type optical filter having a mesh pattern, which is then used as the experimental example.

[86] For comparison with the effects of the experimental example (a), the comparative example (b) of FIG. 6, illustrating a conventional optical filter, is obtained by laminating electrolytic copper foil 10 D thick on a PET-made transparent substrate using a transparent adhesive, including acrylic resin, to thus prepare a Cu-transparent substrate, which is then etched in a mesh shape using photolithography.

[87] Comparing the experimental example (a) with the comparative example (b), transparency and light transmission are drastically increased in the experimental example (a) of the present invention, realized without the use of an adhesive, compared to in the conventional optical filter of the comparative example (b) using the adhesive.

[88] This is considered to be due to a decrease in haze, which indicates the degree of turbidity, decreasing transparency and light transmission of the optical filter. In the comparative example (b) using the adhesive, the haze was determined to be about 59.11, but the haze of the experimental example (a) according to the present invention was drastically decreased, and thus determined to be about 1.85.

[89] That is, the plating type optical filter according to the present invention can be seen to have superior transparency and light transmission to the conventional optical filter using the adhesive.

[90] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes with reference to the examples depicted in the drawings, those skilled in the art will appreciate that various modifications, additions and substitutions are possible.

[91] Thus, the technical concept of the invention is limited only to the scope of the invention as defined by the accompanying claims. Industrial Applicability

[92] The present invention provides a plating type optical filter and a method of manufacturing the same. The plating type optical filter is manufactured using a plating process, to thus be relatively thin and highly light-transmissive, and consequently may be applied to displays, including LCDs or PDPs.

Claims

[I] A plating type optical filter, comprising: a transparent substrate; a metal seed layer formed on an upper surface of the transparent substrate; and an electroplating layer formed on an upper surface of the metal seed layer. [2] The plating type optical filter according to claim 1, wherein the transparent substrate is a film or transparent glass. [3] The plating type optical filter according to claim 1, further comprising a first functional combination layer having a function of increasing adhesive performance between the transparent substrate and the metal seed layer or improving contrast, between the transparent substrate and the metal seed layer. [4] The plating type optical filter according to claim 1, wherein the metal seed layer has a thickness of 0.01 D to 2 D. [5] The plating type optical filter according to claim 1, wherein the metal seed layer is formed of copper (Cu). [6] The plating type optical filter according to claim 1, wherein the metal seed layer is formed using any one process selected from among vacuum deposition, sputtering, and electroless plating. [7] The plating type optical filter according to claim 1, wherein the electroplating layer is formed in a predetermined pattern shape. [8] The plating type optical filter according to claim 7, wherein the pattern shape is a lattice mesh shape. [9] The plating type optical filter according to claim 1, wherein the electroplating layer has surface roughness of 0.015 D to 0.5 D. [10] The plating type optical filter according to claim 9, further comprising a second functional combination layer having a function of increasing adhesive performance or improving contrast, on an upper surface of the electroplating layer having the surface roughness.

[I I] The plating type optical filter according to claim 3 or 10, wherein the first functional combination layer or the second functional combination layer is formed using at least one selected from among nickel (Ni), copper (Cu), cobalt (Co), cupper II oxide (CuO), iron (Fe), nickel-phosphorus (Ni-P), phosphorus (P), tungsten (W), and chromium (Cr).

[12] The plating type optical filter according to claim 11, wherein the first functional combination layer or the second functional combination layer comprises nickel (Ni) and chromium (Cr), nickel (Ni) is used in an amount of 6.0 to 9.8 mass%, and chromium (Cr) is used in an amount of 0.2 to 4.0 mass%.

[13] The plating type optical filter according to claim 11, wherein the first functional combination layer or the second functional combination layer comprises nickel (Ni) and copper (Cu), nickel (Ni) is used in an amount of 5 to 8 mass%, and copper (Cu) is used in an amount of 2 to 5 mass%.

[14] A method of manufacturing a plating type optical filter, comprising: a transparent substrate surface-treating step of treating a surface of a transparent substrate; a metal seed layer forming step of forming a metal seed layer on an upper surface of the transparent substrate; and an electroplating layer forming step of forming an electroplating layer on an upper surface of the metal seed layer.

[15] The method according to claim 14, further comprising a first functional combination layer forming step of forming a first functional combination layer having a function of increasing adhesive performance between the transparent substrate and the metal seed layer or improving contrast, between the transparent substrate surface-treating step and the metal seed layer forming step.

[16] The method according to claim 14 or 15, further comprising a surface roughness imparting step of imparting surface roughness to an upper surface of the electroplating layer; and an electroplating layer pattering step of patterning the electroplating layer in a predetermined pattern shape, after the electroplating layer forming step.

[17] The method according to claim 16, wherein the surface roughness imparting step is conducted using a surface fine etching process to impart surface roughness of 0.015 D to 0.5 D to the upper surface of the electroplating layer.

[18] The method according to claim 17, wherein the surface fine etching process is conducted using any one chemical selected from among nitric acids, sulfuric acids, hydrochloric acids, and copper sulfates.

[19] The method according to claim 14 or 15, wherein the transparent substrate surface-treating step is conducted using ion beams.

[20] The method according to claim 14 or 15, wherein the metal seed layer forming step is conducted using any one process selected from among vacuum deposition, sputtering, and electroless plating, to thus form the metal seed layer to a thickness of 0.01 D to 2 D.