WO2007131672A1 - Utilisation d'un vide pour étendre la colle vers le trou central - Google Patents

Utilisation d'un vide pour étendre la colle vers le trou central Download PDF

Info

Publication number
WO2007131672A1
WO2007131672A1 PCT/EP2007/004076 EP2007004076W WO2007131672A1 WO 2007131672 A1 WO2007131672 A1 WO 2007131672A1 EP 2007004076 W EP2007004076 W EP 2007004076W WO 2007131672 A1 WO2007131672 A1 WO 2007131672A1
Authority
WO
WIPO (PCT)
Prior art keywords
inner hole
substrate
receiving pin
adhesive
discs
Prior art date
Application number
PCT/EP2007/004076
Other languages
German (de)
English (en)
Inventor
Alexander Hupp
Torsten Zimmermann
Ulrich Speer
Original Assignee
Hamatech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamatech Ag filed Critical Hamatech Ag
Priority to EP07724999A priority Critical patent/EP2022048A1/fr
Publication of WO2007131672A1 publication Critical patent/WO2007131672A1/fr

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/548—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by capillarity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Definitions

  • the present invention relates to a method and a device for joining at least two substrate slices having an inner hole to a data carrier.
  • the present invention is therefore based on the object, the contamination of the recording pin with the adhesive during assembly of the substrate to avoid slices and prevent the formation of ejection effects, such as air pockets.
  • this object is achieved by a method for joining at least two substrate disks having an inner hole to form a data carrier, in which at least two substrate disks lying on top of one another are placed on a stationary receiving pin with a liquid adhesive therebetween and simultaneously centered.
  • a method for joining at least two substrate disks having an inner hole to form a data carrier in which at least two substrate disks lying on top of one another are placed on a stationary receiving pin with a liquid adhesive therebetween and simultaneously centered.
  • the adhesive layer is cured after pulling in the direction of the inner hole locally in the region of the inner edge.
  • this curing is done by UV light, which is blasted onto the local area of the adhesive layer and generated by LEDs. These LEDs are preferably integrated in the receiving pin.
  • Advantages of this curing in the region of the inner edge are inter alia in the fixation of the substrate discs centered by the receiving pin. Thereafter, the substrate slices can be transported to another process station without loss of centering. Furthermore, the contamination of the receiving pin is prevented with the liquid adhesive, since the liquid adhesive is cured in the region of the inner hole. This has a positive effect on the uptime of the machine, because the recording pen does not have to be replaced or cleaned due to contamination by liquid adhesive.
  • a liquid adhesive is applied locally to at least one substrate wafer on the stationary receiving pin prior to placement of the substrate disks. Subsequently, the substrate discs are placed on each other.
  • the liquid adhesive is preferably applied as a closed annular bead.
  • the substrate disks are preferably transported to a spinning station, which ejects the remaining liquid adhesive and evenly distributed between the substrates. Subsequently, the adhesive is completely cured in the entire area. Separating glue application, in-line drawing with local cure, and skimming results in a reduced cycle time for each individual process.
  • the apparatus in order for the liquid adhesive not to be pulled over the edge as it is pulled toward the inner edge of the substrate disks, the apparatus includes a control unit that controls application of the vacuum such that drawing of the liquid adhesive ends prior to reaching the inner hole ,
  • the object on which the invention is based is also achieved by a device for joining at least two substrate disks having an inner hole to a data carrier which provides a stationary receiving pin for at least two substrate disks, and means for generating a negative pressure in the region of the inner hole ,
  • This device can, as described above, be equipped with a UV light source, which preferably consists of LEDs, in order to harden the liquid adhesive locally in the region of the inner hole.
  • the UV light source is preferably integrated for a compact construction in the receiving pin.
  • the receiving pin is preferably provided with outwardly facing lines which are connectable to a vacuum source.
  • the lines are connected to a circumferential groove, wherein the lines and / or the groove are preferably located at the level of the space between the substrate wafers.
  • the stationary receiving pin is set such that an inner hole gripper can pick up and deposit at least two substrate disks.
  • the receiving pin has recesses which allow the insertion of an inner hole gripper between the receiving pin and substrate discs.
  • Fig. 1 is a block diagram of an apparatus for assembling substrate discs having an inner hole
  • Fig. 2 is a perspective view of a vacuum-pen-integrated pick-up device which is part of an adhesive distribution device;
  • FIG. 3 shows a sectional view through the receiving device according to FIG. 2;
  • Fig. 4 is a plan view of the device of FIG. 2;
  • Fig. 5 is a sectional view taken along the line V-V in Fig. 3;
  • Fig. 6 is a sectional view through an alternative receiving device
  • FIG. 7 is a flowchart showing the process of assembling substrate disks having an inner hole.
  • FIG. 1 shows a device 1 for joining substrate disks having an inner hole, consisting of three separate devices 3 to 5.
  • the device 3 is a device for applying an adhesive to at least one of the substrate slices to be joined, and for initially assembling the at least two substrate slices by laying them on one another after the adhesive application.
  • the device 4 is a first adhesive distribution device which serves to draw adhesive to the inner hole of the substrate wafer, as will be explained in more detail below with reference to Figures 2 to 6.
  • the device 5 is a second adhesive distribution device in which adhesive is distributed radially outward from the local application location. This is done by rapid rotation of the substrate discs with the adhesive therebetween.
  • Devices 3, 4 and 5 as well as from the device 5 out corresponding handling devices, not shown, are provided. These are designed as inner hole gripper, but may also have a different configuration.
  • Fig. 2 shows a perspective view of a part of the adhesive distribution device 4, wherein the part is a receiving pin 7.
  • the receiving pin 7 has a base part 9, a middle part 10 and an upper centering part 11.
  • the base part 9 is formed as a circular plate and has a plurality of passage openings 13, which serve to receive fastening elements for fixing the base part 9.
  • the central part 10 has a cylindrical shape and extends away from the base part 9 in the axial direction of the receiving pin.
  • the middle part 10 has a smaller outer circumference than the base part 9.
  • the central part has a central center bore 15 which extends through the base part 9, the middle part 10 and partly into the upper center part 11 extends into it.
  • the central bore 15 is closed by a suitable plug 17.
  • a corresponding connecting element may be provided in order to connect the transverse bore 19 with a vacuum source, not shown, as will be explained in more detail below.
  • the central part 10 has a flat bearing surface 21 on which a substrate disk can be placed, as will be explained in more detail below.
  • the centering part 11 adjoins the central part 10 in the axial direction, namely at the end of the central part 10 which is at a distance from the base part 9.
  • the centering part 11 has a cylindrical basic shape with an outer circumference 23 which is smaller than the circumference of the central part 10 11 has three bulges 25, as best seen in the perspective view of FIG. 2 can be seen.
  • the bulges 25 serve to introduce an inner hole gripper, as will be explained in more detail below.
  • the centering part 11 also has centering slopes 27 at its end remote from the middle part.
  • the centering bevels 27 serve to provide a guide during insertion of the centering in the inner hole of the substrate wafer.
  • a plurality of radially extending from the central bore 15 to the outer periphery 23 bores 30 are also provided.
  • six holes 30 are provided. Of course, a different number of holes can be provided.
  • FIG. 6 shows an alternative embodiment of a receiving pin 7 which can be used in the adhesive distribution device 4.
  • the same reference numerals are used, as long as the same or similar components are shown.
  • the receiving pin 7 in turn has a base part 9 with through-openings 13, a middle part 10 and an upper centering part 11. Again, a central bore 15 is provided, which extends through the base part 9 and the middle part 10 in the upper centering part 11 inside. In the region of the base part 9, the central bore 15 is in turn closed by a plug 17.
  • a transverse bore 19 in the middle part 10 allows a connection of the central bore 15 with a vacuum source, not shown.
  • the middle part 10 in turn forms a support surface 21, in which in the embodiment of FIG. 6, however, a recess 35 is provided which divides the support surface 21 in an inner and an outer part.
  • a plurality of LEDs 37 are arranged, which generate UV light. The function of the recess 35 and the LEDs 37 will be explained in more detail below.
  • the upper centering part 11 in turn has a cylindrical main body with an outer periphery 23, which has protrusions 25 for inserting elements of an inner hole gripper. Furthermore, again centering bevels 27 are provided at the free end. As in the previous embodiment, extending radially from the central bore 15 bores 30 are provided. These bores are connected to a circumferential groove 40 formed in the outer circumference 23. The groove serves, as will be explained in more detail below, to distribute a vacuum applied via the line 30 uniformly on the outer circumference.
  • Fig. 7 shows a flow chart showing the different operations in the assembly of substrate holes having an inner hole.
  • a first step represented by the block 42, two substrate discs having an inner hole are received on a receiving pin of the glue application device 3 and held spaced from each other.
  • an annular glue bead is applied in proximity to but spaced from the inner hole of the substrates.
  • the adhesive bead is applied annularly and concentrically to the inner hole.
  • the substrate discs are placed in the Kleberaufbringvoretti each other.
  • the superposed substrate disks are simultaneously detected by a center hole gripper and transported together to the adhesive distribution device 4.
  • the superposed substrate disks are deposited on the receiving pin 7.
  • the outer circumference 23 of the upper centering part 11 exactly to the inner circumference of Inner holes adapted to ensure accurate centering of the two substrate discs in the recording on the receiving pin 7 to each other.
  • a receiving pin 7 is installed in the device 4, which is adapted to the inner holes of the substrate wafer, wherein the shape and size of the inner holes depend on an upstream, not shown injection molding system . After the initial installation, no further adjustment is necessary unless changes are made to the injection molding system. If a change is made to the injection molding system, a new adjustment of the pickup pin may be required.
  • the receiving pin is installed interchangeably in the device 4.
  • the superimposed substrate disks are deposited on the support surface 21, while the upper centering part 11 extends into the inner hole of both substrate disks. During this process, the gripping elements of the inner hole gripper engage in the recesses 25 of the upper centering part 11.
  • the bores 30 are at a height which is between the two substrate disks, i. that the distance of the support surface 21 to the bore 30 corresponds approximately to the height of a substrate wafer.
  • a negative pressure is applied in the inner hole region of the substrate disks via the transverse bore 19, the central bore 15 and the bores 30.
  • the receiving pin 7 and the substrate discs are stationary.
  • the adhesive located between the substrate discs is pulled in the direction of the inner hole of the substrate discs.
  • the negative pressure is controlled so that the adhesive does not move into the inner hole, but the movement is stopped before reaching the inner hole.
  • a control unit not shown, which controls, for example, the intensity of the applied negative pressure and / or the duration of the applied negative pressure as a function of the adhesive used and its viscosity.
  • a local curing of the adhesive in the region of the inner hole can be effected by means of a UV source.
  • the UV source can be external, i. be provided outside the receiving pin 7, or be integrated as in the embodiment shown in Fig. 6 in the receiving pin 7 itself.
  • the integration in the receiving pin 7 has the advantage that in a good and controlled manner, a local irradiation of the adhesive layer can be done.
  • the local curing of the adhesive takes place in a separate step in the adhesive distribution device 4, this step being represented by the block 48.
  • the substrate disks are removed from the receiving pin 7 in a next step, represented by the block 50, and to the second Glue distribution device 5 transported.
  • the second adhesive distribution device 5 the remaining adhesive between the substrate wafers and uncured glue is distributed radially outward by a spin coating method as known in the art. This is done in a step represented by block 52.
  • the adhesive Once the adhesive has been distributed uniformly, it can in turn be completely cured, for example by UV radiation, to form the finished optical data carrier. This curing can be done within the spinner or even a separate device.
  • the invention is not limited to the specific embodiment shown.
  • it is not absolutely necessary to provide a local curing of the adhesive in the region of the inner hole before the substrate disks are transported into the second adhesive distribution device 5.
  • this feature is very advantageous because a subsequent displacement of the two substrate discs to each other is thereby prevented.
  • the local curing may be other than by UV irradiation, depending on the adhesive used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un procédé pour assembler au moins deux disques de substrat présentant un trou intérieur, afin de former un support de données. Ledit procédé consiste à poser sur une broche de réception stationnaire au moins deux disques de substrat superposés, entre lesquels une colle liquide est appliquée, et à générer une dépression au niveau du trou intérieur pour étendre la colle liquide en direction de ce trou intérieur.
PCT/EP2007/004076 2006-05-15 2007-05-09 Utilisation d'un vide pour étendre la colle vers le trou central WO2007131672A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07724999A EP2022048A1 (fr) 2006-05-15 2007-05-09 Utilisation d'un vide pour étendre la colle vers le trou central

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006022608.9 2006-05-15
DE102006022608A DE102006022608A1 (de) 2006-05-15 2006-05-15 Verwendung eines Vakuums, um den Kleber zum Mittelloch zu ziehen

Publications (1)

Publication Number Publication Date
WO2007131672A1 true WO2007131672A1 (fr) 2007-11-22

Family

ID=38537708

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/004076 WO2007131672A1 (fr) 2006-05-15 2007-05-09 Utilisation d'un vide pour étendre la colle vers le trou central

Country Status (3)

Country Link
EP (1) EP2022048A1 (fr)
DE (1) DE102006022608A1 (fr)
WO (1) WO2007131672A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0773372A2 (fr) 1995-10-13 1997-05-14 Kitano Engineering Co., Ltd. Table de fixation tournante, avec pion, pour tenir et faire tourner un disque d'information
EP0833315A2 (fr) 1996-07-31 1998-04-01 Kitano Engineering Co., Ltd. Procédé pour la correction du non-alignement d'un disque d'information
US5800670A (en) 1995-05-20 1998-09-01 Kitano Engineering Co., Ltd. Spreader of an optical disc
EP1288933A2 (fr) 2001-08-31 2003-03-05 Ricoh Company Soudage de plaques en empêchant l'entrée d'air entre elles
DE202004003575U1 (de) 2003-03-11 2004-07-15 Automation Design & Manufacture Technology Co., Ltd., Shulin Maschine zum Herstellen einer Compact Disk

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800670A (en) 1995-05-20 1998-09-01 Kitano Engineering Co., Ltd. Spreader of an optical disc
EP0773372A2 (fr) 1995-10-13 1997-05-14 Kitano Engineering Co., Ltd. Table de fixation tournante, avec pion, pour tenir et faire tourner un disque d'information
EP0833315A2 (fr) 1996-07-31 1998-04-01 Kitano Engineering Co., Ltd. Procédé pour la correction du non-alignement d'un disque d'information
EP1288933A2 (fr) 2001-08-31 2003-03-05 Ricoh Company Soudage de plaques en empêchant l'entrée d'air entre elles
DE202004003575U1 (de) 2003-03-11 2004-07-15 Automation Design & Manufacture Technology Co., Ltd., Shulin Maschine zum Herstellen einer Compact Disk

Also Published As

Publication number Publication date
EP2022048A1 (fr) 2009-02-11
DE102006022608A1 (de) 2007-11-22

Similar Documents

Publication Publication Date Title
DE112017000475T5 (de) Endflächen-Beschichtungsvorrichtung
DE102015117611A1 (de) Linseneinrichtung für eine Kamera eines Kraftfahrzeugs mit verbessertem Klebebereich, Kamera, Kraftfahrzeug sowie Verfahren
DE102016104187A1 (de) Funktionselement
DE102017202520A1 (de) Verfahren und Vorrichtung zum Verbinden von zwei Dichtungsenden in einem Stoßbereich
DE60217124T2 (de) Verfahren und vorrichtung zum zusammenfügen von kernen
WO2007131672A1 (fr) Utilisation d'un vide pour étendre la colle vers le trou central
DE3400910A1 (de) Leitungsrohr fuer stark abrasive, stroemungsfaehige medien und verfahren zu seiner herstellung
EP0654204B1 (fr) Adaptateur pour un dispositif automatique de controle des circuits imprimes
DE102014005146A1 (de) Verfahren zum Bereitstellen von Abstandshaltern
DE3932635C2 (fr)
DE19744455A1 (de) Bauteil zur SMD-Montagetechnik und Verfahren zu dessen Herstellung
EP0083301A1 (fr) Rouleau à revêtement élastique
DE2453750C3 (de) Vorrichtung und Verfahren zur Befestigung eines Ablenkjochs an einer Kathodenstrahlröhre
WO2011113073A1 (fr) Procédé et combinaison pour traiter ou manipuler une pluralité de cartes de circuits imprimés et leur application
DE102020006845A1 (de) Verfahren und Vorrichtung zur Herstellung einer Membran-Elektroden-Anordnung
DE3236875C2 (fr)
DE60006285T2 (de) Druckhülse mit befestigungsmitteln für druckplatten und verfahren zu ihrer herstellung
DE10213273A1 (de) Herstellung von DVD-Cards und anderen Disks mit nicht runden Formen
DE102013001967A1 (de) Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten Träger zu einem zweiten Träger
DE2950864C2 (fr)
DE102018126704A1 (de) Verfahren und Vorrichtung zur Herstellung eines Faserverbundbauteils mittels eines 3D-Druckverfahrens
DE102005023399A1 (de) Verfahren und Vorrichtung zum Herstellen einer optischen Disk
DE102012021738A1 (de) Verfahren und Vorrichtung zur Herstellung eines Vorformlings aus einem Faserhalbzeug
DE4444812C1 (de) Verfahren zum Verkappen eines Chipkartenmoduls und Vorrichtung zum Durchführen des Verfahrens
DE10053963A1 (de) Verfahren und Vorrichtung zum Herstellen einer optischen Aufzeichnungsplatte

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07724999

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2007724999

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE