WO2007119544A1

WO2007119544A1 - Laptop personal computer cooling plate and laptop personal computer cooling method using same

Info

Publication number: WO2007119544A1
Application number: PCT/JP2007/056532
Authority: WO
Inventors: Toyohiro Kisaka; Minori Taguchi; Sonoe Mochida; Fumiaki Tsuchiya; Tatsuo Suzuki
Original assignee: Mochida Corporation
Priority date: 2006-04-12
Filing date: 2007-03-20
Publication date: 2007-10-25

Abstract

Provided are a cooling plate for cooling laptop personal computers and a method for cooling laptop personal computers using such cooing plate. The cooling plate surely and efficiently cools a portion required to be cooled in a laptop personal computer by a simple structure without deteriorating convenience of the laptop personal computer. The cooling plate is composed of a metal plate for dissipating heat and a composite body formed of heat transfer adhesive body arranged on one surface of the metal plate. The cooling plate is adhered and fixed on the bottom outer surface of the case of the laptop personal computer and/or a heat generating portion between the bottom inner surface of the case and a mother board lower surface, and the laptop personal computer is cooled.

Description

Description Laptop computer cooling plate and notebook computer cooling method using the same

The present invention relates to a personal computer, particularly a notebook personal computer (hereinafter referred to as

Parts and equipment that generate heat, such as CPU (central processing circuit), hard disk drive, optical disk drive, video graphic accelerator, etc. inside the casing of the “notebook computer” (hereinafter referred to as “heating element”) This is related to a notebook computer cooling plate and a notebook computer cooling method using the same, which efficiently releases the heat generated in step) to the outside of the housing and stabilizes the operation of the notebook computer. Background art

In recent years, this notebook personal computer has been required to have high performance in order to be portable and to be able to respond quickly to various uses. In order to meet these market demands, in this field, notebook computer housings have been made smaller, thinner, and lighter.

The speed of the CPU part and graphic chip part has been increased.

However, this portability requirement is due to the heat generated by heating elements such as CPU, hard disk drive, optical disk drive, and video graphic display installed on the motherboard inside the chassis. In particular, the heat generation during use has increased dramatically due to the high speed of the CPU and graphic chip parts, and as a result, the temperature inside the notebook PC housing has increased. The actual situation is that the structure rises easily. In particular, C P U generates heat to the extent that it can be burned out by its own heat, so this part is provided with cooling means such as a fan.

Such a rise in temperature inside the notebook PC casing may cause the notebook PC to freeze or run away, resulting in malfunctions or a reduction in calculation processing speed. In the past, it has been considered to release heat generated by various methods from the inside of the housing to the outside.

For example, in Patent Document 1 (Japanese Patent Laid-Open No. 2 0 0 5-2 9 4 5 1 9), a fluid-type cooling device is incorporated in the case of a notebook computer, and a heat generating part inside the case is used for cooling. There has been proposed a notebook personal computer cooling method in which a gas or liquid is supplied and cooled by a circulation means or the like. In Patent Document 2 (Japanese Patent Laid-Open No. 7-3 1 1 6 3 2), power from other than a notebook computer, for example, power from an AC power supply, is supplied to the inside of a mounting table on which a notebook personal computer is mounted. A cooling method has been proposed in which a cooling fan device is installed, the cooling fan is driven by this electric power, and the outside air taken in is blown to the bottom of the notebook computer to cool the notebook computer.

Further, Patent Document 3 (Japanese Patent Laid-Open No. 2 00 0-2 3 1 4 2 4) discloses a card-like notebook equipped with a fan driven by power from a notebook computer in a card slot of a notebook computer. A notebook personal computer cooling device that is equipped with a personal computer cooling device and is blown by a fan to cool the periphery of the notebook personal computer and a method for cooling a personal computer using the same is proposed. .

Furthermore, Non-Patent Document 1 (the page related to “Chemical Notebook PC Cooler Product Information” on the Internet homepage of Abel Co., Ltd.) has a mounting base on which the laptop and the laptop are placed. A notebook PC cooling plate 10 0 0 using the latent heat of fusion of inorganic crystals as shown in Fig. 1 is installed between it and sodium sulfate hydrate 1 0 0 a and iron plate 1 0 0 b in a plastic case 1 A notebook computer cooling plate that has a structure enclosed by 0 0 c, dissolves sodium sulfate hydrate 100 0 a by the heat released from the notebook computer, and cools the notebook computer by this latent heat of dissolution. A cooling method for notebook computers was proposed.

However, the notebook computer cooling method described in Patent Document 1 increases the size and weight of the notebook PC housing itself, resulting in a smaller, thinner and lighter notebook PC. It was difficult to improve the portability of the system. In addition, in the notebook PC cooling method described in Patent Document 2, a mounting table having a considerable weight and size is indispensable when using a notebook PC, so that the portability is impaired, and the operation of the cooling device is also reduced. Power supply from a power source other than a laptop computer is necessary for this purpose, so it is impossible to use a laptop computer in an environment where it is difficult to secure a power source, such as outdoors, in trains, or on business trips. Because it is limited to use at the home of a laptop computer, indoors at work or attending school, a friend's acquaintance's home, or accommodation, etc., the notebook computer can be used anywhere. There was a problem that the convenience of being used was impaired. In addition, in the notebook computer cooling method described in Patent Document 3, since power is supplied from the notebook computer, when the notebook computer operates only with the battery built in, the battery is quickly consumed. As a result, there is a problem that the continuous use time of the notebook personal computer is shortened. In addition, since this is a method of cooling only the vicinity of the card slot, if there are no heating elements such as a CPU, hard disk drive, optical disk drive, or video graphics accelerator in the vicinity, this is an indirect method. Due to the cooling method, effective cooling of the notebook PC heat generating part could not be expected.

Furthermore, in the notebook computer cooling method described in Non-Patent Document 1, as in the case of Patent Document 2, it is at least as large as a notebook computer can be placed, and at least as large as a notebook computer. Since a mounting table that requires more weight than that is required, there is a problem in that it is heavy and bulky when it is carried along with the notebook personal computer, and the portability is significantly reduced.

Therefore, the present invention has been made in view of the above problems, and without losing the advantages of the notebook computer, the CPU, hard disk drive, and off inside the notebook computer casing. A notebook computer cooling plate that uses a simple structure to efficiently release and cool the heat generated by a heating element such as a telecommunication disc drive or video graphic accelerator, etc. to the outside of the housing, and a notebook computer using the same. The purpose is to provide a PC cooling method. Disclosure of the invention

The present invention relates to a notebook personal computer cooling plate and a notebook personal computer cooling method using the same, and the object of the present invention is a composite of a heat-dissipating plate metal and a heat transfer paste provided on one surface of the metal. A notebook personal computer cooling plate (hereinafter simply referred to as a “cooling plate”), and the heating plate on the outer surface and / or the inner surface of the bottom wall of the notebook personal computer. This is achieved by tightly fixing to the heat generating part, and releasing heat from the notebook personal computer through this cooling plate and cooling. Brief Description of Drawings

FIG. 1 is a perspective view showing in cross section the structure of a conventional cooling plate that uses the latent heat of fusion of inorganic crystals.

FIG. 2 is an exploded perspective view of a cooling plate product according to the present invention used for cooling a heat generating portion of a notebook computer.

FIG. 3 is a sectional side view of the cooling plate product shown in FIG.

FIG. 4 shows a first embodiment of the notebook personal computer cooling method according to the present invention, and is a perspective view when the cooling plate is used by being attached to almost the entire outer surface of the bottom wall of the notebook personal computer casing. is there.

FIG. 5 shows a second embodiment of the notebook computer cooling method according to the present invention, and is a perspective view when the cooling plate is used by being attached to a notebook computer provided with a waste opening on the bottom wall of the housing. It is. FIG. 6 shows a third embodiment of the notebook computer cooling method according to the present invention. FIG. 6 is a perspective view showing the positional relationship when a cooling plate is individually attached in the vicinity of each notebook computer heat generating portion and used. It is.

FIG. 7 is a perspective view showing a state in which the cooling plate in the third embodiment is individually attached in the vicinity of each heat generating portion of the notebook computer and used.

FIG. 8 shows a fourth embodiment of the notebook personal computer cooling method according to the present invention, and is a front view showing a positional relationship when a notebook personal computer with a cooling plate attached is placed on a placement table. FIG. 9 shows a modified example of the fourth embodiment, and shows a configuration in which a space between the cooling plate and the mounting table according to the present invention is widened by using a spacer to cool the notebook personal computer. It is a front view.

FIG. 10 shows a fifth embodiment of the notebook personal computer cooling method according to the present invention, and is a front view showing a configuration in the case of cooling the notebook personal computer by closely contacting the cooling plate and the mounting table. FIG. 11 shows a modified example of the fifth embodiment, in which the cooling plate and the mounting table are brought into close contact with each other, and the notebook PC is cooled by stabilizing it with a spacer. FIG.

FIG. 12 shows a sixth embodiment of the notebook computer cooling method according to the present invention, in which a cooling rod is attached between the mother board to which the heating element is attached and the inner surface of the bottom wall of the housing. FIG. 5 is a side sectional view showing a configuration for cooling the notebook computer.

FIG. 13 shows a modified example of the sixth embodiment, in which a cooling plate is attached between a mother pad attached with a heating element and the bottom wall of the casing, and the outer surface of the bottom wall of the casing is fixed. It is a fragmentary sectional side view which shows the structure in the case of sticking also on the said heat_generation | fever part and cooling the said notebook personal computer. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a cooling plate according to the present invention and a noisy personal computer cooling method using the same will be described based on preferred embodiments. Note that the present invention is not necessarily limited to the following embodiments, and it goes without saying that the configuration can be variously changed without departing from the scope of the claims.

Fig. 2 is an exploded view showing the form of a notebook computer cooling plate product (hereinafter referred to as "cooling plate product") 1A of the cooling plate 1 according to the present invention used for cooling a heat generating portion of the laptop computer 10 described later. It is a perspective view. This cooling plate product 1 A is a cooling plate 1 consisting of a composite of a heat dissipating metal plate 2 and a heat transfer adhesive 3 provided on one surface (the upper surface in the figure) of the metal plate 2. Protective release papers 4 and 5 are detachably provided on the lower surface (that is, the lower surface of the metal plate 2) and the upper surface (that is, the upper surface of the heat transfer adhesive 3). As will be described later, these release papers 4 and 5 ….

Only the cold plate 1 is used.

The metal plate 2 is made of a rectangular plate such as aluminum, copper, nickel, zinc, iron, chromium, or an alloy thereof, and the material is particularly high in thermal conductivity from the viewpoint of heat dissipation efficiency, for example, aluminum or copper. However, the present invention is not limited to these. In addition, the surface of the metal plate 2 can be decorated by painting, fendering treatment, immobilization treatment, embossing, shot blasting, etc., if necessary.

The heat transfer paste 3 is composed of an organic polymer material and an inorganic filler (filler), and the organic polymer material contains silicone, urethane, acrylic, polyethylene, epoxy, or any of them, and is filled with inorganic material. As the agent, powder containing alumina, zinc oxide, aluminum hydroxide, silicon carbide, magnesia, calcium carbonate, boron nitride, or any one of them is used. The number of blending parts of the inorganic filler with respect to the organic polymer material is preferably not less than 200 parts by weight and less than 90 parts by weight with respect to 100 parts by weight of the organic polymer material.

In this embodiment, the heat transfer adhesive 3 is a granular inorganic filler (generally 75 m or less of aluminum or the like) in an elastomer such as a soft silicone resin or a soft acryl resin having a sticky surface. (A metal powder such as copper) or a heat transfer sheet 6 in which a heat transfer member 6 made of metal fibers such as aluminum or copper is dispersedly dispersed, and has a thermal conductivity of, for example, 0.5 to 1. O WZm 'K is available, and the flame retardant level according to UL 94 is better than V-2.

Incidentally, the content of the heat transfer member 6 made of granular inorganic filler or metal fiber such as aluminum or copper is set in the range of 5 to 50% according to the application. If this content is 5% or less, sufficient thermal conductivity cannot be expected, and if it exceeds 50%, the sticking power of the heat transfer sticking body 3 decreases.

The heat transfer paste 3 configured as described above has a flexibility that can be easily deformed by the pressure applied by a human finger, and has a strength that does not easily break or collapse. And, it has an adhesive strength enough to be in close contact with the casing 1 1 surface of the notebook computer 10.

Such flexibility, strength, and adhesive strength optimize the cross-link density after polymerization of the polymer material. It is obtained by the technique to do. The optimization of the cross-linking density is based on the formulation design that adjusts the addition amount of cross-linking agent, catalyst, polymerization reaction accelerator, polymerization reaction retarder, etc. to the so-called base polymer, and heating for polymerization. Depending on processing conditions such as temperature and heating time.

As described above, the cooling plate 1 has a very simple structure composed of a composite of the heat-dissipating metal plate 2 and the heat transfer sticking body 3, and the thickness is usually 1 to 5. Since it is designed to be as light and thin as about mm, it has the advantage of being highly portable and inexpensive to manufacture. In addition, it is only necessary to stick directly to the heat generating part of the notebook PC 10, and furthermore, since it can be easily attached and detached, there is an advantage that it is easy to handle and economical because it can be used repeatedly. Needless to say, the size of the cooling plate 1 can be designed and manufactured to an arbitrary size as required.

Next, a method of cooling the notebook computer 10 using the main cooling plate 1 configured as described above will be described.

FIG. 4 shows the first embodiment of the notebook personal computer cooling method according to the present invention. The cooling plate 1 described above is attached to the lower surface of the notebook personal computer 10, that is, the outer wall 1 2 of the bottom wall 1 2 of the housing 1 1. FIG. 2 is a perspective view of the case where it is used by sticking it to the rectangular inner surface formed by the four rubber feet 13 shown in FIG. Here, the height of the foot 13 is set higher than the thickness of the cooling plate 1.

When using the cooling plate 1 in this way, first cut the cooling plate product 1 A into a shape that matches the bottom wall 1 2 of the housing 1 1, and then the top surface of the cooling plate product 1 A, that is, the adhesiveness. Peel off the release paper 5 provided on the surface of the heat transfer sticker 3 you have, and stick the surface of this heat transfer sticker 3 against the outer surface 1 2 a of the bottom wall 1 2 of the housing 1 1 After that, the work is completed by removing the release paper 4 provided on the surface of the metal plate 2.

As described above, according to the notebook personal computer cooling method in which the cooling plate 1 is attached to almost the entire area of the bottom wall 1 2 outer surface 1 2 a of the casing 1 1, The generated heat is transferred to the metal plate 2 via the heat transfer member 6 made of granular inorganic filler dispersed in the heat transfer paste 3 or metal fibers such as aluminum or copper, and this metal. Air from board 2 The heat generation part is cooled by being discharged inside. At this time, since the heat transfer sticking body 3 is formed of an elastomer such as a soft silicone resin or an acrylic resin as described above, the heat transfer sticking body 3 is fine on the bottom surface 1 2 of the casing 11. A large amount of heat is transmitted over a large area.

FIG. 5 shows a second embodiment of the notebook computer cooling method according to the present invention, in which the cooling plate 1 is provided with an exhaust port 14 on the outer surface 1 2 a of the bottom wall 1 2 of the housing 1 1. FIG. 6 is a perspective view when used by being attached to a notebook PC 10. As described above, when the cooling plate 1 is used to cool the heat generating part to the notebook computer 10 provided with the exhaust port 14, the cooling plate product 1 A is supplied to the exhaust port as in the first embodiment. 1 Except for 4 Case 1 1 Bottom wall 1 1 Cut into a shape that matches 2 and peels off release paper 5 provided on the surface of adhesive heat transfer sticker 3 This surface is the case 1 1 After pressing and adhering to the outer surface 1 2 a of the bottom wall 1 2, the work is completed by removing the release paper 4 provided on the surface of the metal plate 2. As described above, the same effect as described above can be obtained also by the notebook personal computer cooling method in which the cooling plate 1 is adhered so as not to block the exhaust port 14.

FIG. 6 shows a third embodiment of the notebook personal computer cooling method according to the present invention. The positional relationship when the cooling plate 1 is used by being individually attached in the vicinity of each heat generating portion of the notebook personal computer 10. FIG.

As shown in the figure, the notebook PC 1 0 has a CPU 1 5, a hard disk drive 1 6, an optical disk drive 1 7, and a video graphic QUACERALAY 1 8 as shown in the figure. The cooling plate 1 is cut to a size and shape that matches each heating element, and as indicated by the arrows, the outer surface 1 2 a of the bottom wall 1 2 of the casing 1 1 is in the vicinity of each heating element. And is attached as shown in a perspective view in FIG.

In this embodiment, the cooling plate 1 is attached to all the positions in the vicinity of each of the heating elements described above. However, the cooling plate 1 is not necessarily attached to the corresponding position of all the heating elements. The location and size of the cooling plate 1 is appropriately selected according to the heat generation characteristics of the first base PC 10. This preferable selection condition is that a predetermined number or number of cooling plates 1 are actually installed in the notebook computer. It is determined by an experiment such as sticking to or peeling off from a 10 exothermic part or in the vicinity thereof. This notebook computer cooling method is advantageous in terms of cost because the object can be achieved only by using the cooling plate 1 having the minimum required size.

FIG. 8 shows a fourth embodiment of the notebook personal computer cooling method according to the present invention. The front view shows the positional relationship when the notebook personal computer 10 with the cooling plate 1 attached is placed on the placement table 20. It is a figure. In the present embodiment, only one cooling plate 1 is attached to the outer surface 1 2 a of the bottom wall 1 2 of the casing 1 1 (that is, corresponding to the first and second embodiments). However, a plurality of cooling plates 1 may be used as in the third embodiment.

This notebook computer cooling method uses the cooling plate 1 as a heat transfer medium, and releases the heat generated in the notebook computer 10 from the outer surface 1 2 a of the bottom wall 1 2 of the housing 1 1. Although common to the laptop computer cooling method according to the third embodiment, a gap H is provided between the cooling plate 1 and the mounting table 2 0 in order to diffuse heat further than the cooling plate 1, and the laptop computer 1 0 It is devised to diffuse and release the heat generated from the air from the void H into the atmosphere.

This notebook computer cooling method is particularly effective when the mounting table 20 on which the notebook computer 10 is placed has poor thermal conductivity. According to this notebook computer cooling method, the heat generated from the notebook computer 10 is reduced. Can be efficiently diffused and released from the air gap H into the atmosphere.

Experiments by the present inventors, that is, a cooling plate 1 having a length of 50 mm, a width of 50 mm, and a thickness of 1 mm, a CPU 1 5, a hard disk drive 1 6, and a hard disk drive 1 6 Attached in the vicinity of each heating element of Videographic Accelerare 1 8 and the notebook PC 10 is continuously connected 3 with a gap H between the cooling plate 1 and the mounting table 2 0. As a result of conducting an experiment of collecting temperature data using thermography after using for a long time, compared with the conventional case where the cooling plate 1 is not used, the cooling method of this notebook computer is about 3 ° C on the notebook computer 10. The temperature drop was observed.

FIG. 9 shows a modified example of the fourth embodiment. In this notebook computer cooling method, a spacer 21 is used to set a preferable value for the height of the gap H. is there. This spacer 2 1 is not high enough for the foot 1 3 and has enough space to dissipate and dissipate heat H Used when cannot be obtained. Here, the spacer 21 is not limited in particular in material, shape, arrangement, etc., as long as it can hold the notebook computer 10 parallel to the mounting table 20 and prevent it from wobbling. However, it is more effective if it is made of a material that has adhesive force on the surface contacting the mounting table 20 and can be adhesively fixed to the mounting table 20 or, if necessary, a material having thermal conductivity. is there.

According to this notebook computer cooling method, sufficient air gap H is secured to release the heat generated from the notebook computer 10 into the atmosphere, so the heat generating part of the notebook computer 10 can be cooled more efficiently. can do.

FIG. 10 shows a fifth embodiment of the notebook personal computer cooling method according to the present invention, and shows a configuration in which the notebook personal computer 10 is cooled by bringing the cooling plate 1 and the mounting table 20 into close contact with each other. It is a front view.

As shown in the figure, this PC cooling method is generated from the notebook PC 10 with the cooling plate 1 attached to the bottom wall 1 2 of the case 1 1 and the outer surface 1 2 a in close contact with the mounting table 2 0. This is a method in which heat is transferred and diffused to the mounting table 20 to cool the notebook computer 10, and is particularly effective when the mounting table 20 on which the notebook computer 10 is mounted has good thermal conductivity. When applying this notebook computer cooling method, it is necessary that the thickness of the cooling plate 1 is larger than the height of the foot 13.

Experiments by the present inventors, that is, a cooling plate 1 having a length of 100 mm and a width of 100 mm and a thickness of 5 mm was attached to the outer surface 1 2 a of the bottom wall 1 2 of the casing 1 1 and the cooling plate 1 As a result of conducting an experiment to collect temperature data using thermography after using the laptop computer 10 for 3 hours in a state where 1 and the mounting table 20 are in close contact with each other, the conventional cooling plate 1 is not used. Compared to the case, the notebook PC cooling method showed a maximum temperature drop of 3 ° C in the notebook PC 10. FIG. 11 shows a modified example of the fifth embodiment. The cooling plate 1 and the mounting table 20 are brought into close contact with each other, and further stabilized by the spacers 2 1 a and 2 1 b. FIG. 3 is a front view showing a configuration when the notebook personal computer 10 is cooled.

The cooling plate 1 is partially attached to the bottom wall 1 2 outer surface 1 2 a of the casing 1 1 (the third embodiment) If the laptop PC 10 is placed on the mounting table 20 due to the shape, thickness, sticking position, number of locations, etc. of the cooling plate 1, the center of gravity cannot be removed and the wobbling occurs. There is a case. In this embodiment, the spacer 2 1 a having a height matching the height of the foot 1 3 on the lower surface of the foot 1 3 and the bottom wall 1 2 of the housing 1 1 and the outer surface 1 2 a A spacer 21 b is mounted, the notebook personal computer 10 is stabilized on the mounting table 20, and the notebook personal computer 10 is cooled by the same method as in the fifth embodiment. According to the notebook computer cooling method, the notebook personal computer 10 can be cooled in a stable state as in the fifth embodiment. FIG. 12 shows a sixth embodiment of the notebook personal computer cooling method according to the present invention. Inside the casing 11, the CPU 15, which is a heating element, the hard disk drive 16, and the video graphics mixer. Evening 1 8 The side showing the configuration when the cooling board 1 is attached between the mother board 1 9 with the 8 installed and the bottom wall of the chassis 1 0 1 2 inner surface 1 2 b to cool the PC It is a sectional view.

That is, in the present embodiment, as shown in the drawing, the lower surface of the mother port 19 having the CPU 15, the hard disk drive 16, and the video graphic accelerator 18 mounted on the upper surface as shown in FIG. Case 1 1 Bottom wall 1 2 Inner surface 1 2 B 1 Each cooling plate 1 is fixed by tightening to the bottom wall 1 2 of 1 1. According to this notebook computer cooling method, the heat from each heating element passes through the cooling plate 1 (in detail, from the heat transfer sticking body 3 of the cooling plate 1 to the metal plate 2). It is transmitted to the bottom wall 12 and discharged from here into the atmosphere to cool each heat generating part. In particular, recent notebook computers have a thin casing and a structure in which the space inside the casing is narrowed so that the internal heat does not easily escape to the outside. However, according to this notebook computer cooling method, the cooling plate 1 is the casing. Because it is provided close to the heating element in the body 1 1, the heat from the heating element can be immediately and efficiently released to the outside through the cooling plate 1 regardless of the space in the housing 1 1. Can do.

In this embodiment, the cooling plate 1 is provided at the heat generating parts of the three heat generating elements of the CPU 15, the hard disk drive 16, and the video graphic processor 18, but the other heat generating elements Needless to say, it may be provided at the heat generating part. According to the experiments by the present inventors, it is effective that the cooling plate 1 is provided at least in the heat generating portion of the CPU 15 and the video graphic processor 18 which generate a large amount of heat. It has been made clear. Further, depending on the model or structure of the notebook computer 10, the cooling plate 1 can be arranged directly below the hard disk drive 16.

FIG. 13 shows a modified example of the sixth embodiment, in which the cooling plate 1 is installed inside the casing 11 1 and also attached to the outer surface 1 2 a of the casing 11 1. The configuration for cooling the personal computer 10 is shown in a sectional side view.

That is, in the present embodiment, similar to the sixth embodiment, the CPU 15 that is a heating element, the hard disk drive 16, and the video graphics processor 18 are attached to the upper surface of the motherboard 19. Place the cooling plate 1 formed in a predetermined size between the lower surface and the bottom wall 1 2 inner surface 1 2 b of the housing 1 1 and stick them together. 1 9 is fastened to the bottom wall 1 2 of the casing 1 1, while the cooling plate 1 formed in the same manner as described above is placed on and adhered to the heat generating part of each heating element on the outer surface 1 2 a of the bottom wall 1 2 It is a thing. According to this laptop cooling method, both the cooling plate 1 provided on the bottom wall 1 2 inner surface 1 2 b side of the casing 1 1 and the cooling plate 1 provided on the bottom wall 1 2 outer surface 1 2 a side Compared with the case of the sixth embodiment, the heat from each heating element can be released to the outside more efficiently.

As described above, the contents of the present invention have been described based on the embodiments. In the present invention, a light-weight, small, and simple structure cooling plate is simply attached to a necessary portion of a notebook computer, that is, a heat generating portion. Heat generated by heating elements such as CPUs, hard disk drives, optical disk drives, and video graphic accelerators in PC enclosures can be released from the notebook PCs for efficient cooling. Therefore, according to the present invention, it is possible to surely prevent problems such as malfunctions, a decrease in calculation processing speed, or a failure due to freeze or runaway of the notebook computer. it can.

In addition, as described above, the cooling plate itself is lightweight, small, and simple in structure, so the notebook computer with the cooling plate attached is convenient to carry and can be implemented at low cost. The It can also be done without any load on the laptop's internal battery.

Furthermore, according to the notebook computer cooling method in which the cooling plate is attached to the outer surface of the housing for cooling, the cooling plate can be easily attached to and detached from the outer surface of the housing as many times as necessary. It is economical because it can.

In the above-described embodiment, the method of directly attaching the heat transfer sticker is used for attaching the cooling plate to the housing wall surface. However, the present invention is not necessarily limited to this method. For example, any method can be applied as long as the cooling plate is firmly fixed to the wall surface of the casing, for example, attached via an adhesive or a screw.

The cooling plate is a CPU, a hard disk drive, an optical disk drive, a video graphic accelerator array, or other heating elements arranged inside the casing of the notebook computer. As described above, it is preferable to provide the heat generation part overnight. Industrial applicability

The cooling plate according to the present invention is not limited to a notebook personal computer, and can be applied to other electronic equipment parts and control equipment, for example, where heat generation is a problem.

Claims

The scope of the claims

1. A notebook comprising a composite of a heat-dissipating metal plate and a heat transfer sticker provided on one surface of the metal plate, and being used in close contact with a heat generating part of a notebook computer. Cooling plate for PC cooling.

2. The cooling according to claim 1, wherein the metal plate is made of a metal having a high thermal conductivity or an alloy thereof, and the heat transfer adhesive body includes an inorganic filler in an organic high molecular weight material. Board.

3. The metal plate is made of aluminum or copper, and the organic polymer material is a self-adhesive soft silicone, urethane, acrylic, polyethylene, epoxy, or a resin containing one of them, and the inorganic The filler is composed of a heat transfer member such as alumina, zinc oxide, aluminum hydroxide, silicon carbide, magnesia, calcium carbonate, boron nitride or a powder containing any of them and / or metal fiber. Item 3. The cooling plate according to Item 2.

4. Using a cooling plate composed of a composite of a heat dissipating metal plate and a heat transfer sticker provided on one side of the metal plate, the cooling plate is connected to the outer wall of the bottom wall of the case of the notebook PC and Z or A notebook computer cooling method, characterized in that the notebook computer is cooled by being closely attached to a heat generating portion between an inner surface of the bottom wall and a lower surface of the mother pad.

5. The cooling plate includes at least a CPU and a video graphic processor in a CPU, a hard disk drive, an optical disk drive, and a video graphic processor arranged in the casing of the notebook computer. The notebook personal computer cooling method according to claim 4, wherein the notebook personal computer is provided at a heat generating part.

6. A notebook computer in which the cooling plate is provided on the outer surface of the bottom wall of the housing; 6. The notebook computer cooling method according to claim 4, wherein an air gap is provided between the air conditioner and the mounting table, and heat generated from the notebook personal computer is diffused and released into the atmosphere from the air gap.

7. A notebook computer in which the cooling plate is provided on the outer surface of the bottom wall of the casing and a mounting table on which the notebook computer is mounted are brought into close contact with each other, and heat generated from the notebook computer is directly transferred to the mounting table and spread. The notebook personal computer cooling method according to claim 4 or 5, wherein:

8. The metal plate is made of a metal having a high thermal conductivity or an alloy thereof, and the heat transfer paste is an organic high molecular material containing an inorganic filler, and the heat transfer paste of the cooling plate is 8. The method for cooling a personal computer according to claim 4, comprising an organic polymer material and an inorganic filler.

9. The metal plate is made of aluminum or copper, and the organic polymer material is self-adhesive soft silicone, urethane, acrylic, polyethylene, epoxy, or a resin containing one of them, the inorganic The filler is composed of alumina, zinc oxide, aluminum hydroxide, silicon carbide, magnesia, calcium carbonate, boron nitride, or a powder containing any of them, and a heat transfer adhesive body made of a heat transfer member such as Z or metal fiber. The organic polymer material includes silicon, urethane, acrylic, polyethylene, epoxy, or any of them, and the inorganic filler includes alumina, zinc oxide, aluminum hydroxide, silicon carbide, magnesia. A powder comprising calcium carbonate, boron nitride or one of them. Note Basokon cooling method according to any one of claims 4 to 8, characterized in.