WO2007088948A1

WO2007088948A1 - Electronic component and method for manufacturing same

Info

Publication number: WO2007088948A1
Application number: PCT/JP2007/051735
Authority: WO
Inventors: Seiji Goto; Masahiro Kimura
Original assignee: Murata Manufacturing Co., Ltd.
Priority date: 2006-02-03
Filing date: 2007-02-01
Publication date: 2007-08-09
Also published as: EP1983530A1; CN101379572A; CN101379572B; JPWO2007088948A1; JP4183020B2; EP1983530A4

Abstract

An electronic component wherein resistance elements having various resistance values can be efficiently manufactured, and a method for manufacturing such electronic component are provided. The electronic component is provided with a pair of facing terminals (4, 6) and a resistance element arranged between the terminals (4, 6). The resistance element includes at least two resistance sections (hereinafter referred to as 'first resistance section' and 'second resistance section'), which are arranged in series. The first resistance section includes a plurality of first dots (1a) arranged one over another. The second resistance section includes a plurality of second dots (2a) which are arranged one over another and have an electrical resistance different from that of the first dots.

Description

Specification

Electronic component and manufacturing method thereof

Technical field

[0001] The present invention relates to an electronic component and a method for manufacturing the same, and more particularly to an electronic component having a resistance element and a method for manufacturing the same.

Background art

[0002] As a method of forming a resistance element such as a resistance film having a desired resistance value with respect to a resistor or the like, for example, screen printing or an ink jet method is known.

[0003] For example, in Patent Document 1, dot-shaped first resistance portions having different areas and intervals are formed in a substantially strip shape on the substrate surface using screen printing, and the first resistance portions are formed on the first resistance portions. It is disclosed that a continuous layer-like second resistance portion having a different electrical resistance from that of one resistance portion is formed.

[0004] Patent Document 2 discloses forming a resistor on an unfired ceramic sheet by attaching one type of resistive ink by an ink jet method.

Patent Document 1: JP-A-60-30101

Patent Document 2: JP-A-10-189305

Disclosure of the invention

Problems to be solved by the invention

[0005] However, as in Patent Document 1, when the resistance portion is formed using screen printing, the screen plate is replaced when the resistance value changes. For this reason, a large amount of screen plate manufacturing cost is incurred for each resistance value, and it takes a long time to manufacture the screen plate.

[0006] When two or more types of conductive paste are printed using screen printing, two or more types of conductive paste cannot be printed at the same time, and each time one type of conductive paste is printed. Each time, a drying step and a screen plate changing step are required. After printing the second type of conductive paste, it is necessary to position the screen plate with high accuracy at the printing position of the conductive paste printed before. In addition, the second and subsequent conductive pastes are applied to the gaps between the previously printed conductive pastes by screen printing. A void may be formed without entering. For this reason, it is difficult to simplify the process.

[0007] When a resistor is formed using one type of resistive ink as in Patent Document 2, for example, in order to make the resistor's dimensions' shape and the resistance value different, it corresponds to the resistance value. Thus, resistive inks having different compositions must be prepared in advance. For this reason, it is difficult to handle high-mix low-volume production.

[0008] The present invention is intended to provide an electronic component and a method for manufacturing the same, which can efficiently manufacture resistance elements having various resistance values in view of the actual situation.

Means for solving the problem

In order to solve the above-described problems, the present invention provides an electronic component configured as follows.

[0010] The electronic component is of a type including a pair of terminals facing each other and a resistance element arranged between the pair of terminals. The resistance element includes at least two resistance parts (hereinafter referred to as “first resistance part” and “second resistance part”) arranged in succession. The first resistance portion includes a plurality of first dots arranged to overlap each other. The second resistance portion includes a plurality of second dots having different electrical resistances from the first dots arranged to overlap each other.

[0011] In the above configuration, the first dots and the second dots are formed by, for example, using an ink jet method and ejecting fine particles of resistive ink having different compositions to adhere to the substrate. It is also possible to use a laser printing method to form fine particles of resistance toner having different compositions by adhering to a substrate. The resistance element is divided into at least two first resistance portions and second resistance portions, and each resistance portion includes a plurality of dots that overlap each other.

[0012] According to the above configuration, since the screen plate is not required for forming the resistance element, the production cost of the screen plate is not necessary, and the production period of the screen plate is eliminated, so that a short delivery time can be met. Resistance elements having various resistance values can be formed by changing the size and number of dots in the resistance portion, the shape of the resistance portion, etc. without changing the resistance ink or resistance toner for forming dots.

[0013] Preferably, the first resistor portion and the second resistor portion are arranged in series between the terminals. Yes.

In this case, it is easy to obtain a desired resistance value by calculation. Further, when adjusting the resistance value of the formed resistance element later, first, the resistance part having a relatively high resistance value is partially removed to roughly adjust the resistance value, and then the resistance value is relatively adjusted. It is possible to finely adjust the resistance value by partially removing the lower resistance portion.

[0015] Preferably, the first resistance portion and the second resistance portion are arranged in parallel between the terminals. Here, the term “parallel” may be used when the first resistance portion and the second resistance portion are in contact with each other or when they are apart from each other. When they are in contact, they may be stacked one above the other. Further, in the state where they are stacked one above the other, the second resistance portion may be formed in a floating island shape in the first resistance portion.

[0017] Preferably, at least one of the first resistance portion and the second resistance portion is a metal.

[0018] Metals have various resistance values, such as those with a fairly high resistance value such as Ni-Cr, those with a slightly high resistance value such as Pd, and those with a low resistance value such as Ag. Therefore, it is possible to easily form resistance elements having various resistance values depending on the application.

[0019] In addition, in order to solve the above problems, the present invention provides a method of manufacturing an electronic component configured as follows.

[0020] A method for manufacturing an electronic component includes: (1) using a first resistance ink containing a component that is a part of a resistance element in a first region of a base material; A first step of disposing dots, and (2) the first resistive ink including a component that is another part of the resistance element in a second region adjacent to the first region. A second step of disposing a plurality of second dots overlapping each other by an inkjet method using a second resistive ink having a different composition; (3) the first dots and the second in the first region; And a third step of heat-treating the second dot in the region to form the resistance element.

In the above method, the first dot and the second dot are the first resistance ink and the second dot, respectively. It is formed by ejecting fine ink droplets of the resistance ink 2 to adhere to the substrate. The resistance element is divided into at least two first regions and second regions, and each region includes a plurality of dots that overlap each other. The second step may be started before the first step is finished. The third step may include a plurality of steps having different heat treatment temperatures as the drying step and the firing step. Of these, the drying step may be started before the first step or the second step is completed.

[0022] According to the above method, the screen plate is not required for forming the resistance element, the management cost of producing the screen plate is unnecessary, and the production period of the screen plate is also eliminated. By using the same resistance ink and changing the size and number of dots in the area, the shape of the area, etc., resistance elements having various resistance values can be formed.

[0023] Preferably, a dot drying step for drying the first dots is provided before the second step. This dot drying step may be provided independently between the first step and the second step, but is preferably performed in parallel with the first step. For example, in the first step, the dot drying step may be performed by setting the base material to a temperature higher than room temperature or by performing the first step in a dry atmosphere.

[0024] In this case, the first dot placed on the base material is dried by performing the first step in a dry atmosphere or the force that brings the base material to a temperature higher than room temperature (for example, 25 ° C or higher). Since the time can be shortened, it becomes difficult to mix two types of resistance inks even if they are overcoated or arranged, and it is easy to obtain a desired resistance value.

[0025] Further, in order to solve the above problems, the present invention provides a method for manufacturing an electronic component configured as follows.

[0026] The method of manufacturing an electronic component includes (1) a first step of arranging a plurality of first dots by an ink jet method using a first resistance ink containing a component serving as a resistance element on a substrate. (2) A second resistance ink containing a component that becomes the resistance element and having a composition different from that of the first resistance ink is used, and a plurality of second dots are overlapped with the first dot by an inkjet method. A second step of forming the mixing portion by mixing the first resistance ink of the first dot and the second resistance ink of the second dot; and (3) And a third step of heat-treating the mixing portion to form the resistance element. [0027] In the above method, the second step may be started before the first step is completed.

[0028] According to the above method, since the screen plate is not required for forming the resistance element, the production cost of the screen plate is not necessary, and the production period of the screen plate is also eliminated. Use the same resistance ink, and adjust the mixing ratio of the resistance ink by changing the size (number of ink liquid) and number of the first and second dots, the number of times of printing, etc., or changing the printing pattern As a result, various resistance values can be obtained.

[0029] Preferably, in the first step and the second step, the temperature is set to room temperature or lower than room temperature.

[0030] In this case, the resistance of the substrate can be reduced by delaying the drying of the first dot ink and lengthening the ink mixing time by setting the substrate to room temperature or lower than room temperature (for example, less than 25 ° C). The variation in the resistance value of the film can be reduced, and a stable resistance value can be obtained.

The invention's effect

[0031] According to the present invention, resistance elements having various resistance values can be efficiently manufactured.

Brief Description of Drawings

FIG. 1 is an overall configuration diagram of an inkjet printer used for printing. (Example 1)

FIG. 2 is a schematic diagram for explaining a print pattern. (Example 1)

FIG. 3 is a schematic diagram for explaining a print pattern. (Example 1)

FIG. 4 is a schematic diagram for explaining a printing method. (Example 2)

FIG. 5 is a schematic diagram for explaining a print pattern. (Example 2)

FIG. 6 is a schematic diagram for explaining a print pattern. (Example 3)

Explanation of symbols

[0033] la first dot

2a 2nd dot

3 Mixing section

4 terminals

6 terminals

8 Base material

10 Inkjet printer 14, 16, 18 Inkjet head

34, 36, 38 Resistive ink

35, 37, 39 Ink drops

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 5.

<Example 1> [0035] Example 1 will be described with reference to Figs.

First, an inkjet printer 10 used for printing a pattern to be a resistive film (resistive element) will be described with reference to the schematic diagram of FIG.

[0037] The inkjet printer 10 generally includes a moving table 12 on which a base material 8 is placed, a plurality (for example, three) of inkjet heads 14, 16, 18, and a control unit 11 that controls the overall apparatus. Is provided.

[0038] The moving table 12 is driven in the X direction indicated by reference numeral 23 by the motor 22, is driven in the Y direction indicated by reference numeral 25 by the motor 24, and is moved in the Θ direction (in the X and Y axes) indicated by reference numeral 27 by the motor 26. Driven around the right Z axis). The driving of the motors 22, 24 and 26 of the moving table 12 is controlled by the control unit 11. The moving table 12 may be moved in directions other than X, Υ, and Θ, or conversely, may be moved only in any one or two directions of X, Υ, and Θ. The moving table 12 may be provided with a vacuum suction hole for adsorbing the base material 8 or a heater for heating and keeping the base material 2 as necessary.

The inkjet heads 14, 16, and 18 are respectively arranged at fixed positions above the moving table 12. Ink jet heads 14, 16, and 18 are supplied with resistance inks 34, 36, and 38 force tanks with different compositions, respectively. Inkjet heads 14, 16, and 18 are formed with one or more minute holes, and these holes are also used to transfer ink droplets 35, 37, and 39, which are fine particles of resistance ink 34, 36, and 38, to a moving table. Inject towards 12 The ink jet heads 14, 16, and 18 change the size (the amount of ink droplets) and the number of ink droplets 35, 37, and 39 to be ejected under the control of the control unit 11.

[0040] The resistance inks 34, 36, 38 include a resistance material such as ruthenium oxide, glass, carbon, and metal particles. As the resistance material included in the resistance inks 34, 36, and 38, one having an arbitrary resistance value can be used. For example, with metal particles, the resistance is quite high, like Ni-Cr. There are various resistance values, such as those with a slightly high resistance value such as Pd and those with a low resistance value such as Ag, but any material can be used depending on the application. The base material 8 placed on the movable table 12 is a workpiece such as a substrate or a ceramic green sheet for producing an electronic component.

[0041] For the control unit 11, for example, a personal computer is used. The control unit 11 drives the ink jet heads 14, 16, and 18 in synchronization with the movement of the moving table 12 according to a predetermined program based on the input parameters of the keyboard force (not shown) and the ink droplets 3 5, 37, 39 is discharged. As a result, a predetermined pattern is printed on the substrate 8 placed on the moving table 12 with the resistance inks 34, 36, and 38.

[0042] Preferably, the ink jet heads 14, 16, 18 in which a plurality of holes for ejecting the ink droplets 35, 37, 39 are arranged in a row are arranged so that the rows of holes are parallel to each other. The moving table 12 is driven in the direction in which the inkjet heads 14, 16, 18 are arranged (perpendicular to the row of holes) or in an oblique direction. As a result, printing can be performed almost simultaneously using the resistance inks 34, 36, and 38, and the pattern serving as the resistance element can be efficiently formed.

Note that the inkjet heads 14, 16, 18 are arranged at fixed positions, and instead of moving the substrate 8, the inkjet heads 14, 16, 18 may be moved while the substrate 8 is fixed. Both the substrate 8 and the ink jet heads 14, 16, 18 may be moved.

[0044] Using this ink-jet printer 10, using a plurality of types of resistance inks, a pattern to be a resistance film is applied separately, and then dried and baked to form a resistance film.

[0045] For example, a pattern to be a resistive film is divided into a plurality of printing process areas (regions) in the plane direction, and each printing process area is roughly abbreviated using different resistance inks using a plurality of inkjet heads. Paint at the same time. From this, it is possible to realize a resistance film having a resistance value different from that of the resistance film formed of one type of resistance ink. Resistive films with different resistance values can be realized by changing the planar shape and cross-sectional shape of the pattern to be the resistive film.

[0046] Preferably, at the time of printing, the substrate 8 is heated to a temperature higher than room temperature (for example, 25 ° C or higher), and printing is performed in an atmosphere that is easily dried, such as dry air. For example, a heater is provided on the moving table 12 and the base material 8 is heated and kept warm. Even if the substrate 8 is heated in advance before printing, the substrate 8 may be heated to a temperature higher than room temperature by air conditioning during printing. Or print part It may be covered with a cover, and dry air with a predetermined humidity may be continuously supplied to the cover to maintain an atmosphere that is easy to dry. This shortens the drying time of the dots of the resistance ink printed on the substrate 8, makes it difficult for the two types of resistance inks to be mixed even if they are overcoated or aligned, and a desired resistance value is easily obtained.

[0047] The pattern to be the resistance film is printed as shown in the schematic diagrams of FIGS. 2 and 3, for example. Between the terminals 4 and 6 formed in advance on the base material 8 (see FIG. 1), two types of resistance inks 1 and 2 dots 1 a and 2 a are arranged, and the resistance film is formed by an aggregate of dots la and 2 a. A pattern is formed.

[0048] The pattern shown in the plan view of FIG. 2 (a) includes a first group including a plurality of (in the figure, 2 × 2) dots 1 of resistance ink 1 between terminals 4 and 6, and a plurality of patterns. The second group including the dots 2a of the resistance ink 2 (2 × 2 in the figure) is alternately arranged in a staggered pattern. The dots la, 2a overlap, and the first group and the second group are continuous.

[0049] The pattern shown in the plan view of Fig. 2 (b) is a plurality of (six in the figure) resistors arranged between the terminals 4 and 6 in a direction perpendicular to the direction connecting the terminals 4 and 6. A first group including the dot la of ink 1 and a second group including a plurality of (six in the figure) resistive ink 2 dots 2a arranged in a direction perpendicular to the direction connecting the terminals 4 and 6; Are alternately arranged in the direction connecting the terminals 4 and 6. The dots la and 2a overlap each other, and the first group and the second dull loop are continuous.

[0050] The pattern shown in the plan view of FIG. 2 (c) is a plurality of (10 in the figure) dots of resistive ink 1 arranged in a direction connecting terminals 4 and 6 between terminals 4 and 6. And a second group including a plurality of (10 in the figure) resistive ink 2 dots 2a arranged in the direction connecting the terminals 4 and 6 in the direction connecting the terminals 4 and 6 They are alternately arranged in the direction perpendicular to it. The dots la and 2a overlap each other, and the first group and the second group are continuous.

[0051] The pattern shown in the plan view of FIG. 2 (d) is a first pattern including a plurality (5 × 6 in the figure) of resistive ink 1 dots la arranged between the terminals 4 and 6 in a square shape. A group and a second group including a plurality (5 × 6 in the figure) of resistive ink 2 dots 2 a arranged in a square are arranged in series between terminals 4 and 6. The dots la and 2a overlap each other, and the first dull loop and the second group are continuous. [0052] The pattern shown in the plan view of FIG. 2 (e) is a first pattern including a plurality of (10 × 3 in the figure) resistive ink 1 dots la arranged between the terminals 4 and 6 in a square shape. A group and a second group including a plurality of (10 × 3 in the figure) resistive ink 2 dots 2a arranged in a square are arranged in parallel. The dots la and 2a overlap each other, and the first group and the second group are continuous.

[0053] When the first group and the second group are arranged in parallel, as shown in Fig. 3 (a), a part of the first group including the dot la of the resistance ink 1, The force formed in a state where the second group including the dot 2a of the resistance ink 2 is superposed vertically, or the first group including the dot la of the resistance ink 1 as shown in FIG. The entire force of the second group including the dot 2a of the resistance ink 2 on a part of the group 1 is a force formed in a state of being superposed in a floating island shape, so that it is partially arranged in parallel. It may be. In these cases, the vertical relationship between the first dull loop and the second group may be reversed. Further, as shown in FIG. 3 (c), the first first group including the dot la of the resistance ink 1 and the second group including the dot 2a of the resistance ink 2 may be separated from each other. .

[0054] The pattern shown in the plan view of FIG. 2 (f) and the side view of FIG. 2 (g) has a plurality of squares (10 × 6 in the figure) as the first layer between the terminals 4 and 6. The first group containing the dot la of the resistance ink 1 is arranged, and as the second layer, a second group including a plurality (10 X 6 in the figure) of the resistance ink 2 dots 2a is formed on the second layer. Has been placed. The dots la and 2a overlap each other, and the first group and the second group are continuous.

In each pattern shown in FIG. 2 and FIG. 3, the first group of dots la is arranged in the first region, and the second group of dots 2a is arranged in the second region. . The first group and the second group by the dots la, 2a are dried and fired to form a resistance film, and then become a first resistance portion and a second resistance portion, respectively.

[0056] The pattern shown in FIG. 2 (a) is obtained by changing the resistance value variation by making the first group of the resistance ink 1 and the second group of the resistance ink 2 a certain size. Overlapping portion of resistive ink 1 and resistive ink 2 that is likely to cause (i.e., the boundary between the first area where the first dot la is arranged and the second area where the second dot 2a is arranged) The total length of the wire is shortened, making it easier to predict the resistance value of the resistive film between terminals 4 and 6. Also between terminals 4 and 6 In this connection, the electrical resistance distribution can be made substantially uniform.

[0057] The patterns shown in FIGS. 2 (b) to 2 (g) and FIG. 3 show the force between the terminals 4 and 6 between the first group of the resistance ink 1 and the second group of the resistance ink 2. Since they are arranged in series or in parallel, the resistance value of the resistive film between the terminals 4 and 6 can be easily predicted. Further, when adjusting the resistance value of the formed resistance film later, first, the group having a relatively high resistance value is partially removed to roughly adjust the resistance value, and then relatively The resistance value can be finely adjusted by partially removing the lower resistance group.

[0058] The resistance value of the resistive film between the terminals 4 and 6 is determined by the pattern (size, shape, and arrangement of each group) separately applied by the resistance inks 1 and 2, and the dot la of the resistance inks 1 and 2 in each group. , 2a can be changed by changing the size (the amount of ink droplets) and the number of ink droplets.

[0059] If resistance ink is printed using a plurality of inkjet heads, two or more types of resistance inks can be applied separately. As a result, the drying process can be performed only once. In addition, since the drying process is not performed in the middle and printing is performed at a time, printing with high alignment accuracy between the resistance inks without realigning the printing position can be easily performed.

[0060] Since the screen plate is not used, the printing pattern of the second and subsequent types of resistance ink is set so that no gap is generated even when the printing pattern of the first type of resistance ink is narrow. Can be printed.

[0061] Furthermore, the resistance value change 'adjustment by separately applying a plurality of types of resistance inks can be easily performed by changing the setting of software parameters.

[0062] Next, a specific example will be described.

[0063] In advance, there is ruthenium oxide (RuO), glass or the like, which is a material for a resistance film for electronic components.

2

Two types of ink-jet resistance ink 1 and resistance ink 2 having different compositions dispersed in an organic solvent were prepared.

[0064] The weight percentage of each component in the solid content of the resistance ink 1 is RuO force ¾0 parts by weight.

2

St, CaO-Al O -SiO-BO-based glass 56 weight ^{_{0/0, SiO-BO-}} KO system

2 3 2 2 3 2 2 3 2 Glass is 14% by weight. Weight percent of each component in the solid content of the resistor ink 2, RuO force 0 wt ^{_{0/0, CaO-Al O}} -SiO-BO -based glass 35 weight ^_0/0, SiO BO-KO glass is 15% by weight. Resistance ink 1 has a viscosity of 89 mPa's at room temperature

2 3 2, Resistive Ink 2 has a viscosity of 109 mPa's at room temperature. However, since the ink is heated before ink jetting, the viscosity before ink jetting is lower than that at room temperature, approximately 20m 'Pa's.

[0065] Below the two piezo-type inkjet heads, an inkjet printer having a movable table movable in the X and Y directions, and two separate silver electrodes as a pair of terminals were formed. A ceramic green sheet was prepared. The inkjet head has SUS adhesive material with 256 holes with a hole diameter of 50 m formed in a row at a pitch of 280 m, and can eject ink droplets of 10 to L00 pi (picoliters).

[0066] From the two inkjet heads of the inkjet printer, resistive inks 1 and 2 were ejected substantially simultaneously, and a pattern as shown in the schematic diagram of Fig. 2 (a) was printed on the ceramic green sheet. . That is, a square pattern in which a first group of a plurality of dots of resistive ink 1 and a second group of a plurality of dots of resistive ink 2 are alternately arranged in a staggered manner between two silver electrodes. Printed.

[0067] This ceramic green sheet was laminated with other sheets and “press” fired to obtain a ceramic substrate in which a resistance film was formed between silver electrodes. When the resistance value of the resistance film on the ceramic substrate was measured, a resistance value of 5.4 kΩ was obtained.

[0068] As Comparative Example 1, only resistive ink 1 was ejected, a square pattern connecting two silver electrodes on a ceramic green sheet was printed, and lamination and pressing were performed in the same manner as in Example 1. A ceramic substrate having a resistance film formed only between the resistance inks 1 between the silver electrodes was obtained. When the resistance value of the resistance film using only the resistance ink 1 was measured, a resistance value of 84 kΩ was obtained.

[0069] As Comparative Example 2, only the resistance ink 2 was ejected, a square pattern connecting the two silver electrodes on the ceramic green sheet was printed, and lamination and pressing were performed in the same manner as in Example 1. A ceramic substrate having a resistance film formed only between the resistance inks 2 between the silver electrodes was obtained. When the resistance value of the resistance film using only the resistance ink 2 was measured, a resistance value of 2.3 kΩ was obtained.

[0070] As can be seen from the above specific examples, the resistance value of the resistance film manufactured by separately applying the resistance ink 1 and the resistance ink 2 is the resistance value of the resistance film manufactured only by the resistance ink 1, and the resistance ink 2 It can be set to an intermediate value between the resistance value of the resistance film produced only by this method. <Example 2> Example 2 will be described with reference to FIGS. 4 and 5. FIG.

[0072] In Example 2 as well, printing is performed using an inkjet printer.

As schematically shown in FIG. 4, printing is performed almost simultaneously on the base material 8 placed on the moving table 12 from the inkjet heads 14 and 16 in a substantially Cf standing manner. At this time, printing is performed so that a part or all of the dots la of the resistance ink 1 discharged from the ink jet head 14 and a part or all of the dots 2a of the resistance ink 2 discharged from the inkjet head 16 overlap. Also, before the dot la of the resistance ink 1 dries, the dot 2a of the resistance ink 2 is overlapped so that the resistance ink 1 of the dot la and the resistance ink 2 of the dot 2a are mixed. Ultrasound may be applied to facilitate mixing. By mixing, a part of the component of the resistance ink 1 and a part of the component of the resistance ink 2 may chemically react or an alloy may be formed.

[0074] During printing, for example, by cooling the moving table 12 to room temperature or a temperature lower than room temperature, the substrate 8 can be brought into a state at room temperature or a temperature lower than room temperature (for example, less than 25 ° C). I like it. In this case, by delaying the drying of the resistance ink and lengthening the mixing time of the resistance ink, variation in the resistance value of the resistance film can be reduced and a stable resistance value can be obtained.

By mixing the resistance inks, as shown schematically in the plan view of FIG. 5, the mixing unit 3 in which the plurality of resistance inks 1 and 2 are mixed is formed between the terminals 4 and 6. A resistance film is formed between the terminals 4 and 6 by drying and firing the mixing portion 3.

[0076] The resistance value of the resistance film between the terminals 4 and 6 can be changed, for example, by changing the program parameters of the control unit 11, the mixing ratio of the resistance inks 1 and 2, the printing area, the printing pattern (planar shape, cross-sectional shape), etc. It can be changed by changing. The mixing ratio of the resistance inks 1 and 2 can be changed by changing the size (number of ink droplets) and the number of the inks 1 and 2 of the resistance inks 1 and 2 and the number of overprints.

If the dots la and 2a are printed at a uniform pitch while keeping the mixing ratio of the resistance inks 1 and 2 constant, a substantially uniform resistance film can be formed between the electrodes 4 and 6.

The mixing ratio of the resistance inks 1 and 2 for mixing the resistance inks 1 and 2 to obtain a resistance film having a desired electrical resistance is, for example, a law called “volume mixing rule” (the following formula (1)) It is possible to make predictions using

That is, the resistivity and dielectric constant of a composite material formed by mixing a plurality of component materials are: In the case of two components, the following approximate expression holds.

V log = V log p + V log p (1)

total total 1 1 2 2

Where V is the volume of the composite material. p is the resistivity of the composite material. V 1 and V total total 1 2 are the volumes of components 1 and 2 in the composite material. p, is the resistivity of components 1 and 2

1 2

is there.

[0080] Next, a specific example will be described.

[0081] Using the same inkjet printer and resistive inks 1 and 2 as the specific example of Example 1, the resistive inks 1 and 2 are ejected, and printing is performed so that a plurality of dots of the resistive inks 1 and 2 are overlapped. While mixing the resistance inks 1 and 2 on the sheet, a pattern to be a resistance film was formed. At that time, the moving table was not heated to room temperature (25 ° C), the drying of the ink on the ceramic green sheet was delayed, and sufficient time was secured for mixing the resistance inks 1 and 2 together.

[0082] When another sheet was laminated, pressed and fired on the green sheet printed with the pattern to be a resistance film in this way, the resistance value of the resistance film was measured, and a resistance value of 15.3 kΩ was obtained. This resistance value is an intermediate value between the resistance value of the resistance film made with only the resistance ink 1 of Comparative Example 1 described above and the resistance value of the resistance film made with only the resistance ink 2 of Comparative Example 2 described above. .

Example 3> Example 3 will be described with reference to FIG.

[0084] The pattern shown in the plan view of FIG. 6 (a) is a plurality of (4 × 6 in the figure) resistive inks arranged in a square on the terminal 4 side as in the pattern of FIG. 2 (d). The first group Is containing the dot 1 la, and the second group 2s containing the dots 2a of multiple (4 X 6 in the figure) resistance ink 2 arranged in a square on the terminal 6 side Is arranged. In a region 5s between the first group Is and the second group 2s, as shown in the pattern of FIG. The fourth groups including the dots 2a of the resistance ink 2 are alternately arranged in a staggered pattern. The dots la and 2a overlap each other, and the first to fourth groups are continuous.

[0085] The pattern shown in the plan view of FIG. 6 (b) is a plurality of (4 × 6 in the figure) resistive inks arranged in a square on the terminal 4 side as in the pattern of FIG. 2 (d). A plurality of resistors (4 X 6 in the figure) arranged in a square on the side of terminal 6 where the first loop It including 1 dot la is placed A second group 2t including dots 2a of ink 2 is arranged. In the region 5t between the first group It and the second group 2t, as shown in the pattern in Fig. 2 (b), a plurality of (Fig. In the figure, six dots (resistor ink 2) are arranged in a direction perpendicular to the direction connecting the third group and the terminals 4 and 6 to the third group including the dot la of the resistance ink 1. Are arranged alternately in the direction connecting the terminals 4 and 6. The dots la and 2a overlap each other, and the first to fourth groups are continuous.

If dots la, 2a having different resistance values are arranged as shown in FIGS. 6 (a) and 6 (b), a resistance gradient can be provided between terminals 4 and 6. FIG. For example, when the dot la of the resistance ink 1 containing Pd having a relatively large electric resistance and the dot 2a of the resistance ink 2 containing Ag having a relatively small electric resistance are arranged from the upper terminal 4 in the figure. The resistance can be tilted so that the electrical resistance gradually decreases as it is directed to the lower terminal 6.

[0087] By providing a resistance slope in this way, impedance matching between the circuit side and the ground side can be achieved without providing a so-called shunt resistor separately, and the effect of grounding can be obtained with a simple method.

[0088] It should be noted that not only the case where both the dot la of the resistance ink 1 and the dot 2a of the resistance ink 2 are metal, but one of them is a metal and the other is other than a metal such as ruthenium oxide, glass or carbon. A resistance gradient can be provided between the terminals 4 and 6.

<Summary> According to Examples 1 and 2 described above, it is possible to efficiently produce resistance elements having various resistance values.

That is, by printing the resistance ink using inkjet, it is not necessary to prepare a large number of screen plates. As a result, the plate manufacturing cost can be reduced, and electronic parts can be manufactured at low cost. In addition, since there is no plate production period, it is possible to meet short delivery times.

[0091] In addition, since it is easy to change the printing pattern in the inkjet, it is possible to easily produce resistance films having different resistance values by changing the planar shape, cross-sectional shape, etc. of the pattern to be the resistance film. Monkey.

Note that the present invention is not limited to the above-described embodiment, and various modifications are made. Can be implemented.

For example, three or more types of resistance ink may be used. It is also possible to produce a resistance element by using a single laser printer instead of inkjet and arranging a plurality of types of dots with different electrical resistance.

Claims

The scope of the claims

[1] a pair of terminals facing each other;

An electronic component comprising a resistance element disposed between the pair of terminals, wherein the resistance element includes at least two resistance parts (hereinafter referred to as “first resistance part”, “second resistance part”) ")

The first resistance unit includes a plurality of first dots arranged to overlap each other, and the second resistance unit includes a plurality of second dots having different electric resistances from the first dots arranged to overlap each other. An electronic component characterized by including a dot.

2. The electronic component according to claim 1, wherein the first resistance part and the second resistance part are arranged in series between the terminals.

[3] The electronic component according to [1], wherein the first resistance portion and the second resistance portion are arranged in parallel between the terminals.

[4] The at least one of the first resistance part and the second resistance part is a metal.

The electronic component according to claim 1.

[5] A first step of using a first resistance ink containing a component that is a part of a resistance element in a first region of the base material, and arranging a plurality of first dots that overlap each other by an inkjet method; The second region adjacent to the first region includes a component that is another part of the resistive element, and a second resistive ink having a composition different from that of the first resistive ink is used. A second step of arranging a plurality of second dots overlapping each other;

A third step of heat-treating the first dots in the first region and the second dots in the second region to form the resistance element;

A method for producing an electronic component, comprising:

6. The method for manufacturing an electronic component according to claim 5, further comprising a dot drying step for drying the first dots before the second step.

[7] The electronic unit according to [6], wherein the dot drying step dries the first dot by setting the base material to a temperature higher than room temperature in the first step. Product manufacturing method.

[8] The dot drying step is performed by performing the first step in a dry atmosphere. 8. The method of manufacturing an electronic component according to claim 6, wherein the first dots are dried.

[9] A first step of arranging a plurality of first dots by an inkjet method using a first resistance ink containing a component that becomes a resistance element on a substrate;

Using a second resistance ink containing a component that serves as the resistance element and having a composition different from that of the first resistance ink, a plurality of second dots are arranged to overlap the first dots by an inkjet method. A second step of mixing the first resistive ink of the first dot and the second resistive ink of the second dot to form a mixing portion;

A third step of heat-treating the mixing portion to form the resistance element;

A method for producing an electronic component, comprising:

[10] The method of manufacturing an electronic component according to [9], wherein in the first step and the second step, the temperature is set to normal temperature or lower than normal temperature.