WO2007079371A2 - Materiau perfore pour caloduc - Google Patents

Materiau perfore pour caloduc Download PDF

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Publication number
WO2007079371A2
WO2007079371A2 PCT/US2006/062591 US2006062591W WO2007079371A2 WO 2007079371 A2 WO2007079371 A2 WO 2007079371A2 US 2006062591 W US2006062591 W US 2006062591W WO 2007079371 A2 WO2007079371 A2 WO 2007079371A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
shell
para
mesh
volume
Prior art date
Application number
PCT/US2006/062591
Other languages
English (en)
Other versions
WO2007079371A3 (fr
Inventor
Igor Touzov
Original Assignee
Igor Touzov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/306,530 external-priority patent/US20070151709A1/en
Priority claimed from US11/306,529 external-priority patent/US20080099188A1/en
Priority claimed from US11/307,292 external-priority patent/US20070151710A1/en
Priority claimed from US11/307,359 external-priority patent/US20070151121A1/en
Priority claimed from US11/307,865 external-priority patent/US7310232B2/en
Application filed by Igor Touzov filed Critical Igor Touzov
Priority to PCT/US2006/062591 priority Critical patent/WO2007079371A2/fr
Priority to PCT/US2007/067017 priority patent/WO2007124386A2/fr
Publication of WO2007079371A2 publication Critical patent/WO2007079371A2/fr
Publication of WO2007079371A3 publication Critical patent/WO2007079371A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/0052—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using the ground body or aquifers as heat storage medium
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the invention provides essential improvement in field of heat transferring devices and materials. In particular it contributes to devices and materials design that rely on use of phase transitions of embedded substances such as gas and liquids. Fundamental advantage of instant invention is in area of applications requiring efficient heat transfer to or from ambient gaseous or liquid media: commonly air and water.
  • Taiwan Patent Serial Number 861 1541 5 discloses a cooling device that is essentially planar heat pipe with one wall made in shape of folded fins. This design not only has minimal thermal gradients across all dimensions but also provides increase surface area for interfacing with airflow and increasing efficiency of heat dissipation from the device.
  • Huang US Patent 6,269,865
  • invention utilizes capillary type heat pipes interfacing with grid formed by interconnected capillaries that play role of radiator and effectively dissipates heat into adjacent airflow. Capillary effects carry essential role in function of such design. It requires close loop to be formed in order for bubble train inside the capillary to propel the liquid circulation.
  • the essence of this invention is to provide completely passive lightweight and highly efficient heat dissipating solution.
  • the primary aspect of this invention is novel material that transfers heat from one location to another in form of latent heat of evaporation of embedded chemicals that undergo phase transitions between liquid and gaseous states. Unlike known prior art devices including planar and traditional heat pipes, this material is breathable. This means it allows ambient media (commonly air or water) to go through and not around its geometry.
  • the material has internal sealed volume 2 that contains chemical(s) 3 capable of undergoing phase transition from liquid 4 to gaseous or supercritical state 5.
  • the volume 2 is shared by liquid 4 and gas 5.
  • Supply of heat to the material increases evaporation of liquid 4 and raises the pressure of gas 5.
  • Dissipation of heat from the material causes condensation of gaseous components of liquid 4 and reduction of the pressure.
  • Gaseous phase 5 might also contain some non-condensing gases.
  • the volume 2 may enclose some additional functional elements some of which are common to designs of heat pipes and are well known to engineers experienced in the art. Some examples of such elements are wicking materials, spacers, structural elements. Complete disclosure of internal structure is not essential for matter of the instant invention and is disclosed in co pending patent applications.
  • inner volume 2 has no additional structural components except chemicals 3 (not shown).
  • the shell 6 that surrounds volume 2 is thin continuous film. It separates inner volume 2 from ambient media. Because of large number of perforations 1 minimal curvature of the film 6 is inherently high. This makes geometrical structure of the material on local scale (distance between adjacent perforations 1) to be very stiff with respect to difference between inner and outer pressures, while allowing reduced thickness of film 6. At the same time on larger scale (approximately 10 average distances between adjacent perforations) the material behaves as soft and flexible.
  • the primary shape of the material is planar film, yet it may exist in variety of other shapes.
  • the material's topology is corrugated sheet that has 3D structure with higher and lower regions arranged in chess order. Corrugation period is nearly matches average distance between perforations 1 . This highly corrugated surface resembles thin sponge. It has higher surface area per unit area of the material than the planar sheet.
  • FIG. 20 Yet another embodiment uses three dimensional network like topology where the network nodes are natively distributed in complex 3D pattern and each node is interconnected with plurality of adjacent nodes. While above mentioned topologies are topological ⁇ equivalent to planar mesh, the topology of present embodiment is strictly not planar. This topology provides notable benefits to heavy duty heat dissipating applications where high surface area must be achieved in minimal allocated space. Yet internal structure of the material with this topology is equivalent to structure of the other topological arrangements.
  • perforation pattern has preferred orientation with elliptic form of through holes oriented in one direction. This approach creates anisotropic effect with respect to amount of heat transferred in different directions. Changing pattern of perforation allows creation of custom heat distribution pattern as well as can be used to add artistic aspects to the design.
  • junction point 7 is permanent connection between opposite surface sides of the material. Functionally junction point 7 increases the curvature of shell 6 and improves local stiffness of the material while at the same time attributes to increase in its flexibility on larger scale. Pattern of junction points 7 used in this embodiment creates regions where average distances between opposite surfaces of the material become notably smaller that its average thickness. This creates regions 8 with profound capillary effect. It also causes liquid 4 to redistribute within volume 2 by dominantly occupying regions 8 and freeing remainder of volume 2 for gases 5. This segregation attributes to increase in overall heat transport performance of the material.
  • Regions 8 can be created by use of junction points, or by use of perforations, or both. Because the material can be heat sealed, its perforation pattern, shape, and functional performance can be easily tuned and modified by means of in-process or after-process addition of both junction points and perforations.
  • array of junction points is added to the material to create interface region for electronic device. This array makes several regions 8 that accelerate intake of liquid 4.
  • Figure 4 illustrates the design. Contact regions 9 does not form a continuous surface, instead they are collection of small contact pads with tiny separations between them.
  • Figure 1 shows external view on a sheet of the material. Numerous through perforations 1 form channels for air to pass through the layer. Ultra thin shell of the material is only few micron thick able to sustain mechanical and geometrical stability due to high local curvatures. View A shows 2D net-like topology, view B shows topology of rows formed by isolated patterns of perforations. Magnified view shows example of perforation pattern in arrangement of view B.
  • Figure 2 shows capillary channels that adsorb liquid 4 clearing passages for transport of gases 5.
  • Figure 3 shows region of joint points. View A shows detail view on perforation 1 , while view B is detailed view of joint point 7.
  • Figure 4 shows interface pad 9 created by array 8 of joint points 7.
  • High temperature silicone stamp was produced with extended features forming the pattern of the perforations 1.
  • Tin replica was created from the stamp using molding process with thickness of produced film of 500 microns. Tin film was deoxidized and electroplated in caustic conditions with copper to 0.5 micron. Then rinsed with distilled water and placed in acidic electroplating bath to deposit 2.5 micron of copper. Resulting film was cut by one edge and placed in 23O 0 C silicone oil bath to remove tin inside. Resulting copper shell 6 is tinned on inside. It was placed in antifreeze bath at -3O 0 C and filled with Rl 34a to 20% of inner volume.
  • TPSiV thermoplastic elastomer
  • felt of the same composition
  • all elements are maintained below -3 0 C
  • liquid refrigerant such as 1 ,2-dichloro-l ,1 ,2,2-tetrafluoroethane (R-1 14) or butane
  • R-1 14 liquid refrigerant
  • second layer of TPSiV film is placed on top of the assembly
  • hot stamp with mesh pattern is pressed against the assembly at pressure in excess of 44atm at 295 0 C, after setting time the stamp is cooled.
  • Invented heat pipe can be custom cut to desired shape without need for special equipment using standard hot knife and a wise or a clamp.
  • the pipe sheets or decals can be sewed together or to any fabric using standard sewing equipment. This makes the product suitable for general apparel manufacturing.
  • the material is produced from two rolls of fine copper foil tined on one side.
  • the foils are arranged vertically facing tined side of each other.
  • the foils are passed through hot rolling stamps heated nearly to 23O 0 C and surface lubricated with high temperature silicone oil with anticorrosion additives to prevent oxidation.
  • the pattern of perforations and (optional joint points 7) is created in a way that seals the cut edges. In one example this process can use modified equipment for expanded metal production.
  • Perforated sandwich of two foils is chilled to -3O 0 C and liquid refrigerant Rl 34a is pumped between the foils with moderate excessive pressure. This step is performed right before the assembly passes between two cold rolling stamps with fixed separation between them.
  • the separation is set to desired percentage of volume 2 to be occupied by liquid 4.
  • foil thickness is 3 micron
  • target material thickness is 600 micron
  • part of volume occupied by liquid 4 is 1 5% (percent)
  • average separation between the plates is 53 microns. This step ejects excessive amount of refrigerant from the assembly.
  • the second set of stamps is adjacent to set of hot rollers that seal the edges.
  • three-dimensional network topology of the invention was produced by following technique.
  • Production process for the structure begins with making a wick layout. This may be done via broad range of techniques including weaving, plaiting, braiding, knitting, cutting, forming, molding, stretching, or any other process that arranges wick material into desired linear, planar, or three dimensional arrangement. In some implementations it is possible that temporary spacers or other hardness features are embedded into such arrangement to stabilize it during production phase.
  • Second step of production process is priming. This step may be repeated several times until desired properties are achieved.
  • a primer is viscous usually polymeric or inorganic composite or solution that is sprayed on all surfaces of the wick creating a coat or other chemicals.
  • composition of the primer depends on many factors such as the wick material, layout density, desired product characteristics, and chemicals 3.
  • liquid butyl was used as a primer.
  • elecroless 1 micrometer copper film was deposited on. It is well known how to optimize composition of the primer to achieve necessary tackiness, penetration depth, thickness etc.
  • Materials of the primer may vary. In one example gradient coat of two primers was achieved, when approximately one half of sponge like wick was coated with silicone carbide ceramic while the rest was coated with silicone rubber.
  • Third step of the process is addition of liquid refrigerant. This step may be performed as a second step of the sequence if chemical and process compatibility with primer allows it (e.g. when water is used as the refrigerant liquid it may be possible to exclude this step when water based primer is employed). In case when this step follows priming procedure, part of the wick arrangement is trimmed or striped to allow quick infusion of the refrigerant into the wick. Created opening then sealed with identical or alternative primer compound or using other techniques.
  • step of the process creates additional layers of coat on top of the primer.
  • This step in some modifications of the process can be used instead of or be interchanged with the priming step.
  • This step can be repeated several times to achieve desired thermal and mechanical characteristics of the product.
  • electroplating of chrome can be performed to provide high longevity and durability to the product.
  • Process must be performed under conditions that prevent escape of refrigerant and permeation of gases into the wick structure. When methanol used as a refrigerant electroplating was performed in sealed bath at pressure matching boiling point of refrigerant.
  • the material can be permanently imbedded into or form by itself the apparel structure. This improves apparel durability and reduces its weight.
  • Preferred chemical 3 for the material in this application area is medium pressure commercial refrigerant, while low or high pressure refrigerants and other liquids are not excluded. Use of medium pressure refrigerants allows to overcome problem associated with high gas permeability of polymer materials.
  • Preferred shape of the invention for apparel application is a planar mesh or a planar ribbon with flaps. Spatial or 3D mesh structures are also the subject of these applications.
  • the mesh shape allows for significant airflow through the material that allows for effective integration into apparel and other systems by sewing, gluing, molding, or fastening through the voids 1 of the material, while preserving breathable properties of the product.
  • Sheets of the material of planar of foam/sponge like 3D meshes can be utilized as a thermal barrier for fire protection, building thermal insulation, energy harvesting by heat pumps, and other traditional thermal applications.
  • the mesh structure of the invention contributes to high transport efficiency of capillary wicks.
  • the small area of segments created by the mesh is compensated by two or three dimensional flow pattern of the mesh. This allows for large geometrical dimensions of the heat pipes with minimal degradation of their efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Abstract

L'invention concerne un matériau de transfert de chaleur plan ou tridimensionnel, à mailles, thermoscellable et à caractéristiques de poids améliorées. Ce matériau présente une grande zone de surface et une surface perméable à l'air qui sont particulièrement avantageuses pour des tâches de dissipation ou de prélèvement thermique. Ce matériau est thermoscellable, ce qui permet des opérations de personnalisation et d'ajustement impossibles dans les dispositifs traditionnels de diffusion ou dissipation thermique. Le matériau selon l'invention convient à des applications telles que la gestion de chaleur d'appareils électroniques, l'habillement et les dispositifs médicaux.
PCT/US2006/062591 2005-12-30 2006-12-24 Materiau perfore pour caloduc WO2007079371A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/US2006/062591 WO2007079371A2 (fr) 2005-12-30 2006-12-24 Materiau perfore pour caloduc
PCT/US2007/067017 WO2007124386A2 (fr) 2006-04-19 2007-04-19 Mécanismes et matériaux échangeurs de chaleur utilisant des membranes perméables aux gaz

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US11/306,530 2005-12-30
US11/306,529 2005-12-30
US11/306,530 US20070151709A1 (en) 2005-12-30 2005-12-30 Heat pipes utilizing load bearing wicks
US11/306,529 US20080099188A1 (en) 2005-12-30 2005-12-30 Perforated heat pipes
US30705106A 2006-01-20 2006-01-20
US11/307,051 2006-01-20
US11/307,292 2006-01-31
US11/307,292 US20070151710A1 (en) 2005-12-30 2006-01-31 High throughput technology for heat pipe production
US11/307,359 US20070151121A1 (en) 2005-12-30 2006-02-02 Stretchable and transformable planar heat pipe for apparel and footwear, and production method thereof
US11/307,359 2006-02-02
US11/307,865 US7310232B2 (en) 2005-12-30 2006-02-26 Multi-surface heat sink film
US11/307,865 2006-02-26
PCT/US2006/062591 WO2007079371A2 (fr) 2005-12-30 2006-12-24 Materiau perfore pour caloduc

Publications (2)

Publication Number Publication Date
WO2007079371A2 true WO2007079371A2 (fr) 2007-07-12
WO2007079371A3 WO2007079371A3 (fr) 2007-11-29

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PCT/US2006/062591 WO2007079371A2 (fr) 2005-12-30 2006-12-24 Materiau perfore pour caloduc

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009007905A2 (fr) * 2007-07-11 2009-01-15 Koninklijke Philips Electronics N.V. Caloduc
JP2016507837A (ja) * 2013-01-24 2016-03-10 江▲蘇▼都万▲電▼子科技有限公司Ｊｉａｎｇｓｕ Ｄｕｗａｎ Ｅｌｅｃｔｒｏｎｉｃ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． 車載データ記録装置の防火性能を向上させる方法及び保護装置
ITUB20152826A1 (it) * 2015-07-21 2017-01-21 Ernst Gruber Spalmatore di calore

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329993A (en) * 1992-01-14 1994-07-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger and clamping plate
USD414257S (en) * 1998-07-02 1999-09-21 Rosalio Estrada Flue pipe heat exchanger
US5953834A (en) * 1995-08-09 1999-09-21 A.R.M.I.N.E.S.- Association Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels Footwear or clothing article with integral thermal regulation element
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US6595929B2 (en) * 2001-03-30 2003-07-22 Bodymedia, Inc. System for monitoring health, wellness and fitness having a method and apparatus for improved measurement of heat flow
US20040131835A1 (en) * 2002-11-12 2004-07-08 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Structure for heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329993A (en) * 1992-01-14 1994-07-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger and clamping plate
US5953834A (en) * 1995-08-09 1999-09-21 A.R.M.I.N.E.S.- Association Pour La Recherche Et Le Developpement Des Methodes Et Processus Industriels Footwear or clothing article with integral thermal regulation element
USD414257S (en) * 1998-07-02 1999-09-21 Rosalio Estrada Flue pipe heat exchanger
US6446706B1 (en) * 2000-07-25 2002-09-10 Thermal Corp. Flexible heat pipe
US6595929B2 (en) * 2001-03-30 2003-07-22 Bodymedia, Inc. System for monitoring health, wellness and fitness having a method and apparatus for improved measurement of heat flow
US20040131835A1 (en) * 2002-11-12 2004-07-08 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Structure for heat dissipation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009007905A2 (fr) * 2007-07-11 2009-01-15 Koninklijke Philips Electronics N.V. Caloduc
WO2009007905A3 (fr) * 2007-07-11 2009-03-26 Koninkl Philips Electronics Nv Caloduc
JP2016507837A (ja) * 2013-01-24 2016-03-10 江▲蘇▼都万▲電▼子科技有限公司Ｊｉａｎｇｓｕ Ｄｕｗａｎ Ｅｌｅｃｔｒｏｎｉｃ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． 車載データ記録装置の防火性能を向上させる方法及び保護装置
US10149398B2 (en) 2013-01-24 2018-12-04 Duvonn Electronic Technology Co., Ltd Method for improving fire prevention performance of vehicle-carried data recording device and protection device thereof
EP2950624B1 (fr) * 2013-01-24 2019-12-04 Jiangsu Duwan Electronic Technology Co. Ltd. Procédé pour améliorer les performances de prévention incendie d'un dispositif d'enregistrement de données transporté à bord d'un véhicule, et dispositif de protection
ITUB20152826A1 (it) * 2015-07-21 2017-01-21 Ernst Gruber Spalmatore di calore
EP3121546A1 (fr) * 2015-07-21 2017-01-25 Ernst Gruber Élement de dissipateur de chaleur

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