WO2007066921A1

WO2007066921A1 - Structure of sticking extraneous matter and warm foot digital compression plate

Info

Publication number: WO2007066921A1
Application number: PCT/KR2006/005038
Authority: WO
Inventors: Ho Young Lee
Original assignee: Ho Young Lee
Priority date: 2005-12-08
Filing date: 2006-11-28
Publication date: 2007-06-14

Abstract

The present invention relates to a structure for adhering extraneous matter (any ornaments or finishing materials such as tiles, protrusions for acupressure, gravel, or the like) to a first adhesion layer that totally loses elasticity after curing, in which a second adhesion layer that can maintain certain level of elasticity even after curing, is interposed between the extraneous matter and the first adhesion layer. The present invention also relates to a warm foot digital compression plate, which utilizes the structure for adhering extraneous matter.

Description

[DESCRIPTION]

[Invention Title]

STRUCTURE OF STICKING EXTRANEOUS MATTER AND WARM FOOT DIGITAL COMPRESSION PLATE

[Technical Field]

<i> The present invention relates to a structure of sticking extraneous matter (any ornaments or finishing materials such as tiles, acupressure protrusions, gravel, or the like) to a first adhesion layer that totally loses elasticity after curing, in which a second adhesion layer capable of maintaining elasticity even after curing is interposed between the extraneous matter and the first adhesion layer.

<3> The present invention also relates to a warm foot digital compression plate, which utilizes the aforementioned structure for adhering extraneous matter.

[Background Art]

<5> Roughly, an adhesive is categorized into two groups, one of which (hereinafter, referred to as a first adhesive) loses its elastic property when completion of curing, and the other (hereinafter, referred to as a second adhesive) can maintain elasticity even after the curing. For example, the first adhesive includes epoxy, cement (mortar), plaster, and the like. The second adhesive includes silicon, urethane, or solution of resin or synthetic rubber dissolved in a solvent.

<7> Even though the second adhesive is superior in its adhesive property, however it has drawback that the second adhesive is vulnerable to external force due to relatively low strength itself. That is, as shown in FIGS 11 and 12, as external force (F) is exerted on the extraneous matter, a crack occurs and grows in the adhesive, which finally results in break of the adhesion layer. FIGS. 11 and 12 illustrate destructions caused by external force exerted in a horizontal direction and in a vertical direction, respectively. The destruction by the vertical force entails a necking. That is the reason why the second adhesive is rarely used for attaching extraneous matter (particularly, stones or tiles).

<9> Meanwhile, the first adhesive, which is widely used for attaching smooth-surfaced matter such as native locks or imitation stones to a base (plate, wall, floor, or the like), comes to lose elasticity after curing. As time goes by, the extraneous matter attached to the base and the first adhesive shrink or expand depending on temperature variation. The difference in thermal shrinkage/expansion between the matter and the first adhesive leads to stress therebetween, due to which a crack may occur in a boundary surface between the matter and the elasticity-lost first adhesive. Once the crack occurs, it would rapidly grow and then result in breakage of the attachment if an external force is applied. (See FIG. 13)

<π> Several prior arts have been conceived for eliminating such a drawback.

For an example, one of the prior arts suggests an extraneous matter that is provided with a friction enhancing means such as a wire net for increasing coherence between the matter and the adhesive. Moreover, as shown in FIG. 14, another prior art teaches a method for preventing escape of the attached matter by mechanical treatments, like perforating the matter.

<13> However, since such prior arts require additional elements or to have each attaching matter processed separately, it is a time-consuming and a labor-intensive work.

<i5> Foot acupressure plates according to prior arts having the foregoing drawbacks are listed below as cited references 1 to 3, which employ either the first adhesion or the second adhesion. The foot acupressure plates according to the cited references 1 to 3 employ silicon, FRP (Fiber Reinforced Plastic) resin layer, and concrete layer as a adhesion layer to accommodate acupressure protrusions.

<i7> Such foot acupressure plates are often realized in a large scale at a park in the form of a pavement equipped with stones stuck in a concrete 1ayer.

<19> The acupressure protrusions may be furnished with a heating element adapted for facilitating blood circulation by dilating blood vessels of foot. A foot acupressure plate having such a heating element is, for example, suggested in the cited reference 4.

<2i> As shown in FIG. 4, the warm foot digital compression plate disclosed in the cited reference 4 comprises a backing plate (1), a sheet-like heating element (10) disposed on a top surface of the backing plate (1), a plurality of acupressure means (30) attached in a regularly spaced manner on the sheet- like heating element (10) by means of epoxy resin (20). In order to decrease a diameter, the acupressure means (30) is composed of a vertical wall (31) defining closed area, a conical portion (32) extending from the vertical wall (31), and a round portion (33) formed at a vertex of the conical portion (32).

<23> The epoxy resin (20) has an advantage that curing is rapidly completed, thereby improving productivity of products.

<25> Cited reference 1: Korean Unexamined Utility Model Publication No.

1992-0014766

<27> Cited reference 2: Korean Utility Model Registration No. 20-0340714

<28> Cited reference 3: Korean Unexamined Patent Publication No. 2005- 0011623

<30> Cited reference 4: Korean Unexamined Patent Publication No. 2004- 0035949

[Disclosure]

[Technical Problem]

<32> However, as temperature of the sheet-like heating element (10) repeatedly varies, an interconnecting portion between the epoxy resin (20) and the acupressure means (30) is subjected to stress due to the difference in thermal shrinkage/expansion, which finally leads to escape of the acupressure means (30) from the epoxy resin layer.

[Technical Solution]

<34> The present invention aims at solving the aforementioned drawbacks of the conventional warm foot digital compression plate. Therefore, it is an object of the present invention to provide a structure for adhering extraneous matter, in which the matter can be securely fixed therein by a simple attaching method.

<36> It is another objection of the present invention to provide a warm foot digital compression plate, in which undesirable effect caused by difference of thermal shrink/expansion between extraneous materials is alleviated, so that escape of the acupressure protrusions from a plate can be effectively prevented while improving productivity.

<38> In order to accomplish the foregoing objects, one embodiment of a structure for adhering extraneous matter according to the present invention comprises a first adhesion layer, extraneous matter, and a second adhesion layer interposed between the first adhesion layer and the extraneous matter. The second adhesion layer is superior to the first adhesion layer in terms of maintaining elasticity after curing.

<40> According to the structure, it is feasible to effectively prevent escape of the extraneous matter by a simplified attaching method, without installation of any additional elements or mechanical treatments.

<42> In the foregoing structure, in order to further enhance the attachment of the extraneous matter, a thickness of the second adhesion layer is thinner than the thinnest portion of the first adhesion layer being compressed by the extraneous matter.

<44> Further, the second adhesion layer is configured to be concealed from the atmosphere so as to minimize change of physical properties thereof, thereby maintaining the adhesive characteristic in a favorable condition for a long time.

<46> The first adhesion layer comprises epoxy or cement, and the second adhesion layer comprises silicon. Since those materials have affinity between each other, the adhesive strength is enhanced.

<48> One embodiment of a warm foot digital compression plate according to the present invention comprises a first adhesion layer, extraneous matter, a second adhesion layer interposed between the first adhesion layer and the extraneous matter, and a heating element disposed on a top surface of the first adhesion layer. The first adhesion layer is formed on a base and the extraneous matter are acupressure bodies. The second adhesion layer is superior to the first adhesion layer in terms of maintaining elasticity after curing.

<50> According to the embodiment, it is feasible to effectively prevent escape of the acupressure protrusions by alleviating difference of thermal shrink/expansion between the acupressure protrusions and the first adhesion layer while improving productivity.

[Advantageous Effects]

<52> As apparent from the foregoing description, the structure for adhering extraneous matter and the foot acupressure plate using the same according to the present invention have advantageous effects as follows.

<54> First, since the second adhesion layer capable of maintaining its elastic characteristic even after curing is interposed between the extraneous matter and the first adhesion layer losing its elasticity after the curing, not only an interconnecting surface between the first adhesion layer and the second adhesion layer has enhanced adhesive strength, but also an interconnecting surface between the second adhesion layer and the extraneous matter is free from stress caused by thermal shrink/expansion, so that escape of the matter can be surely prevented.

<56> Second, since the second adhesion layer is not exposed to the atmosphere, physical properties thereof are hardly changed for a long time, whereby maintaining the adhesive characteristic in a favorable condition.

<58> Third, by configuring the thickness of the second adhesion layer to be thinner than the thinnest portion of the first adhesion layer being compressed by the extraneous matter, the attachment between the first adhesion layer and the extraneous matter can be sustained in an optimized and stable manner. Therefore, escape of the extraneous matter from the adhesion layers is further prevented.

<60> Fourth, employing epoxy resin having a fast curing rate and cost- effectiveness enhances competitiveness of the product. <62> Fifth, in case of the foot acupressure plate equipped with a heating element, endurance thereof may be significantly deteriorated by undesirable detachment of the extraneous matter, which is mainly caused by thermal shrink/expansion. Therefore, the present invention implemented with the second adhesion layer, which is superior to the first adhesion layer in terms of maintaining elasticity after curing, has an advantage in improving endurance thereof.

[Description of Drawings]

<64> FIG. 1 is a sectional view of a structure for adhering extraneous matter according to a flawless preferred embodiment of the present invention;

<66> FIG. 2 is a sectional view of an example of a structure for adhering extraneous matter having a defect I

<68> FIGS. 3 to 5 are drawings that schematically illustrate methods for fabricating the structure depicted in FIG. 1;

<70> FIG. 6 is a perspective view of a warm foot digital compression plate according to a preferred embodiment of the present invention;

<72> FIG. 7 is a partial sectional view of the foot acupressure plate illustrated in FIG.6;

<74> FIG. 8 is a perspective view of a warm foot digital compression plate according to another preferred embodiment of the present invention;

<76> FIG. 9 is a partial sectional view of the foot acupressure plate illustrated in FIG. 8;

<78> FIG. 10 is a perspective view of a warm foot digital compression plate according to still another preferred embodiment of the present invention;

<80> FIGS. 11 and 12 show structures for adhering extraneous matter comprising a single adhesion layer (a second adhesion layer) capable of maintaining elasticity even after curing, in which cracks are occurred;

<82> FIG. 13 shows a structure for adhering extraneous matter comprising a single adhesion layer (a first adhesion layer) losing elasticity after curing, wherein the extraneous matter is being detached due to a gap occurred between boundary surfaces; and <84> FIG. 14 is a sectional view of a conventional warm foot digital compression plate.

<86> <Reference numerals>

<87> 100, 200, 300: warm foot digital compression plate

<88> 110: base 120: bond

<89> 130: (sheet-like) heating element 150: first adhesion layer (epoxy resin)

<9i> 170, 270, 370: extraneous matter (acupressure body)

<92> 180: arched acupressure protrusion 190: second adhesion layer (silicon)

<93> 230: controller

[Best Mode]

<94> Hereinafter, a preferred embodiment of the present invention is described in detailed with reference to the accompanying drawings.

<96> The inventor of the present invention conceived that in order to prevent an extraneous matter from escaping out of an adhesion layer, it is necessary to furnish a buffering material between the matter and the adhesion layer, which can alleviate the stress caused by difference in thermal shrink/expansion. Based on the conception, the inventor provides a structure for adhering extraneous matter, which comprises a first adhesion layer serving as a base substrate, the first adhesion layer having a superior mechanical strength while losing elasticity after curing, and a second adhesion layer superposed on the first adhesion layer, the second adhesion layer being capable of sustaining elasticity even after curing. Thereafter, before cure of the first adhesion layer, the extraneous matter is attached to the first adhesion layer while interposing the second adhesion layer therebetween as shown in FIG. 1.

<98> That is, as shown in FIG. 1, the structure for adhering extraneous matter is constituted by a first adhesion layer, extraneous matter, and a second adhesion layer interposed between the first adhesion layer and the extraneous matter. The second adhesion layer is superior to the first adhesion layer in terms of maintaining elasticity after curing. :ioo> Such a double-layered adhesion layer implemented by two adhesion layers having different characteristics from each other is advantageous in that an interconnecting surface between the first adhesion layer and the second adhesion layer has enhanced adhesive strength, and an interconnecting surface between the second adhesion layer and the extraneous matter is free from stress caused by thermal shrink/expansion, so that escape of the matter can be effectively alleviated.

:iO2> Referring to FIG. 2, in case that thickness of the second adhesion layer exceeds a certain limit, the second adhesion layer becomes susceptible to external force. Namely, there is a risk that the second adhesion layer itself is destructed by the external force because the second adhesion layer generally has relatively low mechanical strength.

ci04> For the reason, the thickness (t) of the second adhesion layer is preferably thinner than a minimum thickness (T) of the first adhesion layer being compressed by the extraneous matter. (Namely, when the second adhesion layer in a laminated form occupies about 80 to 90% with respect to an area of the first adhesion layer, adhesion strength comes to be most reliable.)

<1O6> With such an arrangement, as an external force is applied to the extraneous matter, considerable amount of the external force is taken by the first adhesion layer having superior mechanical strength, while reducing influence of the external force on the second adhesion layer as much as possible.

<i08> As depicted in FIG. 1, the second adhesion layer is configured to be concealed from the atmosphere so as to minimize change of physical properties thereof, thereby maintaining the adhesive characteristic in a favorable condition for a long time.

<πo> Further, even though the first adhesion layer maintains elasticity a little, the above mentioned technical feature is likewise exhibited.

<ii2> Hereinafter, a method for constructing the structure according to the embodiment of the present invention will be described in detail.

<ii4> First, as shown in FIG. 3, the first adhesion layer is applied on a top surface of a base. Subsequently, the second adhesion layer is applied in the form of laminate on the first adhesion layer. Thereafter the extraneous matter is positioned on the second adhesion layer and depressed before the first adhesion layer is cured. Then, the extraneous matter is implanted into the first adhesion layer (for example, to such an extent that the second adhesion layer is not exposed to the atmosphere) and fixed as it is while curing the first adhesion layer.

ii6> Meanwhile, as shown in FIG.4, alternatively, the second adhesion layer may be directly formed on a lower surface of the extraneous matter. Thereafter, the extraneous matter coated with second adhesion layer is depressed before the first adhesion layer is cured, and fixed while curing the first adhesion layer. In the event, the same structure with FIG. 3 can be obtained.

:ii8> The structure for adhering extraneous matter illustrated in FIGS 3 and

4 may be directly formed on a solid base such as a floor and a wall. However, it may be also possible to eliminate the base that is adapted for only serving as a frame for the first adhesion layer, after curing the first adhesion layer. In this case, the first adhesion layer functions as a temporary base.

d20> Such a temporary-base type structure for adhering extraneous matter is advantageous in that it can be arranged and fixed in various shapes on the solid base such like a floor and a wall in accordance with a userll demand.

<122> Meanwhile, as shown in FIG. 5, the second adhesion layer may be directly formed on a lower surface of the extraneous matter and then the extraneous matter is attached to the base. Subsequently, the first adhesion layer is formed around the extraneous matter. Preferably, the first adhesion layer is prepared by pouring and curing a first adhesive in state of fluid.

<i24> It is obvious that the base structure of FIG. 5 can be either a solid- base type or a temporary-base type likewise to those of FIGS 4 and 5.

<i26> Hereinafter, a warm foot digital compression plate will be descried in detail, in which the structure for adhering extraneous matter according to the present invention is employed.

:128> Embodiment 1

:129> FIG. 6 is a perspective view of a warm foot digital compression plate according to a preferred embodiment of the present invention and FIG. 7 is a partial sectional view of the foot acupressure plate illustrated in FIG. 6.

:i3i> As shown in FIGS 6 and 7, the warm foot digital compression plate (100) according to a first embodiment comprises a base (110), a first adhesion layer (150) formed on a top surface of the base (110), a heating element (130) interposed between the base (110) and the first adhesion layer (150), a plurality of acupressure bodies (170) attached on the first adhesion layer, and a second adhesion layer (190) formed between the acupressure bodies (170) and the first adhesion layer (150).

;i33> The base (110) is preferably made of wood which has a superior heat- resistant property, a heat-insulating property, and ease of manufacture. The base (110) serves as a frame of the first adhesion layer (150), and also functions as a portable bottom plate.

<135> The first adhesion layer (150) is preferably implemented by epoxy resin, which is relatively inexpensive and has fast cure rate among other thermosetting resins.

<137> In order to evenly distribute heat overall, the heating element (130) is implemented by a sheet-like heating element (130) in the form of a film. As a pretreatment , the sheet-like heating element (130) may be adhered to a top surface of the base (110) by bond before any other works. Further, it is preferable to provide a controller (230) for adjusting temperature of the heating element (130). (See FIGS 8 and 10) The controller (230) is composed of a timer and/or a temperature adjuster, so that a user can arbitrarily control a configuration of the heating element (130) in accordance with his or hers physical condition.

<i39> As shown in FIG. 6, the acupressure bodies (170) include acupressure protrusions (170) (native locks or imitation stones) of irregular shapes. A native lock like jade radiates far-infrared rays when being heated, which has beneficial effect to health of a foot.

:i4i> Further, there is provided with an arched acupressure protrusion (180) that is suitable for acupressing an arched portion of a sole of the foot. Preferably, the arched acupressure protrusion (180) is somewhat largely rounded than the acupressure protrusion (170) adapted for the sole of the foot.

:143> Even though the second adhesion layer (190) such as silicon may be entirely applied on a top surface of the epoxy resin (150), however, in the light of a cure rate and a cost, the second adhesion layer (190) is preferably coated on a lower surface of the acupressure protrusion (170) and then implanted into the epoxy resin (150).

ci45> As previously mentioned, because the silicon (190) functions to alleviate a difference of thermal shrink/expansion between the epoxy resin (150) and the acupressure protrusions (170), joining strength of the acupressure protrusions (170) is stably maintained.

<147> Embodiment 2

<148> FIG. 8 is a perspective view of a warm foot digital compression plate according to another preferred embodiment of the present invention, and FIG. 9 is a partial sectional view of the foot acupressure plate illustrated in FIG. 8.

<i50> The warm foot digital compression plate (200) according to a second embodiment is similar to the first embodiment in terms of its structure and function, except for difference in an acupressure protrusion body (270) compared with the acupressure body (170) of the first embodiment.

<152> Specifically, there is a difference in that the acupressure body (270) comprises a ceramic tile (273) and an acupressure protrusion (271), wherein the acupressure body (270) is integrally formed by baking the ceramic tile (273) with the acupressure protrusion (271) disposed thereon. This acupressure body (270) may be implanted into and attached to the epoxy resin (150) after silicon (290) is applied to a bottom surface thereof.

<i54> The foregoing acupressure body (270) can be arranged in tessellated format such that the epoxy resin (150) is hardly exposed, thereby preventing the epoxy resin from coming off and accomplishing an aesthetically pleasing appearance. Further, since the ceramic tile (273) radiates far-infrared rays, it facilitates improvement of health.

:i56> Embodiment 3

:157> FIG. 10 is a perspective view of a warm foot digital compression plate according to still another preferred embodiment of the present invention.

:159> As illustrated in FIG. 10, the warm foot digital compression plate

(300) according to a second embodiment is similar to the first and the second embodiments in terms of its structure and function, except that an acupressure body (370) comprises an acupressure protrusion (371) and a ceramic tile (373) interposed between the neighboring acupressure protrusions (371).

;i6i> In this instance, due to irregular shapes of the acupressure bodies

(370), the epoxy resin (150) may be partially exposed. Such exposed epoxy resin (150) serves to support a lower portion of the acupressure protrusion (371), namely to hold the acupressure protrusion (371) not to be tipped over during its attachment.

[Industrial Applicability]

<i63> The structure for adhering extraneous matter and the warm foot digital compression plate using the same of the present invention are not limited by the aforementioned embodiments and it should be appreciated that various modifications can be made by a person having an ordinary skill in the art without departing from concept or spirit of the present invention.

Claims

[CLAIMS]

[Claim 1]

A structure for adhering extraneous matter, comprising:

a first adhesion layer;

extraneous matter; and

a second adhesion layer interposed between the first adhesion layer and the extraneous matter, wherein the second adhesion layer is superior to the first adhesion layer in terms of maintaining elasticity after curing.

[Claim 2]

The structure for adhering extraneous matter according to claim 1, wherein the second adhesion layer is configured to be concealed from the atmosphere.

[Claim 3]

The structure for adhering extraneous matter according to claim 1 or 2, wherein a thickness of the second adhesion layer is thinner than the thinnest portion of the first adhesion layer being compressed by the extraneous matter.

[Claim 4]

The structure for adhering extraneous matter according to claim 3, wherein the first adhesion layer is made of epoxy or cement, and the second adhesion layer is made of silicon.

[Claim 5]

A warm foot digital compression plate comprising:

a first adhesion layer;

extraneous matter;

a second adhesion layer interposed between the first adhesion layer and the extraneous matter; and

a heating element disposed on a top surface of the first adhesion layer, wherein the first adhesion layer is formed on a base and the extraneous matter are acupressure bodies, and wherein the second adhesion layer is superior to the first adhesion layer in terms of maintaining elasticity after curing.

[Claim 6]

The warm foot digital compression plate according to claim 5, wherein the first adhesion layer is made of epoxy or cement, and the second adhesion layer is made of silicon.