WO2007066582A1 - Temperature control apparatus, exposure apparatus, temperature control method and device manufacturing method - Google Patents

Temperature control apparatus, exposure apparatus, temperature control method and device manufacturing method Download PDF

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Publication number
WO2007066582A1
WO2007066582A1 PCT/JP2006/324028 JP2006324028W WO2007066582A1 WO 2007066582 A1 WO2007066582 A1 WO 2007066582A1 JP 2006324028 W JP2006324028 W JP 2006324028W WO 2007066582 A1 WO2007066582 A1 WO 2007066582A1
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WO
WIPO (PCT)
Prior art keywords
exchanger
temperature
heat
pipe
air
Prior art date
Application number
PCT/JP2006/324028
Other languages
French (fr)
Japanese (ja)
Inventor
Toshihiko Tsuji
Tsukasa Ogiwara
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2007066582A1 publication Critical patent/WO2007066582A1/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection

Definitions

  • 0001 relates to a method of manufacturing a device and chair using this device each time the device is heated to a predetermined temperature.
  • the conductors, manufacturing, and temperature and humidity control are installed in a room, and especially semiconductors and manufacturing equipment with a high degree of processing are housed in a chamber called a cha that is cut by a partition wall.
  • 000 3 Chan is a space that is precisely controlled to the target degree, that is, positive, positive, and 5 C degrees.
  • Conductor and manufacturing The temperature is controlled by the controlled temperature.
  • a control of 000 4 Chan is usually performed using a freezing cycle.
  • the air inside the chamber is installed inside the air conditioner, and the air that absorbs the heat generated by the semiconductor / manufacturing equipment is cooled to below the constant temperature of the chamber and then set using an electric heater or the like. The temperature is controlled every time.
  • () Is a device that heats up to a predetermined temperature, and heat is exchanged between () which is supplied from a source independent of the body and the processing device and which is lower than the constant temperature, and a heat exchanger (54). If the body and the temperature are higher than the specified temperature
  • a heat exchanger (52) is provided for heat exchange with (c).
  • the above-mentioned device is provided for supplying the first body into the moving part (2) or the chamber for moving it to heat it to a predetermined temperature.
  • Figure 2 shows a two-unit configuration.
  • FIG. 7 shows how to make a chair using a table.
  • the scanning dew drives multiple moving parts 2 (physically, aters) and interacts with W. As the moving speed of W and W increases, the amount of semiconductor elements produced within a certain period of time increases, so the drive unit 2 is large and the amount of heat generated is large.
  • State 0117 is the first adjacent to Jiang 4 above.
  • a first exchanger 54 connected to the pipe P2 is arranged in the room to cool the air collected from the chain 4. Also the first
  • a second exchanger 52 is disposed in the first exchanger 54 in order to store the air cooled by the first exchanger 54. Further, a pipe P3 is arranged between the first exchanger 54 and the second exchanger 52. The exchanger 52 is connected to P, which sends air, which is conditioned to a certain degree, into the chamber 4. The second exchanger 52, the pipe P, the chain 4, the pipe P2, and the first exchanger 54 P3 form an air passage.
  • the first exchanger 54 is equipped with a meter 2 for measuring the air content.
  • pipe P is provided with 32, but this is for supplying air into the pipe of pipe P or P3, and it is not provided in pipe P, pipe P2, or pipe P3. Moyo.
  • a pipe () is generally installed in the pipe P located at CHIANG 4 in order to prevent the dyeing of W in the projection system 6 or to prevent the dyeing of W.
  • the exchanger 52 is connected to the pipe P4 for supplying the high temperature body which is the third C supplied from the factory (conductor) and the pipe P5 for discharging the heat-exchanged third C from the factory.
  • the first exchanger 54 has a second
  • the pipe P6 for supplying the low temperature body is connected to the pipe P7 for discharging the second heat-exchanged factory. That is, in the state, exposure X
  • the pipe P6 for supplying 002 to the first exchanger 54 has a heat-insulated low temperature.
  • the pipe P7 for discharging the second from the first exchanger 54 to the field is provided with a flow rate.
  • the pipe P4 that supplies the third C to the second exchanger 52 the insulated high temperature 62, the variable 2 for adjusting the amount of the body from the high temperature 62, and the temperature of the high temperature body via the variable 2 are set. A total of 4 to detect is arranged in order from the upstream.
  • the second of the states is the cryogenic body that is normally supplied and used in the semiconductor field.
  • the third C is a hot body that is normally supplied and used in the field.
  • a low temperature body is a body having a low temperature with respect to the temperature of Chan 4
  • a high temperature body is a body having a high temperature with respect to the temperature of Chang 4. Therefore, in this embodiment, since it is the target of Chang 4 of 23 OC, for example, the water of 25 C supplied from the semiconductor plant is a high temperature body, and the water of C is a low temperature body.
  • X is a step-an-skiyan movement that synchronizes with W in one dimension and transfers the tan formed in to each region on W via the projection system 6, that is, It is a loose scanning step. This is X exposed in Jiang 4
  • the Cyan 4 is installed on the floor inside the bun, firstly adjacent to it.
  • 024 is a movable system 4 that retains the movable system 2 that illuminates by exposure to light 4, a movable system 6 that projects the emitted light onto W, and a movable stage 2 that holds the W W.
  • the main body ram 25, which holds the projection system 6 etc. and the stage 2, is used to control the exposure overall.
  • the illumination system 2 is connected to the exposure through the rotating system (the system).
  • the routing system includes a part of the optical system called beam, ching, and so on. With this structure, Gakusei 2 is able to achieve a higher degree of distribution in the above prescribed region.
  • the lighting housing 2a and the routing system () are housed in non-gas (eg, um, etc.) in each part, so that the cleanliness is maintained very well.
  • the lighting housing 2a is supported by the support 26.
  • the support 26 For example, it is emitted from a lamp.
  • Ultraviolet light such as (,,,) and scratches (248) and scratches () are used.
  • the 002 stage 4 supports, and performs two movements and a small rotation in a plane perpendicular to A of the projection system 6. In addition, is vacant due to the structure of the frame formed on the mouth of the cage 4.
  • the two-way position and rotation of class 4 are measured in time by the, and output to that control unit. It is supported by the class 4 by driving the actuator based on the result of the table.
  • the class 4 is supported by the support 26.
  • Student 6 forms the tan formed in at a predetermined rate.
  • the projection system 6 has projections 4 or 5, for example, and forms a stern of the projection area conjugate to the aforementioned area. It should be noted that the projection system 6 may be reduced, and the system and the system may be shifted. The inside of 6a is cleaned with non-gas (for example, um, etc.), so that it can be cleaned very well.
  • non-gas for example, um, etc.
  • the projection system 6 is installed on the plate of the main ram 27 and supported.
  • the wastage 2 holds W and performs two movements and a small rotation in a plane perpendicular to the optical axis A by holding the drive W.
  • C W is held by vacuum on the surface of Stage 2.
  • a movement 22 is provided on the stage 2, and a unit 24 is provided on the opposite side.
  • the two-way position and rotation of the waste 2 are measured in time by the 24, and the measurement result is output to the control unit.
  • the W held by the stage 2 is performed.
  • the stage 2 is supported on the stage forming the main ram 27.
  • the 003 ram 25 is supported by a plurality of 29 toward the spout 28 installed on the surface of the Jiang 4.
  • the ram 25 has a main ram 27 supported by vibration proof 29 and a support ram 26 erected on the main ram 27 portion.
  • the projection system 6 is supported by the main ram, which is the main ram 27.
  • the support system 26 supports class 4 and lighting system 2.
  • a da chamber and a da located in this part Note that the exposure is arranged in that part. There is an outlet for jetting the air supplied from the pipe P into the channel 4 on the surface, so that the air is sent between the jet tray and the side.
  • a tan 8 is provided for exposure, and the end of a tan duct 9 is connected to this tan 8. It is connected to the pipe P2 of the duct 9. In other words, the air in the exposure is returned to the pipe P2 from the tank 8 through the tank duct 9.
  • Cyan 4 is supplied with air of 23C which is the standard value of air conditioning through the second exchanger 52 to 32P.
  • the temperature meter measures the air temperature in Chan 4 in order to confirm that 23C is being supplied to Channel 4.
  • the area where the temperature needs to be adjusted to a high level is housed in Jiang 4.
  • a drive unit 2 that generates heat is arranged in the. For example, I can reach 5 C to 7 C.
  • the air conditioning by down-type is carried out toward ((). Is discharged to the department.
  • the probometer 3 measures the degree of air blown out below the chain 4. The discharged air has risen to 237C, for example.
  • a low temperature () is supplied from the factory to the first exchanger 54 via the pipe P6 as an object of heat exchange. Since the temperature and the flow rate fluctuate, the temperature is temporarily stored in the low temperature 64, which reduces the temperature of the low temperature body and suppresses the flow rate fluctuation. , Is supplied to the first exchanger 54 via a variable adjusted so that a predetermined amount flows under control. At the mouth of the exchanger 54, the temperature of the low temperature body is measured by the thermometer 5. Here, the following is performed assuming that the temperature of the low temperature body measured by the thermometer 5 is 2C.
  • the first air and the second cold body are heat-exchanged.
  • strong heat transfer to food such as stainless steel causes the air and the low temperature body to pass through the wall such as metal, and indirectly exchanges heat with the air and the low temperature body.
  • the first exchanger 54 cools the air of 23C flowing in the pipe P2 to 23C below the C by the low temperature body, for example 22C. Supply to pipe P3. Physically, the variable is controlled by the control to adjust the amount of the 2 C body flowing to the first exchanger 54, and the air degree is reduced from 23 7C to 227C. When the temperature rises, it is discharged to the factory via pipe P7.
  • the temperature of the low temperature body flowing through the pipe P6 is 2 C
  • the temperature is measured with the thermometer 2 placed in the pipe P2, and the measured value is sent to the control as an id signal. Be done. It is introduced into the 2nd exchanger 52 of 22 7C and exchanges heat with the hot body supplied from the factory as an object of heat exchange. Since the temperature and the flow rate fluctuate, they are temporarily stored in the low temperature 64 and then supplied to the second exchanger 52.
  • the flow rate can be suppressed as the temperature of the hot body changes. Adjusts the feed rate of the hot body exchanger 52 by controlling variable 2. The temperature is measured by the thermometer 4 for the high temperature body at the mouth of the exchanger 52.
  • the exchanger 52 exchanges the first air and the third C high temperature body. Good heat transfer to food such as stainless steel, etc. Air and hot body are separated via the wall made of metal, etc., and heat is indirectly exchanged between air and hot body.
  • the second exchanger 52 feeds the gas of 227C flowing to the pipe P3 to the pipe P after making it up to 23C by the high temperature body.
  • the variable 2 is controlled by the control to adjust the amount of the body of 25 C flowing to the second exchanger 52, and the air degree is increased from 22 7 C to 23 C. , It is discharged to the factory via pipe P5 with the temperature lowered.
  • control specifically uses P control using proportional, integral, and action, or the control that defines the man, the number, and the fuzzy to put the human camellia in the evaluation. Then, control the temperature inside Chan 4.
  • the thermometer 5 without thermometer is constantly measured to adjust the thermometer to 230 ° C, and the variable 2 is controlled by adjusting the amount of the low temperature body and the body.
  • the amount of air flowing in Chan 4 is adjusted, and the amount of air circulating in Chan is controlled by Atta 32.
  • the difference between the state and the first state is that The point is that the body is not directly introduced into the first exchanger 54 or the second exchanger 52. That is, in addition to the second and first states, a first intermediate heat exchanger 58 and a second intermediate heat exchanger 56 are further provided.
  • a high temperature 62 64 was provided to control the temperature and quantity. However, when the temperature and movement of the low temperature body and body supplied from the factory are large, it is determined that the high temperature 6264 alone is not sufficient. In the state, the amount and the degree of the low temperature body and the body introduced into the first exchanger 54 or the second exchanger 52 are very large and suitable.
  • a first exchanger 54, a second exchanger 52, a first intermediate heat exchanger 58 and a second intermediate heat exchanger 56 are arranged.
  • the intermediate heat exchanger 58 is connected to a pipe P6 for supplying a low-temperature body supplied from the factory and a pipe P7 for discharging the heat-exchanged body from the factory.
  • the second intermediate heat exchanger 56 is connected to a pipe P4 for supplying a hot body supplied from the field and a pipe P5 for discharging the heat-exchanged body from the factory.
  • the low temperature 64 from the upstream side, the variable temperature, and the thermometer 5 are arranged, as described in the first state. Further, a high temperature 62, a variable 2 and a thermometer 4 are arranged from the upstream side in the pipe P4 for supplying the high temperature body.
  • the one intermediate heat exchanger 58 is followed by the first exchanger 54 P P, and the auxiliary () is unidirectional in these pipes by the pump 36.
  • the second intermediate heat exchanger 56 is followed by the second exchanger 52 P89, which is assisted in these pipes by the pump 36 (
  • NAT trade name of Sum Co., Ltd.
  • IDOTE IDOTE
  • variable 3 and the thermometer 7 are arranged in the order from the direction of the flow.
  • variable 4 thermometers 6 are arranged in the order from the direction of the flow.
  • the air and the auxiliary body are exchanged. If the target is to set the inside of the channel 4 to 23C, the first exchanger 54 controls so that the air of 23 7C flowing in the pipe P2 is cooled to 22 7C and then flows into the pipe P3. Physically, the variable 3 is controlled by adjusting the amount of 22 C body flowing into the first exchanger 54.
  • the temperature control is easy because the temperature of the auxiliary equipment is stable and the temperature is stable compared to the low temperature body directly supplied from the factory.
  • 227C in 004 P3 is introduced into the second exchanger 52.
  • an auxiliary body that circulates between the second intermediate heat exchanger 56 and the second intermediate heat exchanger 56 as a target for heat exchange is supplied to the second exchanger 52 through the pipe P8.
  • the intermediate heat exchanger 56 is supplied with an average of 25C of body that is input from the factory through P4. For this reason, when measured with the thermometer 6, it is possible to change it by control so that a body of 24 C that is almost constant flows. 2 is controlled. It is discharged via pipe P5 in the condition that the high temperature and the temperature are lowered.
  • the air is exchanged with the auxiliary body.
  • the exchanger 52 controls the air at 227C flowing in the pipe P3 to 23C, and controls the air to flow in the pipe P.
  • the variable 2 is controlled by adjusting the amount of the body of 24 C flowing into the second exchanger 52.
  • the temperature is stable because the second high temperature inside is stable and the temperature is stable compared to the high temperature body supplied directly from the factory.
  • the high temperature 62 64 need not be provided.
  • the temperature meter 4 or the thermometer 5 for measuring the temperature of the cold body and the body. This is because the body and body degree can be measured with the thermometer 6 or the thermometer 7.
  • the 0051 uses the P control to constantly measure the thermometer without the thermometer 7 and controls the variable 4 to control the temperature inside the channel 4. If the pump 36 is a variable pump,
  • the difference from the state is that the high temperature body supplied from the factory is not necessary, and the air discharged from the chair 4 is first heat-exchanged in the third exchanger 42 and then heat-exchanged. This is the point that air is used as the first exchanger 54. Well In the third state 4, the heat of the air discharged from the chamber 4 is effectively used.
  • the first exchanger 54, the second exchanger 52, and the exchanger 42 are arranged at 4.
  • Exchanger 42 includes a third exchange 42 and a second exchange 42.
  • the pipe P 2 connecting with () and the pipe P 3 connecting the second exchanger 52 to the third exchanger 42 are connected.
  • the exchanger 42 is arranged between the P2 connecting the first exchanger 4 of the Cha 4 and P2.
  • the thermometer 3 provided in the pipe P2 is arranged between the third exchanger 42 and the first exchanger 54 so that the degree of the cooled and cooled air can be determined.
  • a pipe 44 for supplying 52 exchangers is provided with a heater 44, a variable 5 and a thermometer 8 from the upstream side.
  • the pump 36 is connected to the pipe P 2 or the pipe P 3, and the body is oriented in a certain direction in the pipes of the second exchanger 52, the third exchanger 42, and the pipe P 2 P 3 by the pump 36. . Since it is only enclosed within No. 34, it does not matter if the body or species is of any body type, such as NAT (trade name of Sum Co., Ltd.) or (Idote), or water. It can be the body.
  • the third exchanger 42 of, for example, 237 C discharged from Chang 4.
  • the body circulating between the third exchanger 42 and the second exchanger 52 is supplied through the pipe P 3.
  • the degree of air is almost equal to 23 C due to the exchange with the air, and it is supplied to the third exchanger 42 in the state of 23 C.
  • heat is exchanged between the air at 237 C and the body at 23 C, and the temperature drops to 234 C in the case of air, for example, and it rises to 234 C, which is almost equivalent to the air in the body, and cools to 234 C.
  • the separated air is introduced into the first exchanger 54.
  • the air cooled to 234 ° C. in the third exchanger 42 and the low temperature body are exchanged. Will be seen. Similar to the state, the oC body supplied from the factory flows into the first exchanger 54. If the goal is to make the inside of Chan 4 C, the first exchanger 54 controls so that the air of 23 3C flowing to the pipe P2 is cooled to 227C and then flows to the pipe P3. Physically, the variable is controlled by adjusting the amount of the body of C flowing into the first exchanger 54 and controlling it.
  • 227C in P007 P3 is introduced into the second exchanger 52.
  • the body of 234C is supplied to the second exchanger 52 through the pipe P 2.
  • the exchanger 52 controls so that the air of 22 7 C flowing in the pipe P3 is reduced to 23 C and flows into the pipe P.
  • the control uses a variable 5 to control the amount of the body of 23 4C flowing into the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer.
  • the exposure is used to control the degree of the air introduced into the chamber 4.
  • the temperature in the area of (3) has not risen yet, and it is almost the same as the supplied air of the air discharged through the pipe P2. Therefore, immediately after the start of exposure, the body temperature does not rise to the desired degree, and it is not possible to control the air temperature via the second exchanger 52. Therefore, immediately after the start of exposure, the auxiliary heater 44 is used to warm the body and control the air level.
  • the control is based on the result of the thermometer 8 of the auxiliary heater 44.
  • the control reduces the power of the auxiliary heater 44, or Stop if necessary.
  • the control does not change the degree of body movement not only after exposure. Therefore, the auxiliary heater 44 can always be operated based on the result of the thermometer 8. In this case, it is desirable that the auxiliary heater 44 has the minimum force necessary to compensate for fluctuations in the body.
  • thermometer 006 uses the P control to control variable 5 based on the results of thermometer without thermometer 3 and thermometer 58, to control the temperature inside channel 4.
  • FIG. 5 is a stem of the stem according to the clear state.
  • This stem is equipped with C4 which is a modification of the C part of the first state, and those having the same function as C are given the same symbols.
  • the fourth aspect is that the fourth state requires a high-temperature body supplied from the factory.Instead, the heat from the heater 32 and its board is exchanged with the fourth exchanger 34, and the heat is exchanged. This is the second exchanger 52. This is an embodiment in which the heat of the heat source in the 4th chamber is effectively utilized in the 4th state.
  • the fourth exchanger 34 is arranged at 32, which is arranged at the offset of P, the pipe P2, or the pipe P3. In addition, in 5, 32 is placed in pipe P3.
  • the 006 exchanger can be a device that is directly attached to the pump tank, and the fourth exchanger 34 has a main purpose of absorbing the heat of the pump, so it is a profitable path for 4. Only the picture is drawn.
  • the four exchangers 6 are provided with the first exchanger 54, the exchanger 52, and the exchanger 34.
  • a pipe P 4 branched from a pipe P 7 for discharging low temperature () stored in the first exchanger 54 is connected to the exchanger 34.
  • the low temperature () introduced into the fourth exchanger 34 increases in temperature due to the fourth exchanger 34 and becomes high temperature ().
  • the low temperature () and the high temperature () are the same () flowing in the same flow.
  • the description will be given by changing the name of the body of the converter 34.
  • a pipe 44 for supplying the second exchanger 52 from the fourth exchanger 34 is provided with a heater 44 from the upstream side, a variable 6 and a thermometer 9.
  • the pump 36 is arranged in the pipe P 5, but it may be arranged in the pipe P 4.
  • the force from the pipe P7 for discharging the hot body is strong, it is not necessary to install the pump 36. After being introduced into the exchanger 52 and undergoing heat exchange, it is shipped to the factory. 006 (state)
  • the water which is a 2 C body supplied to the exchanger 54, is discharged via the pipe P7 in a state where the temperature has risen in the first exchanger 54, for example, every 25 ° C. It is sent to the 4th exchanger 34 every 25C.
  • the low-temperature heat sent to the exchanger 34 and the heat generated at 32 are collected by the fourth exchanger 34 and discharged from the fourth exchanger 34 as a body of 235C.
  • 227 CC in P006 P3 is introduced into the second exchanger 52.
  • the body of 235C is supplied to the second exchanger 52 through the pipe P5.
  • the exchanger 52 controls so that the air of 22 7 C flowing in the pipe P3 is reduced to 23 C and flows into the pipe P.
  • the control uses the variable 6 to control the amount of the 2 3 5 C body flowing to the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer. It is sent to the factory via the exchanger 52.
  • the heat generated in the stator 32 during the startup is low, so it is necessary to adjust the temperature of the high temperature body with the auxiliary heater 44. Also, even after exposure to light, the heater 44 can be used to control the fluctuation of the hot body, as in the third state.
  • the open path was constructed by the pipes P 4 P 5, but as in the third state, the circuit was constructed by the fourth exchanger 34, the second exchanger 52, and the pipes P 4 P 5. Even Control the variable 6 based on the results of the thermometer without thermometer 3 and thermometer 5 g using the P control to control the temperature inside channel 4.
  • the low temperature body is heated only by the fourth exchanger 34, but the low temperature body may be heated by using the heat generated by the pump 36 other than this. .
  • the power of the heater 44 can be reduced, and more energy can be achieved.
  • the fifth aspect is that the fifth state requires a high-temperature body supplied from the factory, and instead, the low-temperature (heated through the first exchanger 54) (
  • a pipe P 6 is provided so as to branch from the pipe P 7 for discharging the low temperature () stored in the exchanger 54.
  • a heater 44, a pump 36, a variable 7 and a thermometer are arranged from upstream in the pipe P 6. Note that the pon 36 is not necessary when the force from the pipe P7 that discharges the low temperature body is strong.
  • Water which is the body of 2 OC supplied to the exchanger 54, is discharged via the pipe P7 in a state where the temperature has risen in the first exchanger 54, for example, at a temperature of 225 ° C. Since the temperature of 22 5C is too high to supply to the second exchanger 52, it is heated up to 23 5C by the low temperature auxiliary heater 44 and the high temperature (
  • the high temperature () is the same () branched from the low temperature (), but for the sake of explanation, the description of the body of the above-mentioned heater 44 will be changed.
  • 225C in P0071 P3 is introduced into the second exchanger 52.
  • the body of 235C is supplied to the second exchanger 52.
  • the exchanger 52 controls the air at 225C flowing in the pipe P3 to 23C, and controls the air to flow in the pipe P. Physically, the control uses the variable 7 to control the amount of the 2 3 5 C body flowing to the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer. It is sent to the factory via the exchanger 52.
  • thermometer 007 uses the P control to control variable 7 based on the results of thermometer without thermometer 3 and thermometer 5 to control the temperature inside channel 4.
  • the air supplied to the channel 4 is adjusted to a predetermined temperature. It is necessary to limit the supply to Chan to air. For example, it could be gas.
  • One of the six faculties can be applied as.
  • NAT trade name of Sum company
  • IDOTE IDOTE
  • the exposure X can also be applied to a step-and-stitch type exposure in which at least two tans are partially overlapped and transferred on the c.
  • the exposure X can also be applied to a device that closely turns a disc that does not use a projection system to turn it.
  • the exposure X it can be applied to a device. That's it
  • a method disclosed in International Publication No. 2453958 is known as a method of filling the space between the projection system and the base with a body.
  • the exposure X it is also applicable to a device in which a stage holding the exposed material is moved in the bath, and a device for forming a predetermined on the stage and holding the substrate in it.
  • a measuring stage equipped with various materials and / or sensors that can move while holding a substrate such as c. It can also be applied to a device equipped with.
  • the operation procedure, or combination, etc. in the above-mentioned state is an example, and it can be based on the process condition and the design within the range that is not deviated from the reason.
  • the movable stage is not limited to the conductor window made of semiconductor device, but the glass for display device, Servos for shoes, or discs or slabs used in the location (English, English), etc. are applicable.
  • the device type is not limited to a semiconductor device device that uses a semiconductor tank, and a device, a pad, (CC), an equine chip, an S chip, or a mask or a mask device made by a child manufacturing display device. It can also be applied to equipment for manufacturing etc., and can also be applied to insta-type equipment that has multiple usages. Twin stage type construction and, for example,
  • a disc having a predetermined tan (or a tan tan) formed on the transient, or a disc having a predetermined tan formed on the emissive is used.
  • a tan or a reflection tan or a luminescence tan is formed based on the data of the exposure tan (also called a morpho-form tan, for example, the image display ()).
  • Includes seeds Dg a Mc omo Devce
  • the light can also be applied to exposures that are actually created by the interaction of a plurality of bundles, for example, called two lights. It is disclosed in the law and, for example, in International Publication No. 3568.
  • Kaki 248
  • Kaki 93, 2 Kiza (57), etc.
  • () (365), etc. can be used for the position to which Ming is applied. If only system reduction And even a deviation of the system.
  • the stages WST and RS may be of a type that moves along a guide or a guide type that does not have a guide.
  • a moving mechanism of the stage it is also possible to use a flat plate that drives a stage by a magnetic force that opposes a two-dimensionally arranged stone and an two-dimensionally arranged arm. In this case, connect one side of the magnet to the stage and connect the side to the magnet to the moving surface of the stage.
  • the process of establishing the system from the system includes mechanical connection, connection of electrical circuits, and air pressure between various systems. It goes without saying that there is a system stand-up process before this system stand-up process. After the process of setting up the system is completed, the overall adjustment is performed and the degree as an exposed body is secured. In addition, it is desirable that the exposure temperature and kun are controlled. It should be noted that, as far as legally permitted, all examples of exposure equipment and the like are incorporated into the text of this document.
  • equates such as conductor chairs have a step of performing an equate measurement step, a step of manufacturing a step based on this step, a step 2 of manufacturing materials, and the steps of the above-described embodiment.
  • Exposure process, exposing process, developing process, developing process, including process such as (key) etching process, step 3 It will be manufactured through the inspection step 5 and so on.
  • the equipment unit can be dispensed with a refrigerator or the like.

Abstract

A temperature control apparatus controls the temperature of a body (104), the temperature of which is to be controlled, to be at a prescribed temperature by means of a first medium flowing in a circulation flow path. The temperature control apparatus is provided with a first heat exchanger (54), which exchanges heat between the first medium and a second medium (B) which is supplied from a supply source independent from a processing apparatus and the temperature control apparatus and is at a temperature lower than the prescribed temperature, and a second heat exchanger (52) which exchanges heat between the first medium and a third medium (C) which is at a temperature higher than the prescribed temperature.

Description

置 、  Location
、露光 置、温 法及び イスの製 法 術分野  , Exposure equipment, temperature and chair manufacturing fields
0001 、 を所定温度に温 する びにこのよ 置を 用 た 置及び イスの製 法に関する。 0001, relates to a method of manufacturing a device and chair using this device each time the device is heated to a predetermined temperature.
、 2 5 2 5日に出願された 2 5 35 943号に基 き 先権 を主張し、その 容をここに援用する。  , Claiming priority on the basis of No. 25 35 943, filed on May 25, 2005, the content of which is incorporated herein.
0002 導体・ 製造をはじめとした精密 工を行 造にお て、製造 年間を 通じて安定した運転 態を維持し、また停止 態にお ても 身の 度を維持 するために安定した環境 にお れる必要がある。 導体・ 製造 、温湿 度制御がされたク ン ム内に設置されると共に、特に加工 度の 半導体・ 製造 置などは隔壁で 切 たチャ と呼ばれる 器内に収容される。 002 Conducting precision work such as conductors and manufacturing to maintain a stable operating condition throughout the manufacturing year, and maintain a stable environment in order to maintain a high level of personality even in a stopped condition. Need to be done. The conductors, manufacturing, and temperature and humidity control are installed in a room, and especially semiconductors and manufacturing equipment with a high degree of processing are housed in a chamber called a cha that is cut by a partition wall.
0003 チャン 内は、半導体・ 製造 置の 境を維持するため、 目標 度 に対してプラス イナス ・ 「 プラス イナス ・ 5 C 度に精密 度制御さ れた空間である。 導体・ 製造 、このよ 度に制御された温度 によ て 度を確保して る。 In order to maintain the boundary between semiconductors and manufacturing equipment, the inside of 000 3 Chan is a space that is precisely controlled to the target degree, that is, positive, positive, and 5 C degrees. Conductor and manufacturing The temperature is controlled by the controlled temperature.
0004 チャン の 度制御は、通常、冷凍サイク を用 て行われる。この サイク では、チャン 内の空気を空調 内に設置した に導入し、半導体・ 製造 置 ら発生する熱を吸 した空気を、チャン の 定温度以下まで 却した 後、電気ヒ タ等を用 て設定温度まで する 度制御を行 。 A control of 000 4 Chan is usually performed using a freezing cycle. In this cycle, the air inside the chamber is installed inside the air conditioner, and the air that absorbs the heat generated by the semiconductor / manufacturing equipment is cooled to below the constant temperature of the chamber and then set using an electric heater or the like. The temperature is controlled every time.
0005 方、半導体・ の 代が進むに れ、半導体・ 製造 大型 すると 同時に消費する電力の量も増加し、半導体 工場での 増大する 傾向にある。プラス イナス ・ 「 プラス イナス ・ 5 Cの 度な 度制御 を必要する半導体・ 製造 、この 度な 度制御を実現するために、 台の半導体・ 製造 置に対して 台の冷 を備えて た。On the other hand, as the cost of semiconductors and semiconductors increases, the amount of power consumed at the same time increases as semiconductors and manufacturing become larger, and semiconductor factories tend to increase. PLUS INUS • “PLUS INUS • Semiconductors / manufacturing that requires a degree of control of 5 C. In order to achieve this degree of control, the stage was equipped with cooling for the stage semiconductor / manufacturing equipment.
W 74 8 ン 明の W 74 8 Of Ming
明が解決しよ とする課題  Problems that Ming is trying to solve
0006 導体 造業界にお ても、環境保護の 点 ら、また電力消費量の 減の 点 らも、半導体・ 製造 置及びその 辺装置の 力を極力 さ ること が求められて る。 006 In the conductor manufacturing industry, it is required to maximize the power of semiconductors / manufacturing equipment and its peripheral devices in terms of environmental protection and reduction of power consumption.
また、半導体・ 製造 冷凍機などを用意した場合には、環境保護 電力消費の 減の ば りでな 、装置 体の ストが高 なる 題がある。 0007 、装置 ストの 抑制し の に必要な消費 力を減 少さ 置、露光 置及び イスの製 法を提供することを目的とす る。  Also, when semiconductors and manufacturing refrigerators are prepared, there is a problem that not only the environmental protection and reduction of power consumption, but also the cost of the equipment is high. 0007, It is an object of the present invention to provide a manufacturing method of an exposure apparatus and a chair for reducing the power consumption required for controlling the apparatus cost.
題を解決するための  To solve the problem
0008 、処理装置( )が える ( 4)を、 を流れる第一0008, the processing device () (4), the first flowing through
( )に 所定温度に温 する 置であ て、その 体と処理装置及び とは独立した 給源 ら供給され 定温度 りも低温の ( ) との間で熱交換を〒 交換器(54)と、その 体と所定温度 りも高温の () Is a device that heats up to a predetermined temperature, and heat is exchanged between () which is supplied from a source independent of the body and the processing device and which is lower than the constant temperature, and a heat exchanger (54). If the body and the temperature are higher than the specified temperature
(c)との間で熱交換を〒 交換器(52)とを備える。  A heat exchanger (52) is provided for heat exchange with (c).
0009 また、 明の ( X)は、感光 (w) に タ ンを する 000 Also, the light (X) turns on the light exposure (w).
、前記 を収納する 4)とを備える 置にお て、前記  , 4) for storing the above, and
を移動さ る 動部( 2)又は前記チヤン 内に第一 体を供給して所定温 度に温 する として、上記の 置を備えて る。  The above-mentioned device is provided for supplying the first body into the moving part (2) or the chamber for moving it to heat it to a predetermined temperature.
0010 さらに、 明の イス製 、 グラ ィ 程にお て上記 置を 用 ることを特徴とする。 001 Further, it is characterized by using the above-mentioned device in the gray process, made by Ming chair.
明の  Of Ming
0011 明に れば、 に対して第一 体の 制御しな がら、 に必要であ た電力消費を少な することができる。 [0111] It is clear that the power consumption required for the above can be reduced while controlling the first for the above.
0012 態に係る ステムの ステム である。 2 置の 細構成を示す である。This is the stem of the stem related to the 002 state. Figure 2 shows a two-unit configuration.
3 態に係る ステムの ステム である。 It is the stem of the stem according to three states.
4 態に係る ステムの ステム である。 It is the stem of the stem related to four states.
5 態に係る ステムの ステム である。 It is the stem of the stem related to 5 states.
6 態に係る ステムの ステム である。 It is the stem of the stem according to 6 states.
7 置を使用した イスの製 法を示す である。  7 shows how to make a chair using a table.
号の  Of the issue
0013 C ~ C5 置、 X 置、36 ポンプ、42 交換器、 001 C ~ C5 position, X position, 36 pumps, 42 exchangers,
、52 交換器、54 交換器、 56 交換器、58 交換 器、62 、64 、 置、 4チャン 、 6 学系、 ~ 7 、 ~ 度計  , 52 exchangers, 54 exchangers, 56 exchangers, 58 exchangers, 62, 64, equipment, 4 chan, 6 academic systems, ~ 7, ~ meter
明を実施するための 良の  Good for carrying out Ming
0014 下、本 明の 適な実施の 態に て 面を参照して説明する。 [0114] An appropriate implementation of the present invention will be described below with reference to aspects.
( 態の )  (State)
は、 明の 態に係る ステムの ステム である。 にお て、露光 Xを構成するチャン 4は、投影 学系 6を介して  Is the stem of the stem according to the apparent state. In the exposure X, Chan 4 is
に描 れた タ ンを Wに投影するスキャン 式の露  Scan type dew for projecting the tan on the W
を収容して る。スキャン 式の露 は、複数の 動部 2( 体的には ア タ)を駆動さ て、 Wとを相互 動さ る 。 Wとを移動さ る速度が速 ほど、一定時間内に 造される半 導体 子の量が多 なるため、駆動部 2は大型 しており、 その 生する熱 は多大なものとな て る。  Is housed. The scanning dew drives multiple moving parts 2 (physically, aters) and interacts with W. As the moving speed of W and W increases, the amount of semiconductor elements produced within a certain period of time increases, so the drive unit 2 is large and the amount of heat generated is large.
0015 これら ら発生する熱は、半導体を製造する際には精度上の問 題を生じさ る。たとえば、投影 学系 6に温度変化が生じると 影像が変 、 ノメ ト 位で制御が必要な 導体 タ ンの ね合わ 度が低下する。ま た、熱によ て Wを移動さ るステ ジが熱膨張すると、同様に 半導体 タ ンの ね合わ 度が低下する。このよ 背景 ら、チャン 4内 には一定の 度に調整された第一 、具体的には空気 ガス( えば ガス)が常時 給されて る。 下、第一 が空気であることを前提に説明する 0016 チヤン 4には、一定の 度に調整された空気をチヤン 4内に送り込む[0115] The heat generated from these causes an accuracy problem when manufacturing a semiconductor. For example, if the projection system 6 changes in temperature, the image changes, and the degree of matching of the conductor tans that needs to be controlled at the nominal position decreases. Moreover, when the stage that moves W by heat expands thermally, the matching degree of the semiconductor tan also decreases. Against this background, the first, specifically air gas (for example, Gas) is always supplied. Below, we will explain on the premise that the first is air. In 0016 Chan 4, the air adjusted to a certain degree is sent into Chan 4.
P と、チヤン 4内の熱を奪 度が上が た空気を外 出す P2が配置 されて る。また、チヤン 4内には、 チヤン 4内の空気温度を測定する ための 度計 が設置 れ、配管P2には、 P2内の空気温度を測定する ための 度計 3が設置されて る。チヤ 4内は、 様に応じて一定 の 度に設定される。 般的に、チヤン 4内は C ら25Cの 定温度に保 たれて るが、 態では、23Cプラス イナス ・ C 後に調整する ことを前提に説明する。  There are P and P2, which removes the heat that has taken away heat in Chillan4. In addition, a meter for measuring the air temperature in Chan 4 is installed in Jiang 4, and a meter 3 for measuring the air temperature in P2 is installed in pipe P2. The inside of the cheer 4 is set at a certain degree according to the situation. Generally, the temperature inside Cyan 4 is maintained at a constant temperature from C to 25C, but in the state, the explanation will be made on the assumption that the temperature will be adjusted after 23C plus • C.
0017 態の C は、上記チヤン 4に隣接した第一 State 0117 is the first adjacent to Jiang 4 above.
内に配置されて る。 には、チヤン 4 ら回収した空気を冷却 するため、配管P2に接続された第一 交換器54が配置される。また、第一  It is located inside. A first exchanger 54 connected to the pipe P2 is arranged in the room to cool the air collected from the chain 4. Also the first
には、第一 交換器54によ て冷却された空気を めるために、第二 交換器5 2が配置されて る。また、これら第一 交換器54 第二 交換器52と間には、配 管P3が配置されて る。 交換器52には、一定の 度に調整された空気をチ ヤン 4内に送り込む P が接続されて る。これら第二 交換器52、配管P 、チヤン 4、配管P2、第一 交換器54 P3は、空気を さ る を形成して る。  A second exchanger 52 is disposed in the first exchanger 54 in order to store the air cooled by the first exchanger 54. Further, a pipe P3 is arranged between the first exchanger 54 and the second exchanger 52. The exchanger 52 is connected to P, which sends air, which is conditioned to a certain degree, into the chamber 4. The second exchanger 52, the pipe P, the chain 4, the pipe P2, and the first exchanger 54 P3 form an air passage.
0018 P3には、第一 交換器54を 空気の 度を測定する 度計 2が配置さ れて る。なお、配管P には 32が設けられて るが、これは配管P な し P3の 管内に空気を さ るものであり、配管P 、配管P2又は配管P3の ず れの 所に設けてお てもよ 。また、チヤン 4の に位置する配管P に は、投影 学系 6の ンズの れにならな よ に、又は Wの 染を防止するために、一般に ィ タ( )が配置してある。 0019 交換器52には、工場( 導体 ) ら供給される第三 Cである 高温 体を供給する配管P4と、熱交換された第三 Cが工場 出される配管P 5とが接続されて る。また、第一 交換器54には、工場 ら供給される第二 である低温 体を供給する配管P6と、熱交換された第二 が工場 出される 配管P7とが接続されて 。すなわち、 態では、露光 XAt 0018 P3, the first exchanger 54 is equipped with a meter 2 for measuring the air content. Note that pipe P is provided with 32, but this is for supplying air into the pipe of pipe P or P3, and it is not provided in pipe P, pipe P2, or pipe P3. Moyo. In addition, a pipe () is generally installed in the pipe P located at CHIANG 4 in order to prevent the dyeing of W in the projection system 6 or to prevent the dyeing of W. [0119] The exchanger 52 is connected to the pipe P4 for supplying the high temperature body which is the third C supplied from the factory (conductor) and the pipe P5 for discharging the heat-exchanged third C from the factory. In addition, the first exchanger 54 has a second The pipe P6 for supplying the low temperature body is connected to the pipe P7 for discharging the second heat-exchanged factory. That is, in the state, exposure X
C とは独立した 給源である工場 ら第二 ( ) From the factory, which is a source independent of C,
( )が供給される。  () Is supplied.
0020 を第一 交換器54に供給する配管P6には、断熱 われた低温The pipe P6 for supplying 002 to the first exchanger 54 has a heat-insulated low temperature.
64と、低温 64 らの 体の 量を調整する可変 と、可変 を経由した低温 体の 度を検出する 度計 5とが上流側 ら順に配 置されて 。 方、第二 を第一 交換器54 ら 場に排出する配管P7に は、 流量 設けられて 。また、第三 Cを第二 交換器52に 供給する配管P4には、断熱 われた高温 62と、高温 62 らの 体の 量を調整する可変 2と、可変 2を経由した高温 体 の 度を検出する 度計 4とが上流 ら順に配置されて 。 方、第三 Cを 第二 交換器52 ら 場 出する配管P5には、 流量 設けられ て 。  64, a variable that adjusts the amount of the cold body from the low temperature 64, and a degree meter 5 that detects the degree of the low temperature body via the variable are arranged in order from the upstream side. On the other hand, the pipe P7 for discharging the second from the first exchanger 54 to the field is provided with a flow rate. In addition, in the pipe P4 that supplies the third C to the second exchanger 52, the insulated high temperature 62, the variable 2 for adjusting the amount of the body from the high temperature 62, and the temperature of the high temperature body via the variable 2 are set. A total of 4 to detect is arranged in order from the upstream. On the other hand, there is a flow rate in the pipe P5 that outputs the third C from the second exchanger 52.
0021 ここで、半導体 、露光 X 外にも、ウ Wに ジストを 002 Here, in addition to semiconductors and exposure X
ジスト 置、ウ Wを ポ ング ポ ング 置、又は搬 置などを備えており、それらの に必要な 高温 体を供給するた めの 備を有して 。 態における第二 は、このよ に半導体 場で通常 給され、使用されて 低温 体である。 方、第三 Cは、 場で通常 給され、使用されて 高温 体である。これら低温 体及び  It is equipped with a gist device, a W device, a pong device, a carry device, etc., and a facility for supplying the hot body required for them. The second of the states is the cryogenic body that is normally supplied and used in the semiconductor field. On the other hand, the third C is a hot body that is normally supplied and used in the field. These cold bodies and
、具体的には水である。  , Specifically water.
0022 なお、本明細書にお 低温 体とは、チャン 4の 標の 度に対して低温 の 体を 、高温 体とはチャン 4の 標の 度に対して高温の 体を 。したが て、本実施 態にお ては、チャン 4の 標の 23 OCである ので、例えば、半導体 場 ら供給される25Cの水は高温 体であり、 Cの 水は低温 体である。 In the present specification, a low temperature body is a body having a low temperature with respect to the temperature of Chan 4, and a high temperature body is a body having a high temperature with respect to the temperature of Chang 4. Therefore, in this embodiment, since it is the target of Chang 4 of 23 OC, for example, the water of 25 C supplied from the semiconductor plant is a high temperature body, and the water of C is a low temperature body.
0023 2は、露光 Xの 細構成を示す である。なお、以下に説明する002 3 shows the fine structure of the exposure X. It will be described below
Xの 細構成は、後述する 態にお ても同様である。 Xは、 Wとを一次元 向に同期 動し 、 に形成された タ ンを投影 学系 6を介して W上の各 ョッ 域に転 写するステップ・アン スキヤン 式の走 置、すなわち、 わゆるスキヤ ング・ステッ である。このよ Xはチヤン 4内に露光 The detailed structure of X is the same in the state described later. X is a step-an-skiyan movement that synchronizes with W in one dimension and transfers the tan formed in to each region on W via the projection system 6, that is, It is a loose scanning step. This is X exposed in Jiang 4
が収納されたものであり、チヤン 4は、第一 に隣接した状態でク ン ム内の床面 上に設置されて る。  The Cyan 4 is installed on the floor inside the bun, firstly adjacent to it.
0024 は、露光 により を照明する 学系 2、 を保持して移動 能な ク ステ ジ 4、 ら 出される を W上に投射する 学系 6、ウ Wを保持して移動 能な ステ ジ2 と、投影 学系 6等を保持すると共に ステ ジ2 が され る本体 ラム25、露光 を統括的に制御する の 024 is a movable system 4 that retains the movable system 2 that illuminates by exposure to light 4, a movable system 6 that projects the emitted light onto W, and a movable stage 2 that holds the W W. The main body ram 25, which holds the projection system 6 etc. and the stage 2, is used to control the exposure overall.
 .
0025 学系 2は、 ク ステ ジ 4に支持されて る を で 明するものであり、 の 源 ら 出された の 度を 002 Academic system 2 is supported by class 4, and the degree of
オプテイカ インテグ タ、 ンデンサ ンズ、 ンズ系、 上 の露 による 域をス ット状に設定する可変 ( ずれも Optical Integrator, Densers, Lenses, Variable to set the area due to the upper dew to a stud shape
)を有して る。これらの 学部 、照明 ウジング 2a内に所定の 係 で 容される。  ) Is included. These faculties will be housed in the lighting housing 2a with predetermined responsibilities.
0026 また、照明 学系 2は、 の き回し 学系( 学系)を介して、露光 に接続されて る。なお、引き回し 学系は、その な とも一部にビ ム・ 、チング・ ット 呼ばれる光軸 の 学系を含む。 学系 2は、このよ 構成により、 上の所定の 域を、より 一な 度分布の で 能とな て る。 [0026] The illumination system 2 is connected to the exposure through the rotating system (the system). The routing system includes a part of the optical system called beam, ching, and so on. With this structure, Gakusei 2 is able to achieve a higher degree of distribution in the above prescribed region.
なお、照明 ウジング 2a、引き回し 学系が収容される ( )は、それ ぞれ 部が不 ガス( えば 、 ウムなど)で ジされ、清浄 が極めて 良好に 持されるよ にな て る。  In addition, the lighting housing 2a and the routing system () are housed in non-gas (eg, um, etc.) in each part, so that the cleanliness is maintained very well.
0027 また、照明 ウジング 2aの な とも一部は、サポ ト ラム26により支持される 。 源 ら 出される としては、例えば ランプ ら 出される の ( 、 、 )、 キ ザ ( 248 ) キ ザ ( )等の紫外光が用 られる。 002 In addition, most of the lighting housing 2a is supported by the support 26. For example, it is emitted from a lamp. Ultraviolet light such as (,,,) and scratches (248) and scratches () are used.
0028 ク ステ ジ 4は、 を支持し 、投影 学系 6の A に垂 直な平面内の2 動及び 小回転を行 ものである。なお、 は、 ク ステ ジ 4に形成された 口の 囲に設けられた ク 構により真 空 される。 ク ステ ジ 4 の の2 向の 置及び回転 、 ザ により ア タイムで計測され、その 制御 置に出力される。 置が ザ の 果に基 て ア タ等を 駆動することで、 ク ステ ジ 4に支持されて る の めが行わ れる。なお、 ク ステ ジ 4は、サポ ト ラム26により支持される。 The 002 stage 4 supports, and performs two movements and a small rotation in a plane perpendicular to A of the projection system 6. In addition, is vacant due to the structure of the frame formed on the mouth of the cage 4. The two-way position and rotation of class 4 are measured in time by the, and output to that control unit. It is supported by the class 4 by driving the actuator based on the result of the table. The class 4 is supported by the support 26.
0029 学系 6は、 に形成された タ ンを所定の 率で 002 Student 6 forms the tan formed in at a predetermined rate.
Wに投影 するものであ て、複数の 子で構成される。これら光学 It is projected on W and consists of multiple children. These optics
6aで支持される。 実施 態にお て、投影 学系 6は、投影 例えば 4ある は 5の であり、前述の 域と共役な投影 域に スク タ ンの を形成する。なお、投影 学系 6は縮小 、 系及び 大系の ずれでもよ 。なお、 6aは、内部が不 ガス( えば 、 ウ ムなど)で ジされ、清浄 が極めて良好に 持されるよ にな て る。  Supported by 6a. In the embodiment, the projection system 6 has projections 4 or 5, for example, and forms a stern of the projection area conjugate to the aforementioned area. It should be noted that the projection system 6 may be reduced, and the system and the system may be shifted. The inside of 6a is cleaned with non-gas (for example, um, etc.), so that it can be cleaned very well.
0030 また、投影 学系 6は、メイン ラム27の 板に設けられた の 入 されて、支持される。ウ ステ ジ2 は、ウ Wを保持し 、 ア タ等の駆 置によ て、光軸A に垂直な平面内の2 動及び 小回転 を行 ものである。ウ Wは、ウ ステ ジ2 の 面に、真空 によ て 持されて る。また、ウ ステ ジ2 上には移動 22が設けられ、これに対向する 置には ザ 24が設けられる。ウ ステ ジ2 の2 向の 置及 び回転 、 ザ 24により ア タイムで計測され、計測 果が制御 置 に出力される。 置が ザ 24の 果に基 て ア タ等を 駆動することで、ウ ステ ジ2 に保持されて る Wの めが行われ る。なお、ウ ステ ジ2 は、メイン ラム27の を構成するステ ジベ ス上 に支持される。 0031 ラム25は、チヤン 4の 面上に設置された スプ ト28の 方に、 複数の 29を介して支持されて る。 ラム25は、防振 29によ て支持 されたメイン ラム27と、このメイン ラム27 部に立 されたサポ ト ラム26とを有 して る。メイン ラム27の となるメイン ムには、投影 学系 6が支持さ れて る。また、サポ ト ラム26には、 ク ステ ジ 4、照明 学系 2が支持 されて る。 003 Also, the projection system 6 is installed on the plate of the main ram 27 and supported. The wastage 2 holds W and performs two movements and a small rotation in a plane perpendicular to the optical axis A by holding the drive W. C W is held by vacuum on the surface of Stage 2. In addition, a movement 22 is provided on the stage 2, and a unit 24 is provided on the opposite side. The two-way position and rotation of the waste 2 are measured in time by the 24, and the measurement result is output to the control unit. By driving the actuator etc. based on the result of the 24, the W held by the stage 2 is performed. The stage 2 is supported on the stage forming the main ram 27. The 003 ram 25 is supported by a plurality of 29 toward the spout 28 installed on the surface of the Jiang 4. The ram 25 has a main ram 27 supported by vibration proof 29 and a support ram 26 erected on the main ram 27 portion. The projection system 6 is supported by the main ram, which is the main ram 27. The support system 26 supports class 4 and lighting system 2.
0032 チヤン 4は、環境 ( 、温度、圧力 がほぼ一定に 持された 003 32, the environment (, temperature and pressure were kept almost constant)
と、この の 部に配置された ダ室及び ダ とを有するよ に形成されて る。なお、露光 は、その 部に露光 が配置される。 の 面には、配管P ら供給される空気をチヤ ン 4内に噴出す 出口 設けられており、空気が噴出口皿 らサイド にて の 間に送り込まれるよ にな て る。また、露光 の には、 タ ン 8が設けられ、この タ ン 8の 方には、 タ ンダクト 9の 端が接続される。 タ ンダクト 9の 、配管P2に接続されて る。すなわち、 露光 内の空気が タ ン 8 ら タ ンダクト 9を介して配管P2に戻される よ にな て る。  And a da chamber and a da located in this part. Note that the exposure is arranged in that part. There is an outlet for jetting the air supplied from the pipe P into the channel 4 on the surface, so that the air is sent between the jet tray and the side. A tan 8 is provided for exposure, and the end of a tan duct 9 is connected to this tan 8. It is connected to the pipe P2 of the duct 9. In other words, the air in the exposure is returned to the pipe P2 from the tank 8 through the tank duct 9.
0033 ( 態の ) 003 (state)
次に、 態に係る ステムの 作に て説明する。 Next, the operation of the stem according to the state will be explained.
Xのチヤン 4内を23Cプラス イナス ・ Cに調整するため、チ ヤン 4には、空調の 標値である 23Cの 気が第二 交換器52 ら 32 P を介して 給される。 度計 は、このよ 23Cの 気がチヤ ン 4内に供給されて ることを確認するため、チヤン 4内の空気温度を計測 して る。  In order to adjust the inside of Cyan 4 of X to 23C plus C, Cyan 4 is supplied with air of 23C which is the standard value of air conditioning through the second exchanger 52 to 32P. The temperature meter measures the air temperature in Chan 4 in order to confirm that 23C is being supplied to Channel 4.
0034 チヤン 4内には高度に温度調整が必要な が収容されて る。 には、熱を発生する 駆動部 2が配置されて る。たとえば ア タの イ 5 C ら7 Cに達する。チヤン 4内で は、全体として ( ら ( 向にダウン 式による空調が行われる。 部に排出される。 度計 3は、チヤン 4の下 ら き出された空気の 度を 計測して る。この き出された空気は、たとえば23 7Cに上昇して る。 003 The area where the temperature needs to be adjusted to a high level is housed in Jiang 4. A drive unit 2 that generates heat is arranged in the. For example, I can reach 5 C to 7 C. In Jiang 4, the air conditioning by down-type is carried out toward ((). Is discharged to the department. The probometer 3 measures the degree of air blown out below the chain 4. The discharged air has risen to 237C, for example.
0035 この23 7Cの 配管P2によ て第一 交換器54に導入される。この 方、 第一 交換器54には、熱交換の 象として工場 ら低温 ( )が配管 P6を介して 給される。 、温度と流量とが変動するため、一時的に低温 64に蓄えられることで、低温 体の 度が されると共に流量の 動が 抑えられる。 、制御 により所定の量が流れるよ に調整された可変 を介して第一 交換器54に供給される。 交換器54の 口にお て 度計 5によ て低温 体の 度が計測される。ここでは、温度計 5で計測され た低温 体の 度が2 Cであるとして以下の 明を行 。 It is introduced into the first exchanger 54 through the pipe P2 of 237C. On the other hand, a low temperature () is supplied from the factory to the first exchanger 54 via the pipe P6 as an object of heat exchange. Since the temperature and the flow rate fluctuate, the temperature is temporarily stored in the low temperature 64, which reduces the temperature of the low temperature body and suppresses the flow rate fluctuation. , Is supplied to the first exchanger 54 via a variable adjusted so that a predetermined amount flows under control. At the mouth of the exchanger 54, the temperature of the low temperature body is measured by the thermometer 5. Here, the following is performed assuming that the temperature of the low temperature body measured by the thermometer 5 is 2C.
0036 交換器54では、第一 である空気と第二 である低温 体とが熱 交換される。 えば、ステン スなどの 食に強 熱伝達 が良 金属などの壁を介 して空気と低温 体とが てられ、空気と低温 体とが間接的に熱交換される。 In the exchanger 54, the first air and the second cold body are heat-exchanged. For example, strong heat transfer to food such as stainless steel causes the air and the low temperature body to pass through the wall such as metal, and indirectly exchanges heat with the air and the low temperature body.
態ではチヤン 4内を23Cにすることが目標である ら、第一 交換器 54は、配管P2に流れて る23 7Cの 気を低温 体によ て23 C 下、例え ば22 7Cまで冷却して配管P3に供給する。 体的には、制御 により可変 を制御して第一 交換器54に流れる2 Cの 体の 量を調整し、 空気の 度を23 7C ら22 7Cまで低下さ る。 、温度が上昇した状 態で配管P7を経由して工場に排出される。  In the state, if the goal is to make the inside of the chamber 4 23C, the first exchanger 54 cools the air of 23C flowing in the pipe P2 to 23C below the C by the low temperature body, for example 22C. Supply to pipe P3. Physically, the variable is controlled by the control to adjust the amount of the 2 C body flowing to the first exchanger 54, and the air degree is reduced from 23 7C to 227C. When the temperature rises, it is discharged to the factory via pipe P7.
0037 ここで、配管P6に流れる低温 体が2 Cであるので、第一 交換器54にお て配管P2に流れる空気の 度を Cに近 度にまで下げることも可能である。し し、第一 交換器54を経由して配管P2に流れる空気の 、上述の 22・ 7 でと、 目標である23 Cよりわず に低 度となるよ に制御するのが好ま 。 なぜなら、第二 交換器52で23 Cにまで上げる必要があることと、空気の 度を 上げる際に、差が大きすぎると温度の (オ ング)が大き なり、第二 交 換器52での 度調整が困難となる らである。 Here, since the temperature of the low temperature body flowing through the pipe P6 is 2 C, it is possible to reduce the degree of the air flowing through the pipe P2 in the first exchanger 54 to a temperature close to C. However, it is preferable to control the air flowing through the first exchanger 54 to the pipe P2 so that it is lower than the target 23 C at 22.7 mentioned above. This is because it is necessary to raise the temperature to 23 C in the second exchanger 52, and when increasing the degree of air, if the difference is too large, the temperature (Hong) becomes large and the temperature in the second exchanger 52 becomes large. It is difficult to adjust the degree.
0038 P2に流れる空気が22 7Cにな て る を計測するため、配管P2に配置し た温度計 2で温度計測し、制御 に イ ド ック 号として計測 度が送ら れる。 22 7Cの 、第二 交換器52に導入され、熱交換の 象として工場 ら供給される高温 体と熱交換される。 、温度と流量とが変動するため、 一時的に低温 64に蓄えられた後、第二 交換器52に供給される。003 In order to measure that the air flowing to P2 is 227C, the temperature is measured with the thermometer 2 placed in the pipe P2, and the measured value is sent to the control as an id signal. Be done. It is introduced into the 2nd exchanger 52 of 22 7C and exchanges heat with the hot body supplied from the factory as an object of heat exchange. Since the temperature and the flow rate fluctuate, they are temporarily stored in the low temperature 64 and then supplied to the second exchanger 52.
62に一定量の えられることで、高温 体の 度が されると共 に流量の 動が抑えられる。 は、可変 2を制御することにより、 高温 体の 交換器52 の 給量を調節する。また、この 交換器52の 口における高温 体の 温度計 4によ て計測される。  Since a certain amount can be obtained at 62, the flow rate can be suppressed as the temperature of the hot body changes. Adjusts the feed rate of the hot body exchanger 52 by controlling variable 2. The temperature is measured by the thermometer 4 for the high temperature body at the mouth of the exchanger 52.
0039 交換器52は、第一 である空気と第三 Cである高温 体との 交 換を行 。ステン スなどの 食に強 熱伝達 が良 金属などの壁を介して空気と 高温 体とが てられ、空気と高温 体とが間接的に熱交換される。 [0139] The exchanger 52 exchanges the first air and the third C high temperature body. Good heat transfer to food such as stainless steel, etc. Air and hot body are separated via the wall made of metal, etc., and heat is indirectly exchanged between air and hot body.
態ではチャン 4内を23Cにすることが目標である ら、第二 交換器52は、配 管P3に流れて る22 7Cの 気を高温 体によ て23 Cまで めて配管P に供給する。 体的には、制御 により可変 2を制御して第二 交換 器52に流れる25 Cの 体の 量を調整し、空気の 度を22 7C ら23 Cまで上昇さ る。 、温度が下降した状態で配管P5を経由して工場に 排出される。  In the state, if the goal is to make the inside of Chang 4 23C, the second exchanger 52 feeds the gas of 227C flowing to the pipe P3 to the pipe P after making it up to 23C by the high temperature body. . Physically, the variable 2 is controlled by the control to adjust the amount of the body of 25 C flowing to the second exchanger 52, and the air degree is increased from 22 7 C to 23 C. , It is discharged to the factory via pipe P5 with the temperature lowered.
0040 ここで、制御 は、具体的には、比例、積分及び 作を持 を使 たP 御、又はメン 、プ 数及び ァジイ を定義して人間の あ ま 椿を評価に入れる ァジ 御を使用してチャン 4内の温度制御を行 。 度計 を23 0Cにするよ に、温度計 な し 度計 5を常時計測し、低温 体及び 体の 量を調整す 、可変 2を制御す る。さらに、チャン 4内を流れる空気の量を調整す 、 ア タ32でチ ャン 内を循 する 量を制御する。 004 Here, the control specifically uses P control using proportional, integral, and action, or the control that defines the man, the number, and the fuzzy to put the human camellia in the evaluation. Then, control the temperature inside Chan 4. The thermometer 5 without thermometer is constantly measured to adjust the thermometer to 230 ° C, and the variable 2 is controlled by adjusting the amount of the low temperature body and the body. In addition, the amount of air flowing in Chan 4 is adjusted, and the amount of air circulating in Chan is controlled by Atta 32.
0041 ( 態の )004 (state)
3は、 明の 態に係る ステムの 体構成である。この ステムは、第一 態の C の 部を変更した C2を備えるも のであり、 C 同じ 能を有するものに対しては同じ 号を付して る。  3 is the body structure of the stem according to the clear state. This stem is equipped with C2, which is a modification of the C part of the first state, and those with the same function as C are given the same symbols.
態が第一 態と異なる点は、工場 ら供給される高温 体または 体を直接、第一 交換器54または第二 交換器52に導入して な 点であ る。 まり、第二 、第一 態に加えて、第一中間熱交換器58 二中間熱交換器56をさらに有する点である。 The difference between the state and the first state is that The point is that the body is not directly introduced into the first exchanger 54 or the second exchanger 52. That is, in addition to the second and first states, a first intermediate heat exchanger 58 and a second intermediate heat exchanger 56 are further provided.
0042 場内にある他の装置が低温 高温 体を多量に使用すると、工場 ら供 給される低温 体及び 体の 度及び 量の 動が大き なる。これを防ぐた めに、第一 態では高温 62 64を設けて、温度及び 量の 動を して た。し し、工場 ら供給される低温 体及び 体の 度及び 動が なり大き 場合には、高温 62 64だけ では不十分な場合が 定される。 態では、第一 交換器54または第二 交換器52に導入される低温 体及び 体の 量及び 度が なり大き 適である。 004 If other equipment in the plant uses a large amount of cold and hot bodies, the degree and amount of cold bodies and bodies supplied from the factory will increase. In order to prevent this, in the first state, a high temperature 62 64 was provided to control the temperature and quantity. However, when the temperature and movement of the low temperature body and body supplied from the factory are large, it is determined that the high temperature 6264 alone is not sufficient. In the state, the amount and the degree of the low temperature body and the body introduced into the first exchanger 54 or the second exchanger 52 are very large and suitable.
0043 特に第一 態と異なる点を説明すると、次のとおりである。 In particular, the points different from the first state are explained as follows.
態の 2には、第一 交換器54、第二 交換器52、第一 中間熱交換器58 二中間熱交換器56が配置されて る。 一中間熱交換器 58には、工場 ら供給される低温 体を供給する配管P6と、熱交換された 体が 工場 出される配管P7とが接続されて る。また、第二中間熱交換器56には、 場 ら供給される高温 体を供給する配管P4と、熱交換された 体が工場 出さ れる配管P5とが接続されて る。  In the second state, a first exchanger 54, a second exchanger 52, a first intermediate heat exchanger 58 and a second intermediate heat exchanger 56 are arranged. The intermediate heat exchanger 58 is connected to a pipe P6 for supplying a low-temperature body supplied from the factory and a pipe P7 for discharging the heat-exchanged body from the factory. Further, the second intermediate heat exchanger 56 is connected to a pipe P4 for supplying a hot body supplied from the field and a pipe P5 for discharging the heat-exchanged body from the factory.
0044 体を供給する配管P6には、第一 態で説明したと同様に、上流 ら低 温 64と、可変 と、温度計 5とが配置されて る。また、高温 体を 供給する配管P4には、上流 ら高温 62と、可変 2と、温度計 4とが 配置されて る。 一中間熱交換器58は第一 交換器54 P P で 続されており、ポンプ36によりこれらの 管内で、補助 ( )が 一定方向に して る。 二中間熱交換器56は第二 交換器52 P8 9で 続されており、ポンプ36によりこれらの 管内で補助 ( In the pipe P6 for supplying the 004 body, the low temperature 64 from the upstream side, the variable temperature, and the thermometer 5 are arranged, as described in the first state. Further, a high temperature 62, a variable 2 and a thermometer 4 are arranged from the upstream side in the pipe P4 for supplying the high temperature body. The one intermediate heat exchanger 58 is followed by the first exchanger 54 P P, and the auxiliary () is unidirectional in these pipes by the pump 36. The second intermediate heat exchanger 56 is followed by the second exchanger 52 P89, which is assisted in these pipes by the pump 36 (
)が一定方向に して る。 体及び 、第二  ) Is in a fixed direction. Body and second
2内の閉 内を して るだけであるので、 体の 問わな 、たとえば ナ ト( ス ム社の商品名)や ( イド オ テ )、もし は 水などの 体、又は種 の 体であ てもよ 。 Since it is only closed within 2, it can be used for any body type, such as NAT (trade name of Sum Co., Ltd.) or (IDOTE). It can be a body such as water or a body of species.
0045 一中間熱交換器58 第一 交換器54との間には、 向の 流 ら順に、 可変 3と、温度計 7とが配置されて る。 二中間熱交換器56 第二 交 換器52との間には、 向の 流 ら順に、可変 4 温度計 6とが配置 されて る。また、制御 には、 32、温度計 な し 度計 7、 Between the intermediate heat exchanger 58 and the first exchanger 54, the variable 3 and the thermometer 7 are arranged in the order from the direction of the flow. Between the two intermediate heat exchangers 56 and the second exchanger 52, variable 4 thermometers 6 are arranged in the order from the direction of the flow. In addition, for control, 32, thermometer without temperature meter 7,
な し 4がそれぞれ 続されて る。  None 4 are continued respectively.
0046 ( 態の ) 004 (state)
次に、第二 態の ステムの 作に て、第一 態と異なる点の みを説明する。  Next, I will explain only the differences between the first-stage system and the first-stage system.
チャン 4 ら き出される23 7Cの 、第一 交換器54に導入される。 方、第一 交換器54には、第一中間熱交換器58との間を循 する補助 体が配管P を通 て 給される。 一中間熱交換器58には、工場 ら供給される 平均2 Cの 体が供給されて る。このため、温度計 7で計測すると、ほぼ一 定した22Cの 体が流れるよ に、制御 で可変 が制御さ れて る。 場 出される低温 、温度が上昇した状態で配管P7を経由して 出される。  At 237C discharged from Chang 4, it is introduced into the first exchanger 54. On the other hand, an auxiliary body circulating between the first exchanger 54 and the first intermediate heat exchanger 58 is supplied through the pipe P. One intermediate heat exchanger 58 is supplied with an average of 2 C of body supplied from the factory. For this reason, when measured with the thermometer 7, the variable is controlled by the control so that a substantially constant body of 22C flows. It is discharged via pipe P7 in the condition that the temperature is low and the temperature rises.
0047 交換器54では、空気と補助 体との 交換が行われることになる。チ ャン 4内を23Cにすることが目標である ら、第一 交換器54は、配管P2に流 れて る23 7Cの 気を22 7Cまで冷やして配管P3に流れるよ に制御する。 体的には、第一 交換器54に流れる22 Cの 体の 量を調整す 、可変 3が制御される。 内を して る補助 、工場 ら直 接 給されて る低温 体に比 、温度及び とも安定して るので、温度制御が 容易になる。 In the exchanger 54, the air and the auxiliary body are exchanged. If the target is to set the inside of the channel 4 to 23C, the first exchanger 54 controls so that the air of 23 7C flowing in the pipe P2 is cooled to 22 7C and then flows into the pipe P3. Physically, the variable 3 is controlled by adjusting the amount of 22 C body flowing into the first exchanger 54. The temperature control is easy because the temperature of the auxiliary equipment is stable and the temperature is stable compared to the low temperature body directly supplied from the factory.
0048 P3内の22 7Cの 、第二 交換器52に導入される。 方、第二 交 換器52には、熱交換の 象として第二中間熱交換器56との間を循 する補助 体が配管P8を通 て 給される。 二中間熱交換器56には、工場 ら P4を 通 て 入される平均25Cの 体が供給されて る。このため、温度計 6で 計測すると、ほぼ一定した24Cの 体が流れるよ に、制御 で可変 2が制御されて る。 場 出される高温 、温度が下降した状態 で配管P5を経由して 出される。 227C in 004 P3 is introduced into the second exchanger 52. On the other hand, an auxiliary body that circulates between the second intermediate heat exchanger 56 and the second intermediate heat exchanger 56 as a target for heat exchange is supplied to the second exchanger 52 through the pipe P8. (2) The intermediate heat exchanger 56 is supplied with an average of 25C of body that is input from the factory through P4. For this reason, when measured with the thermometer 6, it is possible to change it by control so that a body of 24 C that is almost constant flows. 2 is controlled. It is discharged via pipe P5 in the condition that the high temperature and the temperature are lowered.
0049 交換器52では、空気と補助 体との 交換が行われる。 交換 器52は、配管P3に流れて る22 7Cの 気を23 Cまで めて配管P に流れ るよ に制御する。 体的には、第二 交換器52に流れる24 Cの 体 の 量を調整す 、可変 2が制御される。 内を して る第二高温 、工場 ら直接 給されて る高温 体に比 、温度及び とも安定して るので、温度制御が容易になる。 In the exchanger 52, the air is exchanged with the auxiliary body. The exchanger 52 controls the air at 227C flowing in the pipe P3 to 23C, and controls the air to flow in the pipe P. Physically, the variable 2 is controlled by adjusting the amount of the body of 24 C flowing into the second exchanger 52. The temperature is stable because the second high temperature inside is stable and the temperature is stable compared to the high temperature body supplied directly from the factory.
0050 なお、第二 態にお て、第一中間熱交換器58 二中間熱交換器56 で熱交換の 御が容易にできる場合には、高温 62 64を ずしも設ける必要はな 。また、工場 ら供給される低温 体及び 体の 度 が大体予想が 合には、低温 体及び 体の 度を計測する 度計 4 又は温度計 5は必ずしも設ける必要はな 。 体及び 体の 度を温度計 6又は温度計 7で計測すれば りる らである。また、高温 62In the second state, if the first intermediate heat exchanger 58 and the second intermediate heat exchanger 56 can easily control the heat exchange, the high temperature 62 64 need not be provided. In addition, if the temperature of the cold body and the body supplied from the factory are roughly expected, it is not always necessary to provide the temperature meter 4 or the thermometer 5 for measuring the temperature of the cold body and the body. This is because the body and body degree can be measured with the thermometer 6 or the thermometer 7. Also, high temperature 62
2の 置、 64 の 置を入れ替 えてもよ 。  You can switch the positions of 2 and 64.
0051 は、P ァジ 御を使用して、温度計 な し 度計 7 を常時計測し、可変 4を制御して、チヤン 4内の温 度制御を行 。なお、ポンプ36が可変 ポンプであれば、可変The 0051 uses the P control to constantly measure the thermometer without the thermometer 7 and controls the variable 4 to control the temperature inside the channel 4. If the pump 36 is a variable pump,
4を設けずに、可変 ポンプで流量 御することも可能である。  It is also possible to control the flow rate with a variable pump without providing 4.
0052 ( 態の )005 2 (state)
4は、 明の 態に係る ステムの ステム である。この ステムは、第一 態の C の 部を変更した C3を 備えるものであり、 C 同じ 能を有するものに対しては同じ 号を付し て る。  4 is the stem of the stem according to the clear state. This stem is equipped with C3 which is a modification of the C part of the first state, and those with the same function as C are given the same symbols.
態と異なる点は、工場 ら供給される高温 体を必要として な こと 、またそ わりにチヤ 4 ら き出された空気を、最初に第三 交換器42 で熱交換し、次に熱交換された空気を第一 交換器54 て る点である。 ま 、第三 態の 4内でチャン 4 ら き出された空気の熱を 有効に活用する実施 態である。 The difference from the state is that the high temperature body supplied from the factory is not necessary, and the air discharged from the chair 4 is first heat-exchanged in the third exchanger 42 and then heat-exchanged. This is the point that air is used as the first exchanger 54. Well In the third state 4, the heat of the air discharged from the chamber 4 is effectively used.
0053 さらに、特に第一 態と異なる点を説明すると、次のとおりである。Further, the points different from the first embodiment will be described as follows.
4には、第一 交換器54、第二 交換器52、 交換器4 2が配置されて る。 交換器42には、第三 交換器42 ら第二 交換器 The first exchanger 54, the second exchanger 52, and the exchanger 42 are arranged at 4. Exchanger 42 includes a third exchange 42 and a second exchange 42.
( )を する配管P 2と、第二 交換器52 ら第三 交換器 42 体を する配管P 3とが接続されて る。 交換器42は、チャ 4 第一 交換器54とを結ぶ P2の 間に配置される。また、配管P2に 設けられた温度計 3は、 換されて冷やされた空気の 度が 定できるよ に、 第三 交換器42 第一 交換器54との間に配置される。  The pipe P 2 connecting with () and the pipe P 3 connecting the second exchanger 52 to the third exchanger 42 are connected. The exchanger 42 is arranged between the P2 connecting the first exchanger 4 of the Cha 4 and P2. Further, the thermometer 3 provided in the pipe P2 is arranged between the third exchanger 42 and the first exchanger 54 so that the degree of the cooled and cooled air can be determined.
0054 交換器52 体を供給する配管P 2には、上流 ら ヒ タ44と、 可変 5と、温度計 8とが配置されて る。また、配管P 2又は配管P 3にポ ンプ36が接続され、ポンプ36により、第二 交換器52、第三 交換器42、配管P 2 P 3の 管内で、 体が一定方向に して る。 、第 三 4内の閉 内を して るだけであるので、 体の 問わな 、 たとえば ナ ト( ス ム社の商品名)や ( イド オ テ )、もし は水などの 体、又は種 の 体であ てもよ 。 A pipe 44 for supplying 52 exchangers is provided with a heater 44, a variable 5 and a thermometer 8 from the upstream side. Further, the pump 36 is connected to the pipe P 2 or the pipe P 3, and the body is oriented in a certain direction in the pipes of the second exchanger 52, the third exchanger 42, and the pipe P 2 P 3 by the pump 36. . Since it is only enclosed within No. 34, it does not matter if the body or species is of any body type, such as NAT (trade name of Sum Co., Ltd.) or (Idote), or water. It can be the body.
0055 ( 態の ) 005 (state)
次に、第三 態の ステムの 作に て、第一 態と異なる点の みを説明する。  Next, I will explain only the differences between the first-state system and the first-state system.
チャン 4 ら き出される例えば23 7Cの 、まず、第三 交換器42に 導入される。 方、第三 交換器42には、第二 交換器52との間を循 する 体が配管P 3を通 て 給される。 交換器52を通過した 、空 気との 交換によ て空気の 度である23 Cとほぼ同等の 度にな てお り、その 23 Cの 態で第三 交換器42に供給される。 交換器42では、 23 7Cの 気と23 Cの 体との間で熱交換が行われ、空気の 例え ば23 4Cまで低下し、 体の 空気とほぼ同等の23 4Cまで上昇する 23 4Cまで冷やされた空気は第一 交換器54に導入される。 方、約23 4C まで温められた 、補助ヒ タ44を通過して第二 交換器52に導入される 0056 交換器54では、第三 交換器42で23 4C 度に冷やされた空気と低温 体との 交換が行われることになる。 態と同様に、第一 交換器54に は工場 ら供給される oCの 体が流れて る。チャン 4内を Cにする ことが目標である ら、第一 交換器54は、配管P2に流れて る23 3Cの 気を 22 7Cまで冷やして配管P3に流れるよ に制御する。 体的には、第一 交換器 54に流れる Cの 体の 量を調整す 、制御 により可変 が制御される。 First, it is introduced into the third exchanger 42 of, for example, 237 C discharged from Chang 4. On the other hand, the body circulating between the third exchanger 42 and the second exchanger 52 is supplied through the pipe P 3. After passing through the exchanger 52, the degree of air is almost equal to 23 C due to the exchange with the air, and it is supplied to the third exchanger 42 in the state of 23 C. In the exchanger 42, heat is exchanged between the air at 237 C and the body at 23 C, and the temperature drops to 234 C in the case of air, for example, and it rises to 234 C, which is almost equivalent to the air in the body, and cools to 234 C. The separated air is introduced into the first exchanger 54. One, about 23 4C After being warmed up, it passes through the auxiliary heater 44 and is introduced into the second exchanger 52. In the 0056 exchanger 54, the air cooled to 234 ° C. in the third exchanger 42 and the low temperature body are exchanged. Will be seen. Similar to the state, the oC body supplied from the factory flows into the first exchanger 54. If the goal is to make the inside of Chan 4 C, the first exchanger 54 controls so that the air of 23 3C flowing to the pipe P2 is cooled to 227C and then flows to the pipe P3. Physically, the variable is controlled by adjusting the amount of the body of C flowing into the first exchanger 54 and controlling it.
0057 P3内の22 7Cの 、第二 交換器52に導入される。 方、第二 交 換器52には、 23 4Cの 体が配管P 2を通 て 給される。 交換器5 2は、配管P3に流れて る22 7Cの 気を23 Cまで めて配管P に流れるよ に制御する。 体的には、制御 は、温度計 でチャン 4に供給される 空気の 度を確認しながら、第二 交換器52に流れる23 4Cの 体の量を 可変 5を用 て制御する。 227C in P007 P3 is introduced into the second exchanger 52. On the other hand, the body of 234C is supplied to the second exchanger 52 through the pipe P 2. The exchanger 52 controls so that the air of 22 7 C flowing in the pipe P3 is reduced to 23 C and flows into the pipe P. Physically, the control uses a variable 5 to control the amount of the body of 23 4C flowing into the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer.
0058 ここで、補助ヒ タ44の 作に て説明する。 明の 、本実施 態では チャン 4に導入する空気の 度制御に、露光 の を利用して る。し し、露光 の 始直後は の 部の 度がまだ上昇しておらず、配管P2を通じて 出される空気の 、供給される空 気の 度とほぼ同等である。そのため、露光 の 始直後は、 体の 度が所望の 度まで上昇 ず、第二 交換器52を介した空気の 度制 御を行 ことができな 。そこで、露光 の 始直後は、補助ヒ タ4 4を用 て 体を温め、空気の 度制御を行 。ここで、補助ヒ タ44の 温度計 8の 果に基 て制御 が 。 Here, the operation of the auxiliary heater 44 will be described. In the present embodiment, the exposure is used to control the degree of the air introduced into the chamber 4. However, immediately after the start of exposure, the temperature in the area of (3) has not risen yet, and it is almost the same as the supplied air of the air discharged through the pipe P2. Therefore, immediately after the start of exposure, the body temperature does not rise to the desired degree, and it is not possible to control the air temperature via the second exchanger 52. Therefore, immediately after the start of exposure, the auxiliary heater 44 is used to warm the body and control the air level. Here, the control is based on the result of the thermometer 8 of the auxiliary heater 44.
0059 の 、時間の 伴 配管P2 ら排出される空気の 度が上昇すると、補助ヒ タ44を用 て 体を温める必要がな なるので、制 御 は補助ヒ タ44の 力を低下さ 、ある は必要に応じて停止する。また、 制御 は、露光 の 後だけでな 、 体の 度変動を 制するため、温度計 8の 果に基 て、常時補助ヒ タ44を作動さ るこ ともできる。この 合、補助ヒ タ44の 、 体の 度変動 を補償するた めに必要な最低限の 力とすることが望ま 。 As the air discharged from the pipe P2 increases with time, it is necessary to heat the body using the auxiliary heater 44, so the control reduces the power of the auxiliary heater 44, or Stop if necessary. In addition, the control does not change the degree of body movement not only after exposure. Therefore, the auxiliary heater 44 can always be operated based on the result of the thermometer 8. In this case, it is desirable that the auxiliary heater 44 has the minimum force necessary to compensate for fluctuations in the body.
0060 は、P ァジ 御を使用して、温度計 な し 度計 3 、温度計 5 8の 果に基 て、可変 5を 制御して、チャン 4内の温度制御を行 。 006 uses the P control to control variable 5 based on the results of thermometer without thermometer 3 and thermometer 58, to control the temperature inside channel 4.
0061 ( 態の )006 (state)
5は、 明の 態に係る ステムの ステム である。この ステム、第一 態の C の 部を変更した C4を備 えるものであり、 C 同じ 能を有するものに対しては同じ 号を付して る。  5 is a stem of the stem according to the clear state. This stem is equipped with C4 which is a modification of the C part of the first state, and those having the same function as C are given the same symbols.
態と異なる点は、第四 態が、工場 ら供給される高温 体を必 要として な こと、その わりに ア タ32 びその 盤 らの熱を、第 四 交換器34で熱交換し、その熱を第二 交換器52 て る点である。 まり 、第四 態の 四温 6内で第四温 室内にある 源の熱を有効に活用 する実施 態である。  The fourth aspect is that the fourth state requires a high-temperature body supplied from the factory.Instead, the heat from the heater 32 and its board is exchanged with the fourth exchanger 34, and the heat is exchanged. This is the second exchanger 52. This is an embodiment in which the heat of the heat source in the 4th chamber is effectively utilized in the 4th state.
0062 さらに、特に第一 態と異なる点を説明すると、次のとおりである。Further, the points different from the first embodiment will be described below.
P 、配管P2又は配管P3の ずれ に配置される 32に、第四 交換 器34が配置される。なお、 5では、 32が配管P3に配置されて る。  The fourth exchanger 34 is arranged at 32, which is arranged at the offset of P, the pipe P2, or the pipe P3. In addition, in 5, 32 is placed in pipe P3.
0063 交換器34は、ポンプの タに直接的に 体を れる構造の 器が適用 でき、また、第四 交換器34は、 タの熱を吸収することが主目的であるため 4 では 収の 路のみが描 れて る。 四温 6には、第一 交換器54 交換器52、 交換器34が配置されて る。 交換器34には 、第一 交換器54 ら 場 められた低温 ( )を排出する配管P7 ら分岐した配管P 4が接続される。ここで、第四 交換器34に導入された低温 ( )は、第四 交換器34の により 度が上昇し、高温 ( )となる。なお、本実施 態にお て、低温 ( ) 高温 ( )とは同一流 を流れる同一 ( )であるが、説明の 上、上記の り第四 換器34の 体の 称を変えて説明することとする。 The 006 exchanger can be a device that is directly attached to the pump tank, and the fourth exchanger 34 has a main purpose of absorbing the heat of the pump, so it is a profitable path for 4. Only the picture is drawn. The four exchangers 6 are provided with the first exchanger 54, the exchanger 52, and the exchanger 34. To the exchanger 34, a pipe P 4 branched from a pipe P 7 for discharging low temperature () stored in the first exchanger 54 is connected. Here, the low temperature () introduced into the fourth exchanger 34 increases in temperature due to the fourth exchanger 34 and becomes high temperature (). In this embodiment, the low temperature () and the high temperature () are the same () flowing in the same flow. The description will be given by changing the name of the body of the converter 34.
0064 また、第四 交換器34 ら第二 交換器52 体を供給する配管P 5には 、上流 ら ヒ タ44と、可変 6と、温度計 9とが配置されて る。 4で はポンプ36が、配管P 5に配置してあるが、配管P 4に配置してあ てもよ 。また 、高温 体を排出する配管P7 らの 力が強 場合にはポンプ36を設ける必要は な 。 交換器52に導入された 、熱交換された後、工場 出される。 0065 ( 態の ) In addition, a pipe 44 for supplying the second exchanger 52 from the fourth exchanger 34 is provided with a heater 44 from the upstream side, a variable 6 and a thermometer 9. In the case of 4, the pump 36 is arranged in the pipe P 5, but it may be arranged in the pipe P 4. Moreover, if the force from the pipe P7 for discharging the hot body is strong, it is not necessary to install the pump 36. After being introduced into the exchanger 52 and undergoing heat exchange, it is shipped to the factory. 006 (state)
次に、第四 態の ステムの 作に て、第一 態と異なる点の みを説明する。  Next, only the differences in the operation of the fourth-state stem from the first-state will be explained.
交換器54に供給される2 Cの 体である水は、第一 交換器54 で温度が上昇した状態、たとえば2 5oCの 度で、配管P7を経由して 出される。 2 5Cの 度の 、第四 交換器34 送られる。 交換器34に送 られた低温 、 32で発生する熱を第四 交換器34で 収し、23 5Cの 体として第四 交換器34 ら排出される。  The water, which is a 2 C body supplied to the exchanger 54, is discharged via the pipe P7 in a state where the temperature has risen in the first exchanger 54, for example, every 25 ° C. It is sent to the 4th exchanger 34 every 25C. The low-temperature heat sent to the exchanger 34 and the heat generated at 32 are collected by the fourth exchanger 34 and discharged from the fourth exchanger 34 as a body of 235C.
0066 P3内の22 7CCの 、第二 交換器52に導入される。 方、第二 交 換器52には、 23 5Cの 体が配管P 5を通 て 給される。 交換器5 2は、配管P3に流れて る22 7Cの 気を23 Cまで めて配管P に流れるよ に制御する。 体的には、制御 は、温度計 でチャン 4に供給される 空気の 度を確認しながら、第二 交換器52に流れる23 5Cの 体の量を、 可変 6を用 て制御する。 交換器52を経由した 工場 出される。 227 CC in P006 P3 is introduced into the second exchanger 52. On the other hand, the body of 235C is supplied to the second exchanger 52 through the pipe P5. The exchanger 52 controls so that the air of 22 7 C flowing in the pipe P3 is reduced to 23 C and flows into the pipe P. Physically, the control uses the variable 6 to control the amount of the 2 3 5 C body flowing to the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer. It is sent to the factory via the exchanger 52.
0067 なお、第三 態と同様に、スタ トアップ時には、 ア タ32で発生す る熱は 、さ ので、補助ヒ タ44による高温 体の 度調節が必要である。また、露 光 の 後にお ても、第三 態と同様に、高温 体の 度変 動の 制のために ヒ タ44を用 ることができる。また、第四 態では、配 管P 4 P 5により開放 路を構成したが、第三 態と同様に、第四 交換器34、第二 交換器52、配管P 4 P 5により 回路を構成してもよ は、P ァジ 御を使用して、温度計 な し 度計 3 、温度計 5 gの 果に基 て、可変 6を 制御して、チャン 4内の温度制御を行 。 Note that, as in the third state, the heat generated in the stator 32 during the startup is low, so it is necessary to adjust the temperature of the high temperature body with the auxiliary heater 44. Also, even after exposure to light, the heater 44 can be used to control the fluctuation of the hot body, as in the third state. In addition, in the fourth state, the open path was constructed by the pipes P 4 P 5, but as in the third state, the circuit was constructed by the fourth exchanger 34, the second exchanger 52, and the pipes P 4 P 5. Even Control the variable 6 based on the results of the thermometer without thermometer 3 and thermometer 5 g using the P control to control the temperature inside channel 4.
なお、第四 態にお ては、第四 交換器34のみにより低温 体を加熱した が、これ以外の 、例えばポンプ36の 生する熱も利用して低温 体を加熱す るよ にしてもよ 。これにより ヒ タ44の 力を低減することができ、より ネ ギ を達成することができる。  In the fourth state, the low temperature body is heated only by the fourth exchanger 34, but the low temperature body may be heated by using the heat generated by the pump 36 other than this. . As a result, the power of the heater 44 can be reduced, and more energy can be achieved.
0068 ( 態の )006 (state)
6は、 明の 態に係る ステムの ステム である。この ステムは、第一 態の C の 部を変更した C5を 備えるものであり、 C 同じ 能を有するものに対しては同じ 号を付し て る。  6 is the stem of the stem according to the clear state. This stem is equipped with C5, which is a modification of the C part of the first state, and those with the same function as C are given the same symbols.
態と異なる点は、第五 態が、工場 ら供給される高温 体を必 要として な こと、その わりに第一 交換器54を経由して暖められた低温 ( The fifth aspect is that the fifth state requires a high-temperature body supplied from the factory, and instead, the low-temperature (heated through the first exchanger 54) (
)を補助ヒ タ44で 、第二 交換器52 て る点である。 まり、 第五 態の 8内で第一 交換器54 ら排出される熱を有効に 活用する実施 態である。  ) Is the auxiliary heater 44 and the second exchanger 52. In other words, it is an embodiment that effectively utilizes the heat discharged from the first exchanger 54 within the fifth state 8.
0069 さらに、特に第一 態と異なる点を説明すると、次のとおりである。 Further, the differences from the first embodiment will be described below.
交換器54 ら 場 められた低温 ( )を排出する配管P7 ら分岐するよ に配管P 6が設けられて る。また、配管P 6には上流 ら ヒ タ44と、ポンプ36と、可変 7と、温度計 とが配置されて る。なお、ポ ン 36は、低温 体を排出する配管P7 らの 力が強 場合には不要となる。  A pipe P 6 is provided so as to branch from the pipe P 7 for discharging the low temperature () stored in the exchanger 54. In addition, a heater 44, a pump 36, a variable 7 and a thermometer are arranged from upstream in the pipe P 6. Note that the pon 36 is not necessary when the force from the pipe P7 that discharges the low temperature body is strong.
交換器52に導入された 、熱交換された後、工場 出される。  After being introduced into the exchanger 52 and undergoing heat exchange, it is shipped to the factory.
0070 ( 態の ) 007 0 (state)
次に、第五 態の 置の 作に て、第一 態と異なる点のみを 説明する。  Next, I will explain only the differences in the operation of the fifth state from the first state.
交換器54に供給される2 OCの 体である水は、第一 交換器54 で温度が上昇した状態、たとえば22 5oCの 度で、配管P7を経由して 出される。 22 5Cの 度の 、第二 交換器52に供給する 度としては すぎる ため、低温 補助ヒ タ44によ て23 5Cまで温められ、高温 ( Water, which is the body of 2 OC supplied to the exchanger 54, is discharged via the pipe P7 in a state where the temperature has risen in the first exchanger 54, for example, at a temperature of 225 ° C. Since the temperature of 22 5C is too high to supply to the second exchanger 52, it is heated up to 23 5C by the low temperature auxiliary heater 44 and the high temperature (
)となる。なお、本実施 態にお て、高温 ( )は低温 ( ) ら分岐した同一 ( )であるが、説明の 上、上記の ヒ タ44の 体の 称を変えて説明することとする。  ). In the present embodiment, the high temperature () is the same () branched from the low temperature (), but for the sake of explanation, the description of the body of the above-mentioned heater 44 will be changed.
0071 P3内の22 5Cの 、第二 交換器52に導入される。 方、第二 交 換器52には、 23 5Cの 体が供給される。 交換器52は、配管P3に流 れて る22 5Cの 気を23 Cまで めて配管P に流れるよ に制御する。 体 的には、制御 は、温度計 でチャン 4に供給される空気の 度を確認し ながら、第二 交換器52に流れる23 5Cの 体の量を可変 7を用 て制御する。 交換器52を経由した 工場 出される。 225C in P0071 P3 is introduced into the second exchanger 52. On the other hand, the body of 235C is supplied to the second exchanger 52. The exchanger 52 controls the air at 225C flowing in the pipe P3 to 23C, and controls the air to flow in the pipe P. Physically, the control uses the variable 7 to control the amount of the 2 3 5 C body flowing to the second exchanger 52 while confirming the degree of the air supplied to the chamber 4 with the thermometer. It is sent to the factory via the exchanger 52.
0072 は、P ァジ 御を使用して、温度計 な し 度計 3 、温度計 5 の 果に基 て、可変 7 を制御して、チャン 4内の温度制御を行 。 007 uses the P control to control variable 7 based on the results of thermometer without thermometer 3 and thermometer 5 to control the temperature inside channel 4.
0073 ( ) 007 ()
上、チャン 4に供給する空気を所定温度に調整する実施 態を説明した。 チャン に供給するものは、空気に限定する必要なな 。たとえば、 ガスなど でもよ 。  The above has described an embodiment in which the air supplied to the channel 4 is adjusted to a predetermined temperature. It is necessary to limit the supply to Chan to air. For example, it could be gas.
0074 また、露光 を収納するチャン 4内を温 する各種 態を説 明してきたが、チャン 4内に適用するだけでな 、露光 を構成する の ットを することも可能である。特に、投影 学系 6に温度変 が生 じると 影像が変 してしま 、 ノメ ト 位で制御が必要な 導体 タ ンの ね合わ ができな な てしま 。そこで、チャン 4の とは別に、投影 学系 6用の温 置を設け、投影 学系 6を 密に温 することも可能であ る。 Also, although various states of heating the inside of the Chan 4 that stores the exposure have been described, it is possible to configure the exposure by only applying the inside of the Chan 4. In particular, if a temperature change occurs in the projection system 6, the image will change, and the conductor tans that need to be controlled at the nominal position cannot be combined. Therefore, in addition to Chan 4, a projection system 6 can be installed to keep Projection 6 densely heated.
0075 また、露光 は、 ア タなどの 動部 2 びその 路など が熱を多 発生するため、特に駆動部 2 びその 路に対して第二 交換 器52 ら駆動部 2に直接 管を用意し、駆動部 2 びその 路の を にすることは好適である。すなわち、駆動部 2、チヤン 4 In exposure, since a large amount of heat is generated in the moving part 2 such as the attendant and its path, a tube is directly prepared for the driving part 2 and its path from the second exchanger 52 to the driving part 2 and driven. Part 2 and its road It is preferable that That is, drive unit 2 and chain 4
学系 6の な とも一 を として適用することができる。  One of the six faculties can be applied as.
0076 動部 2 学系 6 管を接続する場合には、配管に流す 、空気 ガスなどの 体である必要はな 。 えば、 ナ ト( ス ム社の商品名)もし は ( イド オ テ )など 体であ てもよ 。 007 When connecting 6 pipes of moving part 2 system, it is not necessary to let the body flow through the pipes or air gas. For example, it may be a body such as NAT (trade name of Sum company) or (IDOTE).
0077 Xしては、走査 置、ある は とを 止した状態 で の タ ンを一括 、ウ を順次ステップ 動さ るステップ・アン ピ ト 式の投 (ステッ )にも適用することができる。また、露光 Xとして、ウ 上で少な とも2 の タ ンを部分的に重ねて転写するステッ プ・アン スティッ 式の露 置にも適用できる。また、露光 Xとして、投 影 学系を用 ることな スク とを密接さ て スクの タ ンを する ティ 置にも適用できる。 It is also applicable to the step-and-amp type throwing in which the scan position and the turn position are stopped together, and the c is stepped in sequence. The exposure X can also be applied to a step-and-stitch type exposure in which at least two tans are partially overlapped and transferred on the c. The exposure X can also be applied to a device that closely turns a disc that does not use a projection system to turn it.
0078 また、露光 Xとして、 置にも適用 能である。そのよ Also, as the exposure X, it can be applied to a device. That's it
としては、例えば、投影 学系と基 との間を局 体で満たす方式とし て、国際公開 2 4 53958 ン に開示されて るものが知られて る。また、露光 Xとして、露光 象の を保持したステ ジを 槽の中で移 動さ る 置、ステ ジ上に所定 の を形成しその中に基 を保 持する 置にも適用 能である。  As such, for example, a method disclosed in International Publication No. 2453958 is known as a method of filling the space between the projection system and the base with a body. Further, as the exposure X, it is also applicable to a device in which a stage holding the exposed material is moved in the bath, and a device for forming a predetermined on the stage and holding the substrate in it.
0079 また、露光 Xとして、 354 ( 際公開 999 23692 )に開示されて るよ に、ウ 等の被 理基 を保持して移動 能な ステ 、各種の 材及び 又はセンサを備えた計測ステ ジとを備えた 置 にも適用することができる。 Further, as the exposure X, as disclosed in 354 (publication publication 999 23692), a measuring stage equipped with various materials and / or sensors that can move while holding a substrate such as c. It can also be applied to a device equipped with.
0080 なお、上記 態にお て した動作手順、ある は の 、 組合 等は一例であ て、 明の 旨 ら 脱しな 範囲にお てプ セス 件 、設計 に基 き 能である。 00080 The operation procedure, or combination, etc. in the above-mentioned state is an example, and it can be based on the process condition and the design within the range that is not deviated from the reason.
0081 なお、上記 態で移動ステ ジに保持される としては、半導体 イス 製 の 導体ウ のみならず、ディスプ イデ イス用のガラス 、 ッド用のセラ ックウ 、ある は 置で用 られる スクまたは の ( 英、 ンウ )等が適用される。 In addition, in the above state, the movable stage is not limited to the conductor window made of semiconductor device, but the glass for display device, Servos for shoes, or discs or slabs used in the location (English, English), etc. are applicable.
0082 置の 類としては、ウ に半導体 タ ンを する半導体 子製 造 の 置に限られず、 子製造 ディスプ イ製 の 置、 ッド、 (CC )、 イク ン、 S チップ、 ある は ク 又は スクなどを製造するための 置などにも広 用できる 0083 また、 、ウ ステ ジが複数 けられる インステ ジ型の露 置に も適用できる。ツインステ ジ型の露 置の 造及び 、例えばThe device type is not limited to a semiconductor device device that uses a semiconductor tank, and a device, a pad, (CC), an equine chip, an S chip, or a mask or a mask device made by a child manufacturing display device. It can also be applied to equipment for manufacturing etc., and can also be applied to insta-type equipment that has multiple usages. Twin stage type construction and, for example,
63 99 報及び 2 4783 ( 6 34 7 、6 4 44 、6 549 269号及び6 59 634 )、 2 5 595 8 ( 5 969 44 )ある は米国 6 2 8 4 7号に開示され て る。さらに、 明を本願 願人が先に出願した 2 4 6848 ( 際公開2 5 22242)の ステ ジに適用してもよ 。  63 99 and 2 4783 (6 34 7, 6 4 44, 6 549 269 and 6 59 634), 2 5 595 8 (5 969 44) or in the US 6 2 8 4 7. Furthermore, the description may be applied to the stage of 2 4 6848 (publication 2 5 22242) filed earlier by the applicant of the present application.
0084 なお、上述の 態にお ては、 過性の 上に所定の タ ン( または タ ン・ タ ン)を形成した スク、ある は 射性 の 上に所定の タ ンを形成した スクを用 たが、それらに限 定されるものではな 。 えば、そのよ スクに代えて、露光す き タ ンの デ タに基 て タ ンまたは反射 タ ン、ある は発光 タ ンを形 成する( 変成形 スクとも呼ばれ、例えば 像表示 ( ) の 種である (Dg a Mc o m o Devce)などを含む。 It should be noted that in the above-mentioned state, a disc having a predetermined tan (or a tan tan) formed on the transient, or a disc having a predetermined tan formed on the emissive is used. However, it is not limited to them. For example, instead of such a disc, a tan or a reflection tan or a luminescence tan is formed based on the data of the exposure tan (also called a morpho-form tan, for example, the image display ()). Includes seeds (Dg a Mc omo Devce) etc.
0085 また、例えば、2 光と呼ばれて るよ 、複数の 束の 渉によ て生 じる に露光するよ 置にも 明を適用することができる。そ のよ 法及び 、例えば、国際公開 35 68 ン に開示されて る。 The light can also be applied to exposures that are actually created by the interaction of a plurality of bundles, for example, called two lights. It is disclosed in the law and, for example, in International Publication No. 3568.
0086 また、 明が適用される 置の には、 キ ザ(248 ) キ ザ( 93 、 2 ザ( 57 )等のみならず、 ( ) (365 )等を用 ることができる。さらに、投影 学系の 縮小 のみなら および 大系の ずれでもよ 。 In addition, not only Kaki (248) Kaki (93, 2 Kiza (57), etc., but also () (365), etc. can be used for the position to which Ming is applied. If only system reduction And even a deviation of the system.
0087 ステ ジ 又は ク ステ ジに ア タ(U P5623853またはU0087 Stage or cluster (U P5623853 or U
P5528118 )を用 る場合は、 アベア ングを用 た ア 上 および ン または アクタンスカを用 た 気浮上 のどちらを用 てもよ 。また、 ス テ ジWST、RS は、ガイドに沿 て移動するタイプでもよ 、ガイドを設けな ガイ ド スタイプであ てもよ 。  When using P5528118), it is possible to use either the air bearing with the air bearing or the air levitation with the air bearing or the actansuka. In addition, the stages WST and RS may be of a type that moves along a guide or a guide type that does not have a guide.
0088 ステ ジの 動機構としては、二次元に 石を配置した ット 、二次元 に イ を配置した電機 ットとを対向さ 磁力により ステ ジを駆動する 平面 タを用 てもよ 。この 合、磁石 ット 電機 ットとの ずれ 一 方をステ ジに接続し、磁石 ット 電機 ットとの 方をステ ジの 動面 に設ければよ 。 As a moving mechanism of the stage, it is also possible to use a flat plate that drives a stage by a magnetic force that opposes a two-dimensionally arranged stone and an two-dimensionally arranged arm. In this case, connect one side of the magnet to the stage and connect the side to the magnet to the moving surface of the stage.
0089 ステ ジの 動により発生する 、投影 学系に伝わらな よ に、0089 It is generated by the movement of the stage and is not transmitted to the projection system.
8 66475 ( 5 528 8 )に記載されて るよ に 、 ム を用 て機械的に ( )に逃がしてもよ 。  8 As described in 66 475 (5 528 8), you may use a mechanical mechanism to let it escape to ().
0090 ク ステ ジの 動により発生する 、 8 33 224 (It is caused by the movement of the 0. 009 class, 8 33 224 (
5 874 82 )に記載されて るよ に、 ム を用 て機械的 に ( )に逃がしてもよ 。  As described in 5 874 82), it is possible to mechanically escape to () using a rubber.
0091 また、露光 、 素を含む各種サ ステムを、所定の 械的 度、 電気 度、光学的 度を保 よ に、組み立てることで製造される。これら各種 度を確保するために、この 立の 後には、各種 学系に ては光学的 度を 達成するための 整、各種 に ては機械的 度を達成するための 整、 各種 に ては電気 度を達成するための 整が行われる。 サ ステム ら 置 の 立工程は、各種サ ステム 互の、機械的接続、電気 回路の 続、気圧 路の が含まれる。この サ ステム ら 置 の 立工程の前に、 サ ステム の 立工程があることは まで もな 。 サ ステムの 置 の 立工程が終了したら、総合 整が行わ れ、露光 体としての 度が確保される。なお、露光 置の 温度お よびク ン が管理されたク ン ムで ことが望まし 。 0092 なお、法令で許容される限りにお て、露光 置などに関する全ての 例の 示を 援用して本文の 載の 部とする。 Also, it is manufactured by assembling various systems including exposure and exposure, while maintaining a predetermined mechanical degree, electrical degree, and optical degree. In order to secure these various degrees, after this establishment, various systems are used to achieve optical degrees, various types are used to achieve mechanical degrees, and various electrical levels are used. Adjustments are made to achieve degrees. The process of establishing the system from the system includes mechanical connection, connection of electrical circuits, and air pressure between various systems. It goes without saying that there is a system stand-up process before this system stand-up process. After the process of setting up the system is completed, the overall adjustment is performed and the degree as an exposed body is secured. In addition, it is desirable that the exposure temperature and kun are controlled. It should be noted that, as far as legally permitted, all examples of exposure equipment and the like are incorporated into the text of this document.
0093 ( イスの製 )0093 (made of chair)
7は、上述したよ に された Xを用 た イスの製 法を示 す である。  7 shows the manufacturing method of the chair using X as described above.
導体 イス等の イク イスは、この 7に示すよ に、 イク イスの ・ 計を行 ステップ 、この ステップに基づ た を製作す るステップ 、 ン 料 ら を製造するステップ 2、前述した実施 態の 置により の タ ンを に露光する工程、露光した を現像 する工程、現像した の (キ ア) チング 程などの プ セ スを含むステップ 3、 イス み立てステッ (ダイ ング 程、ボンディング 程 、 ッケ ジ 程を含む) 4、検査ステップ 5等を経て 造される。  As shown in Fig. 7, equates such as conductor chairs have a step of performing an equate measurement step, a step of manufacturing a step based on this step, a step 2 of manufacturing materials, and the steps of the above-described embodiment. Exposure process, exposing process, developing process, developing process, including process such as (key) etching process, step 3 It will be manufactured through the inspection step 5 and so on.
0094 なお、 、 製造 置、 ジスト 置、 を描画する 電子ビ ム 置など、厳し 理が要求される装置にも適用 能である。 It can also be applied to devices that require strictness, such as manufacturing equipment, jig equipment, and electronic beam equipment for drawing.
明の 想及び 術的 囲 ら 脱することな 、 明に対して 変 更を加えることができることは、当業者には明ら であ 。  It will be apparent to those skilled in the art that changes can be made to Ming without departing from Ming's thoughts and technical scope.
、従来のよ に、装置ごとに冷凍 を設けて な ため、環境保護 電 力消費の 減の 点で有利である。また、装置 体の ストも冷凍機などが不要な 分 することができる。  However, unlike the conventional method, refrigeration is not provided for each device, which is advantageous in terms of environmental protection and power consumption reduction. In addition, the equipment unit can be dispensed with a refrigerator or the like.

Claims

求の Wanted
理装置が える 、 を流れる第一 体により所定温度に温 する 置であ て、  A device that heats up to a predetermined temperature by the first body flowing through
前記 体と前記 理装置及び とは独立した 給源 ら供給さ れ 定温度よりも低温の 体との間で熱交換を行 交換器と、 前記 体と前記 定温度よりも高温の 体との間で熱交換を行 交換器と、を備える 。 A heat exchange is performed between the body and a body which is supplied from a source independent of the processing device and which has a temperature lower than a constant temperature, and between the body and a body which has a temperature higher than the constant temperature. And a heat exchanger for heat exchange.
2 交換器にお て、前記 体の熱が第四 体を介して、前記 2 In the exchanger, the heat of the body is transferred to the
体に伝わる に記載の 。 It is described in "Transmitting to the body".
3 体を前記 交換器より上流で一時的に蓄える第一 ッ タンク をさらに備える 又は請求 2に記載の 。The method according to claim 2, further comprising a first tank for temporarily storing three bodies upstream of the exchanger.
4 体の 度を計測する第一 センサ 、 The first sensor to measure the degree of 4 bodies,
前記 前記 体の 量を調整する第一 、  The first to adjust the amount of the body,
前記 センサの 報に基 て前記 を制御する制御 と をさらに備える ら 3の ずれ に記載の 。 The control which controls the above based on the information of the sensor is further included, and the shift of 3 is given.
5 体の 量を調整する第二調整 をさらに備え、 5 The second adjustment to adjust the amount of body is further provided,
前記 、前記 センサの 報に基 て前記 二調整 を制 御する 4に記載の 。 5. The control according to 4 above, which controls the two adjustments based on the information from the sensor.
6 交換器より上流で前記 体の 度を検出する第二 センサ 、 前記 交換器より上流で前記 体の 度を検出する第三 センサ 、 をさらに備え、 6 further comprising a second sensor upstream of the exchanger for detecting the degree of the body, a third sensor upstream of the exchanger for detecting the degree of the body,
前記 、前記 センサ センサの 報に基 て 、前記 二調整 を制御する 5に記載の 。 5. The control of the two adjustments based on the information of the sensor and the sensor.
7 体が、前記 理装置及び とは独立した 給源 ら供給 される ら 6の ずれ に記載の 。If 7 bodies are supplied from a source independent of the above-mentioned processing device and the above, it is described in the deviation of 6.
8 体を前記 交換器より上流で一時的に蓄える第二 ッ タンク をさらに備える 7に記載の 。8. The method according to 7, further comprising a second tank for temporarily storing 8 bodies upstream of the exchanger.
9 と前記 交換器との間に設けられると共に、前記 体の を前記 体に伝える第三 交換器をさらに備える ら 6の ず れ に記載の 。 9 is provided between the exchange and 6. If further provided with a third exchanger for transmitting the above to the body, it is described in any of 6 above.
0 と前記 交換器との間に設けられると共に、前記 体を さ るポンプの を前記 体に伝える第四 交換器をさらに備える ら 6の ずれ に記載の 。 7. A fourth exchanger provided between 0 and the exchanger, further comprising a fourth exchanger for transmitting the pump of the body to the body.
、前記 交換器を経て 上昇した前記 体である ら 6の ずれ に記載の 。 , If the body is elevated after passing through the exchanger, it is described in the deviation of 6.
2 理装置は、前記 とは別の発 を有し、 2 The processing device has a source different from the above.
前記 、前記 交換器よりも下流での との 交換により 上昇した前記 体である ら 6の ずれ に記載の 。 The above, the shift of 6 if the body is raised by the exchange with the downstream of the exchanger.
3 、 を搭 して移動 能なステ ジを駆動する 置で あり、前記 、前記 置に供給される 体である ら 2の ずれ に記載の 。3 is a device for driving a movable stage on which the vehicle is mounted, and the body supplied to the device is described in the deviation of 2.
4 、感光 上に タ ンを する であり、 4, to turn on the light exposure,
前記 、前記 を収容するチャン に供給される 気であるこ とを特徴とする ら 3の ずれ に記載の 。 Item 4. In the item 3, there is a feature that the gas is supplied to the chamber containing the item.
5 感 上に タ ンを する 、前記 を収納するチャン とを 備える 置にお て、 5 In the place where the tan is put on,
前記 を移動さ る 動部 前記チャン 内に第一 体を供給して所 定温度に温 する として、請求 ら 4の ずれ に記載 の 置を備える 。 The moving part that moves the device is provided with the device according to claim 4 for supplying the first body into the chamber and heating it to a predetermined temperature.
6 グラ ィ 程を含む イスの製 法にお て、前記 グラ ィ 程にお て 5に記載の 置を用 る イスの製 。6 In the manufacturing method of the chair including the gray process, the manufacturing process of the chair using the device described in 5 in the above-mentioned gray process.
7 理装置が える 、第一 体により所定温度に温 する 置であ て、 7 A device that can be heated by the first body to a specified temperature
前記 定温度よりも低温の 体を前記 交換器よりも上流で える第一 体と前記 体との間で熱交換を〒 交換器と、 前記 体と前記 定温度よりも高温の 体との間で熱交換を〒 交換器と、を備える 。A body with a temperature lower than the constant temperature can be obtained upstream of the exchanger. A heat exchanger for exchanging heat between the body and the body; and a heat exchanger for exchanging heat between the body and a body having a temperature higher than the constant temperature.
8 体を前記 交換器よりも上流で える第二 ッ タンクをさらに 備える 7に記載の 8.The method according to 7, further comprising a second tank for holding eight bodies upstream of the exchanger.
9 交換器は、第四 体を介して前記 体と前記 体との間で 熱交換を〒 二中間熱交換器を有する 7又は請求 8に記載の 。 9. The heat exchanger according to claim 7 or 8, wherein the heat exchanger has two intermediate heat exchangers for heat exchange between the body and the body via the fourth body.
20 交換器は、第五 体を介して前記 体と前記 体との間で 熱交換を〒 一中間熱交換器を有する 7に記載の 。20. The heat exchanger according to 7, which has a first intermediate heat exchanger for heat exchange between the body and the body through the fifth body.
2 体の 度を計測する センサ 、前記 体の 量を調整する 調整 とをさらに備える 7 ら 2 の ずれ に記載の 22 理装置が える 、第一 体により所定温度に温 する 法であ て、 The method of heating to a predetermined temperature by the first body is provided by the processing device described in any of 7 to 2, further comprising a sensor for measuring the degree of the two bodies and an adjustment for adjusting the amount of the body.
前記 理装置が設置されて る施設 ら前記 定温度よりも低温の 体の 給を受けることと、  Receiving a body temperature lower than the constant temperature from the facility in which the physical processing device is installed;
前記 体と前記 体との間で熱交換を〒 ことと、  Heat exchange between the body and the body,
前記 体と前記 定温度よりも高温の 体との間で熱交換を〒 ことと、 を有する 。 Heat exchange between the body and a body having a temperature higher than the constant temperature.
23 体を第一 ッ タンクに一時的に蓄えた後、前記 体と前記 体との間で熱交換を〒 22に記載の 。After temporarily storing 23 bodies in the first tank, heat exchange between the bodies is described in FIG.
24 体の 度を計測し、計測 果に基 て、前記 前記 体の 量を調整する 22又は請求 23に記載の 。The method according to claim 23 or claim 23, wherein the degree of 24 bodies is measured, and the amount of the body is adjusted based on the measurement result.
25 グラ ィ 程を含む イスの製 法にお て、前記 グラ ィ 程にお て 22 ら 24の ずれ に記載の 法を用 る イスの製 。 In the manufacturing method of the chair including the 25 steps, the manufacturing method of the chair using the method described in the deviations of 22 to 24 in the above steps.
PCT/JP2006/324028 2005-12-05 2006-11-30 Temperature control apparatus, exposure apparatus, temperature control method and device manufacturing method WO2007066582A1 (en)

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JP2012048165A (en) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp Exposure device, stage temperature control method for exposure device, and display panel substrate manufacturing method

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JP2012048165A (en) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp Exposure device, stage temperature control method for exposure device, and display panel substrate manufacturing method

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