TW200731342A - Temperature control apparatus, exposure device, method of temperature control, and method of producing device - Google Patents

Temperature control apparatus, exposure device, method of temperature control, and method of producing device

Info

Publication number
TW200731342A
TW200731342A TW095145116A TW95145116A TW200731342A TW 200731342 A TW200731342 A TW 200731342A TW 095145116 A TW095145116 A TW 095145116A TW 95145116 A TW95145116 A TW 95145116A TW 200731342 A TW200731342 A TW 200731342A
Authority
TW
Taiwan
Prior art keywords
temperature control
temperature
medium
heat exchanger
control apparatus
Prior art date
Application number
TW095145116A
Other languages
Chinese (zh)
Inventor
Toshihiko Tsuji
Tsukasa Ogiwara
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200731342A publication Critical patent/TW200731342A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Abstract

A temperature control apparatus is used to adjust temperature to a predetermined temperature by a first medium flowing in the loop path. It includes a first heat exchanger (54) and a second heat exchanger (52). The first heat exchanger(54) is to proceed heat transfer between the first medium and a second medium (B) (supplied by a supply source independent from the process apparatus and temperature controlling apparatus) which has a temperature lower than the predetermined temperature. The second heat exchanger(52) is to proceed heat transfer between the first medium and a third medium (C) which has a temperature higher than the predetermined temperature.
TW095145116A 2005-12-05 2006-12-05 Temperature control apparatus, exposure device, method of temperature control, and method of producing device TW200731342A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005350943 2005-12-05

Publications (1)

Publication Number Publication Date
TW200731342A true TW200731342A (en) 2007-08-16

Family

ID=38122728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145116A TW200731342A (en) 2005-12-05 2006-12-05 Temperature control apparatus, exposure device, method of temperature control, and method of producing device

Country Status (2)

Country Link
TW (1) TW200731342A (en)
WO (1) WO2007066582A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2003341A (en) 2008-08-22 2010-03-10 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2012048165A (en) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp Exposure device, stage temperature control method for exposure device, and display panel substrate manufacturing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252970A (en) * 1988-08-16 1990-02-22 Nec Corp Cooling device
JPH10125592A (en) * 1996-10-21 1998-05-15 Nikon Corp Temperature controller and temperature control method
JPH11184538A (en) * 1997-12-18 1999-07-09 Komatsu Ltd Temperature controller
JPH11312632A (en) * 1998-04-27 1999-11-09 Nikon Corp Temperature controller and exposure device thereof

Also Published As

Publication number Publication date
WO2007066582A1 (en) 2007-06-14

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