WO2007063489A1 - Module de diodes electroluminescentes - Google Patents

Module de diodes electroluminescentes Download PDF

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Publication number
WO2007063489A1
WO2007063489A1 PCT/IB2006/054479 IB2006054479W WO2007063489A1 WO 2007063489 A1 WO2007063489 A1 WO 2007063489A1 IB 2006054479 W IB2006054479 W IB 2006054479W WO 2007063489 A1 WO2007063489 A1 WO 2007063489A1
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulant
optical element
led module
substrate
chip
Prior art date
Application number
PCT/IB2006/054479
Other languages
English (en)
Inventor
Koen Van Os
Lingli Wang
Gerardus F. C. M. Lijten
Georges M. Calon
Martijn Riemeijer
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Priority to EP06831976A priority Critical patent/EP1958270A1/fr
Publication of WO2007063489A1 publication Critical patent/WO2007063489A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Definitions

  • the present invention relates to a light emitting diode (LED) module comprising at least one LED chip mounted on a heat spreading substrate and an encapsulant covering the chip(s).
  • the present invention also relates to a method for the manufacturing of such a LED module.
  • a common approach is to fill a cavity between the substrate/chips and an enclosing optical out coupling element with a soft encapsulation material, in order to reduce the tension or forces on the components of the LED module (which tension or forces are due to for example a mismatch in thermal expansion coefficient between the components of the LED module).
  • the encapsulant requires space to expand when it is heated during operation of the LED module. Solutions to this problem include only partly filling the cavity with encapsulant, to allow expansion of the encapsulant. An alternative solution is to movably attach the optical element, so that the optical element can move when the encapsulant expands. Both these solutions are disclosed in for example the document US2004124487.
  • a drawback with partly filling the cavity with encapsulant is that the void being created between the encapsulant and the optical element reduces the output of light from the LED module, due to refractive index mismatch.
  • a drawback with the movable optical element is that such a design limits the weight of the optical element that can be used. If a heavy movable optical element is used, the LED module easily fails when exposed even to minor shocks.
  • a LED module comprising at least one LED chip mounted on a heat spreading substrate, an encapsulant covering the chip(s), and an optical element fixedly mounted in relation to the substrate and in contact with the encapsulant, wherein the optical element is so arranged that the encapsulant has at least one free surface to allow deformation of the encapsulant.
  • the optical element is placed and/or formed in relation to the other components of the LED module so that the encapsulant is not completely sealed, whereby the encapsulant can expand at the free surface (unconstrained area) when it is heated during operation of the LED module, without affecting the optical element.
  • an optical element mounted in a fixed position allows for a more robust LED module, compared to a LED module where the optical element is movably attached.
  • an optical element in contact with the encapsulant allows for efficient light coupling between the encapsulant and the optical element.
  • an optical semiconductor device having an aperture for relieving a state of hermetic sealing for the soft resin of the device is known from the document EP1484802.
  • there is no heat spreader onto which the chip is mounted allowing the aperture to be formed in the rear side of the chip holder.
  • a free surface is instead formed by arranging the optical element appropriately.
  • the optical element is mounted on the substrate to cover the chip(s) and encapsulant, and the optical element comprises at least one opening configured to allow deformation of the encapsulant.
  • the encapsulant has a free surface (for example towards the ambient) at the opening, to relieve an otherwise hermetic seal state for the encapsulant. Consequently, the encapsulant can expand when heated (for example during operation of the LED module) through the opening in a controlled way, without otherwise affecting the optical element. Further, the opening facilitates the filling of the encapsulant during manufacturing of the LED module.
  • the opening is formed in the lower edge of the optical element towards the substrate. This design reduces light losses via the opening.
  • a free moving block can be provided at the opening. Thus, when the encapsulant expands, the free moving block moves along with the expansion.
  • the block is made of a reflective material or provided with a reflective coating to reduce light losses via the opening.
  • a recess can be formed in the substrate next to the chip(s), to further allow deformation of the encapsulant. This allows expansion of the encapsulant, even if the opening in the optical element should be closed after filling of the encapsulant.
  • the LED module can additionally comprise a rigid frame mounted to the substrate and supporting the optical element around the opening.
  • the frame gives support to the optical element, which increases the robustness of the LED module and ensures a stable fixation of the optical element.
  • the frame is made of a reflective material or provided with a reflective coating to increase the efficiency of the LED module.
  • the LED module further comprises a reflective frame mounted on the substrate to surround the chip(s) and encapsulant, the frame having an opening opposite the substrate, wherein the optical element is arranged to partly cover the opening, thereby forming a gap between the frame and optical element, and wherein the free surface is located in the gap.
  • the encapsulant has a free surface at the gap, and the free surface relieves an otherwise hermetic seal state for the encapsulant. Consequently, the encapsulant can expand when heated (for example during operation of the LED module) through the gap without affecting the optical element.
  • the frame comprises a horizontal ledge, and the gap is formed laterally in level with the ledge. This design reduces light losses via the free surface(s).
  • a method for the manufacturing of a LED module comprising mounting at least one LED chip on a heat spreading substrate, covering the chip(s) with an encapsulant, and fixedly mounting, in relation to the substrate, an optical element in contact with the encapsulant, wherein the optical element is so arranged that the encapsulant has at least one free surface to allow deformation of the encapsulant.
  • the optical element is mounted on the substrate to cover the chip(s) and encapsulant, and the optical element comprises at least one opening through which the encapsulant can be provided.
  • the optical element can be mounted on the substrate before application of the encapsulant, which facilitates manufacturing.
  • Figs. Ia-Ib are side views of a LED module according to an embodiment of the invention.
  • Fig. 2 is a side view of a variant of the LED module of Figs. Ia-Ib
  • Fig. 3 is a side view of another variant of the LED module of Figs. Ia-Ib
  • Figs. 4a-4b illustrate yet another variant of the LED module of Figs. Ia-Ib
  • Fig. 4c illustrates a rigid frame used for support in the variant of the LED module of Figs. 4a-4b
  • Fig. 5 is a side view of a LED module according to another embodiment of the invention.
  • Figs. Ia-Ib are side views of a LED module 10 according to an embodiment of the invention.
  • the LED module in Fig. Ia is rotated about 90° in relation to the LED module on Fig. Ib.
  • the LED module 10 comprises a plurality of LED chips 12 mounted on top of a heat spreading substrate 14.
  • the substrate 14 can for example comprise a printed circuit board (PCB) mounted on a heat sink.
  • PCB printed circuit board
  • the LED module 10 further comprises an optical element 16, such as a total internal reflection (TIR) collimator, fixedly mounted on the substrate 14.
  • the optical element 16 is adapted to cover the LED chips 12. More specific, the optical element 16 defines at its bottom surface several cavities 18 accommodating the LED chips 12. Here, each cavity 18 accommodates one chip 12, it is however possible for each cavity to accommodate more than one chip. Further, the cavities can be separated for each other or at least partly joined together.
  • Each cavity 18 is filled with an encapsulant 20 covering the LED chips 12.
  • the encapsulant 20 is a soft optical material, such as silicone gel or other soft organic material, and it is used to reduce the tension or forces on the components of the LED module 10 during operation.
  • Each cavity has an opening 22 formed in the lower edge of the optical element 16 towards the substrate 14, as can be seen clearly in Fig. Ia.
  • This opening 22 mainly serves two purposes. First, it allows filling of the encapsulant 20 during manufacturing of the LED module 10. And second, it allows deformation of the encapsulant 20, i.e. the encapsulant can expand when heated (for example during operation of the LED module) in a controlled way through the opening 22. Thus, at the opening 22, the encapsulant 20 has a free surface 24 for deformation. In Fig. Ia, the free surface 24 is towards the ambient, i.e. it connects the cavity 18 with the ambient.
  • Fig. 2 illustrates a variant of the LED module in Figs. Ia-Ib.
  • the LED module 10 further comprises a free moving block 26 provided at the opening 22.
  • the free moving block 26 moves along with the expansion, as indicated by arrow 28.
  • the block 26 is made of a reflective material, or the surface of the block 26 towards the opening 22 can be provided with a reflective coating 30, to reduce light losses via the opening 22.
  • Fig. 3 illustrates another variant of the LED module in Figs. Ia-Ib.
  • a recess 32 is formed in the substrate 14 next to the LED chip 12. This further allows expansion of the encapsulant 20, even if the opening 22 should be closed (after filling of the encapsulant 20), for example by fixating the block 26.
  • Figs. 4a-4b illustrate yet another variant of the LED module in Figs. Ia-Ib.
  • the LED module 10 further comprises a rigid frame 34.
  • the rigid frame 34 is mounted to the substrate 14, and it is designed to support the optical element 16 on the sides of the optical element 16 where no opening 22 is provided.
  • the rigid frame 34 is illustrated alone in Fig. 4c.
  • the rigid frame 34 increases the robustness of the LED module 10, and ensures a stable fixation of the optical element 16.
  • the rigid frame 34 is made of a reflective material or provided with a reflective coating to increase the efficiency of the LED module 10 by reflecting light incident on the rigid frame 34 back towards/into the optical element 16.
  • the rigid frame 34 can for example by made of metal, and it can be manufactured by means of insert moulding and soldered to the substrate 14. It should be noted that the variants illustrated in Figs. 2-4 freely could be combined in a single LED module.
  • Fig. 5 is a side view of a LED module 40 according to another embodiment of the invention.
  • the LED module 40 comprises a plurality of LED chips 42 mounted on top of a heat spreading substrate 44 (the other LED chips are line up "behind" the chip 42 shown in Fig. 5).
  • the substrate 44 can for example comprise a printed circuit board (PCB) 46 mounted on a heat sink 48.
  • PCB printed circuit board
  • the LED module 40 further comprises a reflective frame 50 mounted on the substrate 44, which frame 50 surrounds the LED chips 42.
  • the frame 50 comprises reflector 52, for reflecting portions of light from the LED chips 42 as illustrated by sample light ray (other portions of the light are not reflected by the inner surface, as illustrated by sample light ray), and an upper horizontal ledge 54.
  • a cavity 56 formed by the frame 50 is filled with an encapsulant 58 up to a certain level 60 above the horizontal ledge 54.
  • the encapsulant 58 is a soft optical material, such as a silicone gel, and it is used to reduce the tension or forces on the components of the LED module during operation.
  • An opening 62 of the frame 50 at the level 60 is further partly covered by a fixedly mounted optical element 64, thereby forming a gap 66 between the frame 50 and the optical element on each side of the optical element 64.
  • the encapsulant has a free surface 68 (at the gap 66) towards the ambient on each side of the optical element 64 for deformation of the encapsulant 58.
  • the optical element 64 can for example be a collimator, and it is in contact with the encapsulant 58.
  • the free surfaces 68 which easily can deform, minimize tensile stresses in the encapsulant 62 and tensile stresses between the encapsulant 62 and other parts of the LED module.
  • the optical element 64 can be fixedly mounted in relation to the substrate by means that do not obstruct the fee surfaces.
  • the optical element 64 is sized and positioned so that the gap 66, and consequently the free surface 68, is formed laterally essentially in level with the ledge 54.
  • This design is optimized to minimize the light losses via the free surfaces 68 of the encapsulant 58, as there is only a small vertical space between the frame 50 and the optical element 64 (the vertical space is smaller than the gaps 66/free surfaces 68) through which light from the LED chips 52 can escape. That is, in the embodiment of Fig. 5, the free surface placed in an area of the encapsulant with little or no light.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention a trait à un module de diodes électroluminescentes, comportant au moins une puce de diode électroluminescente montée sur un substrat de diffusion thermique, un boîtier recouvrant la/les puce(s), et un élément optique monté à demeure au substrat et en contact avec le boîtier, ledit élément étant agencé de sorte que le boîtier présente au moins une surface libre pour permettre la déformation du boîtier. La présente invention a également trait à un procédé pour la fabrication d'un tel module de diodes électroluminescentes.
PCT/IB2006/054479 2005-12-02 2006-11-28 Module de diodes electroluminescentes WO2007063489A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06831976A EP1958270A1 (fr) 2005-12-02 2006-11-28 Module de diodes electroluminescentes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05111610.1 2005-12-02
EP05111610 2005-12-02

Publications (1)

Publication Number Publication Date
WO2007063489A1 true WO2007063489A1 (fr) 2007-06-07

Family

ID=37909522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/054479 WO2007063489A1 (fr) 2005-12-02 2006-11-28 Module de diodes electroluminescentes

Country Status (3)

Country Link
EP (1) EP1958270A1 (fr)
TW (1) TW200729562A (fr)
WO (1) WO2007063489A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008030819A1 (de) * 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206444A (en) * 1987-06-10 1989-01-05 Yue Wen Cheng Light emitting diode
EP0864432A2 (fr) * 1997-03-06 1998-09-16 Matsushita Electronics Corporation Dispositif émetteur de lumière et appareil d'enregistrement l'utilisant
EP1156535A1 (fr) * 1999-12-09 2001-11-21 Rohm Co., Ltd. Dispositif electroluminescent a puce comprenant un boitier et son procede de fabrication
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
EP1204151A1 (fr) * 2000-04-24 2002-05-08 Rohm Co., Ltd. Dispositif semi-conducteur electroluminescent a emission laterale et son procede de production
US20020088987A1 (en) * 2000-12-26 2002-07-11 Kazunori Sakurai Optical device and method for manufacturing the same, and electronic apparatus
US20030067264A1 (en) * 2001-10-09 2003-04-10 Agilent Technologies, Inc. Light-emitting diode and method for its production
US20040169466A1 (en) * 2002-12-24 2004-09-02 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
US20040207999A1 (en) * 2003-03-14 2004-10-21 Toyoda Gosei Co., Ltd. LED package
WO2004109813A2 (fr) * 2003-05-30 2004-12-16 Osram Opto Semiconductors Gmbh Diode luminescente
US20050072981A1 (en) * 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
WO2005098975A2 (fr) * 2004-03-31 2005-10-20 Cree, Inc. Procedes d'emballage d'un dispositif electroluminescent et dispositifs electroluminescents emballes

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2206444A (en) * 1987-06-10 1989-01-05 Yue Wen Cheng Light emitting diode
EP0864432A2 (fr) * 1997-03-06 1998-09-16 Matsushita Electronics Corporation Dispositif émetteur de lumière et appareil d'enregistrement l'utilisant
EP1156535A1 (fr) * 1999-12-09 2001-11-21 Rohm Co., Ltd. Dispositif electroluminescent a puce comprenant un boitier et son procede de fabrication
EP1204151A1 (fr) * 2000-04-24 2002-05-08 Rohm Co., Ltd. Dispositif semi-conducteur electroluminescent a emission laterale et son procede de production
US6345903B1 (en) * 2000-09-01 2002-02-12 Citizen Electronics Co., Ltd. Surface-mount type emitting diode and method of manufacturing same
US20020088987A1 (en) * 2000-12-26 2002-07-11 Kazunori Sakurai Optical device and method for manufacturing the same, and electronic apparatus
US20030067264A1 (en) * 2001-10-09 2003-04-10 Agilent Technologies, Inc. Light-emitting diode and method for its production
US20050072981A1 (en) * 2002-02-19 2005-04-07 Ryoma Suenaga Light-emitting device and process for producing thereof
US20040169466A1 (en) * 2002-12-24 2004-09-02 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
US20040207999A1 (en) * 2003-03-14 2004-10-21 Toyoda Gosei Co., Ltd. LED package
WO2004109813A2 (fr) * 2003-05-30 2004-12-16 Osram Opto Semiconductors Gmbh Diode luminescente
WO2005098975A2 (fr) * 2004-03-31 2005-10-20 Cree, Inc. Procedes d'emballage d'un dispositif electroluminescent et dispositifs electroluminescents emballes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008030819A1 (de) * 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung
US8686452B2 (en) 2008-06-30 2014-04-01 Osram Opto Semiconductors Gmbh Optoelectronic apparatus
US9046673B2 (en) 2008-06-30 2015-06-02 Osram Opto Semiconductors Gmbh Optoelectronic apparatus

Also Published As

Publication number Publication date
EP1958270A1 (fr) 2008-08-20
TW200729562A (en) 2007-08-01

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