WO2007063441A1 - Local control of heat flow to more accurately regulate machine temperatures - Google Patents

Local control of heat flow to more accurately regulate machine temperatures Download PDF

Info

Publication number
WO2007063441A1
WO2007063441A1 PCT/IB2006/054257 IB2006054257W WO2007063441A1 WO 2007063441 A1 WO2007063441 A1 WO 2007063441A1 IB 2006054257 W IB2006054257 W IB 2006054257W WO 2007063441 A1 WO2007063441 A1 WO 2007063441A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
fluid
recited
heat
local
Prior art date
Application number
PCT/IB2006/054257
Other languages
French (fr)
Inventor
Theo A.M. Ruijl
Hendrik Jan Eggink
Jack Van Der Sanden
Ralph T.H. Maessen
Jeroen Dekkers
Original Assignee
Koninklijke Philips Electronics, N.V.
U.S. Philips Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics, N.V., U.S. Philips Corporation filed Critical Koninklijke Philips Electronics, N.V.
Priority to EP06821445A priority Critical patent/EP1958026A1/en
Priority to US12/095,635 priority patent/US20100163221A1/en
Priority to JP2008542874A priority patent/JP2009517627A/en
Publication of WO2007063441A1 publication Critical patent/WO2007063441A1/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/01Control of temperature without auxiliary power
    • G05D23/13Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine

Definitions

  • This disclosure relates to temperature control systems and more particularly to a system and method that provides local temperature control to permit independent and accurate temperature regulation in different areas of a system.
  • cooling water is needed to remove heat from heat generation sources.
  • Heat generation sources may include motors, actuators, molds, processes or other energy sources.
  • Heat regulation is needed to condition machine parts, products and or process temperatures to provide proper operation of devices and ensure predictable behavior of processes.
  • cooling fluid is normally supplied from a temperature controlled reservoir.
  • fast temperature control is nearly impossible since the cooling water volume in the reservoir takes time to adjust.
  • the temperature is limited to a single temperature set point.
  • Cooling water is normally supplied from a water reservoir 12 that is temperature controlled to a network of pipes 14.
  • the piping 14 may include multiple passes (heat exchangers 15) to remove heat from multiple heat sources at different locations in the system and or to condition parts that require a curtain absolute temperature level.
  • the temperature set point of the water in the reservoir 12 is normally set to a fixed value or controlled in a very slow feed back loop with a temperature sensor to compensate for drift effects.
  • this method of cooling has some important drawbacks, namely the capacity of the reservoir makes it impossible to respond or quickly anticipate temperature or heat load changes in a machine, which results in temperature fluctuations.
  • the cooling water of a single reservoir 12 is often supplied in parallel to multiple heat exchangers in the machine, which will result locally in different average machine temperatures depending on the amount of coolant flow to a local exchanger and the local heat sources.
  • reservoir 12 feeds a manifold 18 that supplies three piping paths 20, 21 and 22. Each path passes to a different part of machine, and consequently a different heat load, but all paths return to the cooling unit reservoir 12.
  • the large heat sources will require large coolant flows to realize a more or less uniform machine temperature.
  • Large coolant flows introduce vibrations by requiring more pumping power. These vibrations are one of the main sources of mechanical vibrations in high precision machines.
  • the amount of heat removed or added by a fluid results in better and faster controlled local machine temperatures.
  • a temperature regulation system includes a heat generator/removal device coupled to a piping system at a location at or near an element having a need for temperature control.
  • the piping system is configured to deliver a fluid with a temperature of a value, such that within a control range of a local temperature control, a local set point temperature can be reached, to one or more elements needing temperature control.
  • a controller with a feedback sensor is configured to control a heat generator/removal device such that the amount of heat exchanged with the fluid to, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor, accurately maintained at the controller set point temperature.
  • a temperature regulation method and system includes a reservoir having a fluid with a temperature of a value such that, within a control range of a local temperature controller, a local set point temperature is achievable.
  • a piping system delivers the fluid from the reservoir in parallel to one or more elements needing temperature control.
  • a heat generator/removal device in one of the fluid paths is disposed at or near an element needing temperature control.
  • a local temperature controller and a feedback sensor are configured to control the heat generator/removal device such that an amount of heat exchanged with the fluid, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor to be locally and accurately maintained at the local set point temperature.
  • FIG. 1 is a schematic diagram showing a prior art machine cooling apparatus
  • FIG. 2 is a schematic diagram showing a machine cooling apparatus having local temperature control devices distributed through the machine to provide local heat flow control in accordance with one illustrative embodiment
  • FIG. 3 is a cross-sectional view showing an illustrative heat flow control device having feed forward and feed back sensors to monitor and control incoming and outgoing fluid temperatures;
  • FIG. 4 is a cross-sectional view showing an illustrative heat flow control device having a local heater disposed outside of the flow area;
  • FIG. 5 is a cross-sectional view showing an illustrative heat flow control device having a feed back sensor mounted on or in a machine part to be temperature controlled;
  • FIG. 6 is a cross-sectional view showing an illustrative heat flow control device where the device includes a feed back sensor and a heater mounted on or in a machine part to be temperature controlled;
  • FIG. 7 is a cross-sectional view showing an illustrative heat flow control device having a different temperature flows mixed to achieve a desired output temperature flow where at least one of the flows is gated by a valve to control the outgoing fluid temperature.
  • the present disclosure illustratively provides a system, apparatus and method which are employed to promote rapid and accurate temperature control of systems using a single reservoir. While the present invention may employ multiple reservoirs, illustrative embodiment as described herein, may share a single reservoir since the temperature of each point of interest may be controlled locally.
  • Cooling devices may include, e.g., mixing a cold fluid stream in a hot main stream or using a refrigerant type heat exchanger locally. In addition, heating and cooling may be performed locally at a single location depending on the conditions.
  • Heating and cooling elements may be realized in many ways.
  • heating coils may include heated fluid passing through a tube, electrically resistive coils, radiation, or any other heating method.
  • the heating elements described herein include resistive heating coils; however, as mentioned the present invention is not limited to this type of heating elements.
  • the elements depicted in the FIGS may be implemented in various combinations and provide functions which may be combined in a single element or multiple elements.
  • a single machine may have a single temperature control device or a plurality of temperature control devices employing one or more controlled temperature reservoirs.
  • System 100 is shown in an illustrative configuration for a machine 102 having three locations 104, 106 and 108 where temperature is locally controlled using a piping system 101.
  • Other configurations and machines where embodiments of the present invention may be applied include polymer molding, bearings, devices with electromechanical elements, motors, actuators, resistive heating due to electrical currents, lasers/diode or semiconductor elements, geometric measuring machines, IC manufacturing equipment or any other application where temperature control is needed in one or more locations.
  • Local thermal elements 110 are employed to locally control the amount of heat added/removed by a circulated reservoir fluid 211 (FIG. 2), such as, e.g., water.
  • fluid 211 includes a single phase liquid, although a single phase gas may be employed as well.
  • the input fluid temperature is set to a point that is below a desired machine temperature so that in the nominal situation the heater is always generating heat.
  • a precision machine may need local temperature conditioning of 22.00 ⁇ 0.01 degrees C
  • the temperature of the cooling fluid e.g., water
  • the input fluid temperature is set to a value such that within a control range of local temperature control the local set point temperature can be achieved or reached.
  • the coolant flow is employed as a negative heat source to draw heat away from locations 104, 106 and 108 of the machine 102 to compensate for positive heat sources in the machine or heat generated by local thermal elements 110 (e.g., heaters in this case).
  • local thermal elements 110 e.g., heaters in this case.
  • a high temperature requirement on the fluid in the reservoir 112 is not necessary. Controlling the water or machine temperatures locally close to the heat sources makes it possible to react and anticipate changes in the heat sources much faster.
  • Local thermal elements 110 are controlled by a controller 116 based on a temperature signal monitored by a feedback sensor 114 at or near locations 104, 106 and 108. At or near means in the vicinity and may be upstream to the actual part or area to be monitored location, but still local to that area. With the feed back sensor 114 close to or at the point of interest, local machine temperatures can be much more accurately controlled.
  • Each local thermal element 110 uses a controller 116 and a feedback sensor 114 to make independent temperature control of the local areas possible.
  • a feed forward (sensor) signal may also be applied to anticipate known heat sources or related temperature changes to optimize the temperature control accuracy.
  • a single reservoir may be employed to regulate temperatures of a plurality of points of interest.
  • each point of interest may be programmed or set to a specific temperature or temperature profile which is independent from the other locally controlled areas. Further, since the temperature is locally controlled, it may be independent of the reservoir fluid temperature.
  • one or more local thermal elements (heaters) 110 are used to control machine temperature locally by regulating the amount of heat that is removed by the cooling fluid.
  • the cooling fluid with a temperature below the desired machine temperature is supplied from the reservoir 112 in parallel (although serial arrangements are also contemplated) to different locations where the local thermal elements 110 are placed.
  • Each local thermal element 110 will add the proper amount of heat to the cooling fluid locally to control the machine temperature.
  • the desired local temperature may be, e.g., 22 degrees C
  • a local feedback sensor 114 would sense the local temperature (initially 21.5 degrees C) on which the controller 116 will react (because of an offset relative to the control set point of 22 degrees C) by steering or driving the heater 110 (for example using Pi-control) to supply heat to try to reach and maintain the desired set point temperature.
  • the heaters 110 can be used to heat the coolant stream, going to a local heat exchanger 118, to the appropriate temperature level.
  • the heater can also be integrated with the machine part that is to be temperature controlled. Referring to FIG.
  • FIG. 3 an embodiment is illustratively shown where a cooling fluid 202 in a supply line 204 to a heat exchanger 206 is heated by an electrical heater 208 in the fluid stream.
  • the principals of operation are illustratively described in terms of a heating element 208; however, a cooling element may be employed in addition to or instead of heater 208.
  • a signal from a temperature sensor 210 in front of the heater 208 can be used as a feed forward control to compensate for temperature fluctuations in the incoming fluid from a reservoir (e.g., reservoir 112 in FIG. 2).
  • the feed forward control 210 can also be applied to anticipate for known heat source fluctuations (for example, an increasing motor current, a rotational speed increase for a shaft in a bearing, anticipated cycle temperature changes in a mold, etc.).
  • a temperature sensor 212 is provided and after the heater 208 is used to control the temperature level of the fluid 202 going to the local heat exchanger 206. This feed back sensor 212 can also be positioned at the machine part or device
  • a controller 216 is employed to collect signals from sensors 210 and 212 and to steer the heater (or cooler) 208 (using for example a PI or PID-control algorithm) to try to keep the temperature monitored by the feedback sensor 212 as close as possible to the temperature set point or set point profile.
  • a temperature profile program 218 may be synchronized with a triggering event, e.g., higher current draw, a point in a molding cycle, speed change in a bearing, etc. In this way, the controller can better anticipate known heat load changes resulting in smaller control errors.
  • FIG. 4 an embodiment is shown in which an electrical heater 308 is placed in a spiral around a cooling supply channel 310. In this way, the heater 308 is kept outside a cooling fluid 312. At the inside of the channel 310, a spiral shaped fin 314 is present to enhance heat transfer to the fluid 312.
  • FIG. 5 and 6 embodiments in which heaters 408, 409 are integrated with machine parts 406 to be temperature controlled are illustratively shown.
  • FIG. 5 shows an embodiment in which the heater 408 is integrated with a fluid heat exchanger 410.
  • a heater wire in this embodiment is placed in a spiral around a fluid channel 412 and a feedback temperature sensor 416 is included in the machine part 406.
  • the heater 409 is separated from a fluid heat exchanger 411.
  • the temperature control is fed back with the temperature measured by the temperature sensor 416 on the machine part 406 to be conditioned.
  • a feed forward control 418 may also be applied to the temperature of the incoming fluid or on, e.g., actuator currents or other parameters that can be measured, which could affect the temperature locally.
  • a fluid temperature is adjusted by merging two or more fluid streams 502 and 504 with different temperatures Tl and T2.
  • the fluid temperature is controlled by adjusting a flow of one of the two fluid streams 502 or 504 using a valve 506.
  • the valve 506 may be controlled using a feedback sensor 510 which is employed to measure a temperature of a mixed fluid flow 512.
  • Mixed fluid flow 512 may be employed as a cooling or heating mechanism for locally controlling a temperature.
  • An advantage of this embodiment is that the coolant temperature can be adjusted almost instantaneously.
  • This method includes two coolant supplies to provide each of flows 502 and 504. In other embodiment, a greater number of flows may be employed.
  • Embodiments described herein can be applied in all machines, systems or products where temperature control/conditioning by fluid is needed.
  • the embodiments for temperature control are especially useful in high precision machine and equipment which needs high thermal accuracy and stability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Remote Sensing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Control Of Temperature (AREA)

Abstract

A temperature regulation method and system (100) includes a reservoir (112) having a fluid with a temperature of a value such that, within a control range of a local temperature controller, a local set point temperature is achievable. A piping system (101) delivers the fluid from the reservoir to one or more elements needing temperature control. A heat generator/removal device (110) in one of the fluid paths is disposed at or near an element needing temperature control. For each heat generator/removal device, a local temperature controller (116) and a feedback sensor (114) are configured to control the heat generator/removal device such that an amount of heat exchanged with the fluid, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor to be locally and accurately maintained at the local set point temperature.

Description

Local Control of Heat Flow to More Accurately Regulate Machine Temperatures
This disclosure relates to temperature control systems and more particularly to a system and method that provides local temperature control to permit independent and accurate temperature regulation in different areas of a system.
In many systems, cooling water is needed to remove heat from heat generation sources. Heat generation sources may include motors, actuators, molds, processes or other energy sources. Heat regulation is needed to condition machine parts, products and or process temperatures to provide proper operation of devices and ensure predictable behavior of processes. In such systems, cooling fluid is normally supplied from a temperature controlled reservoir. However, fast temperature control is nearly impossible since the cooling water volume in the reservoir takes time to adjust. In addition, the temperature is limited to a single temperature set point.
Referring to FIG. 1, a machine cooling apparatus 10 is shown. Cooling water is normally supplied from a water reservoir 12 that is temperature controlled to a network of pipes 14. The piping 14 may include multiple passes (heat exchangers 15) to remove heat from multiple heat sources at different locations in the system and or to condition parts that require a curtain absolute temperature level. The temperature set point of the water in the reservoir 12 is normally set to a fixed value or controlled in a very slow feed back loop with a temperature sensor to compensate for drift effects. In high precision machines or equipment 16 that requires accurate and stable machine temperatures, this method of cooling has some important drawbacks, namely the capacity of the reservoir makes it impossible to respond or quickly anticipate temperature or heat load changes in a machine, which results in temperature fluctuations. Furthermore, the cooling water of a single reservoir 12 is often supplied in parallel to multiple heat exchangers in the machine, which will result locally in different average machine temperatures depending on the amount of coolant flow to a local exchanger and the local heat sources. For example, reservoir 12 feeds a manifold 18 that supplies three piping paths 20, 21 and 22. Each path passes to a different part of machine, and consequently a different heat load, but all paths return to the cooling unit reservoir 12. With large and small heat sources in a machine, the large heat sources will require large coolant flows to realize a more or less uniform machine temperature. Large coolant flows introduce vibrations by requiring more pumping power. These vibrations are one of the main sources of mechanical vibrations in high precision machines. In accordance with illustrative embodiments, by using locally controlled heat generators and heat sinks, the amount of heat removed or added by a fluid, results in better and faster controlled local machine temperatures.
A temperature regulation system includes a heat generator/removal device coupled to a piping system at a location at or near an element having a need for temperature control. The piping system is configured to deliver a fluid with a temperature of a value, such that within a control range of a local temperature control, a local set point temperature can be reached, to one or more elements needing temperature control. A controller with a feedback sensor is configured to control a heat generator/removal device such that the amount of heat exchanged with the fluid to, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor, accurately maintained at the controller set point temperature.
A temperature regulation method and system includes a reservoir having a fluid with a temperature of a value such that, within a control range of a local temperature controller, a local set point temperature is achievable. A piping system delivers the fluid from the reservoir in parallel to one or more elements needing temperature control. A heat generator/removal device in one of the fluid paths is disposed at or near an element needing temperature control. For each heat generator/removal device, a local temperature controller and a feedback sensor are configured to control the heat generator/removal device such that an amount of heat exchanged with the fluid, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor to be locally and accurately maintained at the local set point temperature.
These and other objects, features and advantages of the present disclosure will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings. This disclosure will present in detail the following description of preferred embodiments with reference to the following figures wherein:
FIG. 1 is a schematic diagram showing a prior art machine cooling apparatus; FIG. 2 is a schematic diagram showing a machine cooling apparatus having local temperature control devices distributed through the machine to provide local heat flow control in accordance with one illustrative embodiment;
FIG. 3 is a cross-sectional view showing an illustrative heat flow control device having feed forward and feed back sensors to monitor and control incoming and outgoing fluid temperatures;
FIG. 4 is a cross-sectional view showing an illustrative heat flow control device having a local heater disposed outside of the flow area;
FIG. 5 is a cross-sectional view showing an illustrative heat flow control device having a feed back sensor mounted on or in a machine part to be temperature controlled;
FIG. 6 is a cross-sectional view showing an illustrative heat flow control device where the device includes a feed back sensor and a heater mounted on or in a machine part to be temperature controlled; and
FIG. 7 is a cross-sectional view showing an illustrative heat flow control device having a different temperature flows mixed to achieve a desired output temperature flow where at least one of the flows is gated by a valve to control the outgoing fluid temperature.
The present disclosure illustratively provides a system, apparatus and method which are employed to promote rapid and accurate temperature control of systems using a single reservoir. While the present invention may employ multiple reservoirs, illustrative embodiment as described herein, may share a single reservoir since the temperature of each point of interest may be controlled locally.
It should be understood that the elements shown in the FIGS, may be implemented in various forms of hardware. While embodiments will be described in terms of a cooling fluid and local heaters, the reverse scenario where warm fluid and cooling devices may also be employed. Cooling devices may include, e.g., mixing a cold fluid stream in a hot main stream or using a refrigerant type heat exchanger locally. In addition, heating and cooling may be performed locally at a single location depending on the conditions.
Heating and cooling elements may be realized in many ways. For example, heating coils may include heated fluid passing through a tube, electrically resistive coils, radiation, or any other heating method. For illustrative purposes, the heating elements described herein include resistive heating coils; however, as mentioned the present invention is not limited to this type of heating elements. The elements depicted in the FIGS, may be implemented in various combinations and provide functions which may be combined in a single element or multiple elements. For example, a single machine may have a single temperature control device or a plurality of temperature control devices employing one or more controlled temperature reservoirs. Referring now to the drawings in which like numerals represent the same or similar elements and initially to FIG. 2, a system 100 for locally monitoring and controlling temperature is illustratively shown. System 100 is shown in an illustrative configuration for a machine 102 having three locations 104, 106 and 108 where temperature is locally controlled using a piping system 101. Other configurations and machines where embodiments of the present invention may be applied include polymer molding, bearings, devices with electromechanical elements, motors, actuators, resistive heating due to electrical currents, lasers/diode or semiconductor elements, geometric measuring machines, IC manufacturing equipment or any other application where temperature control is needed in one or more locations. Local thermal elements 110 are employed to locally control the amount of heat added/removed by a circulated reservoir fluid 211 (FIG. 2), such as, e.g., water. Preferably, fluid 211 includes a single phase liquid, although a single phase gas may be employed as well. Advantageously, local temperatures for machine devices or areas of interest can be better and more rapidly controlled using local thermal elements 110. In one embodiment, to make positive heat and negative heat (heat removal) control with the heaters possible, the input fluid temperature is set to a point that is below a desired machine temperature so that in the nominal situation the heater is always generating heat. For example, in a specific case, a precision machine may need local temperature conditioning of 22.00± 0.01 degrees C, the temperature of the cooling fluid (e.g., water) in a cooling reservoir 112 may be set to about 21.5 degrees C. More generally, the input fluid temperature is set to a value such that within a control range of local temperature control the local set point temperature can be achieved or reached. Being able to use cooling water with a lower temperature makes it is possible to cool large heat sources with much smaller water flows, which in turn reduces vibration levels. The coolant flow is employed as a negative heat source to draw heat away from locations 104, 106 and 108 of the machine 102 to compensate for positive heat sources in the machine or heat generated by local thermal elements 110 (e.g., heaters in this case). With the machine temperature at locations 104, 106 and 108 controlled by the local heaters 110 a high temperature requirement on the fluid in the reservoir 112 is not necessary. Controlling the water or machine temperatures locally close to the heat sources makes it possible to react and anticipate changes in the heat sources much faster. Local thermal elements 110 are controlled by a controller 116 based on a temperature signal monitored by a feedback sensor 114 at or near locations 104, 106 and 108. At or near means in the vicinity and may be upstream to the actual part or area to be monitored location, but still local to that area. With the feed back sensor 114 close to or at the point of interest, local machine temperatures can be much more accurately controlled. Each local thermal element 110 uses a controller 116 and a feedback sensor 114 to make independent temperature control of the local areas possible. A feed forward (sensor) signal may also be applied to anticipate known heat sources or related temperature changes to optimize the temperature control accuracy. Advantageously, a single reservoir may be employed to regulate temperatures of a plurality of points of interest. In addition, each point of interest may be programmed or set to a specific temperature or temperature profile which is independent from the other locally controlled areas. Further, since the temperature is locally controlled, it may be independent of the reservoir fluid temperature.
In the example, one or more local thermal elements (heaters) 110 are used to control machine temperature locally by regulating the amount of heat that is removed by the cooling fluid. The cooling fluid with a temperature below the desired machine temperature is supplied from the reservoir 112 in parallel (although serial arrangements are also contemplated) to different locations where the local thermal elements 110 are placed. Each local thermal element 110 will add the proper amount of heat to the cooling fluid locally to control the machine temperature. Using the precision machine example, the desired local temperature may be, e.g., 22 degrees C, a local feedback sensor 114 would sense the local temperature (initially 21.5 degrees C) on which the controller 116 will react (because of an offset relative to the control set point of 22 degrees C) by steering or driving the heater 110 (for example using Pi-control) to supply heat to try to reach and maintain the desired set point temperature. The heaters 110 can be used to heat the coolant stream, going to a local heat exchanger 118, to the appropriate temperature level. The heater can also be integrated with the machine part that is to be temperature controlled. Referring to FIG. 3, an embodiment is illustratively shown where a cooling fluid 202 in a supply line 204 to a heat exchanger 206 is heated by an electrical heater 208 in the fluid stream. The principals of operation are illustratively described in terms of a heating element 208; however, a cooling element may be employed in addition to or instead of heater 208. A signal from a temperature sensor 210 in front of the heater 208 can be used as a feed forward control to compensate for temperature fluctuations in the incoming fluid from a reservoir (e.g., reservoir 112 in FIG. 2). The feed forward control 210 can also be applied to anticipate for known heat source fluctuations (for example, an increasing motor current, a rotational speed increase for a shaft in a bearing, anticipated cycle temperature changes in a mold, etc.). A temperature sensor 212 is provided and after the heater 208 is used to control the temperature level of the fluid 202 going to the local heat exchanger 206. This feed back sensor 212 can also be positioned at the machine part or device that needs to be temperature controlled.
A controller 216 is employed to collect signals from sensors 210 and 212 and to steer the heater (or cooler) 208 (using for example a PI or PID-control algorithm) to try to keep the temperature monitored by the feedback sensor 212 as close as possible to the temperature set point or set point profile. In one embodiment, a temperature profile program 218 may be synchronized with a triggering event, e.g., higher current draw, a point in a molding cycle, speed change in a bearing, etc. In this way, the controller can better anticipate known heat load changes resulting in smaller control errors.
Referring to FIG. 4, an embodiment is shown in which an electrical heater 308 is placed in a spiral around a cooling supply channel 310. In this way, the heater 308 is kept outside a cooling fluid 312. At the inside of the channel 310, a spiral shaped fin 314 is present to enhance heat transfer to the fluid 312. Referring to FIG. 5 and 6, embodiments in which heaters 408, 409 are integrated with machine parts 406 to be temperature controlled are illustratively shown. FIG. 5 shows an embodiment in which the heater 408 is integrated with a fluid heat exchanger 410. A heater wire in this embodiment is placed in a spiral around a fluid channel 412 and a feedback temperature sensor 416 is included in the machine part 406. In FIG. 6, the heater 409 is separated from a fluid heat exchanger 411. In these cases, the temperature control is fed back with the temperature measured by the temperature sensor 416 on the machine part 406 to be conditioned. A feed forward control 418 may also be applied to the temperature of the incoming fluid or on, e.g., actuator currents or other parameters that can be measured, which could affect the temperature locally.
Referring to FIG. 7, an embodiment of a heat generating/removal device is shown in which a fluid temperature is adjusted by merging two or more fluid streams 502 and 504 with different temperatures Tl and T2. The fluid temperature is controlled by adjusting a flow of one of the two fluid streams 502 or 504 using a valve 506. The valve 506 may be controlled using a feedback sensor 510 which is employed to measure a temperature of a mixed fluid flow 512. Mixed fluid flow 512 may be employed as a cooling or heating mechanism for locally controlling a temperature. An advantage of this embodiment is that the coolant temperature can be adjusted almost instantaneously. This method includes two coolant supplies to provide each of flows 502 and 504. In other embodiment, a greater number of flows may be employed.
Embodiments described herein can be applied in all machines, systems or products where temperature control/conditioning by fluid is needed. The embodiments for temperature control are especially useful in high precision machine and equipment which needs high thermal accuracy and stability.
Having described preferred embodiments for systems, apparatuses and methods for local control of heat flow to more accurately regulate machine temperatures (which are intended to be illustrative and not limiting), it is noted that modifications and variations can be made by persons skilled in the art in light of the above teachings. It is therefore to be understood that changes may be made in the particular embodiments of the disclosure disclosed which are within the scope and spirit of the embodiments disclosed herein as outlined by the appended claims. Having thus described the details and particularity required by the patent laws, what is claimed and desired protected by Letters Patent is set forth in the appended claims.
In interpreting the appended claims, it should be understood that: a) the word "comprising" does not exclude the presence of other elements or acts than those listed in a given claim; b) the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements; c) any reference signs in the claims do not limit their scope; d) several "means" may be represented by the same item or hardware or software implemented structure or function; e) any of the disclosed elements may be comprised of hardware portions (e.g., including discrete and integrated electronic circuitry), software portions (e.g., computer programming), and any combination thereof; f) hardware portions may be comprised of one or both of analog and digital portions; g) any of the disclosed devices or portions thereof may be combined together or separated into further portions unless specifically stated otherwise; and h) no specific sequence of acts is intended to be required unless specifically indicated.

Claims

Claims:
1. A temperature regulation system (100), comprising a reservoir (112) having a fluid with a temperature of a value such that, within a control range of a local temperature controller (116), a local set point temperature is achievable; a piping system (101) to deliver the fluid from the reservoir to one or more elements needing temperature control; at least one heat generator/removal device (110) in one of the fluid paths disposed at or near an element needing temperature control (118); and for each heat generator/removal device, a local temperature controller (116) and a feedback sensor (114) configured to control the heat generator/removal device such that an amount of heat exchanged with the fluid, at or near the element needing temperature control, results in a local temperature, monitored by the control feedback sensor to be locally and accurately maintained at the local set point temperature.
2. The system as recited in claim 1, further comprising a feed forward signal (210) used by the local temperature controller to anticipate heat loads or related temperature changes.
3. The system as recited in claim 1, further comprising a feed forward sensor (210) configured to monitor a temperature of incoming fluid used by the local temperature controller to anticipate incoming fluid temperature fluctuations.
4. The system as recited in claim 1, wherein the piping system (101) delivers the fluid from the reservoir in parallel to the one or more elements needing temperature control.
5. The system as recited in claim 1, wherein the feedback sensor (114) is located within a machine element needing to be temperature monitored.
6. The system as recited in claim 1, wherein the feedback sensor (114) is located within the piping system at or near a machine element needing to be temperature monitored
7. The system as recited in claim 1, wherein the feed back sensor (114) monitors a temperature of an outgoing fluid such that the outgoing fluid temperature is controlled with the heat generator/removal device.
8. The system as recited in claim 1, further comprising the local temperature controller (110) configured to activate the heat generator/removal device in accordance with a triggering event.
9. The system as recited in claim 8, wherein the triggering event includes a change in operation of a machine element needing to be temperature monitored.
10. The system as recited in claim 1, wherein the heat generator/removal device (110) includes a mixture of fluids (512) from a plurality of flows of different temperatures wherein at least one of the flows is regulated to provide a desired temperature.
11. A temperature regulation system (100), comprising a reservoir (112) having a fluid with a controlled temperature of a first value; a piping system (101) configured to deliver the fluid from the reservoir to one or more elements needing temperature control; a heat generating device (110) disposed at a location at or near an element needing temperature control, the heat generating device being configured to apply heat to control the element needing temperature control; and a local controller (116) configured to activate the heat generating device in accordance with a feedback sensor (114) such that the heat generator device applies heat to increase the temperature above the first value to locally and accurately maintain a set point temperature at the element needing temperature control.
12. The system as recited in claim 11, further comprising a feed forward signal (210) used by the local controller to anticipate known heat loads or related temperature changes.
13. The system as recited in claim 11, further comprising a feed forward sensor (210) configured to monitor a temperature of incoming fluid used by the local controller to anticipate incoming fluid temperature fluctuations.
14. The system as recited in claim 11, wherein the piping system (101) delivers the fluid from the reservoir in parallel to the one or more elements needing temperature control.
15. The system as recited in claim 11, wherein the feedback sensor (114) is located within a machine element needing to be temperature monitored.
16. The system as recited in claim 11, wherein the feedback sensor (114) is located within the piping system at or near a machine element needing to be temperature monitored
17. The system as recited in claim 1, wherein the feed back sensor (114) monitors a temperature of an outgoing fluid such that the outgoing fluid temperature is controlled with the heat generating device.
18. The system as recited in claim 1, further comprising the local controller (116) configured to activate the heat generating device in accordance with a triggering event.
19. The system as recited in claim 18, wherein the triggering event includes a change in operation of a machine element needing to be temperature monitored.
20. The system as recited in claim 1, wherein the heat generating device (110) includes a mixture of fluids (512) from a plurality of flows of different temperatures wherein at least one of the flows is regulated to provide a desired temperature.
21. A method for regulating temperatures locally for machine elements, comprising: providing a reservoir (112) common to a plurality of flow paths through an apparatus, the reservoir having a fluid with a controlled temperature of a first value; delivering the fluid (212) from the reservoir to elements needing temperature control; and generating a thermal change (110) at a location at or near the elements having a need for temperature control by generating or removing heat at or near the elements by sensing a local temperature and controlling a heat generating/removal device in accordance with a set point temperature such that the heat generating/removal device controls the temperature of the elements locally to each element to accurately maintain the temperature relative to the first value and independently of the other elements.
22. The method as recited in claim 21, wherein the sensing (210) includes feed forward sensing to monitor a temperature of an incoming fluid to anticipate changes in heat loads.
23. The method as recited in claim 21, wherein the sensing (114) includes monitoring a temperature of an outgoing fluid such that the outgoing fluid temperature is controlled with the heat generating/removal device.
24. The system as recited in claim 21, further comprising a controller (116) configured to activate the heat generating/removal device (110) in accordance with a triggering event, the method including feed forward sensing (210) and feed back sensing (212) to respectively monitor incoming and outgoing fluid temperatures and adjust the fluid temperatures with the heat generating/removal device.
25. The method as recited in claim 21, wherein the triggering event includes a change in operation of a machine element needing to be temperature monitored.
26. The method as recited in claim 21, wherein generating includes mixing different temperature fluids (512) from a plurality of flows such that at least one of the flows is regulated to provide a desired temperature.
PCT/IB2006/054257 2005-11-30 2006-11-14 Local control of heat flow to more accurately regulate machine temperatures WO2007063441A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP06821445A EP1958026A1 (en) 2005-11-30 2006-11-14 Local control of heat flow to more accurately regulate machine temperatures
US12/095,635 US20100163221A1 (en) 2005-11-30 2006-11-14 Local control of heat flow to more accurately regulate machine temperatures
JP2008542874A JP2009517627A (en) 2005-11-30 2006-11-14 Local control of heat flow to more accurately adjust machine temperature

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74086405P 2005-11-30 2005-11-30
US60/740,864 2005-11-30

Publications (1)

Publication Number Publication Date
WO2007063441A1 true WO2007063441A1 (en) 2007-06-07

Family

ID=37897341

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/054257 WO2007063441A1 (en) 2005-11-30 2006-11-14 Local control of heat flow to more accurately regulate machine temperatures

Country Status (6)

Country Link
US (1) US20100163221A1 (en)
EP (1) EP1958026A1 (en)
JP (1) JP2009517627A (en)
KR (1) KR20080072879A (en)
CN (1) CN101322077A (en)
WO (1) WO2007063441A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012062394A1 (en) * 2010-11-12 2012-05-18 Hydac Cooling Gmbh Device for adjusting an individual operating temperature of machine elements of a machine tool
WO2016012175A1 (en) * 2014-07-23 2016-01-28 Asml Netherlands B.V. Conditioning system and lithographic apparatus comprising a conditioning system

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2005009A (en) * 2009-07-27 2011-01-31 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
KR20140140541A (en) 2012-01-30 2014-12-09 에이에스엠엘 네델란즈 비.브이. Lithographic apparatus with a metrology system for measuring a position of a substrate table
US9618859B2 (en) * 2012-01-30 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20130284529A1 (en) * 2012-04-30 2013-10-31 John Franklin Kral Cooling system for mobile machine
WO2016193689A1 (en) * 2015-06-04 2016-12-08 Icescape Limited Improvements relating to cooling
CZ2015399A3 (en) 2015-06-15 2017-02-08 Jiří Dostál Connection to the system for performance management and diagnostics of the heat exchanger
CN113252493B (en) * 2021-07-13 2021-10-01 中国飞机强度研究所 Control method of thermal strength test system
CN113760002B (en) * 2021-09-01 2022-07-15 南京富岛信息工程有限公司 Heavy oil preheating device and method for near infrared spectrum analysis

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072181A (en) * 1975-10-24 1978-02-07 Vihorlat, Narodny Podnik Apparatus for regulating the temperature of a casting mold
US4651813A (en) * 1984-03-31 1987-03-24 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Thermostat for the setting of a constant temperature for a fluid
EP0363098A2 (en) * 1988-10-03 1990-04-11 Canon Kabushiki Kaisha Temperature controlling device
EP0664501A1 (en) * 1994-01-21 1995-07-26 FSI International, Inc. Temperature control apparatus and method with recirculated coolant
US5476137A (en) * 1992-03-13 1995-12-19 Toshiba Kikai Kabushiki Kaisha Ultra-precision temperature control system for machine tool and control method therefor
JPH0989436A (en) * 1995-09-25 1997-04-04 Shinwa Controls Kk Supplying apparatus for brine
US6102113A (en) * 1997-09-16 2000-08-15 B/E Aerospace Temperature control of individual tools in a cluster tool system
US6148626A (en) * 1997-12-24 2000-11-21 Innotech Corporation Chiller apparatus
US20010007015A1 (en) * 1997-06-17 2001-07-05 Afroditi Kapurniotu Peptides used as agonists and/or inhibitors of amyloid formation and cytotoxicity and also for use in alzheimer's disease, in type ii diabetes mellitus and in spongiform encephalophathies
US20010037652A1 (en) * 2000-05-02 2001-11-08 Kuboyuki Sasayama Temperature control device
US20020020179A1 (en) * 2000-04-27 2002-02-21 Gary Winkler Process and apparatus for achieving precision temperature control
JP2002140119A (en) * 2000-10-31 2002-05-17 Nishiyama:Kk Work temperature controller
US20050140959A1 (en) * 2002-03-22 2005-06-30 Nikon Corporation Exposure device, exposure method and device manufacturing method
US20050151954A1 (en) * 2003-11-13 2005-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072181A (en) * 1975-10-24 1978-02-07 Vihorlat, Narodny Podnik Apparatus for regulating the temperature of a casting mold
US4651813A (en) * 1984-03-31 1987-03-24 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Thermostat for the setting of a constant temperature for a fluid
EP0363098A2 (en) * 1988-10-03 1990-04-11 Canon Kabushiki Kaisha Temperature controlling device
US5476137A (en) * 1992-03-13 1995-12-19 Toshiba Kikai Kabushiki Kaisha Ultra-precision temperature control system for machine tool and control method therefor
EP0664501A1 (en) * 1994-01-21 1995-07-26 FSI International, Inc. Temperature control apparatus and method with recirculated coolant
JPH0989436A (en) * 1995-09-25 1997-04-04 Shinwa Controls Kk Supplying apparatus for brine
US20010007015A1 (en) * 1997-06-17 2001-07-05 Afroditi Kapurniotu Peptides used as agonists and/or inhibitors of amyloid formation and cytotoxicity and also for use in alzheimer's disease, in type ii diabetes mellitus and in spongiform encephalophathies
US6102113A (en) * 1997-09-16 2000-08-15 B/E Aerospace Temperature control of individual tools in a cluster tool system
US6148626A (en) * 1997-12-24 2000-11-21 Innotech Corporation Chiller apparatus
US20020020179A1 (en) * 2000-04-27 2002-02-21 Gary Winkler Process and apparatus for achieving precision temperature control
US20010037652A1 (en) * 2000-05-02 2001-11-08 Kuboyuki Sasayama Temperature control device
JP2002140119A (en) * 2000-10-31 2002-05-17 Nishiyama:Kk Work temperature controller
US20050140959A1 (en) * 2002-03-22 2005-06-30 Nikon Corporation Exposure device, exposure method and device manufacturing method
US20050151954A1 (en) * 2003-11-13 2005-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012062394A1 (en) * 2010-11-12 2012-05-18 Hydac Cooling Gmbh Device for adjusting an individual operating temperature of machine elements of a machine tool
WO2016012175A1 (en) * 2014-07-23 2016-01-28 Asml Netherlands B.V. Conditioning system and lithographic apparatus comprising a conditioning system
US10114298B2 (en) 2014-07-23 2018-10-30 Asml Netherlands B.V. Conditioning system and lithographic apparatus comprising a conditioning system

Also Published As

Publication number Publication date
CN101322077A (en) 2008-12-10
KR20080072879A (en) 2008-08-07
US20100163221A1 (en) 2010-07-01
EP1958026A1 (en) 2008-08-20
JP2009517627A (en) 2009-04-30

Similar Documents

Publication Publication Date Title
US20100163221A1 (en) Local control of heat flow to more accurately regulate machine temperatures
CN101072004B (en) Thermoelectric power generator with built-in temperature adjustment
JP3623696B2 (en) Workstation temperature control system and workstation temperature control method
JP3231749B2 (en) Electronic system and electronic module cooling method
KR101099899B1 (en) Circulation cooling system for cryogenic cable
CN107045361A (en) Double-loop temperature control module and electronic element testing equipment with same
KR20090095456A (en) Thermal Controller for Electronic Devices
JP2008252102A (en) Substrate heat control system
JP4741562B2 (en) Substrate thermal management method
US20230024244A1 (en) Method for operating a heat exchanger, and energy store heat exchange system
CN107701483A (en) Temperature control equipment and its method
EP0226215B1 (en) Electric spark machining apparatus
US11522414B2 (en) Speed-regulated external fans for the temperature-controlled throughput ventilation of turbogenerators, phase shifters, and rotating electrical machines for network stabilization
KR20020066358A (en) Multi-channel temperature control system for semiconductor processing facilities
JP2844422B2 (en) Die height holding method of press machine
JP3454886B2 (en) Fluid constant temperature method and apparatus
JP3411098B2 (en) Air conditioning equipment
JP2006224238A (en) Cooling device of machine tool
JPH0674599A (en) Warm/chilled water manufacturing apparatus
US9914545B2 (en) Aircraft heat exchange system including a thermoelectric device
CN214307348U (en) Constant temperature room temperature governing system based on cold source and heat source
EP3181456B1 (en) Aircraft heat exchange system including a thermoelectric device
JP3122494U (en) Temperature control device
JP2018100780A (en) Temperature control method of heat medium for temperature control and supply device of heat medium for temperature control using the same
JP2008546982A (en) Gas supply method and apparatus

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680045121.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2006821445

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008542874

Country of ref document: JP

Ref document number: 1020087012869

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12095635

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 2006821445

Country of ref document: EP