WO2007043107A1

WO2007043107A1 - Board structure and package component

Info

Publication number: WO2007043107A1
Application number: PCT/JP2005/018135
Authority: WO
Inventors: Masahiro Ono; Yoshihiro Uda; Seiji Yamaguchi; Kazuhiro Shinchi; Satoru Tomekawa; Atsuo Hayakawa
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2005-09-30
Filing date: 2005-09-30
Publication date: 2007-04-19

Abstract

A board structure and a package component in which a step of processing a resin part can be simplified are provided. A board structure (10) has a board (11), electronic parts (12) mounted along the board (11), and a resin part (13) covering the electronic parts (12) with resin and adhering to the board (11). A protrusion (18) is provided on the bottom face (12A) of an electronic part (12) in a position (17) where the protrusion (18) does not interfere with electric connections (15, 16) between the board (11) and the electronic part (12). The protrusion (18) protrudes toward the board (11).

Description

Specification

Board structure and package parts

Technical field

TECHNICAL FIELD [0001] The present invention relates to a substrate structure in which an electronic component is mounted along a substrate, the electronic component is covered with a resin part, and is in close contact with the substrate, and a package part in which the electronic component is covered with a resin part.

Background art

Conventionally, there has been known a substrate structure including a resin part that covers an electronic component mounted along a substrate with resin. With this substrate structure, the mounting strength of the electronic component on the substrate can be improved by the resin portion being in close contact with the substrate.

Further, a reinforcing structure of an IC package is proposed in which an IC package mounted on a mother board is covered with a reinforcing frame having a side surface and an upper surface, and the resin is filled in the reinforcing frame (Patent Document 1). reference).

[0003] In recent years, a resin body formed by a frame body that surrounds an electronic component and is in close contact with a substrate, and a lid that closes the opening of the frame body after the frame body is fully filled with the resin, Substrate structures that improve the reinforcing function have been tried.

[0004] With such a substrate structure, when electrical shielding is required for an electronic component, the frame and the lid are made of, for example, metal, and the resin enters the gap between the frame and the lid, thereby shielding the shield. The filling amount is strictly controlled so that excess or deficiency does not occur in the fat filled in the frame so that the properties are not impaired.

[0005] That is, the amount of grease filled in the frame body is such that when the lid portion is put on the opening of the frame body, the grease does not overflow from the gap between the frame body and the lid portion. It is determined that the resin is filled up to the opening.

Patent Document 1: Japanese Patent No. 3241669

Disclosure of the invention

Problems to be solved by the invention

[0006] By the way, in the substrate structure described above, a circuit pattern provided on the surface of the substrate; The connection part provided on the bottom surface of the electronic component is brought into surface contact with the joint via a screw.

For this structural reason, when forming the resin part, bubbles mixed in the resin or bubbles generated from the resin interfere with the electrical connection between the substrate and the electronic component. However, it tends to stay at the position.

When the bubbles are solidified while the bubbles remain, the bubbles may form a gap.

[0007] However, such bubbles cause an increase in the apparent volume of the resin, and if a lid is placed on the frame, the resin may overflow the frame power and impair the shielding performance. There is. For this reason, in the above-described substrate structure, it is necessary to inject a predetermined amount that does not fully fill the frame with the resin, then place the lid on the frame, and then fill the frame again with the resin. Yes, there is a problem that the processing step of the resin portion becomes complicated.

[0008] The present invention has been made to solve the above-described conventional problems.

Another object of the present invention is to provide a substrate structure and a package component that can simplify the processing process of the resin portion.

Means for solving the problem

[0009] The substrate structure of the present invention includes a substrate, an electronic component mounted along the substrate, and a resin part that covers the electronic component with a resin and adheres to the substrate. A frame that surrounds the electronic component and is in close contact with the substrate; and a lid that closes an opening of the frame, and interferes with an electrical connection between the substrate and the electronic component. However, it is characterized in that a protrusion is provided at a position where one of the front surface of the substrate and the bottom surface of the electronic component protrudes toward the other.

[0010] Further, the knocking component of the present invention is a package component including a resin part in which the electronic component is coated with a resin, and does not interfere with an electrical connection portion at the bottom of the electronic component. And a protrusion is provided at the position.

[0011] A protrusion is provided on one of the surface of the substrate and the bottom surface of the electronic component, and the protrusion protrudes toward the other. Therefore, in the gap between the substrate and the electronic component, the position can be filled with the protrusion without interfering with the electrical connection portion!

This reduces the possibility that bubbles will stay in a position where they do not interfere with the electrical connection location. As a result, it is possible to make it difficult to increase the volume on the surface of the grease.

[0012] Further, the substrate structure of the present invention includes a substrate, an electronic component mounted along the substrate, and a resin part that covers the electronic component with a resin and adheres to the substrate. A plate structure that includes a frame that surrounds the electronic component and is in close contact with the substrate; and a lid that closes an opening of the frame, and interferes with an electrical connection between the substrate and the electronic component. However, the position force is characterized in that a communication hole is provided to the outside.

[0013] Further, the knocking part of the present invention is a package part including a resin part in which an electronic part is coated with a resin, and does not interfere with an electrical connection point at the bottom of the electronic part. The position force is characterized in that a communication hole is provided to the outside.

[0014] Of the gap between the substrate and the electronic component, a communication hole is provided to the outside so as to prevent a positional force that does not interfere with the electrical connection location. Therefore, bubbles staying at a position where they do not interfere with the electrical connection location are guided to the outside through the communication hole.

As a result, the possibility of bubbles staying at a position where they do not interfere with the electrical connection location can be reduced, so that it is difficult to increase the volume of the grease on the four sides.

[0015] Further, the substrate structure of the present invention includes a substrate, an electronic component mounted along the substrate, and a resin portion that covers the electronic component with the resin and adheres to the substrate. A plate structure that includes a frame that surrounds the electronic component and is in close contact with the substrate; and a lid that closes an opening of the frame, and interferes with an electrical connection between the substrate and the electronic component. However, it is characterized in that an underfill is applied to the position.

[0016] Further, the knocking part of the present invention is a package part including a resin part in which an electronic part is coated with a resin, and does not interfere with an electrical connection portion at the bottom of the electronic part. The underfill is applied to the position.

[0017] Underfill was applied to a position in the gap between the substrate and the electronic component that did not interfere with the electrical connection location. This underfill has excellent wettability! /

Therefore, wettability can be obtained at a position that does not interfere with the electrical connection location, so that the resin can easily enter.

The invention's effect

[0018] According to the substrate structure and the package component of the present invention, it is possible to simplify the processing step of the resin portion by making it difficult to increase the apparent volume of the resin.

Brief Description of Drawings

FIG. 1 is a cross-sectional view showing a first embodiment of a substrate structure according to the present invention.

FIG. 2 is an exploded perspective view showing a substrate structure according to the first embodiment.

FIG. 3 is a bottom view showing the substrate structure according to the first embodiment.

FIG. 4 is an enlarged view showing a main part of the substrate structure according to the first embodiment.

FIG. 5 is an enlarged view of a main part showing a substrate structure according to a modification of the first embodiment.

FIG. 6 is a cross-sectional view showing a second embodiment of the substrate structure according to the present invention.

FIG. 7 is a cross-sectional view showing a third embodiment of a substrate structure according to the present invention.

FIG. 8 is a cross-sectional view showing a fourth embodiment of a package component according to the present invention.

FIG. 9 is a cross-sectional view showing a fifth embodiment of a package component according to the present invention.

FIG. 10 is a cross-sectional view showing a sixth embodiment of a package component according to the present invention.

Explanation of symbols

[0020] 10, 50, 60, 70 Board structure

11 Board

11A substrate surface

12 Electronic components

12A Bottom of electronic component (bottom)

13 Lubricating part

15, 16 Electrical connections

17 Positions that do not interfere with electrical connections

18 Protrusion

21 Frame

22 opening

23 Lid 24

61 Communication hole

71 Underfill

80, 90, 100 knock parts

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a substrate structure and a package component according to an embodiment of the present invention will be described with reference to the drawings.

As shown in FIG. 1 and FIG. 2, the board structure 10 of the first embodiment covers a board 11, a plurality of electronic components 12 mounted along the board 11, and each electronic component 12 covered with grease. In addition, a resin portion 13 that is in close contact with the substrate 11 is provided.

As shown in FIGS. 3 and 4, the board structure 10 protrudes from the bottom surface 12 A of the electronic component 12 at a position 17 that does not interfere with the electrical connection points 15 and 16 between the board 11 and the electronic component 12. A portion (dummy electrode) 18 is provided, and the protruding portion 18 protrudes toward the substrate 11.

[0022] As shown in FIGS. 1 and 2, the resin portion 13 includes a frame body 21 that surrounds each electronic component 12 and is in close contact with the substrate 11, and a lid portion 23 that closes the opening 22 of the frame body 21. In addition, the resin 24 is filled inside the frame body 21.

In the frame body 21, an outer frame 26 is formed in a substantially rectangular shape, a lower portion of the outer frame 26 is in close contact with the substrate 11, and an upper portion is opened.

[0023] Inside the outer frame 26, first and second partition frame bodies 27, 28 are provided. The lower portions of the first and second partition frames 27 and 28 are in close contact with the substrate 11.

The height of the upper part of the outer frame 26 and the upper parts of the first and second partition frame bodies 27 and 28 are determined so as to be flush with each other.

The opening 22 of the frame body 21 is closed with a lid portion 23. The lid portion 23 is a substantially rectangular plate that is formed one size larger than the upper portion of the outer frame 26.

The inside of the frame body 21 is filled with grease 24.

The electronic component 12 includes a connection portion 31 on the bottom surface 12A, and the connection portion 31 is connected to a circuit pattern provided on the surface of the substrate 11 via solder. As a result, the electronic component 12 is mounted on the board 1 Electrically connect to 1.

Here, the part where the connection part 31 is connected to the substrate 11 is referred to as an electrical connection part 15, 16 (see FIGS. 3 and 4).

[0026] Then, on the bottom surface 12A of the electronic component 12, a protrusion 18 is provided at a position 17 that does not interfere with the electrical connection portions 15 and 16. The protrusion 18 protrudes toward the substrate 11. Therefore, in the gap between the substrate 11 and the electronic component 12, the position 17 can be filled with the protrusion 18 without interfering with the electrical connection portions 15 and 16.

[0027] Thereby, when forming the resin part 13, the bubbles mixed in the molten resin of the resin 24 or the bubbles generated from the molten resin do not interfere with the electrical connection points 15, 16 at the position 17. The possibility that bubbles will stay can be reduced.

Thus, by reducing the possibility that bubbles will stay, it is possible to make it difficult to increase the apparent volume of the resin 24.

[0028] Therefore, in the manufacturing process of the substrate structure 10, when the resin 24 is filled in the molten resin in the state of the molten resin, the resin 24 does not rise from the opening 12 of the frame 21. In addition, the resin 24 can be suitably filled up to the mouth of the opening 12.

Therefore, when the lid portion 23 is placed on the frame body 21, there is no possibility that the grease 24 overflows the upper force of the frame body 21, and the shielding performance is not impaired.

[0029] Therefore, according to the substrate structure 10 of the first embodiment, the resin 24 is injected into the frame body 21 until it is fully filled, and in this state, the lid portion 23 is placed on the frame body 21. Then, complete the processing step of the grease part 13.

Therefore, as described in the prior art, it is not necessary to inject the resin 24 into the frame body 21 again after the lid portion 23 is placed on the frame body 21, so that it is not necessary to fully fill the resin body. Can be simplified.

[0030] Modification

As shown in FIG. 5, the substrate structure 50 of the modified example has a protrusion (dummy) on the surface 11A of the substrate 11 at a position 17 that does not interfere with the electrical connection points 15 and 16 between the substrate 11 and the electronic component 12. Electrode) 51 is provided, and this protrusion 51 protrudes toward the bottom surface 12A of the electronic component 12. According to the substrate structure 50 of the modification, the same effect as the substrate structure 10 of the first embodiment can be obtained.

[0031] Hereinafter, second to sixth embodiments will be described with reference to Figs. In the second to sixth embodiments, the same members as those of the substrate structure 10 of the first embodiment are denoted by the same reference numerals and description thereof is omitted.

[0032] Second Embodiment

A substrate structure 60 of the second embodiment shown in FIG. 6 is provided with a communication hole 61 instead of the protrusion 18 of the first embodiment, and other configurations are the same as those of the substrate structure 10 of the first embodiment. is there. That is, the substrate structure 60 of the second embodiment is provided with the communication hole 61 from the position 17 to the outside 62 without interfering with the electrical connection portions 15 and 16 between the substrate 11 and the electronic component 12.

Therefore, the air is guided to the outside 62 through the bubble force communication hole 61 that stays at the position 17 that does not interfere with the electrical connection points 15 and 16.

As a result, the possibility of bubbles staying at the position 17 that does not interfere with the electrical connection points 15 and 16 can be reduced, so that it is difficult to increase the volume of the grease 24 on the four sides.

That is, according to the substrate structure 60 of the second embodiment, the same effect as the substrate structure 10 of the first embodiment can be obtained.

[0034] Third Embodiment

A substrate structure 70 of the third embodiment shown in FIG. 7 is obtained by applying underfill 71 instead of the protrusions 18 of the first embodiment, and other configurations are the same as the substrate structure 10 of the first embodiment. is there.

That is, in the substrate structure 70 of the third embodiment, the underfill 71 is applied to the position 17 without interfering with the electrical connection portions 15 and 16 between the substrate 11 and the electronic component 12.

This underfill 71 has excellent wettability.

Therefore, wettability is obtained at the position 17 that does not interfere with the electrical connection points 15 and 16, and the resin 24 is likely to enter.

As a result, air bubbles may stay in position 17 where they do not interfere with electrical connection points 15 and 16. Since the performance can be reduced, it is difficult to increase the volume of the grease 24 on the four sides.

That is, according to the substrate structure 70 of the third embodiment, the same effect as the substrate structure 10 of the first embodiment can be obtained.

[0036] In the substrate structure 70 of the third embodiment, an example in which the underfill 71 is applied to the position 17 without interfering with the electrical connection portions 15 and 16 between the substrate 11 and the electronic component 12 is described. As described above, it is possible to apply the underfill 71 to the entire area between the substrate 11 and the electronic component 12.

[0037] Fourth Embodiment

The package component 80 of the fourth embodiment shown in FIG. 8 includes a grease part 13 in which the electronic component 12 is covered with the grease 24, and an electrical connection point 15 on the bottom surface (bottom part) 12A of the electronic component 12 15, A protrusion 18 is provided at a position 17 without interfering with 16.

[0038] Therefore, when the knocking component 80 is attached to the substrate 11, the position 17 in the gap between the substrate 11 and the electronic component 12 that does not interfere with the electrical connection points 15 and 16 can be filled with the protrusions 18. wear.

As a result, it is possible to reduce the possibility that bubbles will stay at the position 17 where the electrical connection points 15 and 16 do not interfere with each other, and it is possible to make it difficult to increase the volume of the grease 24 on the four sides.

That is, according to the package component 80 of the fourth embodiment, the same effect as the substrate structure 10 of the first embodiment can be obtained.

[0039] Fifth Embodiment

The package component 90 of the fifth embodiment shown in FIG. 9 includes a grease part 13 in which the electronic component 12 is covered with the grease 24, and an electrical connection point 15 on the bottom surface (bottom part) 12A of the electronic component 12 15, A communication hole 61 is provided from position 17 to the outside 62 without interfering with 16. Therefore, when the knocking component 90 is attached to the substrate 11, the bubbles staying at the position 17 are guided to the outside 62 through the communication hole 61 without interfering with the electrical connection portions 15 and 16.

[0040] As a result, the possibility of bubbles staying at the position 17 that does not interfere with the electrical connection points 15 and 16 can be reduced, so that it is difficult to increase the volume of the grease 24 on the four sides.

That is, according to the substrate structure 90 of the fifth embodiment, the same effect as the substrate structure 60 of the second embodiment can be obtained. [0041] Sixth Embodiment

The package component 100 of the sixth embodiment shown in FIG. 10 includes a resin part 13 in which an electronic component 12 is covered with a resin 24, and an electrical connection point 15A on the bottom surface (bottom part) 12A of the electronic component 12. Underfill 71 is applied at position 17 where it does not interfere with 16. This underfill 71 has excellent wettability.

[0042] Therefore, when the package component 90 is attached to the substrate 11, wettability is obtained at the position 17 that does not interfere with the electrical connection portions 15 and 16, so that the resin 24 can easily enter.

That is, according to the substrate structure 100 of the sixth embodiment, the same effect as the substrate structure 70 of the third embodiment can be obtained.

Note that in the first to sixth embodiments, the force exemplified as the plurality of electronic components 12 as the electronic component is not limited to this, and a single electronic component 12 may be used.

Further, the shapes and dimensions of the grease part, the frame, the lid part, and the grease exemplified in the first to sixth embodiments can be appropriately changed.

Industrial applicability

[0044] The present invention is suitable for application to a substrate structure in which an electronic component is mounted along a substrate and the electronic component is covered with a resin portion and is in close contact with the substrate, and the electronic component is covered with the resin portion. It is suitable for application to packaged parts.

Claims

The scope of the claims

[1] A board structure comprising a board, an electronic component mounted along the board, and a grease part that covers the electronic component with grease and adheres closely to the board,

A frame that surrounds the electronic component and is in close contact with the substrate; and a lid that closes an opening of the frame,

Protrusions projecting from one of the front surface of the substrate and the bottom surface of the electronic component to the other are provided at positions that do not interfere with electrical connection locations between the substrate and the electronic component. A substrate structure characterized by that.

[2] A board structure comprising: a board; an electronic component mounted along the board; and a grease part that covers the electronic part with grease and adheres to the board;

A substrate structure, wherein a communication hole is provided from a position that does not interfere with an electrical connection portion between the substrate and the electronic component to the outside.

[3] A board structure comprising a board, an electronic component mounted along the board, and a grease part that covers the electronic part with grease and is in close contact with the board,

An underfill is applied at a position that does not interfere with an electrical connection between the substrate and the electronic component.

[4] A package component having a resin part coated with a resin,

A package part, characterized in that a protrusion is provided at a position that does not interfere with an electrical connection portion at the bottom of the electronic part.

[5] An electronic component is a package component having a resin part coated with resin,

The package component, wherein a communication force is provided to the outside so as not to interfere with an electrical connection portion at the bottom of the electronic component.

[6] A package component comprising a resin part coated with a resin, the electronic component comprising:

An underfill is provided at a position where it does not interfere with an electrical connection portion at the bottom of the electronic component. A package component characterized in that a coating is applied.