WO2007038490A8 - Low melting temperature compliant solders - Google Patents

Low melting temperature compliant solders

Info

Publication number
WO2007038490A8
WO2007038490A8 PCT/US2006/037441 US2006037441W WO2007038490A8 WO 2007038490 A8 WO2007038490 A8 WO 2007038490A8 US 2006037441 W US2006037441 W US 2006037441W WO 2007038490 A8 WO2007038490 A8 WO 2007038490A8
Authority
WO
WIPO (PCT)
Prior art keywords
melting temperature
low melting
temperature compliant
weight
solders
Prior art date
Application number
PCT/US2006/037441
Other languages
French (fr)
Other versions
WO2007038490A2 (en
WO2007038490A3 (en
Inventor
Benlih Huang
Original Assignee
Indium Corp America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp America filed Critical Indium Corp America
Publication of WO2007038490A2 publication Critical patent/WO2007038490A2/en
Publication of WO2007038490A3 publication Critical patent/WO2007038490A3/en
Publication of WO2007038490A8 publication Critical patent/WO2007038490A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Abstract

Low melting temperature compliant solders are disclosed. In one particular exemplary embodiment, a low melting temperature compliant solder alloy comprises from about 91.5% to about 97.998% by weight tin, from about 0.001% to about 3.5% by weight silver, from about 0.0% to about 1.0% by weight copper, and from about 2.001% to about 4.0% by weight indium.
PCT/US2006/037441 2005-09-26 2006-09-26 Low melting temperature compliant solders WO2007038490A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72003905P 2005-09-26 2005-09-26
US60/720,039 2005-09-26
US11/422,782 US20070071634A1 (en) 2005-09-26 2006-06-07 Low melting temperature compliant solders
US11/422,782 2006-06-07

Publications (3)

Publication Number Publication Date
WO2007038490A2 WO2007038490A2 (en) 2007-04-05
WO2007038490A3 WO2007038490A3 (en) 2007-05-31
WO2007038490A8 true WO2007038490A8 (en) 2008-06-12

Family

ID=37894223

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/037441 WO2007038490A2 (en) 2005-09-26 2006-09-26 Low melting temperature compliant solders

Country Status (2)

Country Link
US (1) US20070071634A1 (en)
WO (1) WO2007038490A2 (en)

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WO2009011392A1 (en) * 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. In-containing lead-free solder for on-vehicle electronic circuit
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
JP4787384B1 (en) * 2010-10-29 2011-10-05 ハリマ化成株式会社 Low silver solder alloy and solder paste composition
JP2013252548A (en) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd Solder paste for joining micro component
WO2014097390A1 (en) 2012-12-18 2014-06-26 千住金属工業株式会社 Lead-free solder alloy
US10076808B2 (en) * 2013-08-05 2018-09-18 Senju Metal Industry Co., Ltd. Lead-free solder alloy
US11229979B2 (en) * 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
EP3291942B1 (en) * 2015-05-05 2021-03-24 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN106884107B (en) * 2017-03-09 2018-05-22 宁波新瑞清科金属材料有限公司 A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof
CN109082559B (en) * 2018-09-03 2021-09-28 云南锡业锡材有限公司 SnAgCuNiGeCe low-silver high-reliability lead-free solder alloy
TWI820277B (en) * 2018-12-27 2023-11-01 美商阿爾發金屬化工公司 Lead-free solder compositions
CN110303270A (en) * 2019-07-30 2019-10-08 广东省焊接技术研究所（广东省中乌研究院） Lead-free brazing, preparation method, its application, solder profile and electronic component
CN110952017B (en) * 2019-12-27 2020-10-09 华北水利水电大学 High-entropy ultra-silver solder alloy and preparation method thereof
CN114700653A (en) * 2022-04-13 2022-07-05 北京理工大学 High-hardness all-intermetallic compound welding spot and preparation method thereof

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Also Published As

Publication number Publication date
WO2007038490A2 (en) 2007-04-05
US20070071634A1 (en) 2007-03-29
WO2007038490A3 (en) 2007-05-31

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