WO2007038022A2 - Reduction de contrainte sur filiere a onde acoustique de surface, avec supports structurels entourant la filiere - Google Patents

Reduction de contrainte sur filiere a onde acoustique de surface, avec supports structurels entourant la filiere Download PDF

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Publication number
WO2007038022A2
WO2007038022A2 PCT/US2006/036045 US2006036045W WO2007038022A2 WO 2007038022 A2 WO2007038022 A2 WO 2007038022A2 US 2006036045 W US2006036045 W US 2006036045W WO 2007038022 A2 WO2007038022 A2 WO 2007038022A2
Authority
WO
WIPO (PCT)
Prior art keywords
die
saw
support element
die component
component
Prior art date
Application number
PCT/US2006/036045
Other languages
English (en)
Other versions
WO2007038022A3 (fr
Inventor
Scott L. Bunyer
Steven J. Magee
Original Assignee
Honeywell International Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc. filed Critical Honeywell International Inc.
Publication of WO2007038022A2 publication Critical patent/WO2007038022A2/fr
Publication of WO2007038022A3 publication Critical patent/WO2007038022A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02984—Protection measures against damaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Embodiments are generally related to .surface acoustic wave (SAW) devices and components. Embodiments are also related to SAW die and methods for manufacturing and producing SAW die. Embodiments are additionally related to SAW die structures.
  • SAW surface acoustic wave
  • SAW Surface acoustic wave
  • SAW technology is generally characterized by its reliance on acoustic energy and electrical/acoustic transducers.
  • SAW components are based on devices in which radio frequency signals are converted to acoustic signals and confined within a small substrate made from, for example, Lithium Niobate or other crystalline materials.
  • SAW waves propagate at relatively low speed with reference to radio waves and, as such, a small substrate may produce relatively long time delays.
  • SAW devices are useful, however, for example, devices such as filters utilized in wireless applications and sensors utilized in various environmental detection applications, such as pressure, torque and/or temperature sensors.
  • SAW devices are manufactured from a SAW die. Such components are typically manufactured with quartz, which is utilized because the quartz provides for minimal hysteresis, low creep, low aging and improved long-term stability.
  • quartz is utilized because the quartz provides for minimal hysteresis, low creep, low aging and improved long-term stability.
  • One of the problems with quartz is that it is very brittle and can fracture if the die is over-stressed.
  • the strength of the quartz can be increased by various methods. The methods used to increase the strength of the quartz can add considerable cost to the manufactured part.
  • a die structural support apparatus and method are disclosed, in which a die component is provided.
  • a support element can be configured for use with the die component, wherein said support element surrounds said die component, thereby strengthening said die component to provide a surrounding die support structure thereof.
  • the die component preferably constitutes a SAW die, and may be formed from, for example, quartz.
  • the support element can be molded, stamped, cast, machined and so forth and is preferably located with respect to the SAW die after the SAW die is formed.
  • the separate support element thus surrounds the SAW die to strengthen it.
  • the support element can be ceramic, plastic, metal, quartz, etc.
  • the support element or support piece can be pressed down about the SAW die or may be configured with a small gap for clearance. If a small clearance is utilized, the gap can create a wicking action for the adhesive, which in turn can be utilized to hold the SAW to a transducer package. The adhesive wicking up into this gap can also strengthen the quartz.
  • FIG. 1 illustrates a top view of a die component
  • FIG. 2 illustrates a top view of a die structural support apparatus, which can be implemented in accordance with a preferred embodiment
  • FIG. 3 illustrates a top view of a die structural support apparatus, which can be implemented in accordance with an alternative embodiment.
  • FIG. 1 illustrates a top view of a die component 100 (e.g. a SAW die).
  • a die component 100 e.g. a SAW die
  • a detail is shown with respect to a section 102 of the die component 100.
  • a plurality of micro cracks 104, 106, 108, and 110 may form in the die component 100.
  • FIG. 2 illustrates a top view of a die structural support apparatus 200, which can be implemented in accordance with a preferred embodiment.
  • the die structural support apparatus 200 generally includes a die component 100 and a support element 302 that surrounds said die component 100, thereby strengthening said die component 100 to provide a surrounding die support structure thereof.
  • the die component 100 can be, for example, a SAW die and may be preferably formed from quartz.
  • the support, element 302 functions as a separate piece that surrounds the jdie component 100 to strengthen it.
  • the support .element 302 can be configured from, for example, ceramic, plastic, metal, quartz and the like, depending upon design considerations. Support element 302 is preferably, however, configured form quartz.
  • FIG. 3 illustrates a top view of a die structural support apparatus 300, which can be implemented in accordance with an alternative embodiment.
  • the die component 100 is surrounded by the support element 302.
  • the support element 302 can be pressed down about the die component 100 as indicated in FIG. 2, or can provide for a small gap 402 for clearance as depicted in FIG. 3. It the small clearance of gap 402 is implemented as indicated in FIG. 3, the gap 402 can create a wicking action for an adhesive for use in holding the die component 100 to a transducer package. The adhesive wicking up into gap 402 can also contribute to strengthening the die component 100.
  • the support element 302 can be molded, stamped, cast, machine, and so forth, depending upon design considerations.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

Support structurel de filière et procédé, avec filière. On peut assurer la configuration d'un support destiné à être utilisé avec la filière, ce support entourant la filière, pour renforcer ainsi ladite filière, c'est-à-dire assurer un support structurel qui l'entoure. De préférence, la filière constitue une filière à onde acoustique de surface, par exemple à quartz. On peut réaliser le support par moulage, estampage, coulée, usinage, etc. et ce support est positionné de préférence par rapport à la filière à onde acoustique de surface une fois ladite filière réalisée.
PCT/US2006/036045 2005-09-28 2006-09-15 Reduction de contrainte sur filiere a onde acoustique de surface, avec supports structurels entourant la filiere WO2007038022A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23848305A 2005-09-28 2005-09-28
US11/238,483 2005-09-28

Publications (2)

Publication Number Publication Date
WO2007038022A2 true WO2007038022A2 (fr) 2007-04-05
WO2007038022A3 WO2007038022A3 (fr) 2007-10-25

Family

ID=37654745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/036045 WO2007038022A2 (fr) 2005-09-28 2006-09-15 Reduction de contrainte sur filiere a onde acoustique de surface, avec supports structurels entourant la filiere

Country Status (1)

Country Link
WO (1) WO2007038022A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117490A (ja) * 1997-06-27 1999-01-22 Nec Corp 弾性表面波デバイスと弾性表面波チップの実装方法
JPH11214955A (ja) * 1998-01-29 1999-08-06 Kyocera Corp 弾性表面波装置
US20030020373A1 (en) * 2001-01-17 2003-01-30 Masao Irikura Surface acoustic wave device
EP1313217A1 (fr) * 2000-07-06 2003-05-21 Kabushiki Kaisha Toshiba Dispositif a ondes acoustiques de surface et procede de fabrication associe
US20040238928A1 (en) * 2003-05-30 2004-12-02 Naoyuki Mishima Electronic component and package
EP1492231A1 (fr) * 2002-03-29 2004-12-29 Fujitsu Media Devices Limited Procede de montage d'un element a onde acoustique de surface, dispositif a onde acoustique de surface et element a onde acoustique de surface sous enveloppe de resine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117490A (ja) * 1997-06-27 1999-01-22 Nec Corp 弾性表面波デバイスと弾性表面波チップの実装方法
JPH11214955A (ja) * 1998-01-29 1999-08-06 Kyocera Corp 弾性表面波装置
EP1313217A1 (fr) * 2000-07-06 2003-05-21 Kabushiki Kaisha Toshiba Dispositif a ondes acoustiques de surface et procede de fabrication associe
US20030020373A1 (en) * 2001-01-17 2003-01-30 Masao Irikura Surface acoustic wave device
EP1492231A1 (fr) * 2002-03-29 2004-12-29 Fujitsu Media Devices Limited Procede de montage d'un element a onde acoustique de surface, dispositif a onde acoustique de surface et element a onde acoustique de surface sous enveloppe de resine
US20040238928A1 (en) * 2003-05-30 2004-12-02 Naoyuki Mishima Electronic component and package

Also Published As

Publication number Publication date
WO2007038022A3 (fr) 2007-10-25

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