WO2007028359A1 - Verfahren und vorrichtung zur spanenden bearbeitung von werkstucken aus glas oder glaskeramik - Google Patents

Verfahren und vorrichtung zur spanenden bearbeitung von werkstucken aus glas oder glaskeramik Download PDF

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Publication number
WO2007028359A1
WO2007028359A1 PCT/DE2006/001520 DE2006001520W WO2007028359A1 WO 2007028359 A1 WO2007028359 A1 WO 2007028359A1 DE 2006001520 W DE2006001520 W DE 2006001520W WO 2007028359 A1 WO2007028359 A1 WO 2007028359A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
glass
laser
tool
heating
Prior art date
Application number
PCT/DE2006/001520
Other languages
German (de)
English (en)
Inventor
Christian Brecher
Michael Emonts
Sven C. Lange
Manfred Weck
Original Assignee
Fraunhofer-Gesellschaft Zür Förderung Der Angewandten Forschung E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft Zür Förderung Der Angewandten Forschung E.V. filed Critical Fraunhofer-Gesellschaft Zür Förderung Der Angewandten Forschung E.V.
Priority to EP06805277A priority Critical patent/EP1922194A1/fr
Publication of WO2007028359A1 publication Critical patent/WO2007028359A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
    • B23P25/003—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress immediately preceding a cutting tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser

Definitions

  • the invention relates to a method and a device for machining workpieces made of glass or glass ceramic.
  • Organic glass materials and glass ceramic materials are due to their very low thermal expansion and good chemical resistance in addition to optical applications increasingly their technical use z.
  • the semiconductor industry in particular in the anodic bonding of silicon wafem, or medical technology, for example as a substrate carrier.
  • a glass material is an inorganic melt product that solidifies substantially without crystallization.
  • the glass material undergoes a continuous transition from the molten glass to the glassy solid.
  • Glass is referred to in the literature as a supercooled liquid, wherein due to the very high viscosity at room temperature, a displacement of the molecules is greatly hindered. Therefore, glass materials in the cooled state show a brittle-brittle behavior under mechanical stress, preceded by only a very small plastic deformation.
  • Glass-ceramic differs from the materials glass and ceramics both by its properties and by the production methods used. After the mixture of defined composition has been melted, processing takes place by pressing, blowing, rolling or pouring. The molded bodies produced thereby also have all the typical features of a glass. In the following processing step, the semi-finished products are converted into a polycrystalline material by a specific temperature treatment, ie ceramised (see, for example, Scheidler, H .: Production and Properties of Glass-Ceramic Materials, Silicate - Journal 11, 1975). Glass ceramic materials are characterized by their extremely low thermal expansion tion, which are largely compensated for certain glass-ceramic materials due to the negative expansion coefficient of the crystalline phase and the positive coefficient in the glass phase.
  • glass and glass ceramics are used for mechanical-optical precision workpieces, for example metrology frames, length standards in precision metrology, mirror spacers in laser systems and as mirror supports for X-ray telescopes, weather satellites and comet probes.
  • lightweight structures for example honeycomb structures, are often incorporated into these mirror carriers by means of time-consuming and costly grinding and lapping operations.
  • Urformen For the production of workpieces made of glass or glass ceramic known measures Urformen, forming and separating are used.
  • Glass has a low density compared to steel materials and has a high viscosity and surface tension even at high temperatures. These properties lead to low flowability and poor wetting during primary molding by casting, which is why casting processes for glass materials are only suitable for the production of semi-finished products.
  • Lapping achieves a lower chip removal rate compared to sanding, and is used wherever grinding tooling is impractical. As an example, astronomical mirrors are mentioned here.
  • a polishing allowance typical for this is 50 ⁇ m, which requires polishing times of up to 3 hours for lenses.
  • Cutting techniques with a defined cutting edge such as e.g. Turning or milling has so far not been practicable due to the brittleness of the material.
  • the problem is solved by the glass or the glass ceramic is softened by local heating of the workpiece and the machining takes place in the softened area.
  • the heating is advanced so far that a ductile Zerspanmodus is possible.
  • the method according to the invention can also be carried out in such a way that the machining takes place with a tool having a geometrically determined cutting edge.
  • a tool having a geometrically determined cutting edge e.g. As a turning tool or a milling cutter, the duk- Zerspanmodus to considerable advantages.
  • Tools with geometrically defined cutting edges can be used for the first time for workpieces made of glass or glass ceramic without regular destruction of the workpiece. This opens up new possibilities for increasing processing flexibility and cost-effectiveness in comparison with the state-of-the-art processing methods.
  • time- and cost-intensive grinding and lapping operations can be substituted by ductile hot cutting.
  • For the first time on optical functional surfaces eg.
  • the method according to the invention can also be carried out in such a way that the local heating takes place by means of electromagnetic radiation.
  • a laser in particular a CO 2 laser can be used.
  • the heat is induced by local laser beam energy absorption by absorption in the Zerspanzone before the engagement of the tool cutting edge (s).
  • the laser-induced heat source on the surface of the workpiece and the resulting three-dimensional propagation of the temperature fields in the workpiece are dependent on the specific optical and thermal material properties, the workpiece geometry, the surface condition of the workpiece and the laser beam parameters.
  • transparent inorganic glass-ceramic materials do not absorb above the wavelength of approximately 4.5 ⁇ m, so that the wavelength ⁇ of the laser radiation to be absorbed must exceed this value.
  • CO2 laser radiation emitted with a wavelength of ⁇ 10.6 ⁇ m and would therefore be suitable for the mentioned application example.
  • the method according to the invention can also be carried out such that the heating takes place by means of a particle beam.
  • an electron beam could be used.
  • the method according to the invention can also be carried out in such a way that the workpiece is coated with an absorption layer before the machining and the heating of the workpiece takes place via the absorption layer.
  • lasers for whose wavelength the glass or the glass-ceramic of the workpiece is transparent.
  • an absorption layer would be used which absorbs the laser radiation used and transfers the heat energy thus supplied to the workpiece.
  • an additional absorption layer may be useful, for example if it has better absorbency than the workpiece material or else , eg higher, has thermal conductivity.
  • the absorption layer could also deliberately influence the temperature distribution in the workpiece.
  • One possible variant of an absorption layer is a paint applied to the workpiece, e.g. a black paint color.
  • the method according to the invention can also be carried out in such a way that the supply of the energy intended for heating takes place via a surface of the workpiece which faces away from a tool intended for machining.
  • This can be advantageous in particular if an absorption layer is present.
  • the laser light could be applied to the absorption layer by means of a laser through the material of the tool which is transparent to the laser light.
  • the supply of heat energy takes place via a plurality of entry points in the workpiece, for example via opposite sides of the workpiece.
  • the method according to the invention can also be carried out so that the temperature is measured during processing at at least one point of the workpiece. On the basis of these measurements, it can be ascertained in the case of known material properties whether a temperature distribution exists which ensures sufficient ductility of the material to be processed. In order to create an optimum temperature field for processing, it may also be useful to irradiate the energy provided for heating via a plurality of entry points on the workpiece.
  • the method according to the invention can be carried out such that the at least one measured temperature is used to control or regulate processing variables, in particular the power and shape of the energy radiation intended for heating and / or the feed rate of a tool.
  • the object is achieved with a receptacle for the workpiece, a tool with geometrically defined cutting edge and means for local heating of the workpiece. Further embodiments of the device are set forth in the subclaims.
  • FIG. 4 shows a device according to the invention
  • 5 shows the device according to FIG. 4 in a view rotated by 90 ° about a vertical axis.
  • Fig. 1 shows schematically a workpiece 1 made of glass, which is acted upon locally limited by a CO 2 laser beam.
  • the absorption of the laser light by the material of the workpiece 1 leads to a local heating and thus to a softening of the workpiece material.
  • the number 3 indicates the area sufficiently softened for a ductile machining process.
  • a turning tool 4 engages with the depth of cut a? in the workpiece 1, while the workpiece 1 is moved relative to the rotary tool 4 with the cutting speed V c .
  • Fig. 2 shows instead of the rotary tool 4, a milling tool 5 when engaging in the workpiece 1, wherein the laser beam 2 and the milling tool 5 are moved relative to the workpiece with the feed speed V f .
  • the depth of the softened region 3 also exceeds the cutting depth ap of the milling tool 5.
  • the cutting speed Vc 1 or the feed rate Vf, the inclination angle ⁇ of the laser beam 2 relative to the workpiece 1 and the distance ⁇ XW-L between the tool engagement and the intersection of the axis of the laser beam 2 with the surface of the workpiece 1 are important factors influencing the cutting process.
  • Fig. 3 shows the propagation of a laser-induced temperature field in the workpiece 1 without tools.
  • the laser beam 2 moves over the workpiece 1 at the feed rate Vf.
  • the arrow 7 symbolizes the absorbed portion of the laser radiation;
  • Arrow 8 stands for the reflected portion and arrow 9 for the transmitted portion of the laser light.
  • the laser-induced heat on the surface of the workpiece 1 and the resulting three-dimensional expansion of the temperature field 6 in the workpiece 1 are absorbed by the workpiece 1 as a function of the specific optical and thermal material properties, the workpiece geometry, the surface finish of the workpiece 1 and the laser beam parameters - th laser radiation.
  • the wavelength of the laser beam 2 is to be chosen such that economical absorption of the laser radiation is ensured.
  • the absorbed portion 7 of the laser radiation provides for heating, which propagates via heat conduction, symbolized by the arrow 10, in the workpiece 1.
  • a symbolized by the arrow 11 convection ensures a loss of heat.
  • the temperature field 6, which is shown in Fig. 3 by different gray levels.
  • the determination of the optimum depth of cut a p and the engagement width not shown in the figures require the knowledge of the three-dimensional temperature distribution, since only the ablated Zerspanvolumen should be softened as possible in order to avoid thermal damage to the cut surfaces, which should also be functional surfaces at the same time. In return, the cutting depths a p and the engagement width must not exceed the softened workpiece area in order to prevent brittle material removal and premature tool failure.
  • the determination of the temperature fields on the component surface can be realized by means of pyrometric measurements. The relevant means are not shown in the figures.
  • the three-dimensional temperature field profiles are determined with the aid of numerical simulation models whose calibration is based on the base feedback of the pyrometric measurement.
  • Figures 4 and 5 show a three-axis milling machine with vertical spindle arrangement in two rotated by 90 ° to each other views.
  • a first carriage 13 is movable in the X direction.
  • a second carriage 14 is movable in the Y direction.
  • the second carriage 14 carries a CO 2 laser source 15 whose laser beam 2 is guided via a beam guiding system 16 to the workpiece 1, whose holder is not explicitly shown in FIGS. 4 and 5.
  • the outlet opening 17 of the beam guiding system 16 is for one pivotable about an axis B and on the other in the Y-direction and X-direction displaceable. It can be seen in FIG. 5 that the displacement in the X-direction is realized by a relative movement between two telescoping tubes 18 and 19 of the beam guidance system 16.
  • the otherwise usual conduction of the laser light by means of optical fibers is not possible with the CO 2 laser due to the wavelength of the laser.
  • a tool carriage 20 with a milling cutter 21 can be moved on the second carriage 14 in the Z direction.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)

Abstract

Es werden ein Verfahren und eine Vorrichtung zur Bearbeitung von Werkstücken (1) aus Glas oder Glaskeramik mit Werkzeugen (4, 5) mit geometrisch bestimmter Schneide vorgestellt. Hierzu wird das Material des Werkstückes (1) zunächst durch Erwärmung lokal begrenzt entfestigt und das Werkstück (1) anschließend im entfestigten Bereich spanend bearbeitet.
PCT/DE2006/001520 2005-09-09 2006-08-31 Verfahren und vorrichtung zur spanenden bearbeitung von werkstucken aus glas oder glaskeramik WO2007028359A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06805277A EP1922194A1 (fr) 2005-09-09 2006-08-31 Verfahren und vorrichtung zur spanenden bearbeitung von werkstucken aus glas oder glaskeramik

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005043209.3 2005-09-09
DE200510043209 DE102005043209A1 (de) 2005-09-09 2005-09-09 Verfahren und Vorrichtung zur spanenden Bearbeitung von Werkstücken aus Glas oder Glaskeramik

Publications (1)

Publication Number Publication Date
WO2007028359A1 true WO2007028359A1 (fr) 2007-03-15

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ID=37495673

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2006/001520 WO2007028359A1 (fr) 2005-09-09 2006-08-31 Verfahren und vorrichtung zur spanenden bearbeitung von werkstucken aus glas oder glaskeramik

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EP (1) EP1922194A1 (fr)
DE (1) DE102005043209A1 (fr)
WO (1) WO2007028359A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107775198B (zh) * 2017-10-30 2019-05-17 杨进明 一种卫浴玻璃的切边装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2950559A1 (de) * 1978-12-18 1980-07-03 Philips Nv Verfahren und vorrichtung zur spangebenden bearbeitung von glas und glasartigen werkstoffen sowie nach diesem verfahren bearbeitetes werkstueck aus glas oder glasartigem werkstoff
US4378989A (en) * 1981-10-09 1983-04-05 The Perkin-Elmer Corporation Apparatus for laser assisted machining of glass materials
US4459458A (en) * 1982-08-30 1984-07-10 The Warner & Swasey Company Machine tool with laser heat treating
EP0220421A2 (fr) * 1985-08-30 1987-05-06 Hitachi, Ltd. Procédé pour briser des copeaux

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1586559A (en) * 1977-08-22 1981-03-18 Production Eng Res Hot machining
IT1106970B (it) * 1978-01-18 1985-11-18 Istituto Per Le Ricerche Di Te Procedimento per la lavorazione ad asportazione di truciolo con l'impiego del raggio laser ed apparecchio per l'esecuzione del procedimento
EP0131367B1 (fr) * 1983-05-30 1989-04-05 Inoue-Japax Research Incorporated Procédé et appareil pour l'usinage de matières en céramique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2950559A1 (de) * 1978-12-18 1980-07-03 Philips Nv Verfahren und vorrichtung zur spangebenden bearbeitung von glas und glasartigen werkstoffen sowie nach diesem verfahren bearbeitetes werkstueck aus glas oder glasartigem werkstoff
US4378989A (en) * 1981-10-09 1983-04-05 The Perkin-Elmer Corporation Apparatus for laser assisted machining of glass materials
US4459458A (en) * 1982-08-30 1984-07-10 The Warner & Swasey Company Machine tool with laser heat treating
EP0220421A2 (fr) * 1985-08-30 1987-05-06 Hitachi, Ltd. Procédé pour briser des copeaux

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Publication number Publication date
EP1922194A1 (fr) 2008-05-21
DE102005043209A1 (de) 2007-03-15

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