WO2007025859A3 - Semiconductor structure with a laterally functional construction - Google Patents
Semiconductor structure with a laterally functional construction Download PDFInfo
- Publication number
- WO2007025859A3 WO2007025859A3 PCT/EP2006/065363 EP2006065363W WO2007025859A3 WO 2007025859 A3 WO2007025859 A3 WO 2007025859A3 EP 2006065363 W EP2006065363 W EP 2006065363W WO 2007025859 A3 WO2007025859 A3 WO 2007025859A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor structure
- functional construction
- lateral area
- laterally
- arrangement
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/24011—Deposited, e.g. MCM-D type
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- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H01L2224/2402—Laminated, e.g. MCM-L type
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- H01L2224/24051—Conformal with the semiconductor or solid-state device
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- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
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- H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
- H01L2224/821—Forming a build-up interconnect
- H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
- H01L2224/82102—Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Abstract
The invention relates to an arrangement comprising a substrate (1), on which at least one electronic component (2) is arranged, a layer (3), particularly a film, laterally extending along the substrate surface and/or component surface. The arrangement is characterized in that the layer (3) has, per lateral area (4), specific homogeneous properties that vary from lateral area (4) to lateral area (4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510041100 DE102005041100A1 (en) | 2005-08-30 | 2005-08-30 | Semiconductor structure with a laterally functional structure |
DE102005041100.2 | 2005-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007025859A2 WO2007025859A2 (en) | 2007-03-08 |
WO2007025859A3 true WO2007025859A3 (en) | 2007-04-26 |
Family
ID=37398874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/065363 WO2007025859A2 (en) | 2005-08-30 | 2006-08-16 | Semiconductor structure with a laterally functional construction |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102005041100A1 (en) |
WO (1) | WO2007025859A2 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0465197A2 (en) * | 1990-07-02 | 1992-01-08 | General Electric Company | Multi-sublayer dielectric layers |
DE4321053A1 (en) * | 1992-06-26 | 1994-01-05 | Mitsubishi Electric Corp | Pressure-packed semiconductor device - has semiconductor substrate pressed against heat compensators to produce electrical contacts without solder |
WO2002050904A1 (en) * | 2000-12-21 | 2002-06-27 | Gemplus | Connection by printed-weld deformable member |
DE10235771A1 (en) * | 2002-08-05 | 2004-02-26 | Texas Instruments Deutschland Gmbh | Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces |
WO2005027222A2 (en) * | 2003-09-12 | 2005-03-24 | Siemens Aktiengesellschaft | Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3442131A1 (en) * | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | METHOD FOR ENCODING MICROELECTRONIC SEMICONDUCTOR AND LAYER CIRCUITS |
CN1575511A (en) * | 2001-09-28 | 2005-02-02 | 西门子公司 | Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
DE10335155B4 (en) * | 2003-07-31 | 2006-11-30 | Infineon Technologies Ag | Method for producing an arrangement of an electrical component on a substrate |
-
2005
- 2005-08-30 DE DE200510041100 patent/DE102005041100A1/en not_active Withdrawn
-
2006
- 2006-08-16 WO PCT/EP2006/065363 patent/WO2007025859A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0465197A2 (en) * | 1990-07-02 | 1992-01-08 | General Electric Company | Multi-sublayer dielectric layers |
DE4321053A1 (en) * | 1992-06-26 | 1994-01-05 | Mitsubishi Electric Corp | Pressure-packed semiconductor device - has semiconductor substrate pressed against heat compensators to produce electrical contacts without solder |
WO2002050904A1 (en) * | 2000-12-21 | 2002-06-27 | Gemplus | Connection by printed-weld deformable member |
DE10235771A1 (en) * | 2002-08-05 | 2004-02-26 | Texas Instruments Deutschland Gmbh | Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces |
WO2005027222A2 (en) * | 2003-09-12 | 2005-03-24 | Siemens Aktiengesellschaft | Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly |
Also Published As
Publication number | Publication date |
---|---|
DE102005041100A1 (en) | 2007-03-08 |
WO2007025859A2 (en) | 2007-03-08 |
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