WO2007023130A3 - Systems and methods for cooling electronics components employing vapor compression refrigeration - Google Patents

Systems and methods for cooling electronics components employing vapor compression refrigeration Download PDF

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Publication number
WO2007023130A3
WO2007023130A3 PCT/EP2006/065425 EP2006065425W WO2007023130A3 WO 2007023130 A3 WO2007023130 A3 WO 2007023130A3 EP 2006065425 W EP2006065425 W EP 2006065425W WO 2007023130 A3 WO2007023130 A3 WO 2007023130A3
Authority
WO
WIPO (PCT)
Prior art keywords
vapor compression
compression refrigeration
systems
methods
pressure drop
Prior art date
Application number
PCT/EP2006/065425
Other languages
French (fr)
Other versions
WO2007023130A2 (en
Inventor
Daniel Kearney
Mark Anthony Marnell
Donald Wayne Porter
Original Assignee
Ibm
Ibm Uk
Daniel Kearney
Mark Anthony Marnell
Donald Wayne Porter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm, Ibm Uk, Daniel Kearney, Mark Anthony Marnell, Donald Wayne Porter filed Critical Ibm
Priority to EP06778274A priority Critical patent/EP1917487A2/en
Publication of WO2007023130A2 publication Critical patent/WO2007023130A2/en
Publication of WO2007023130A3 publication Critical patent/WO2007023130A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/31—Expansion valves
    • F25B41/34—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators
    • F25B41/35—Expansion valves with the valve member being actuated by electric means, e.g. by piezoelectric actuators by rotary motors, e.g. by stepping motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/04—Clogging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. The vapor compression refrigeration system (100) includes a condenser (104), at least one expansion structure (114, 116, 400), at least one evaporator (106, 108), and a compressor (122) coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component (110, 112). A portion of the expansion structure (114, 116, 400) is coated with a polytetraf luorethylene in the refrigerant flow path (430, 450) for inhibiting accumulation of material thereon. The polytetraf luorethylene (PTFE) coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area (450) of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area.
PCT/EP2006/065425 2005-08-23 2006-08-17 Systems and methods for cooling electronics components employing vapor compression refrigeration WO2007023130A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06778274A EP1917487A2 (en) 2005-08-23 2006-08-17 Systems and methods for cooling electronics components employing vapor compression refrigeration

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/209,241 2005-08-23
US11/209,241 US20070044493A1 (en) 2005-08-23 2005-08-23 Systems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene

Publications (2)

Publication Number Publication Date
WO2007023130A2 WO2007023130A2 (en) 2007-03-01
WO2007023130A3 true WO2007023130A3 (en) 2007-05-10

Family

ID=37709442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/065425 WO2007023130A2 (en) 2005-08-23 2006-08-17 Systems and methods for cooling electronics components employing vapor compression refrigeration

Country Status (3)

Country Link
US (1) US20070044493A1 (en)
EP (1) EP1917487A2 (en)
WO (1) WO2007023130A2 (en)

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US8955346B2 (en) 2010-11-04 2015-02-17 International Business Machines Corporation Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load
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US10653044B2 (en) * 2013-01-10 2020-05-12 International Business Machines Corporation Energy efficiency based control for a cooling system
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Also Published As

Publication number Publication date
WO2007023130A2 (en) 2007-03-01
US20070044493A1 (en) 2007-03-01
EP1917487A2 (en) 2008-05-07

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