WO2007014778A3 - Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten - Google Patents

Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten Download PDF

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Publication number
WO2007014778A3
WO2007014778A3 PCT/EP2006/007676 EP2006007676W WO2007014778A3 WO 2007014778 A3 WO2007014778 A3 WO 2007014778A3 EP 2006007676 W EP2006007676 W EP 2006007676W WO 2007014778 A3 WO2007014778 A3 WO 2007014778A3
Authority
WO
WIPO (PCT)
Prior art keywords
contacting
substrates
roller
galvanization
contacting roller
Prior art date
Application number
PCT/EP2006/007676
Other languages
English (en)
French (fr)
Other versions
WO2007014778A2 (de
Inventor
Heinz Kappler
Original Assignee
Schmid Gmbh & Co Geb
Heinz Kappler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR1020087004367A priority Critical patent/KR101355952B1/ko
Application filed by Schmid Gmbh & Co Geb, Heinz Kappler filed Critical Schmid Gmbh & Co Geb
Priority to EP06776582A priority patent/EP1910590B1/de
Priority to AU2006274986A priority patent/AU2006274986B2/en
Priority to DE502006006807T priority patent/DE502006006807D1/de
Priority to CA002617575A priority patent/CA2617575A1/en
Priority to CN2006800282232A priority patent/CN101310046B/zh
Priority to AT06776582T priority patent/ATE465284T1/de
Priority to JP2008524440A priority patent/JP2009503263A/ja
Publication of WO2007014778A2 publication Critical patent/WO2007014778A2/de
Priority to US12/022,452 priority patent/US8038851B2/en
Priority to IL189168A priority patent/IL189168A/en
Priority to NO20080905A priority patent/NO20080905L/no
Publication of WO2007014778A3 publication Critical patent/WO2007014778A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Energy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • Manufacture Of Switches (AREA)

Abstract

Eine Kontaktiereinrichtung für eine Galvanisiereinrichtung (11) weist Kontaktierrollen (20) auf mit einer durchgehenden starren Außenseite (26, 27), die mit einem Hülsenabschnitt (22) verbunden ist. Der Hülsenabschnitt (22) weist eine Innenöffnung (23) auf, die weiter ist als eine drehende Welle (30), auf der die Kontaktierrolle (20) sitzt. So ist eine Bewegbarkeit der Kontaktierrolle (20) in radialer Richtung gegeben, wobei über Federn (32) eine elektrische Kontaktierung sowie Lagesicherung für eine Grund-Position erreicht ist. Durch die Bewegbarkeit wird eine gute Kontaktierung durch Anlage an Substrate (16) gewährleistet, auch wenn diese Unebenheiten aufweisen, wobei die Andruckkraft relativ klein sein kann.
PCT/EP2006/007676 2005-08-03 2006-08-03 Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten WO2007014778A2 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
CN2006800282232A CN101310046B (zh) 2005-08-03 2006-08-03 基板的处理设备，尤指基板的电镀设备
EP06776582A EP1910590B1 (de) 2005-08-03 2006-08-03 Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten
AU2006274986A AU2006274986B2 (en) 2005-08-03 2006-08-03 Device for the treatment, particularly galvanization, of substrates
DE502006006807T DE502006006807D1 (de) 2005-08-03 2006-08-03 Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten
CA002617575A CA2617575A1 (en) 2005-08-03 2006-08-03 Device for the treatment and in particular galvanizing of substrates
KR1020087004367A KR101355952B1 (ko) 2005-08-03 2006-08-03 기판들의 처리, 특히 아연도금을 위한 장치
AT06776582T ATE465284T1 (de) 2005-08-03 2006-08-03 Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten
JP2008524440A JP2009503263A (ja) 2005-08-03 2006-08-03 基板を処理する、特に基板を電気メッキする装置
US12/022,452 US8038851B2 (en) 2005-08-03 2008-01-30 Device for the treatment, particularly galvanization, of substrates
IL189168A IL189168A (en) 2005-08-03 2008-01-31 Device for the treatment and in particular galvanizing of substrates
NO20080905A NO20080905L (no) 2005-08-03 2008-02-21 Anordning for behandling, spesielt galvanisering av substrater

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005038450A DE102005038450A1 (de) 2005-08-03 2005-08-03 Einrichtung zur Behandlung von Substraten, insbesondere zur Galvanisierung von Substraten
DE102005038450.1 2005-08-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/022,452 Continuation US8038851B2 (en) 2005-08-03 2008-01-30 Device for the treatment, particularly galvanization, of substrates

Publications (2)

Publication Number Publication Date
WO2007014778A2 WO2007014778A2 (de) 2007-02-08
WO2007014778A3 true WO2007014778A3 (de) 2008-04-24

Family

ID=37602998

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/007676 WO2007014778A2 (de) 2005-08-03 2006-08-03 Einrichtung zur behandlung von substraten, insbesondere zur galvanisierung von substraten

Country Status (13)

Country Link
US (1) US8038851B2 (de)
EP (1) EP1910590B1 (de)
JP (1) JP2009503263A (de)
KR (1) KR101355952B1 (de)
CN (1) CN101310046B (de)
AT (1) ATE465284T1 (de)
AU (1) AU2006274986B2 (de)
CA (1) CA2617575A1 (de)
DE (2) DE102005038450A1 (de)
ES (1) ES2344922T3 (de)
IL (1) IL189168A (de)
NO (1) NO20080905L (de)
WO (1) WO2007014778A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
DE102007038120A1 (de) 2007-07-31 2009-02-05 Gebr. Schmid Gmbh & Co. Verfahren zur Beschichtung von Solarzellen sowie Vorrichtung hierfür
DE102008022282A1 (de) 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen
DE102009018360A1 (de) 2009-04-23 2010-11-04 Rena Gmbh Verfahren und Vorrichtung zur elektrolytischen Behandlung von Solarzellen
KR101284197B1 (ko) * 2009-05-13 2013-07-09 아토테크 도이칠란드 게엠베하 처리될 평면 재료를 처리하는 방법 및 어셈블리, 및 처리액을 제거하거나 억제하는 디바이스
DE102009022337A1 (de) * 2009-05-13 2010-11-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung eines Substrats
CN102083717A (zh) * 2009-05-26 2011-06-01 无锡尚德太阳能电力有限公司 输送辊轮
DE102009029551B4 (de) * 2009-09-17 2013-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur galvanischen Beschichtung von Substraten
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
DE102010014555A1 (de) 2010-04-01 2011-10-06 Somont Gmbh Verfahren und Vorrichtung zur elektrochemischen Metallisierung von flachem Gut
KR101384467B1 (ko) 2010-04-01 2014-04-14 조몬트 게엠베하 태양 전지 및 그 제조 방법
CN103062213A (zh) * 2011-10-19 2013-04-24 无锡尚德太阳能电力有限公司 一种用于镀膜设备的弹簧滚轮及镀膜设备
CN103382566B (zh) * 2012-05-04 2016-05-11 库特勒自动化系统(苏州)有限公司 太阳能电池电镀装置及其供电模组
CN104928738B (zh) * 2015-05-21 2017-04-19 中国科学院山西煤炭化学研究所 一种碳纤维丝束的连续电镀金属方法及装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596012A (en) * 1966-11-30 1971-07-27 Jack Harrild Jordan Apparatus for the production of electrolytic tinplate
US4559123A (en) * 1983-11-11 1985-12-17 "Cockerill-Sambre" Device for electrolytically depositing a lining metal layer over a metal strip
US4662997A (en) * 1986-04-25 1987-05-05 Hirt Theodore A Method and apparatus for energizing metallic strip for plating
US6024849A (en) * 1998-05-06 2000-02-15 Ko; Chien-Hsin Conducting roller for an electroplating apparatus
DE10323660A1 (de) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446548A (en) 1939-01-16 1948-08-10 John S Nachtman Contact roll construction
US4507181A (en) * 1984-02-17 1985-03-26 Energy Conversion Devices, Inc. Method of electro-coating a semiconductor device
JPH04131397A (ja) * 1990-09-20 1992-05-06 Fuji Plant Kogyo Kk リードフレームへの全面メッキ装置
EP0542148B1 (de) 1991-11-11 1997-01-22 SIEMENS SOLAR GmbH Verfahren zum Erzeugen feiner Elektrodenstruckturen
JP3299451B2 (ja) * 1996-09-30 2002-07-08 新日本製鐵株式会社 竪型電解装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596012A (en) * 1966-11-30 1971-07-27 Jack Harrild Jordan Apparatus for the production of electrolytic tinplate
US4559123A (en) * 1983-11-11 1985-12-17 "Cockerill-Sambre" Device for electrolytically depositing a lining metal layer over a metal strip
US4662997A (en) * 1986-04-25 1987-05-05 Hirt Theodore A Method and apparatus for energizing metallic strip for plating
US6024849A (en) * 1998-05-06 2000-02-15 Ko; Chien-Hsin Conducting roller for an electroplating apparatus
DE10323660A1 (de) * 2003-05-15 2004-12-02 Gebr. Schmid Gmbh & Co. Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten

Also Published As

Publication number Publication date
AU2006274986A1 (en) 2007-02-08
EP1910590B1 (de) 2010-04-21
WO2007014778A2 (de) 2007-02-08
KR101355952B1 (ko) 2014-01-27
KR20080031454A (ko) 2008-04-08
CA2617575A1 (en) 2007-02-08
CN101310046B (zh) 2011-03-30
DE502006006807D1 (de) 2010-06-02
ATE465284T1 (de) 2010-05-15
ES2344922T3 (es) 2010-09-09
JP2009503263A (ja) 2009-01-29
DE102005038450A1 (de) 2007-02-08
IL189168A (en) 2011-12-29
AU2006274986B2 (en) 2010-12-02
US20080116059A1 (en) 2008-05-22
EP1910590A2 (de) 2008-04-16
NO20080905L (no) 2008-02-21
CN101310046A (zh) 2008-11-19
IL189168A0 (en) 2008-08-07
US8038851B2 (en) 2011-10-18

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