WO2007011630A3 - Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system by avoiding detector and circuit saturation - Google Patents

Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system by avoiding detector and circuit saturation Download PDF

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Publication number
WO2007011630A3
WO2007011630A3 PCT/US2006/027129 US2006027129W WO2007011630A3 WO 2007011630 A3 WO2007011630 A3 WO 2007011630A3 US 2006027129 W US2006027129 W US 2006027129W WO 2007011630 A3 WO2007011630 A3 WO 2007011630A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuits
methods
detection range
systems
thermal damage
Prior art date
Application number
PCT/US2006/027129
Other languages
French (fr)
Other versions
WO2007011630A2 (en
Inventor
Christian H Wolters
Anatoly Romanovsky
Alexander Slobodov
Original Assignee
Kla Tencor Tech Corp
Christian H Wolters
Anatoly Romanovsky
Alexander Slobodov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/181,237 external-priority patent/US7423250B2/en
Priority claimed from US11/181,228 external-priority patent/US7436508B2/en
Priority claimed from US11/181,519 external-priority patent/US7414715B2/en
Application filed by Kla Tencor Tech Corp, Christian H Wolters, Anatoly Romanovsky, Alexander Slobodov filed Critical Kla Tencor Tech Corp
Priority to JP2008521588A priority Critical patent/JP5302678B2/en
Publication of WO2007011630A2 publication Critical patent/WO2007011630A2/en
Publication of WO2007011630A3 publication Critical patent/WO2007011630A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
    • G01J1/16—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void using electric radiation detectors
    • G01J1/18—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void using electric radiation detectors using comparison with a reference electric value
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
    • H01J43/04—Electron multipliers
    • H01J43/30—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electronic Switches (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. Inspection systems, circuits and methods are also provided to enhance defect detection by addressing saturation levels of the amplifier and analog-digital circuitry as a limiting factor of the measurement detection range of an inspection system. In addition, inspection systems, circuits, and methods are provided to enhance defect detection by reducing thermal damage to large particles by dynamically altering the incident laser beam power level supplied to the specimen during a surface inspection scan.
PCT/US2006/027129 2005-07-14 2006-07-12 Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system by avoiding detector and circuit saturation WO2007011630A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008521588A JP5302678B2 (en) 2005-07-14 2006-07-12 Systems, circuits, and methods for extending the detection range by reducing thermal damage in inspection systems by avoiding detector and circuit saturation

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/181,237 US7423250B2 (en) 2005-07-14 2005-07-14 Systems, circuits and methods for extending the detection range of an inspection system by avoiding circuit saturation
US11/181,228 US7436508B2 (en) 2005-07-14 2005-07-14 Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system
US11/181,228 2005-07-14
US11/181,237 2005-07-14
US11/181,519 US7414715B2 (en) 2005-07-14 2005-07-14 Systems, circuits and methods for extending the detection range of an inspection system by avoiding detector saturation
US11/181,519 2005-07-14

Publications (2)

Publication Number Publication Date
WO2007011630A2 WO2007011630A2 (en) 2007-01-25
WO2007011630A3 true WO2007011630A3 (en) 2007-04-05

Family

ID=37669352

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/027129 WO2007011630A2 (en) 2005-07-14 2006-07-12 Systems, circuits and methods for reducing thermal damage and extending the detection range of an inspection system by avoiding detector and circuit saturation

Country Status (2)

Country Link
JP (2) JP5302678B2 (en)
WO (1) WO2007011630A2 (en)

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US7746462B2 (en) * 2007-05-21 2010-06-29 Kla-Tencor Technologies Corporation Inspection systems and methods for extending the detection range of an inspection system by forcing the photodetector into the non-linear range
US7787114B2 (en) * 2007-06-06 2010-08-31 Kla-Tencor Technologies Corp. Systems and methods for inspecting a specimen with light at varying power levels
US7973921B2 (en) * 2008-06-25 2011-07-05 Applied Materials South East Asia Pte Ltd. Dynamic illumination in optical inspection systems
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US8755044B2 (en) * 2011-08-15 2014-06-17 Kla-Tencor Corporation Large particle detection for multi-spot surface scanning inspection systems
US9184034B2 (en) * 2012-03-19 2015-11-10 Kla-Tencor Corporation Photomultiplier tube with extended dynamic range
JP2014119282A (en) * 2012-12-13 2014-06-30 Fuji Electric Co Ltd Linearity-compensating bleeder circuit and radiation detector
AU2014354949B2 (en) * 2013-11-26 2019-10-31 Perkinelmer U.S. Llc Detectors and methods of using them
WO2016121756A1 (en) 2015-01-30 2016-08-04 株式会社日立ハイテクノロジーズ Examination device
US10186406B2 (en) * 2016-03-29 2019-01-22 KLA—Tencor Corporation Multi-channel photomultiplier tube assembly
JP6850549B2 (en) * 2016-05-12 2021-03-31 日本信号株式会社 Optical ranging device
CA3026955A1 (en) * 2016-06-09 2017-12-14 ETP Ion Detect Pty Ltd Improvements in electron multipliers
US10324045B2 (en) * 2016-08-05 2019-06-18 Kla-Tencor Corporation Surface defect inspection with large particle monitoring and laser power control
WO2018085237A1 (en) * 2016-11-02 2018-05-11 Corning Incorporated Method and apparatus for inspecting defects on transparent substrate and method of emitting incident light
WO2019159334A1 (en) 2018-02-16 2019-08-22 株式会社日立ハイテクノロジーズ Defect inspection device
US11346791B2 (en) 2018-02-28 2022-05-31 Hitachi High-Tech Corporation Inspection device and inspection method thereof
JP7071181B2 (en) 2018-03-20 2022-05-18 キヤノン株式会社 Foreign matter inspection equipment, molding equipment and article manufacturing method
JP2021519841A (en) 2018-03-30 2021-08-12 ベクトン・ディキンソン・アンド・カンパニーＢｅｃｔｏｎ， Ｄｉｃｋｉｎｓｏｎ Ａｎｄ Ｃｏｍｐａｎｙ Water-soluble polymer dye with pendant chromophore
EP3811055A4 (en) 2018-06-19 2022-08-10 Becton, Dickinson and Company Variable multiplexing switches for detector arrays, systems and methods of use thereof
US11099066B2 (en) 2018-06-28 2021-08-24 Becton, Dickinson And Company Light detection systems having input and output modulators, and methods of use thereof
WO2023076325A2 (en) * 2021-10-26 2023-05-04 Smiths Detection Inc. Systems and methods for suppressing x-ray interference in radiation portal monitors
WO2024134724A1 (en) * 2022-12-19 2024-06-27 株式会社日立ハイテク Optical-type foreign matter inspection device

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US3488434A (en) * 1967-03-24 1970-01-06 Fairchild Camera Instr Co Control system for photosensitive video recorder
US3997779A (en) * 1973-10-25 1976-12-14 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. Circuit device for secondary electron multipliers
US4048510A (en) * 1975-02-27 1977-09-13 Ferranti Limited Circuit arrangements for controlling detector signals in surface inspection systems
US4767211A (en) * 1984-10-08 1988-08-30 Hitachi, Ltd. Apparatus for and method of measuring boundary surface
US4806776A (en) * 1980-03-10 1989-02-21 Kley Victor B Electrical illumination and detecting apparatus
US5860972A (en) * 1995-10-26 1999-01-19 Xintec Corporation Method of detection and destruction of urinary calculi and similar structures
US6348682B1 (en) * 1999-11-12 2002-02-19 Institute Of Microelectronics Photodetector circuit and methods
US20020043109A1 (en) * 1997-12-19 2002-04-18 Siu Bernard K. System and method for laser ultrasonic bond integrity evaluation
US6621571B1 (en) * 1999-10-29 2003-09-16 Hitachi, Ltd. Method and apparatus for inspecting defects in a patterned specimen
US20040016867A1 (en) * 2002-07-29 2004-01-29 Applied Materials Israel, Inc. Amplifier circuit with enhanced dynamic range for use in a wafer inspection method or optical inspection tool
US6833913B1 (en) * 2002-02-26 2004-12-21 Kla-Tencor Technologies Corporation Apparatus and methods for optically inspecting a sample for anomalies

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JPS6444557U (en) * 1987-09-14 1989-03-16
JPH02134510A (en) * 1988-11-14 1990-05-23 Hitachi Ltd Visual inspection apparatus
JPH06249791A (en) * 1993-02-25 1994-09-09 Hitachi Ltd Flaw inspection apparatus
JPH06273344A (en) * 1993-03-24 1994-09-30 Nikon Corp Method and equipment for inspecting defect
JPH0961537A (en) * 1995-08-30 1997-03-07 Rigaku Corp Photodetector
US6002122A (en) * 1998-01-23 1999-12-14 Transient Dynamics High-speed logarithmic photo-detector
JP3863290B2 (en) * 1998-05-12 2006-12-27 浜松ホトニクス株式会社 Light intensity detector
JP3745564B2 (en) * 1999-07-08 2006-02-15 三菱電機株式会社 Defect inspection method and defect inspection apparatus
JP2002181725A (en) * 2000-12-11 2002-06-26 Mitsubishi Electric Corp Method for analyzing minute foreign matter, analysis apparatus, method for manufacturing semiconductor device and liquid crystal display device
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Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488434A (en) * 1967-03-24 1970-01-06 Fairchild Camera Instr Co Control system for photosensitive video recorder
US3997779A (en) * 1973-10-25 1976-12-14 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. Circuit device for secondary electron multipliers
US4048510A (en) * 1975-02-27 1977-09-13 Ferranti Limited Circuit arrangements for controlling detector signals in surface inspection systems
US4806776A (en) * 1980-03-10 1989-02-21 Kley Victor B Electrical illumination and detecting apparatus
US4767211A (en) * 1984-10-08 1988-08-30 Hitachi, Ltd. Apparatus for and method of measuring boundary surface
US5860972A (en) * 1995-10-26 1999-01-19 Xintec Corporation Method of detection and destruction of urinary calculi and similar structures
US20020043109A1 (en) * 1997-12-19 2002-04-18 Siu Bernard K. System and method for laser ultrasonic bond integrity evaluation
US6621571B1 (en) * 1999-10-29 2003-09-16 Hitachi, Ltd. Method and apparatus for inspecting defects in a patterned specimen
US6348682B1 (en) * 1999-11-12 2002-02-19 Institute Of Microelectronics Photodetector circuit and methods
US6833913B1 (en) * 2002-02-26 2004-12-21 Kla-Tencor Technologies Corporation Apparatus and methods for optically inspecting a sample for anomalies
US20040016867A1 (en) * 2002-07-29 2004-01-29 Applied Materials Israel, Inc. Amplifier circuit with enhanced dynamic range for use in a wafer inspection method or optical inspection tool

Also Published As

Publication number Publication date
JP5722824B2 (en) 2015-05-27
JP5302678B2 (en) 2013-10-02
WO2007011630A2 (en) 2007-01-25
JP2009501902A (en) 2009-01-22
JP2012159513A (en) 2012-08-23

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