WO2007011218A3 - Method and device for displacing a group of components ordered in a matrix structure - Google Patents

Method and device for displacing a group of components ordered in a matrix structure Download PDF

Info

Publication number
WO2007011218A3
WO2007011218A3 PCT/NL2006/050149 NL2006050149W WO2007011218A3 WO 2007011218 A3 WO2007011218 A3 WO 2007011218A3 NL 2006050149 W NL2006050149 W NL 2006050149W WO 2007011218 A3 WO2007011218 A3 WO 2007011218A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
matrix structure
group
placing
flat carrier
Prior art date
Application number
PCT/NL2006/050149
Other languages
French (fr)
Other versions
WO2007011218A2 (en
Inventor
Willem Antonie Hennekes
Gerardus Hermanus Joha Reulink
Original Assignee
Fico Bv
Willem Antonie Hennekes
Gerardus Hermanus Joha Reulink
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Willem Antonie Hennekes, Gerardus Hermanus Joha Reulink filed Critical Fico Bv
Priority to EP06747601A priority Critical patent/EP1911336A2/en
Publication of WO2007011218A2 publication Critical patent/WO2007011218A2/en
Publication of WO2007011218A3 publication Critical patent/WO2007011218A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0478Simultaneously mounting of different components
    • H05K13/0482Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention relates to a method and a device for placing electronic components ordered in a matrix structure onto a flat carrier, comprising of picking up components ordered in accordance with a matrix structure and placing the components on the flat carrier, wherein the components are picked up in a group of components comprising subgroups and the components are placed successively per subgroup onto the flat carrier. Means are hereby provided with which numbers, pitch or orientation of groups of electronic components, in particular though not exclusively semi-conductor products, can be modified. Placing the components per subgroup moreover creates the freedom to place the subgroups on different carriers.
PCT/NL2006/050149 2005-07-21 2006-06-27 Method and device for displacing a group of components ordered in a matrix structure WO2007011218A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06747601A EP1911336A2 (en) 2005-07-21 2006-06-27 Method and device for displacing a group of components ordered in a matrix structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1029576 2005-07-21
NL1029576A NL1029576C2 (en) 2005-07-21 2005-07-21 Method and device for displacing a group of components arranged in a matrix structure.

Publications (2)

Publication Number Publication Date
WO2007011218A2 WO2007011218A2 (en) 2007-01-25
WO2007011218A3 true WO2007011218A3 (en) 2007-07-12

Family

ID=35918207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/050149 WO2007011218A2 (en) 2005-07-21 2006-06-27 Method and device for displacing a group of components ordered in a matrix structure

Country Status (5)

Country Link
EP (1) EP1911336A2 (en)
CN (1) CN101228815A (en)
NL (1) NL1029576C2 (en)
TW (1) TW200707626A (en)
WO (1) WO2007011218A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5745045B2 (en) * 2010-06-30 2015-07-08 ケーエルエー−テンカー コーポレイション Method and apparatus for placing electronic devices within compartments of input and output media
NL2008290C2 (en) * 2012-02-14 2013-08-19 Fico Bv METHOD AND DEVICE FOR PLACING ELECTRONIC COMPONENTS SUITED IN A MATRIX STRUCTURE.
KR101872764B1 (en) * 2017-03-02 2018-06-29 주식회사 코엠에스 Display LED Chip Arrangement Method and LED Chip Picking and Arrangement Device
JP2022027096A (en) * 2020-07-31 2022-02-10 日亜化学工業株式会社 Manufacturing method of light-emitting module
NL2031053B1 (en) 2022-02-23 2023-09-06 Besi Netherlands Bv Gripper head, device, and method for handling and varying the spacing of electronic components arranged in a matrix structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639203A (en) * 1994-06-03 1997-06-17 Lg Semicon Co., Ltd. Semiconductor device transfer apparatus
US6289579B1 (en) * 1999-03-23 2001-09-18 Motorola, Inc. Component alignment and transfer apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639203A (en) * 1994-06-03 1997-06-17 Lg Semicon Co., Ltd. Semiconductor device transfer apparatus
US6289579B1 (en) * 1999-03-23 2001-09-18 Motorola, Inc. Component alignment and transfer apparatus

Also Published As

Publication number Publication date
TW200707626A (en) 2007-02-16
NL1029576C2 (en) 2007-01-23
CN101228815A (en) 2008-07-23
EP1911336A2 (en) 2008-04-16
WO2007011218A2 (en) 2007-01-25

Similar Documents

Publication Publication Date Title
EP2175054A3 (en) Substrate for growing wurtzite type crystal and method for manufacturing the same and semiconductor device
WO2007011218A3 (en) Method and device for displacing a group of components ordered in a matrix structure
EP2413381A3 (en) Method and apparatus providing simplified installation of a plurality of solar panels
EP2159780A3 (en) Display device
HK1144235A1 (en) Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate
WO2010081003A3 (en) Systems, apparatus and methods for moving substrates
WO2007130471A3 (en) Systems and methods for high density multi-component modules
WO2011038442A3 (en) Picking system and method for loading load carriers
EP1993123A3 (en) Method and apparatus for heat-treating an SOI substrate and method of preparing an SOI substrate by using the same
EP2306501A3 (en) Ceramic wiring board and method of manufacturing thereof
EP1450393A3 (en) System and method for transferring substrates carriers between processing tools
WO2008108338A1 (en) Glass substrate packaging system, protecting-sheet loading device, protecting-sheet feeding device, and glass substrate packaging method
EP1798786A3 (en) Organic electroluminescent device and method of manufacturing the same
EP2075860A3 (en) Light-emitting element, light-emitting device and electronic device
ATE538053T1 (en) TRANSFER DEVICE, TRANSPORT SYSTEM AND METHOD FOR HANDLING PARTS CARRIERS
WO2004072120A3 (en) Surface-bonded, organic acid-based mono-layers
EP1860693A3 (en) Substrate transfer apparatus, substrate process system, and substrate transfer method
ATE440064T1 (en) METHOD AND SYSTEM FOR AUTOMATIC BAGGAGE HANDLING
AU2003294674A1 (en) Device and method for transporting wafer-shaped articles
EP2019572A3 (en) Assembly substrate and method of manufacturing the same
EP1786249A4 (en) Ceramic substrate with chip type electronic component mounted thereon and process for manufacturing the same
TW200745363A (en) Sputtering apparatus, method of driving the same, and method of manufacturing substrate using the same
TW200620279A (en) MRAM over sloped pillar and the manufacturing method thereof
ATE506303T1 (en) METHOD AND SYSTEM FOR TRANSFERRING OBJECTS
EP1807556A4 (en) METHOD FOR GROWING Si-Ge SEMICONDUCTOR MATERIALS AND DEVICES ON SUBSTRATES

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680026689.9

Country of ref document: CN

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 12008500129

Country of ref document: PH

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2006747601

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06747601

Country of ref document: EP

Kind code of ref document: A2