WO2007011218A3 - Method and device for displacing a group of components ordered in a matrix structure - Google Patents
Method and device for displacing a group of components ordered in a matrix structure Download PDFInfo
- Publication number
- WO2007011218A3 WO2007011218A3 PCT/NL2006/050149 NL2006050149W WO2007011218A3 WO 2007011218 A3 WO2007011218 A3 WO 2007011218A3 NL 2006050149 W NL2006050149 W NL 2006050149W WO 2007011218 A3 WO2007011218 A3 WO 2007011218A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- components
- matrix structure
- group
- placing
- flat carrier
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a method and a device for placing electronic components ordered in a matrix structure onto a flat carrier, comprising of picking up components ordered in accordance with a matrix structure and placing the components on the flat carrier, wherein the components are picked up in a group of components comprising subgroups and the components are placed successively per subgroup onto the flat carrier. Means are hereby provided with which numbers, pitch or orientation of groups of electronic components, in particular though not exclusively semi-conductor products, can be modified. Placing the components per subgroup moreover creates the freedom to place the subgroups on different carriers.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06747601A EP1911336A2 (en) | 2005-07-21 | 2006-06-27 | Method and device for displacing a group of components ordered in a matrix structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1029576 | 2005-07-21 | ||
NL1029576A NL1029576C2 (en) | 2005-07-21 | 2005-07-21 | Method and device for displacing a group of components arranged in a matrix structure. |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007011218A2 WO2007011218A2 (en) | 2007-01-25 |
WO2007011218A3 true WO2007011218A3 (en) | 2007-07-12 |
Family
ID=35918207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/NL2006/050149 WO2007011218A2 (en) | 2005-07-21 | 2006-06-27 | Method and device for displacing a group of components ordered in a matrix structure |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1911336A2 (en) |
CN (1) | CN101228815A (en) |
NL (1) | NL1029576C2 (en) |
TW (1) | TW200707626A (en) |
WO (1) | WO2007011218A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5745045B2 (en) * | 2010-06-30 | 2015-07-08 | ケーエルエー−テンカー コーポレイション | Method and apparatus for placing electronic devices within compartments of input and output media |
NL2008290C2 (en) * | 2012-02-14 | 2013-08-19 | Fico Bv | METHOD AND DEVICE FOR PLACING ELECTRONIC COMPONENTS SUITED IN A MATRIX STRUCTURE. |
KR101872764B1 (en) * | 2017-03-02 | 2018-06-29 | 주식회사 코엠에스 | Display LED Chip Arrangement Method and LED Chip Picking and Arrangement Device |
JP2022027096A (en) * | 2020-07-31 | 2022-02-10 | 日亜化学工業株式会社 | Manufacturing method of light-emitting module |
NL2031053B1 (en) | 2022-02-23 | 2023-09-06 | Besi Netherlands Bv | Gripper head, device, and method for handling and varying the spacing of electronic components arranged in a matrix structure |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5639203A (en) * | 1994-06-03 | 1997-06-17 | Lg Semicon Co., Ltd. | Semiconductor device transfer apparatus |
US6289579B1 (en) * | 1999-03-23 | 2001-09-18 | Motorola, Inc. | Component alignment and transfer apparatus |
-
2005
- 2005-07-21 NL NL1029576A patent/NL1029576C2/en not_active IP Right Cessation
-
2006
- 2006-06-27 WO PCT/NL2006/050149 patent/WO2007011218A2/en active Application Filing
- 2006-06-27 CN CNA2006800266899A patent/CN101228815A/en active Pending
- 2006-06-27 EP EP06747601A patent/EP1911336A2/en not_active Withdrawn
- 2006-06-29 TW TW095123499A patent/TW200707626A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5639203A (en) * | 1994-06-03 | 1997-06-17 | Lg Semicon Co., Ltd. | Semiconductor device transfer apparatus |
US6289579B1 (en) * | 1999-03-23 | 2001-09-18 | Motorola, Inc. | Component alignment and transfer apparatus |
Also Published As
Publication number | Publication date |
---|---|
TW200707626A (en) | 2007-02-16 |
NL1029576C2 (en) | 2007-01-23 |
CN101228815A (en) | 2008-07-23 |
EP1911336A2 (en) | 2008-04-16 |
WO2007011218A2 (en) | 2007-01-25 |
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