WO2007003572A3 - Method for deposition of a material in a hole in an electrically conducting workpiece - Google Patents

Method for deposition of a material in a hole in an electrically conducting workpiece Download PDF

Info

Publication number
WO2007003572A3
WO2007003572A3 PCT/EP2006/063680 EP2006063680W WO2007003572A3 WO 2007003572 A3 WO2007003572 A3 WO 2007003572A3 EP 2006063680 W EP2006063680 W EP 2006063680W WO 2007003572 A3 WO2007003572 A3 WO 2007003572A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conducting
deposition
hole
workpiece
conducting workpiece
Prior art date
Application number
PCT/EP2006/063680
Other languages
German (de)
French (fr)
Other versions
WO2007003572A2 (en
Inventor
Jens Dahl Jensen
Ursus Krueger
Ursula Michelsen-Mohammadein
Jan Steinbach
Gabriele Winkler
Original Assignee
Siemens Ag
Jens Dahl Jensen
Ursus Krueger
Ursula Michelsen-Mohammadein
Jan Steinbach
Gabriele Winkler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Jens Dahl Jensen, Ursus Krueger, Ursula Michelsen-Mohammadein, Jan Steinbach, Gabriele Winkler filed Critical Siemens Ag
Publication of WO2007003572A2 publication Critical patent/WO2007003572A2/en
Publication of WO2007003572A3 publication Critical patent/WO2007003572A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention relates to a method for deposition of a material in a hole (210), which extends from the surface (6) of an electrically conducting workpiece (200) into or through said workpiece (200) by use of an electric field, comprising the steps: application of an electrically conducting protective layer (8) to the surface (16) of the workpieces, deposition of the material (13) in the hole by means of the electric field and removal of the electrically conducting protective layer (8).
PCT/EP2006/063680 2005-07-01 2006-06-29 Method for deposition of a material in a hole in an electrically conducting workpiece WO2007003572A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510032019 DE102005032019A1 (en) 2005-07-01 2005-07-01 A method of depositing a material into a hole in an electrically conductive workpiece
DE102005032019.8 2005-07-01

Publications (2)

Publication Number Publication Date
WO2007003572A2 WO2007003572A2 (en) 2007-01-11
WO2007003572A3 true WO2007003572A3 (en) 2007-04-26

Family

ID=37527026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/063680 WO2007003572A2 (en) 2005-07-01 2006-06-29 Method for deposition of a material in a hole in an electrically conducting workpiece

Country Status (2)

Country Link
DE (1) DE102005032019A1 (en)
WO (1) WO2007003572A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1018396A3 (en) * 2008-06-24 2010-10-05 Smalt Spol S R O Sheet metal panel NACHTRAGLICHEM WITH ANTI CORROSION AND ITS MANUFACTURING METHOD.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1199344B (en) * 1959-12-29 1965-08-26 Gen Electric Process for making a printed circuit board
JPS60110869A (en) * 1983-11-18 1985-06-17 Toyota Motor Corp Conductive masking material for vacuum film formation
EP1160352A1 (en) * 2000-05-31 2001-12-05 ALSTOM Power N.V. Method of adjusting the size of cooling holes of a gas turbine component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534709A (en) * 1967-01-20 1968-08-02 Philips Eclairage Radio Method of manufacturing printed circuits with metallized holes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1199344B (en) * 1959-12-29 1965-08-26 Gen Electric Process for making a printed circuit board
JPS60110869A (en) * 1983-11-18 1985-06-17 Toyota Motor Corp Conductive masking material for vacuum film formation
EP1160352A1 (en) * 2000-05-31 2001-12-05 ALSTOM Power N.V. Method of adjusting the size of cooling holes of a gas turbine component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198530, Derwent World Patents Index; AN 1985-181614, XP002419932 *

Also Published As

Publication number Publication date
DE102005032019A1 (en) 2007-01-04
WO2007003572A2 (en) 2007-01-11

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