WO2006137349A1 - Catadioptric projection optical system, and exposure apparatus having the same - Google Patents

Catadioptric projection optical system, and exposure apparatus having the same Download PDF

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Publication number
WO2006137349A1
WO2006137349A1 PCT/JP2006/312205 JP2006312205W WO2006137349A1 WO 2006137349 A1 WO2006137349 A1 WO 2006137349A1 JP 2006312205 W JP2006312205 W JP 2006312205W WO 2006137349 A1 WO2006137349 A1 WO 2006137349A1
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WIPO (PCT)
Prior art keywords
optical system
projection optical
imaging optical
catadioptric projection
light
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PCT/JP2006/312205
Other languages
French (fr)
Inventor
Yutaka Iriyama
Hideki Morishima
Original Assignee
Canon Kabushiki Kaisha
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Application filed by Canon Kabushiki Kaisha filed Critical Canon Kabushiki Kaisha
Publication of WO2006137349A1 publication Critical patent/WO2006137349A1/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B17/00Systems with reflecting surfaces, with or without refracting elements
    • G02B17/08Catadioptric systems
    • G02B17/0804Catadioptric systems using two curved mirrors
    • G02B17/0816Catadioptric systems using two curved mirrors off-axis or unobscured systems in which not all of the mirrors share a common axis of rotational symmetry, e.g. at least one of the mirrors is warped, tilted or decentered with respect to the other elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70225Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems

Definitions

  • the present invention relates generally to an imaging optical system, and more particularly to a catadioptric projection optical system that uses a mirror to project a plate or substrate to be exposed, such as a single crystal substrate for a semiconductor wafer, and a glass plate for a liquid crystal panel.
  • the present invention is suitable, for example, for a so-called immersion exposure apparatus that immerses, in a liquid or fluid, a final plane of the projection optical system and a plate surface, and exposes the plate via the liquid.
  • a conventional projection exposure apparatus transfers a circuit pattern of a reticle or a mask via a projection optical system onto a wafer etc, and is increasingly required to provide higher quality exposure at a finer resolution.
  • Use of an exposure light having a shorter wavelength and a projection optical system that has a high numerical aperture ("NA") is effective measure to obtain the fine resolution.
  • NA numerical aperture
  • the immersion lithography is one attractive means for the high NA scheme.
  • the immersion lithography increases the NA of the projection optical system by replacing a medium at the wafer side of the projection optical system with a liquid or a fluid.
  • an aberrational correction is one important factor for the high quality exposure. In particular, as use of an exposure light having a shorter wavelength promotes, a viable glass material is limited and the chromatic aberration becomes difficult.
  • a catadioptric projection optical system which can easily correct the chromatic aberration. See, for example, Japanese Patent Applications, Publication Nos. 9-211332, 10-90602, 62-210415, 62-258414, 63-163319, 2-66510, 3-282527, 4-234722, 5-188298, 6-230287, 8-304705, 2002-83766 and 2004-317534. Also, see, for example, U.S. Patent Nos. 5,650,877.
  • This catadioptric projection optical system is especially suitable for a high NA environment as in an immersion exposure apparatus.
  • the catadioptric projection optical system is effective to the aberrational correction, but needs a long optical path length for further aberrational correction purposes.
  • any aberration correcting mirror preferably faces the gravity direction in a catadioptric projection optical system, because if not, the mirror's deformation due to its own weight becomes non-uniform within the reflection plane, causing a new aberration.
  • All of the aberration correcting mirror, the reticle plane, and the wafer plane preferably face the gravity direction for high quality exposure, and thus a configuration is not preferable in which aberration correcting mirrors are orthogonal to the wafer plane as in the Japanese Patent Application, Publication No. 2004-317534.
  • the present invention is directed to a catadioptric projection optical system that realizes high quality exposure at a fine resolution, an exposure apparatus having the same, and a device manufacturing method utilizing the exposure apparatus.
  • a catadioptric projection optical system configured to form an image of a first object plural times and to serve as an imaging optical system that images the image onto a second object, planes of the first and second objects opposing to each other and being arranged in parallel, includes a pair of concave mirrors, one of which opposes to one of the first and second objects, and the other of which opposes to the other of the first and second objects.
  • An exposure apparatus includes an illumination optical system configured to illuminate a pattern using a light from a light source, and the above catadioptric projection optical system configured to project an image of a pattern onto a plate to be exposed.
  • a device manufacturing method includes the steps of exposing an object using the above exposure apparatus, and developing the object. Claims for a device manufacturing method for performing operations similar to that of the above exposure apparatus cover devices as intermediate and final products. Such devices include semiconductor chips like an LSI and VLSI, CCDs, LCDs, magnetic sensors, thin film magnetic heads, and the like. Other objects and further features of the present invention will become readily apparent from the following description of the preferred embodiments with reference to the accompanying drawings . BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic block diagram of a projection optical system according to one embodiment of the present invention.
  • FIG. 2 is a schematic block diagram of a variation of the projection optical system shown in FIG. 1.
  • FIG. 3 is a concrete structural view of a projection optical system shown in FIG. 1.
  • FIG. 4 is a concrete structural view of a variation of the projection optical system shown in FIG. 3.
  • FIG. 5 is a concrete structural view of a projection optical system shown in FIG. 2.
  • FIG. 6 is a schematic block diagram of an exposure apparatus according to another aspect of the present invention.
  • FIG. 7 is a flowchart for explaining a method for manufacturing devices (e.g., semiconductor chips such as ICs and LSIs, LCDs, and CCDs) .
  • FIG. 8 is a detailed flowchart of a wafer step in step 4 in FIG. 7.
  • FIG. 1 is a schematic optical path diagram of the projection optical system.
  • 101 denotes a first object, such as a reticle
  • 102 denotes a second object, such as a wafer.
  • the projection optical system includes, in order from the first object side along the optical path, a first imaging system Gl, a second imaging system G2, a pair of deflecting mirrors FMl and FM2, a third imaging system G3, a fourth imaging system G4.
  • the light from the first object 101 passes the first imaging system Gl, and forms a first intermediate image
  • the light from the first intermediate image passes the second imaging system G2, is deflected by the deflecting mirror FMl, and forms a second intermediate image (real image) before or after the deflecting mirror FMl.
  • the light from the deflecting mirror FMl is deflected on the deflecting mirror FM2, and introduced to the third imaging system G3.
  • the light that passes the third imaging system G3 forms a third intermediate image (real image) , and is introduced to the fourth imaging system G4.
  • the light that passes the fourth imaging system G4 approximately telecentrically forms an image of the first object 101 on the second object 102.
  • the four-times imaging system can maintain the optical path length long, and the entire optical system small due to the deflecting mirrors FMl and FM2 without image inversions.
  • At least one or more of the four imaging systems use a concave mirror in addition to a lens, because the concave mirror does not cause the chromatic aberration and has an effect of correcting the positive Petzval sum resulting from the fourth imaging system G4 having a positive refractive index.
  • the imaging systems Gl to G4 preferably have two or more pairs of a dioptric optical system and a catadioptric optical system having a concave mirror. Plural concave mirrors enhance the effect of correcting the above Petzval sum.
  • the concave mirror is preferably arranged at each of the second imaging system G2 and the third of the imaging system G3.
  • the concave mirror should be arranged in an optical system in which the light reciprocates, and effective use of the concave mirror is advantageous to the miniaturization of the entire optical system. It is preferable that two concave mirrors are not arranged coaxially, because this arrangement makes the system less sensitive to an inclination.
  • one concave mirror is arranged parallel to the first object 101, and the other concave mirror is arranged parallel to the second obj ect 102. Since the concave mirror is held uniformly with respect to the gravity, the deformation of the concave mirror due to its own weight can be made uniform, and most of the lenses can be held similarly.
  • ⁇ 3 is an imaging magnification of the third imaging optical system
  • ⁇ 4 is an imaging magnification of the fourth imaging optical system
  • NA is an aperture of an overall system:
  • Equation 1 represents a spread angle of the light between the pair of deflecting mirrors FMl and FM2. If Equation 1 is not met, the deflecting mirrors FMl and FM2 become large, increasing their deformations and making manufactures difficult. The following condition is preferably met where A is a distance between a light condensing point having an angle of view closest to the optical axis in the second intermediate image and the deflecting mirror FMl, and B is an interval between the pair of deflecting mirrors FMl and FM2 : [EQUATION 2]
  • Equation 2 the diameters of the pair of deflecting mirrors FMl and FM2 can be balanced.
  • the size of one of the deflecting mirror becomes excessively large, the imaging performance deteriorates due to the self-weight deformation etc., and the manufacture of the deflecting mirror becomes difficult.
  • the rays concentrate at a position of the intermediate image, causing the high temperature there.
  • An arrangement that spaces three intermediate images from one another can restrain various aberrations caused by the heat and the influence of airflow generated near the intermediate images .
  • the pair of deflecting mirrors FMl and FM2 there is no refractive element between the pair of deflecting mirrors FMl and FM2.
  • This arrangement can hold all optical elements other than the deflecting mirrors substantially horizontally, and restrain asymmetrical shape changes due to the self-weight deformations .
  • tel is an angle between a principal ray of the outermost angle of view and an optical axis between the pair of deflecting mirrors FMl and FM2 : [EQUATION 3] -40° ⁇ tel ⁇ 40°
  • Equation 3 the deflecting mirror can be prevented from becoming excessively large.
  • FIG. 2 is a schematic optical path diagram as a variation of the projection optical system shown in FIG. 1.
  • FIG. 3 shows a concrete structure of the first embodiment.
  • the first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 and a positive lens L103 each having an aspheric convex surface that faces the second object 102 side, a meniscus lens L104 having a convex surface that faces the first object 101 side, and a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side.
  • the first imaging optical system Gl further includes a meniscus lens L106 having an aspheric concave surface that faces the first object 101 side, a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having an aspheric convex surface that faces the second object 102 side, a positive meniscus lens LIlO having a concave surface that faces the first object 101 side, and a positive meniscus lens LlIl having a concave surface that faces the first object side 101 side.
  • the light that passes the first imaging optical system Gl forms a first intermediate image.
  • a formation of the first intermediate image near the deflecting mirror FMl facilitates a separation of the light.
  • the light from the first intermediate image is introduced to the second imaging optical system G2.
  • the second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a concave surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, negative lenses L203 and L204, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml.
  • the light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms a second intermediate image, and is introduced to the deflecting mirror FM2.
  • the light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3.
  • the third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive lens L305 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L304 having a concave surface that faces the deflecting mirror FM2 side, a positive meniscus lens L303 having a convex mirror that faces the deflecting mirror FM2 side, a negative meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the concave mirror M2.
  • the light that reciprocates in the third imaging optical system G3 forms a third intermediate image. A formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light.
  • the light from the third intermediate image is introduced to the fourth imaging optical system G4.
  • the fourth imaging optical system G4 includes optical elements L401 to L416 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes a positive meniscus lens L401 and a positive lens L402 each having a concave surface that faces the second object 102 side, a negative meniscus lens L403 having an aspheric concave surface that faces the third imaging optical system G3 side, a negative lens L404 having an aspheric concave surface that faces the third imaging optical system G3 side, a meniscus lens L405 having an aspheric concave surface that faces the second object 102 side, and a positive lens L406 having a convex surface that faces the second object 102 side.
  • the fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3, positive lenses L408 and L409, positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side, a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side.
  • a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3, positive lenses L408 and L409, positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side
  • This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz.
  • An object-image distance between the first object plane and the second object plane is L of about 1,870 mm.
  • a rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
  • This and following embodiments do not limit an angle of each of the deflecting mirrors FMl and FM2 to 45° relative to the optical axis of the first imaging optical system Gl, and allows their angles to form arbitrary angles relative to the optical axis so that the light maximum incident angle upon the deflecting mirrors FMl and FM2 becomes small.
  • the deflecting mirrors FMl and FM2 are arranged parallel to each other.
  • the parallel arrangement is advantageous to light incident angle characteristic of the deflecting mirror's reflection coating, influence on the imaging performance, and reduced overall length of the optical system.
  • Tables 1 to 5 indicate specifications of numerical examples of the first embodiment:
  • the first column in each Table denotes a plane number along the light traveling direction from the first object 101.
  • the second column denotes a radius of curvature of each plane.
  • the third column denotes an interval between respective planes along the optical axis ("planes' axial interval").
  • the fourth column denotes a refractive index to the center wavelength. The radius of curvature is given a plus sign when the convex surface faces the first object 101 side, and a minus sign when the convex surface faces the second object 102.
  • the planes' axial interval is given a plus interval between the first object 101 and the concave mirror Ml in the second imaging optical system G2, between the deflecting mirrors (flat mirrors) FMl and FM2, and between the concave mirror M2 in the third imaging system G3 and the second object 102.
  • the planes' axial interval is given a minus interval between the concave mirror Ml in the second imaging optical system G2 and the deflecting mirror FMl, and between the deflecting mirror FM2 and the concave mirror M2 in the third imaging optical system G3.
  • the immersion material that fills a space between the final lens and an image plane has a refractive index of 1.597 to a refractive index- to the reference wavelength ⁇ of 193 run.
  • the aspheric surface ASP is defined by the following Equation: [EQUATION 4]
  • X denotes a displacement amount of a lens apex in the optical axis direction.
  • h denotes a distance from the optical axis,
  • ri denotes a radius of curvature,
  • k denotes a conical coefficient.
  • A, B, C, D, E, F, G, H, J are aspheric coefficients.
  • REFL denotes a reflecting surface.
  • FIG. 4 shows a concrete structure of the second embodiment.
  • the first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 having an aspheric convex surface that faces the second object 102 side, a positive lens L103, a meniscus lens L104 having a convex surface that faces the first object 101 side, a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side, a positive meniscus lens L106 having an aspheric concave surface that faces the first object 101 side, a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having a positive aspheric ' surface that faces the second object 102 side, a positive meniscus lens LIlO
  • the second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a convex surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, a concave lens L203, a negative meniscus lens L204 having a concave surface that faces the first imaging optical system Gl side, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml.
  • a positive meniscus lens L201 having a convex surface that faces the first imaging optical system Gl side
  • a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side
  • a concave lens L203 a negative meniscus lens L204 having
  • the light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms -a second intermediate image, passes a refractive element Field 1, and is introduced to the deflecting mirror FM2.
  • the light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3.
  • the refractive element Field 1 facilitates an introduction of the light exiting from the deflecting mirror FMl to the deflecting mirror FM2.
  • the third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive meniscus lens L305 having a convex surface that faces the deflecting mirror FM2 side, a positive meniscus lens L304 having a concave surface that faces the deflecting mirror FM2, a positive meniscus lens L303 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the . concave mirror M2.
  • the light that reciprocates in the third imaging optical system forms a third intermediate image. A formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light.
  • the light from the third intermediate image is introduced to the fourth imaging optical system G4.
  • the fourth imaging optical system G4 includes optical elements L401 to L416 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes a convex lens L401, a positive meniscus lens L402 having a concave surface that faces the second object 102 side, a negative meniscus lens L403 having an aspheric concave surface that faces the third imaging optical system G3 side, a negative meniscus lens L404 having an aspheric surface that faces the third imaging optical system G3 side, a concave lens L405 having an aspheric concave surface that faces the second imaging optical system G2 side, a meniscus lens L406 having a convex surface that faces the second object 102 side.
  • the fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3 side, convex lenses L408 and L409, and positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side.
  • the fourth imaging optical system G4 further includes a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the .second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side.
  • This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz.
  • An object-image distance between the first object plane and the second object plane is L of about 2,000 mm.
  • a rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
  • FIG. 5 shows a concrete structure of the third embodiment .
  • the first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first Object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 having an aspheric convex surface that faces the second object 102 side, a positive lens L103, a meniscus lens L104 having a convex surface that faces the first object 101 side, a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side, and a meniscus lens L106 having an aspheric concave surface that faces the first object 101 side.
  • the first imaging optical system Gl further includes a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having an aspheric convex surface that faces the second object 102 side, a positive meniscus lens LlIO having a concave surface that faces the first object 101 side, and a positive lens LlIl.
  • the light that passes the imaging optical system Gl forms the first intermediate image.
  • a formation of the first intermediate image near the deflecting mirror FMl facilitates a separation of the light.
  • the light from the- first intermediate image is introduced to the second imaging optical system G2.
  • the second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a convex surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, a concave lens L203, a negative meniscus lens L204 having a concave surface that faces the first imaging optical system Gl, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml.
  • the light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms a second intermediate, image, passes a refractive element Field 1, and is introduced to the deflecting mirror FM2.
  • the light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3.
  • the refractive element Field 1 facilitates an introduction of the light exiting from the deflecting mirror FMl to the deflecting mirror FM2.
  • the third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive meniscus lens L305 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L304 having a convex surface that faces the deflecting mirror FM2 side, a positive meniscus lens L303 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the concave mirror M2.
  • a positive meniscus lens L305 having a convex surface that faces the deflecting mirror FM2 side
  • a meniscus lens L304 having a convex surface that faces the deflecting mirror FM2 side
  • a positive meniscus lens L303 having a convex surface that faces the deflecting mirror FM2 side
  • the light that reciprocates in the third imaging optical system G3 forms a third intermediate image.
  • a formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light,
  • the light from the third intermediate image is introduced to the fourth imaging optical system G4.
  • the fourth imaging optical system G4 includes optical elements L401 to L415 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes convex lenses L401 and L402, a concave lens L403 having an aspheric concave surface that faces the third imaging optical system G3, a negative meniscus lens L404 having an aspheric concave surface that faces the third imaging optical system G3 side, a meniscus lens L405 having an aspheric concave surface that faces the second object 102 side, and a meniscus lens L406 having a concave surface that faces the deflecting mirror FM2 side.
  • convex lenses L401 and L402 includes convex lenses L401 and L402, a concave lens L403 having an aspheric concave surface that faces the third imaging optical system G3, a negative meniscus lens L404 having an aspheric concave surface that faces the third imaging optical system G3 side, a meniscus lens L405 having an asphe
  • the fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3 side, convex lenses L408 and L409, positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side.
  • the fourth imaging optical system G4 further includes a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side.
  • This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz.
  • An object-image distance between the first object plane and the second object plane is L of about 2,000 mm.
  • a rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
  • Tables 10 to 13 indicate specifications of numerical examples of- the second embodiment: [TABLE 10 ]
  • FIG. 6 is a schematic block diagram of the exposure apparatus 100.
  • the exposure apparatus 100 includes an illumination section 110, a mask or reticle 130, a reticle stage 132, a projection optical system 140, a main control unit 150, a monitor and input device 152, a wafer 170, a wafer stage 176, and a liquid 180 as a medium.
  • the exposure apparatus 100 is an immersion exposure apparatus that partially or ' entirely immerses, in the liquid 180, a space between the bottom surface of the projection optical system 140 and the wafer 170, and exposes a pattern of the reticle 130 onto the wafer 170 via the liquid 180.
  • the exposure apparatus 100 of this embodiment is a step-and-scan projection exposure apparatus, the present invention is applicable to a step-and-repeat manner and other exposure methods.
  • the illumination apparatus 110 illuminates the reticle 130 that has a circuit pattern to be transferred, and includes a light source section and an illumination optical system.
  • the light source section includes a laser 112 as a light source, and a beam shaping system 114.
  • the laser 112 may be pulsed laser such as an ArF excimer laser with a wavelength of approximately 193 nm, a KrF excimer laser with a wavelength of approximately 248 run, an F 2 laser with a wavelength of approximately 157 nm, etc.
  • a kind of laser, the number of laser units, and a type of light source section are not limited.
  • the beam shaping system 114 can use, for example, a beam expander, etc.
  • the beam shaping system 114 forms a beam that has a size and divergent angle necessary to illuminate an optical integrator 118, which will be described later.
  • the illumination optical system is an optical system that illuminates the reticle 130, and includes a condenser optical system 116, a polarization control means 117, an optical integrator 118, an aperture stop 120, a condenser lens 122, a deflecting mirror 124, a masking blade 126, and an imaging lens 128 in this embodiment.
  • the illumination optical system 120 can provide various illumination modes, such as a conventional (or circular) illumination, an annular illumination, a quadrupole illumination, etc.
  • the condenser optical system 116 includes plural optical elements, and efficiently introduces the light with the desired shape to the optical integrator 118.
  • the condenser optical system 116 includes a zoom lens system, and controls a shape and an angular distribution of the incident beam to the optical integrator 118.
  • the condensing optical system 116 further includes an exposure dose regulator that can change an exposure dose of the illumination light for the reticle 130 for each illumination mode.
  • the exposure dose regulator is controlled by the main control unit 150.
  • the exposure dose regulator may be arranged, for example, between the optical integrator 118 and the reticle 130, or at another place to measure the exposure dose and the result can be fed back.
  • the polarization control means 117 includes, for example, a polarization element arranged at an approximately conjugate to a pupil 142 of the projection optical system 140.
  • the polarization control means 117 controls, as described later, a polarization state in a predetermined region of an effective light source formed on the pupil 142.
  • the polarization control means 117 can include plural types of polarization elements that are provided on a turret rotatable by an actuator (not shown) , and the main control unit 150 may control driving of the actuator.
  • the optical integrator 118 makes uniform the illumination light that illuminates the reticle 130, includes as a fly-eye lens in the instant embodiment for converting an angular distribution of the incident light into a positional distribution and for exiting the light.
  • the fly-eye lens is so maintained that its incident plane and its exit plane are in a Fourier transformation relationship, and includes a multiplicity of rod lenses (or fine lens elements) .
  • the optical integrator 118 usable for the present invention is not limited to the fly-eye lens, and can include an optical rod, a diffraction grating, a plural pairs of cylindrical lens array plates that are arranged so that these pairs are orthogonal to each other, etc.
  • the aperture stop 120 that has a fixed shape and diameter.
  • the aperture stop 120 is arranged at a position approximately conjugate to the effective light source on the pupil 142 of the projection optical system 140, as described later, and the aperture shape of the aperture stop 120 corresponds to the effective light source shape on the pupil 142 plane in the projection optical system 140.
  • the aperture stop 120 controls a shape of the effective light source, as described later.
  • various aperture stops can be switched so that it is located on the optical path by a stop exchange mechanism (or actuator) 121 according to illumination conditions.
  • a drive control unit 151 controlled by the main control unit 150 controls the driving of the actuator 121.
  • the aperture stop 120 may be integrated with the polarization control means 117.
  • the condenser lens 122 collects all the beams that have exited -from secondary light sources near the exit plane of the optical integrator 118 and passed the aperture stop 120.
  • the beams are reflected by the mirror 124, and uniformly illuminate or Koehler-illuminate the masking blade 126.
  • the masking blade 126 includes plural movable light shielding plates, and has an approximately rectangular opening corresponding to an effective area of the projection optical system 140.
  • the light that has passed the opening of the masking blade 126 is used as the illumination light for the reticle 130.
  • the masking blade 126 is a stop having an automatically variable opening width, thus making a transfer area changeable.
  • the exposure apparatus 100 may further include a scan blade, with a structure similar to the above masking blade 126, which makes the exposure are changeable in the scanning direction.
  • the scan blade is also a stop having an automatically variable opening width, and is placed at an optically approximately conjugate with a reticle 130 plane.
  • the exposure apparatus 100 can use these two variable blades to set a size of the transfer area in accordance with the exposure shot size.
  • the imaging lens 128 transfers an aperture shape of the masking blade 126 onto the reticle 130 plane, and projects a reduced pattern of the reticle 130 onto the wafer 170 plane installed on the wafer chuck (not shown) .
  • the reticle 130 is one embodiment of the first object 101 shown in- FIGs . 1 to 5.
  • the reticle 130 has a p-attern to be transferred, and is supported and driven by a reticle stage 132.
  • the diffracted light emitted from the reticle 130 passes the projection optical system 140, and then is projected onto the wafer 170.
  • the wafer 170 is a plate to be exposed, and the resist is coated thereon.
  • the reticle 130 and the wafer 170 are located in an optically conjugate relationship.
  • the exposure apparatus 100 in this embodiment is a step-and-scan exposure apparatus (i.e., "scanner") and therefore, scans the reticle 130 and the wafer 170 to transfer a pattern of the reticle 130 onto the wafer 170.
  • the reticle 130 and the wafer 170 are kept stationary during exposure.
  • the reticle stage 132 supports the reticle 130, and is connected to a transport mechanism (not shown) .
  • the reticle stage 132 and the projection optical system 140 are installed on a stage barrel stool supported via a damper, for example, to a base frame placed on the floor.
  • the reticle stage 132 can use any structure known in the art.
  • the transport mechanism (not shown) is made up of a linear motor and the like, and drives the reticle stage 132 in the XY directions, thus moving the reticle 130.
  • the exposure apparatus 100 scans the reticle 130 and the wafer 170 in a state synchronized with the main control unit 150.
  • the projection optical system 140 is one embodiment of the projection optical systems shown in FIGs. 1 to 5.
  • the projection optical system 140 serves to ima-ge the diffracted light that has generated by the pattern of the reticle 130 onto the wafer 170.
  • the main control unit 150 controls the driving of each component, and particularly performs illumination control based on the information input into the input device of the monitor and input device 152, information from the illumination apparatus 110, and a program stored in a memory (not shown) . More specifically, the main control unit 150 controls a shape of the effective light source formed on the pupil 142 of the projection optical system 140, and a polarization state. For example, for the high-resolution imaging performance with the high NA, the polarization state may eliminate the p-polarized light that deteriorates the imaging contrast and use only the s-polarized light for imaging which has a polarization direction in the longitudinal direction of the reticle pattern. Control information and other information for the main control unit 150 are indicated on the display of the monitor and input device 152.
  • the wafer 170 is one embodiment of the second embodiment shown in FIGs. 1 to 5.
  • the wafer 170 is replaced with a liquid crystal plate and another plate to be exposed in another embodiment.
  • the photoresist 172 is coated on a substrate 174.
  • the wafer 170 is supported by a wafer stage 176.
  • the stage 176 may use any structure known in the art, and thus a detailed description of its structure and operations is omitted.
  • the stage 176 uses a linear motor to move the wafer 170 in the XY directions.
  • the reticle 130 and wafer 170 are, for example, scanned synchronously, and the positions of the reticle stage 132 and wafer stage 176 are monitored, for example, by a laser interferometer and the like, so that both are driven at a constant speed ratio.
  • the stage 176 is installed on a stage stool supported on the floor and the like, for example, via a dumper.
  • the final plane of the projection optical system 140 closest to the wafer 170 is immersed in the liquid 180.
  • the liquid 180 selects its material that has a good transmittance to the wavelength of the exposure light, does not contaminate the projection optical system 140, and matches the resist process.
  • the coating of the final plane of the projection optical system 140 protects the element from the liquid 180.
  • a beam emitted from the laser 112 is reshaped into a desired beam shape by the beam shaping system 114, and then enter the illumination optical system.
  • the condenser optical system 116 guides the light to the optical integrator 118 efficiently.
  • the exposure dose regulator adjusts the exposure dose of the illumination light.
  • the main control unit 150 recognizes reticle pattern information when a user inputs it in the input device in the monitor and input device 152, or by reading, for- example, a barcode of the reticle, and selects the aperture shape and the polarization state among the illumination condition suitable for the reticle pattern, by driving the actuator for the aperture stop 120 and the actuator (not shown) for the polarization control means 117.
  • the optical integrator 118 makes the illumination light uniform, and the aperture stop 120 sets a desired effective light source shape. Such an illumination light illuminates the reticle 130 under optimal condition through the deflecting mirror 124, the masking blade 126 and imaging lens 128.
  • the light that has passed the reticle 130 is projected under a predetermined reduction onto the wafer 170 by the projection optical system 140.
  • the step-and-scan exposure apparatus would fix the laser 112 and the projection optical system 140, and synchronously scan the reticle 130 and wafer 170, then exposing the entire shot.
  • the wafer stage 176 is stepped to the next shot and the new scan operation follows. When this scanning and stepping are repeated, many shots are exposed onto the wafer 170.
  • the step-and-repeat exposure apparatus would expose while maintaining the reticle 130 and the wafer 170 stationary.
  • the projection optical system 140 closest to the wafer 170 is immersed in the liquid 180 that has a higher refractive index than that of air, the projection optical system 140 has a higher NA, and a resolution becomes finer on the wafer 170.
  • the reticle plane and the wafer plane can face the gravity direction, the negative influence of the aberration of the reticle 130 due to the self-weight deformation or spilling of the liquid 180 from the wafer 170 can be prevented.
  • a pair of concave mirrors Ml and M2 can provide aberrational corrections of the projection optical system 140. Since the concave mirrors Ml and M2 can face the gravity direction, the negative influence of the aberration due to the self-weight deformations can be prevented.
  • the polarization control forms an image with higher contrast on the resist 172. As a result, the exposure apparatus 100 can perform a precise pattern transfer onto the resist, can provide high-quality devices
  • FIG. 14 is a flowchart for explaining a fabrication of devices (i.e., semiconductor chips such as IC and LSI, LCDs, CCDs, etc.) .
  • a fabrication of a semiconductor chip As an example.
  • Step 1 circuit design
  • Step 2 reticle fabrication
  • Step 3 wafer preparation
  • Step 4 wafer process
  • Step 5 assembly
  • Step 6 inspection
  • Step 6 performs various tests for the semiconductor device made in Step 5, such as a validity test and a durability test. Through these steps, a semiconductor device is finished and shipped (Step 7) .
  • FIG. 8 is a detailed flowchart of the wafer process in step 4.
  • Step 11 oxidation
  • Step 12 CVD
  • Step 13 electrode formation
  • Step 14 ion implantation
  • Step 15 resist process
  • Step 16 exposure
  • Step 17 development
  • Step 18 etching
  • Step 19 resist stripping
  • Such devices include semiconductor chips like an LSI and VLSI, CCDs, LCDs, magnetic sensors, thin film magnetic heads, and the like.
  • the present invention is not limited to these preferred embodiments, and various modifications and changes may be made in the present invention without departing from the spirit and scope thereof.
  • the projection optical system that does not include Field 1 is within a scope of the present invention.

Abstract

A catadioptric projection optical system configured to form an image of a first object onto a second object includes a first imaging optical system configured to form a first intermediate image of the first object, a second imaging optical system configured to form a second intermediate image of the first object based on a light from the first intermediate image, a third imaging optical system configured to form a third intermediate image based on a light from the second intermediate image, a fourth imaging optical system configured to form the image of the first object onto the second object based on a light from the third intermediate image, and a pair of deflecting mirrors provided between the second and third intermediate optical systems.

Description

DESCRIPTION
CATADIOPTRIC PROJECTION OPTICAL SYSTEM, AND EXPOSURE
APPARATUS HAVING THE SAME
TECHNICAL FIELD
The present invention relates generally to an imaging optical system, and more particularly to a catadioptric projection optical system that uses a mirror to project a plate or substrate to be exposed, such as a single crystal substrate for a semiconductor wafer, and a glass plate for a liquid crystal panel. The present invention is suitable, for example, for a so-called immersion exposure apparatus that immerses, in a liquid or fluid, a final plane of the projection optical system and a plate surface, and exposes the plate via the liquid.
BACKGROUND ART
A conventional projection exposure apparatus transfers a circuit pattern of a reticle or a mask via a projection optical system onto a wafer etc, and is increasingly required to provide higher quality exposure at a finer resolution. Use of an exposure light having a shorter wavelength and a projection optical system that has a high numerical aperture ("NA") is effective measure to obtain the fine resolution. The immersion lithography is one attractive means for the high NA scheme. The immersion lithography increases the NA of the projection optical system by replacing a medium at the wafer side of the projection optical system with a liquid or a fluid. The projection optical system's NA is defined as NA = n sinθ where "n" is a refractive index of the medium; the NA increases up to "n" when the filled medium has a refractive index higher than the air's refractive index, i.e., n > 1. As a result, this scheme decreases a resolution R, which is defined as R = ki (λ / NA) of the exposure apparatus, where ki is a process constant and λ is a wavelength of a light source. In addition, an aberrational correction is one important factor for the high quality exposure. In particular, as use of an exposure light having a shorter wavelength promotes, a viable glass material is limited and the chromatic aberration becomes difficult. Accordingly, a catadioptric projection optical system is proposed which can easily correct the chromatic aberration. See, for example, Japanese Patent Applications, Publication Nos. 9-211332, 10-90602, 62-210415, 62-258414, 63-163319, 2-66510, 3-282527, 4-234722, 5-188298, 6-230287, 8-304705, 2002-83766 and 2004-317534. Also, see, for example, U.S. Patent Nos. 5,650,877. This catadioptric projection optical system is especially suitable for a high NA environment as in an immersion exposure apparatus. The catadioptric projection optical system is effective to the aberrational correction, but needs a long optical path length for further aberrational correction purposes. However, the environment in which the exposure apparatus is installed should be formed in a clean room due to the temperature and air's index of cleanliness, etc., and the exposure apparatus has a limited overall length. In addition, a perpendicular direction to a wafer plane must be parallel to the gravity direction so as to maintain the liquid in the immersion exposure apparatus. Moreover, any aberration correcting mirror preferably faces the gravity direction in a catadioptric projection optical system, because if not, the mirror's deformation due to its own weight becomes non-uniform within the reflection plane, causing a new aberration. All of the aberration correcting mirror, the reticle plane, and the wafer plane preferably face the gravity direction for high quality exposure, and thus a configuration is not preferable in which aberration correcting mirrors are orthogonal to the wafer plane as in the Japanese Patent Application, Publication No. 2004-317534. In order to prevent a mechanical interference between the reticle stage that drives the reticle and the wafer stage that drives the wafer, it is more preferable to arrange the reticle and wafer opposite to each other. DISCLOSURE OF INVENTION
The present invention is directed to a catadioptric projection optical system that realizes high quality exposure at a fine resolution, an exposure apparatus having the same, and a device manufacturing method utilizing the exposure apparatus.
A catadioptric projection optical system according to one aspect of the present invention configured to form an image of a first object onto a second object includes a first imaging optical system configured to form a first intermediate image of the first object, a second imaging optical system configured to form a second intermediate image of the first object based on a light from the first intermediate image, a third imaging optical system configured to form a third intermediate image based on a light from the second intermediate image, a fourth imaging optical system configured to form the image of the first object onto the second object based on a light from the third intermediate image, and a pair of deflecting mirrors provided between the second and third intermediate optical systems .
A catadioptric projection optical system according to another aspect of the present invention configured to form an image of a first object plural times and to serve as an imaging optical system that images the image onto a second object, planes of the first and second objects opposing to each other and being arranged in parallel, includes a pair of concave mirrors, one of which opposes to one of the first and second objects, and the other of which opposes to the other of the first and second objects. An exposure apparatus according to another aspect of the present invention includes an illumination optical system configured to illuminate a pattern using a light from a light source, and the above catadioptric projection optical system configured to project an image of a pattern onto a plate to be exposed.
A device manufacturing method according to another aspect of the present invention includes the steps of exposing an object using the above exposure apparatus, and developing the object. Claims for a device manufacturing method for performing operations similar to that of the above exposure apparatus cover devices as intermediate and final products. Such devices include semiconductor chips like an LSI and VLSI, CCDs, LCDs, magnetic sensors, thin film magnetic heads, and the like. Other objects and further features of the present invention will become readily apparent from the following description of the preferred embodiments with reference to the accompanying drawings . BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic block diagram of a projection optical system according to one embodiment of the present invention.
FIG. 2 is a schematic block diagram of a variation of the projection optical system shown in FIG. 1.
FIG. 3 is a concrete structural view of a projection optical system shown in FIG. 1. FIG. 4 is a concrete structural view of a variation of the projection optical system shown in FIG. 3.
FIG. 5 is a concrete structural view of a projection optical system shown in FIG. 2.
FIG. 6 is a schematic block diagram of an exposure apparatus according to another aspect of the present invention.
FIG. 7 is a flowchart for explaining a method for manufacturing devices (e.g., semiconductor chips such as ICs and LSIs, LCDs, and CCDs) . FIG. 8 is a detailed flowchart of a wafer step in step 4 in FIG. 7.
BEST MODE FOR CARRYING OUT THE INVENTION
Referring now to the accompanying drawings, a description will be given of a catadioptric projection optical system 100 according to one aspect of the present invention. FIG. 1 is a schematic optical path diagram of the projection optical system. 101 denotes a first object, such as a reticle, and 102 denotes a second object, such as a wafer. The projection optical system includes, in order from the first object side along the optical path, a first imaging system Gl, a second imaging system G2, a pair of deflecting mirrors FMl and FM2, a third imaging system G3, a fourth imaging system G4.
The light from the first object 101 passes the first imaging system Gl, and forms a first intermediate image
(real image) . The light from the first intermediate image passes the second imaging system G2, is deflected by the deflecting mirror FMl, and forms a second intermediate image (real image) before or after the deflecting mirror FMl. The light from the deflecting mirror FMl is deflected on the deflecting mirror FM2, and introduced to the third imaging system G3. The light that passes the third imaging system G3 forms a third intermediate image (real image) , and is introduced to the fourth imaging system G4. The light that passes the fourth imaging system G4 approximately telecentrically forms an image of the first object 101 on the second object 102. The four-times imaging system can maintain the optical path length long, and the entire optical system small due to the deflecting mirrors FMl and FM2 without image inversions. Preferably, at least one or more of the four imaging systems use a concave mirror in addition to a lens, because the concave mirror does not cause the chromatic aberration and has an effect of correcting the positive Petzval sum resulting from the fourth imaging system G4 having a positive refractive index. The imaging systems Gl to G4 preferably have two or more pairs of a dioptric optical system and a catadioptric optical system having a concave mirror. Plural concave mirrors enhance the effect of correcting the above Petzval sum. The concave mirror is preferably arranged at each of the second imaging system G2 and the third of the imaging system G3. The concave mirror should be arranged in an optical system in which the light reciprocates, and effective use of the concave mirror is advantageous to the miniaturization of the entire optical system. It is preferable that two concave mirrors are not arranged coaxially, because this arrangement makes the system less sensitive to an inclination. Preferably, one concave mirror is arranged parallel to the first object 101, and the other concave mirror is arranged parallel to the second obj ect 102. Since the concave mirror is held uniformly with respect to the gravity, the deformation of the concave mirror due to its own weight can be made uniform, and most of the lenses can be held similarly.
The following condition is preferably met where β3 is an imaging magnification of the third imaging optical system, β4 is an imaging magnification of the fourth imaging optical system, and NA is an aperture of an overall system:
[EQUATION 1]
0 <β3 β4 NA< 0.3 Equation 1 represents a spread angle of the light between the pair of deflecting mirrors FMl and FM2. If Equation 1 is not met, the deflecting mirrors FMl and FM2 become large, increasing their deformations and making manufactures difficult. The following condition is preferably met where A is a distance between a light condensing point having an angle of view closest to the optical axis in the second intermediate image and the deflecting mirror FMl, and B is an interval between the pair of deflecting mirrors FMl and FM2 : [EQUATION 2]
0.1B < A < 0.9B
When Equation 2 is met, the diameters of the pair of deflecting mirrors FMl and FM2 can be balanced. When the size of one of the deflecting mirror becomes excessively large, the imaging performance deteriorates due to the self-weight deformation etc., and the manufacture of the deflecting mirror becomes difficult. In addition, the rays concentrate at a position of the intermediate image, causing the high temperature there. An arrangement that spaces three intermediate images from one another can restrain various aberrations caused by the heat and the influence of airflow generated near the intermediate images .
Preferably, there is no refractive element between the pair of deflecting mirrors FMl and FM2. This arrangement can hold all optical elements other than the deflecting mirrors substantially horizontally, and restrain asymmetrical shape changes due to the self-weight deformations .
When there is no refractive element between the pair of deflecting mirrors FMl and FM2, the following condition is preferably met, where "tel" is an angle between a principal ray of the outermost angle of view and an optical axis between the pair of deflecting mirrors FMl and FM2 : [EQUATION 3] -40° < tel < 40°
When Equation 3 is met, the deflecting mirror can be prevented from becoming excessively large.
The projection optical system may have a different light emitting position as shown in FIG. 2. Here, FIG. 2 is a schematic optical path diagram as a variation of the projection optical system shown in FIG. 1.
FIRST EMBODIMENT
FIG. 3 shows a concrete structure of the first embodiment.
The first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 and a positive lens L103 each having an aspheric convex surface that faces the second object 102 side, a meniscus lens L104 having a convex surface that faces the first object 101 side, and a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side. The first imaging optical system Gl further includes a meniscus lens L106 having an aspheric concave surface that faces the first object 101 side, a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having an aspheric convex surface that faces the second object 102 side, a positive meniscus lens LIlO having a concave surface that faces the first object 101 side, and a positive meniscus lens LlIl having a concave surface that faces the first object side 101 side. The light that passes the first imaging optical system Gl forms a first intermediate image. A formation of the first intermediate image near the deflecting mirror FMl facilitates a separation of the light. The light from the first intermediate image is introduced to the second imaging optical system G2.
The second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a concave surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, negative lenses L203 and L204, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml.
The light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms a second intermediate image, and is introduced to the deflecting mirror FM2. The light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3.
The third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive lens L305 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L304 having a concave surface that faces the deflecting mirror FM2 side, a positive meniscus lens L303 having a convex mirror that faces the deflecting mirror FM2 side, a negative meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the concave mirror M2. The light that reciprocates in the third imaging optical system G3 forms a third intermediate image. A formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light. The light from the third intermediate image is introduced to the fourth imaging optical system G4.
The fourth imaging optical system G4 includes optical elements L401 to L416 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes a positive meniscus lens L401 and a positive lens L402 each having a concave surface that faces the second object 102 side, a negative meniscus lens L403 having an aspheric concave surface that faces the third imaging optical system G3 side, a negative lens L404 having an aspheric concave surface that faces the third imaging optical system G3 side, a meniscus lens L405 having an aspheric concave surface that faces the second object 102 side, and a positive lens L406 having a convex surface that faces the second object 102 side. The fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3, positive lenses L408 and L409, positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side, a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side.
This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz. An object-image distance between the first object plane and the second object plane is L of about 1,870 mm. The light of an image point of the first object 101 in a range between about 14.00 mm and about 68.00 mm (where the third imaging optical system G3 side is made negative) images on the second object 102 without any interference between the deflecting mirrors FMl and FM2. A rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
This and following embodiments do not limit an angle of each of the deflecting mirrors FMl and FM2 to 45° relative to the optical axis of the first imaging optical system Gl, and allows their angles to form arbitrary angles relative to the optical axis so that the light maximum incident angle upon the deflecting mirrors FMl and FM2 becomes small. Preferably, the deflecting mirrors FMl and FM2 are arranged parallel to each other. Although the deflecting mirrors FMl and FM2 do not contribute- to the aberrational correction, the aberration of the overall system does not change. However, the parallel arrangement is advantageous to light incident angle characteristic of the deflecting mirror's reflection coating, influence on the imaging performance, and reduced overall length of the optical system.
Tables 1 to 5 indicate specifications of numerical examples of the first embodiment:
[TABLE 1 ]
L = I 8 7 0 mm β = l /4
NΛ = 1 1 5
L O B J = ■■ 1 4 . 0 mm
HO B J = 6 8 . O ram
(3 3 = 1 0 0 3 7
/3 4 = 0 1 0 7 2
A= 3 5 1 . 0 4 5 mm
B = 5 8 0 . 0 0 mm t e 1 = 2 . 2 8 7 3
1 : INFINITY 35.000000
2: INFINITY 10.000000 1.5609
3: INFINITY 26.869151
4: 385.23386 54.555344 1.5609
5: -163.87863 1.000075
ASP:
K : 0.000000
A -.0.420324E-07 B :-.354288E-l1 C :0.8l7509E-16 D :0.127069E-19
E :0.186284E-23 F :-.323929E-27 G :0.118136B-31 H :O.O00000E+0O
J :O.0000O0E+OO
6: 1058.34622 26.219882 1.5609
7: -466.66999 44.667792
8; 73.17929 24.472580 1.5609
9: 67.42326 6.900104
10: 69.23467 40.226990 1.5609
11 : 237.50771 13.421450
ASP:
K : 0.000000
A :0.295975E-06 B :0.287785E-09 C :0.552864E-13 D :-.117877E-15
E :-.282764E-20 F :0.808494E-22 G :-.287029E-25 H -.O.OOOOOOE+00
J :O.OO0000E+O0
12: -2101.78201 15.000000 1.5609 ASP:
K : 0.000000
A :-.957145E-06 B :-.153298E-09 C :0.211973E-12 D :-.101698E-16 E :0.312175E-25 F :-.173139E-26 G :0.971590E-26 H :0.000000E+00 J :O.O0O0OOE+O0
13: -174.02502 33.578807
14: -46.45834 20.372566 1.5609
15: -86.72397 1.000005
16: -143.50868 21.447440 1.5609
17: -113.30472 1.000000
18: -556.92555 15.004643 1.5609
19: -328.65641 79.238809
ASP:
K : 0.000000
A :0.696301E-07 B :0.211731E-ll C :-.765556E-15 D :0.993009E-19
E :-.835455E-23 F :0.401264E-27 G :-.809495E-32 H :O.O00OOOE+OO
J :0.000000E+0O [TABLE 2 ]
20: -333.69801 57.836502 1.5609 21 : -171.86131 1.000025 22: -1277.43519 49.613206 1.5609 23: -296.14667 0.000000 24: INFINITY 0.000000 1.5609 25: INFINITY 0.000000 26: INFINITY 0.000000 1.5609 27: INFINITY 28.034687 28: INFINITY 18.575819 29: INFINITY 179.27181 1 30: INFINITY 0.000000 1.5609 XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000
ADE: -45.000000 BDE: 0.000000 CDE: 0.000000
31 : INFINITY 200.000000 XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000 ADE: -45.000000 BDE: 0.000000 CDE: 0.000000
32: 324.54234 95.659439 1.5609 33: 1008.39819 104.578644 34: 218.90025 66.920068 1.5609 ASP:
K : -0.100169 A :-.361865E-08 B :-.535708E-13 C :0.148886E-17 D :-.107164E-21 E :-.195461E-26 F :0.150857E-30 G :-.265732E-35 H :O.0O000OE+O0 J :O.O0O00OE+OO
35: 467.03031 107.043817
36: -3378.25563 49.682228 1.5609
37: 356.29280 177.326638
38: -187.39808 15.071285 1.5609
39: -3221.96645 27.231244
40: -163.21303 17.963825 1.5609
ASP:
K : -0.773461
A :0.123158E-07 B :0.163659E-l l C :-.774998E-15 D :0.210917E-18
E :-.304697E-22 F :0.229667E-26 G :-.676526E-31 H :0.000000E+00
J :O.O0O0O0E+00
41 : -7952.27512 33.888838 42: -188.98037 -33.888838 REFL 43: -7952.27512 -17.963825 1.5609 44: -163.21303 -27.231244 ASP:
K : -0.773461 A :0.123158E-07 B :O.163659E-1 1 C :-.774998E-15 D :0.210917E-l8 E :-.304697E-22 F :0.229667E-26 G :-.676526E-31 H :O.00O0O0E+OO J :O.0O000OE+O0 [TABLE 3 ]
45: -3221.96645 -15.071285 1.5609
46: -187.39808 -177.326638 47: 356.29280 -49.682228 1.5609 48: -3378.25563 -107.043817 49: 467.03031 -66.920068 1.5609 50: 218.90025 -104.578644
ASP:
K : -0.100169
A :-.361865E-08 B :-.535708E-13 C :0.148886E-17 D :-.107164E-21
E :-.1.95461E-26 F :0.150857E-30 G :-.265732E-35 H :O.00OO00E+OO
J :O.OOOOOOE+00
51: 1008.39819 -95.659439 1.5609
52: 324.54234 -200.000000
53: INFINITY 345.871979 REFL XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000 ADE: -45.000000 BDE: 0.000000 CDE: 0.000000
54: -190.80470 0.000000 1.5609
55: -190.80470 1.000000
56: INFINITY 3.000000
57: INFINITY 1.000000
58: 298,21682 0.000000
59: 298.21682 0.000000
60: INFINITY 47.147036
61 : INFINITY 181.980986
62: INFINITY -151.925061 REFL
XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000
ADE: 45.000000 BDE: 0.000000 CDE: 0.000000
63: -485.31751 -39.847030 1.5609
64: -16574.22225 -337.212158
65: -255.67796 -35.257079 1.5609
66: -280.11053 -55.961915
67: -142.06400 -40.234708 1.5609
68: -373.47524 -37.886021
69: 248.56853 -15.005745 1.5609
70: 1027.92262 -17.139234
71 : 360.91785 -17.775260 1.5609
72: -943.25413 -21.402776 -
73: 675.26090 21.402776 REFL
74: -943.25413 17.775260 1.5609
75: 360.91785 17.139234
76: 1027.92262 15.005745 1.5609
77: 248.56853 37.886021
78: -373.47524 40.234708 1.5609
79: -142.06400 55.961915
80: -280.11053 35.257079 1.5609
81 : -255.67796 337.212158
82: -16574.22225 39.847030 1.5609
83: -485.31751 151.925061
84: ΓNFINITY 0.000000 1.5609
XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000
ADE: -45.000000 BDE: 0.000000 CDE: 0.000000 [TABLE 4 ]
85: INFINITY 149.000000 10
XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000 ADE: -45.000000 BDE: 0.000000 CDE: 0.000000
> 86: 356.26386 46.644897 1.5609
87: 11369.70990 1.000197
88: 357.30057 49.175575 1.5609
89: -5412.18933 155.452038
90: -196.27826 15.047801 1.5609
ASP:
K : 0.000000
A :0.403680E-08 B :0.130118E-12 C :-.617759E-17 D :0.729411E-20
E X156674E-24 F :-.405925E-28 G :0.189778E-32 H :0.000000E+00
J :0.000000E+00
91: -569.13428 84.400354
92: -260.25337 18.645268 1.5609
ASP:
K : 0.000000
A :0.623280E-07 B :-.114932E-l l C :-.586076E-16 D :-.305384E-21
E :0.102132E-23 F :-.462328E-28 G :0.193708E-33 H :0.000000E+00
J :0.00OOO0E+0O
93: 338.63593 74.385226
94: 1780.68216 16.304724 1.5609
95: 1352.73399 20.245761
ASP:
K : 0.000000
A :0.235886E-07 B :0.166664E-12 C :-.866110E-l6 D :-.330795E-20
E :0.552825E-24 F :-.198168E-28 G :0.289l72E-33 H :0.000000E+00
J :0.000000E+00
96: 4755.84574 18.267163 1.5609
97: -1287.96943 4.471529
98: 499.49181 15.000000 1.5609
ASP:
K : 0.000000
A :-.127555E-07 B :0.665494E-12 C :-.610232E-16 D :0.135665E-20
E :-.133758E-26 F :-.597449E-30 G :0.132523E-34 H :0.000000E+00
J :0.0OOOO0E+0O [TABLE 5 ]
99: 385.99844 22.492825
100: 737.74585 29.463130 1.5609
101 : -3884.74067 1.000000
102: 502.64896 54.676436 1.5609
103: -1214.64732 1.000000
104: 339.86260 50.007832 1.5609
105: 1362.00163 1.000000
106: 215.14695 49.600916 1.5609
107: 363.82757 1.000000
108: 152.19140 49.701063 1.5609
109: 209.85174 1.000000
110: 108.46804 49.985760 1.5609
11 1: 151.92515 1.000000
ASP:
K : 0.000000
A :0 .161469E-07 B :-.665609E-12 C :-.473582E-16 D :-.752378E-20
E :0.402691E-24 F :0.723732E-27 G :-.535273E-31 H :O.O0OOOOE+0O
J :0.000000E+00
1 12: 92.82886 15.286357 1.5609 ASP:
K : 0.000000
A :0.814742E-07 B :-.235580E-10 C :-.786187E-15 D :-.143238E-18 E :-.233764E-21 F :0.625333E-25 G :-.440512E-29 H :0.O00000E+O0 J :O.O0OOOOE+00
113: 92.66141 1.000002
114: 70.87432 15.006981 1.5609
115: 67.33940 1.000001
ASP:
K : 0.000000
A :0.441371E-06 B :-.120990E-09 C :-.303846E-13 D :-.409288E-18
E :-.191671E-20 F :0.225674E-23 G :-.424079E-27 H :0.0O000OE+OO
J : O.OOOOOOE+00
116: 42.1 1502 46.730402 1.5609
117: INFINITY 2.000000 1.597 In this and following embodiments, the first column in each Table denotes a plane number along the light traveling direction from the first object 101. The second column denotes a radius of curvature of each plane. The third column denotes an interval between respective planes along the optical axis ("planes' axial interval"). The fourth column denotes a refractive index to the center wavelength. The radius of curvature is given a plus sign when the convex surface faces the first object 101 side, and a minus sign when the convex surface faces the second object 102. The planes' axial interval is given a plus interval between the first object 101 and the concave mirror Ml in the second imaging optical system G2, between the deflecting mirrors (flat mirrors) FMl and FM2, and between the concave mirror M2 in the third imaging system G3 and the second object 102. The planes' axial interval is given a minus interval between the concave mirror Ml in the second imaging optical system G2 and the deflecting mirror FMl, and between the deflecting mirror FM2 and the concave mirror M2 in the third imaging optical system G3. The lens glass material SiO2 has a refractive index of 1.5609 to the reference wavelength λ = 193 nm, and refractive indexes of 1.5608995218 and 1.5609004782 to the wavelengths of +0.3 pm and' -0.3 pm to the reference wavelength, respectively. The immersion material that fills a space between the final lens and an image plane has a refractive index of 1.597 to a refractive index- to the reference wavelength λ of 193 run. The aspheric surface ASP is defined by the following Equation: [EQUATION 4]
X=(h2/4) /(l+( (l-(l+k) (h/r)2) )1/2)+Ah4+Bh6+Ch8+Dh10+ ' Eh12+Fh14+Gh16+Hh18+Jh20
"X" denotes a displacement amount of a lens apex in the optical axis direction. "h" denotes a distance from the optical axis, "ri" denotes a radius of curvature, "k" denotes a conical coefficient. A, B, C, D, E, F, G, H, J are aspheric coefficients. "REFL" denotes a reflecting surface.
SECOND EMBODIMENT
FIG. 4 shows a concrete structure of the second embodiment.
The first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 having an aspheric convex surface that faces the second object 102 side, a positive lens L103, a meniscus lens L104 having a convex surface that faces the first object 101 side, a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side, a positive meniscus lens L106 having an aspheric concave surface that faces the first object 101 side, a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having a positive aspheric ' surface that faces the second object 102 side, a positive meniscus lens LIlO having a concave surface that faces the first Object 101 side, and a positive lens LlIl. The light that passes the imaging optical system Gl forms the first intermediate image. A formation of the first intermediate image near the deflecting mirror FMl facilitates a separation of the light. The light from the first intermediate image is introduced to the second imaging optical system G2.
The second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a convex surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, a concave lens L203, a negative meniscus lens L204 having a concave surface that faces the first imaging optical system Gl side, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml. The light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms -a second intermediate image, passes a refractive element Field 1, and is introduced to the deflecting mirror FM2. The light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3. The refractive element Field 1 facilitates an introduction of the light exiting from the deflecting mirror FMl to the deflecting mirror FM2.
The third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive meniscus lens L305 having a convex surface that faces the deflecting mirror FM2 side, a positive meniscus lens L304 having a concave surface that faces the deflecting mirror FM2, a positive meniscus lens L303 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the. concave mirror M2. The light that reciprocates in the third imaging optical system forms a third intermediate image. A formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light. The light from the third intermediate image is introduced to the fourth imaging optical system G4.
The fourth imaging optical system G4 includes optical elements L401 to L416 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes a convex lens L401, a positive meniscus lens L402 having a concave surface that faces the second object 102 side, a negative meniscus lens L403 having an aspheric concave surface that faces the third imaging optical system G3 side, a negative meniscus lens L404 having an aspheric surface that faces the third imaging optical system G3 side, a concave lens L405 having an aspheric concave surface that faces the second imaging optical system G2 side, a meniscus lens L406 having a convex surface that faces the second object 102 side. The fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3 side, convex lenses L408 and L409, and positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side. The fourth imaging optical system G4 further includes a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the .second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side.
This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz. An object-image distance between the first object plane and the second object plane is L of about 2,000 mm. The light of an image point of the first object 101 in a range between about 14.00 mm and about 68.00 mm (where the third imaging optical system G3 side is made negative) images on the second object 102 without any interference between the deflecting mirrors FMl and FM2. A rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
Tables 6 to 9 indicate specifications of numerical examples of the second embodiment:
[TABLE β]
L= 1 8 2 3mm /3 = 1 /4 NA = 1 . 4 5 L O B J = 1 4. 0 mm HO B J = 6 8. 0 mm β 3 = 0. 9 8 8 2 J3 4 = 0. 0 9 0 1 6 A= 3 0 4. 5 5 mm B = 5 8 0. 0 0mm
1 : INFINITY 35.000000
2: INFINITY 10.000000 1.5609
3: INFINITY 36.136060
4: 1040.80105 47.324052 1.5609
5: -155.18347 17.930758
ASP:
K : 0.000000
A :0.575184E-07 B :-.282715E-l l C :-.340458E-16 D :0.136850E-19
E :0.213062E-23 F :-.358904E-27 G :0.137133E-31 H :0.000000E+00
J :O.0OO000E+0O
6: 2898.76861 25.352128 1.5609
7: -311.53393 29.304445
8: 85.14221 30.532883 1.5609
9: 79.78854 12.724096
10: 73.63030 49.999995 1.5609
11: 202.63340 13.541809
ASP:
K : 0.000000
A :0.399036E-06 B :0.314448E-09 C :0.258359E- 13 D :-.1 18631E-15
E :-.239964E-20 F :0.8U499E-22 G :-.294808E-25 H :0.0O00OOE+OO
J :0.00000OE+O0
12: -310.66279 19.170707 1.5609 ASP:
K : 0.000000
A :-.601 163E-06 B :-.174276E-09 C :0.274774E-12 D :-.285236E-15 E :0.258089E-18 F :-.120350E-21 G :0.279874E-25 H :0.000O0OE+O0 J :0.000000E+00
13: -102.70197 26.062782
14: -50.35053 26.696262 1.5609
15: -93.10235 1.000000
16: -119.46085 23.620845 1.5609
17: -98.14894 1.000002
18: -317.46404 15.000000 1.5609
19: -534.83655 94.916264
ASP:
K : 0.000000
A :0.601886E-07 B :0.22556 C :-.749781E-15 D :0.985919E-19
E :-.844362E-23 F :0.401432 G :-.784447E-32 H :O.00O000E+OO
J :0.000000E+00 [TABLE 7 ]
20: -552.99995 68.178200 1.5609 21 : -189.06721 1.000000 22: 1448.20649 55.325455 1.5609 23: -398.47816 374.070268 24: 347.56669 34.079198 1.5609 25: 673.14719 3.663939 26: 171.65331 37.183437 1.5609
ASP:
K : -0.062776 A :-.188746E-08 B :-.109256E-14 C :-.154972E-17 D -.-.431483E-22 E :0.207720E-27 F :0.846240E-31 G :-.368160E-35 H :O.000O0OE+0O J :O.000O0OE+OO
27: , 165.72439 0.000000 28: 165.72439 49.810403 1.5609 29: 204.03200 86.045156 30: -1279.13573 49.005354 1.5609 31: 2423.45826 131.752561 32: -119.43919 15.007027 1.5609 33: -1882.49288 15.067043 34: -270.21611 19.880417 1.5609
ASP:
K : -0.773461 A :O. I23158E-O7 B :0.163659E-l l C :-.774998E-15 D :0.210917E-18 E :-.304697E-22 F :0.229667E-26 G :-.676526E-31 H :0.000000E+O0 J :O.000O0OE+O0
35: -1240.58876 34.707594 36: -190.70903 -34.707594 REFL 37: -1240.58876 -19.880417 1.5609 38: -270.2161 1 -15.067043 ASP:
K : -0.773461 A :0.123158E-07 B :0.163659E-l l C :-.774998E-15 D :0.2109 I7E-18 E :-.304697E-22 F :0.229667E-26 G :-.676526E-31 H :0.00O000E+O0 J :0.000000E+00
39: -1882.49288 -15.007027 1.5609 40: -119.43919 -131.752561 41: 2423.45826 -49.005354 1.5609 42: -1279.13573 -86.045156 43: 204.03200 -86.993840 1.5609 44: 171.65331 -3.663939
ASP:
K : -0.062776 A :-.188746E-08 :-.109256E-14 C :-.154972E-17 D :-.431483E-22 E :0.207720E-27 :0.846240E-31 G :-.368160E-35 H :0.000000E+00 J :0.OOO00OE+O0
45: 673.14719 -34.079198 1.5609 46: 347.56669 -200.000000 47: INFINITY 224.000011 REFL XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000
ADE: -45.000000 BDE: 0.000000 CDE: 0.000000 [TABLE 8 ]
48: 7718.37319 50.000000 1.5609 49: -704.64601 305.999989 50: INFINITY -199.976188 REFL XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000
ADE: 45.000000 BDE: 0.000000 CDE: 0.000000
51: -397.05700 -53.921892 1.5609 52: -1721.62452 -357.646790 53: -5040.91988 -15.000031 1.5609 54: 6807.71172 -1.000026 55: -143.10375 -36.549875 1.5609 56: -320.49631 -37.786251 57: 288.52012 -20.662817. 1.5609 58: 312.71441 -23.851449 59: 199.59567 -15.000011 1.5609 60: -945.93146 -17.549842 61: 666.09020 17.549842 REFL 62: -945.93146 15.000011 1.5609 63: 199.59567 23.851449 64: 312.71441 20.662817 1.5609 65: 288.52012 37.786251 66: -320.49631 36.549875 1.5609 67: -143.10375 1.000026 68: 6807.71172 15.000031 1.5609 69: -5040.91988 357.646790 70: -1721.62452 53.921892 1.5609 71: -397.05700 299.976188 72: 357.41309 48.071623 1.5609 73: -3356.29500 1.000009 74: 322.99981 42.566407 1.5609 75: 2850.04436 144.856222 76: -259.29008 15.000007 1.5609
ASP:
K : 0.000000 A :-.40253I.E-09 B :0.566865E-12 C :-.225998E-16 D :0.267976E-20 E :-.227938E-24 F :0.159302E-28 G :-.509591E-33 H :O.00O0O0E+OO J :0.000000E+00
77: -18089.57026 129.765574 78: -163.88909 15.000000 1.5609 ASP:
K : 0.000000 A :O.63143OE-07 B :-.11O375E-ll C :-.529942E-16 D :0.250288E-20 E :0.715337E-24 F :-.121708E-28 G :-.871455E-33 H :0.000000E+00 J :O.O0O00OE+00
79: -733.27638 57.994336 80: -940.87260 15.000000 1.5609 81: -2291.69997 21.248131 ASP:
K : 0.000000 A :0.2101I7E-07 B :0.233629E-12 C :-.769134E-16 D :-.340413E-20 E :0.538986E-24 F :-.196032E-28 G :0.298435E-33 H :0.000000E+00 J :O.OOOO0OE+00- [TABLE 9 ]
82: -489.28128 15.000000 1.5609 83: -409.09302 2.540045 84: 538.86471 15.000000 1.5609 ASP:
K : 0.000000 A :-.106746E-07 B :0.673684E-12 C :-.621310E-16 D :0.146244E-20 E :0.377055E-26 F :-.669300E-30 G :0.711206E-35 H :0.000000E+00 J :O.O00O0OE+0O
85: 319.65641 24.281359
86: 559.72238 33.510667 1.5609
87: -5199.06033 ].000000
88: 469.47391 52.561466 1.5609
89: -1503.00838 1.000007
90: 338.94224 47.412722 1.5609
91: 1322.31769 LOOOOOO
92: 205.59691 46.819050 1.5609
93: 323.68209 1.000000
94: 147.46962 49.272741 1.5609
95: 198.32002 1.000000
96: 105.05855 50.374175 1.5609
97: 146.89540 1.000000 ASP:
K : 0.000000 A .-0.184246E-07 B :O.721363E-12 C :0.967559E-16 D :-.168774E-20 E :0.773862E-24 F :0.720370E-27 G :-.618954E-31 H :O.0O000OE+0O J :O.O0O00OE+00
98: 92.94488 15.058017 1.5609 ASP:
K : 0.000000
A :0.149067E-06 B :-.188357E-10 C >.615137E-15 D :-.106731E-18 E :-.234042E-21 F :0.638696E-25 G :-.464300E-29 H :O.O00O0OE+OO J :0.000000E+00
99: 91.76894 1.000000
100: 74.69028 15.201727 1.5609
101: 70.46639 1.000000
ASP:
K : 0.000000
A :0.567888E-06 B :-.983708E-10 C :-.275236E-13 D :-.139304E-17
E :-.234065E-20 F :0.212391E-23 G :-.326197E-27 H :O.OO0O0OE+0O
J : O.OOOOOOE+00
102: 41.46004 46.596244 1 .5609
STO: INFINITY 2.013186 1.597 THIRD EMBODIMENT
FIG. 5 shows a concrete structure of the third embodiment .
The first imaging optical system Gl serves as a dioptric optical system, and includes optical elements LlOl to LlIl along the light traveling direction from the first Object 101. More specifically, the first imaging optical system Gl includes a plane-parallel plate LlOl, a positive lens L102 having an aspheric convex surface that faces the second object 102 side, a positive lens L103, a meniscus lens L104 having a convex surface that faces the first object 101 side, a positive meniscus lens L105 having an aspheric concave surface that faces the second object 102 side, and a meniscus lens L106 having an aspheric concave surface that faces the first object 101 side. The first imaging optical system Gl further includes a meniscus lens L107 having a concave surface that faces the first object 101 side, a positive meniscus lens L108 having a concave surface that faces the first object 101 side, a negative meniscus lens L109 having an aspheric convex surface that faces the second object 102 side, a positive meniscus lens LlIO having a concave surface that faces the first object 101 side, and a positive lens LlIl. The light that passes the imaging optical system Gl forms the first intermediate image. A formation of the first intermediate image near the deflecting mirror FMl facilitates a separation of the light. The light from the- first intermediate image is introduced to the second imaging optical system G2.
The second imaging optical system G2 includes optical systems L201 to L205 and a concave mirror Ml along the light traveling direction from the first imaging optical system Gl. More specifically, the second imaging optical system G2 includes a positive meniscus lens L201 having a convex surface that faces the first imaging optical system Gl side, a positive meniscus lens L202 having an aspheric convex surface that faces the first imaging optical system Gl side, a concave lens L203, a negative meniscus lens L204 having a concave surface that faces the first imaging optical system Gl, a negative meniscus lens L205 having an aspheric concave surface that faces the first imaging optical system Gl side, and the concave mirror Ml.
The light that reciprocates in the second imaging optical system G2 is deflected in an approximately 45° direction by the deflecting mirror FMl, forms a second intermediate, image, passes a refractive element Field 1, and is introduced to the deflecting mirror FM2. The light that is deflected by approximately 45° by the deflecting mirror FM2 is introduced to the third imaging optical system G3. The refractive element Field 1 facilitates an introduction of the light exiting from the deflecting mirror FMl to the deflecting mirror FM2.
The third imaging optical system G3 includes optical elements L305 to L301 and a concave mirror M2 along the light traveling direction from the deflecting mirror FM2. More specifically, the third imaging optical system G3 includes a positive meniscus lens L305 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L304 having a convex surface that faces the deflecting mirror FM2 side, a positive meniscus lens L303 having a convex surface that faces the deflecting mirror FM2 side, a meniscus lens L302 having a concave surface that faces the deflecting mirror FM2 side, a negative lens L301, and the concave mirror M2.
The light that reciprocates in the third imaging optical system G3 forms a third intermediate image. A formation of the third intermediate image near the deflecting mirror FM2 facilitates a separation of the light, The light from the third intermediate image is introduced to the fourth imaging optical system G4.
The fourth imaging optical system G4 includes optical elements L401 to L415 along the light traveling direction from the third imaging optical system G3. More specifically, the fourth imaging optical system G4 includes convex lenses L401 and L402, a concave lens L403 having an aspheric concave surface that faces the third imaging optical system G3, a negative meniscus lens L404 having an aspheric concave surface that faces the third imaging optical system G3 side, a meniscus lens L405 having an aspheric concave surface that faces the second object 102 side, and a meniscus lens L406 having a concave surface that faces the deflecting mirror FM2 side. The fourth imaging optical system G4 further includes a negative meniscus lens L407 having an aspheric convex surface that faces the third imaging optical system G3 side, convex lenses L408 and L409, positive meniscus lenses L410, L411 and L412 that have concave surfaces facing the second object 102 side. The fourth imaging optical system G4 further includes a positive meniscus lens L413 having an aspheric concave surface that faces the second object 102 side, a meniscus lens L414 having an aspheric convex surface that faces the third imaging optical system G3 side, a meniscus lens L415 having an aspheric concave surface that faces the second object 102 side, and a planoconvex lens L416 having a plane at the second object 102 side. This embodiment uses an image-side NA of 1.45, a reduction of 1 / 4, and a glass material of quartz. An object-image distance between the first object plane and the second object plane is L of about 2,000 mm. The light of an image point of the first object 101 in a range between about -14.00 mm and about -68.00 mm (where the third imaging optical . system G3 side is made negative) images on the second object 102 without any interference between the deflecting mirrors FMl and FM2. A rectangular exposure area can be secured with at least 26 mm long and about 7 mm wide.
Tables 10 to 13 indicate specifications of numerical examples of- the second embodiment: [TABLE 10 ]
L= 18 O 9mm /3 = 1/4 NA= 1.45 LOB J = 14.0mm HOB J = 68., 0 mm β 3=0. 77083 β 4=0. 11213 A=324. 172mm B= 580mm
> OBJ: INFINITY 35.000000
1: INFINITY 10.000000 1.5609 2: INFINITY 33.517151 3: 715.21943 47.535933 1.5609 4: -158.68452 21.032661
ASP:
K : 0.000000 A :0.589175E-07 B :-.328S91E-ll C :0.416664E-16 D E :0.178233E-23 F :-.344486E-27 G :0.140601E-31 H J :0.000000E+O0
5: 4708.16202 24.920450 1.5609
6: -300.30121 29.678990
7: 80.41816 29.958397 1.5609
8: 70.44305 8.796800
9: 69.30945 49.999987 1.5609
10: 250.06705 14.479445
ASP:
K : 0.000000
A :0.506201E-06 B :0.285191E-09 C :0.289446E-13 D
E :-. l 68803 E-20 F :0.815631E-22 G :-.314382E-25 H
J : O.OOOOOOE+00
11: -209.23340 23.198283 1.5609 ASP:
K : 0.000000
A -.738508E-06 B :-.l 69691 E-09 C :0.274384E-12 D
E . 0.260504E-18 F :-.117187E-21 G :0.294065E-25 H
J : O.OOOOOOE+00
12: -94.18040 26.068109
13: -50.82234 24.332529 1.5609
14: -80.95580 1.000000
15: -97.00415 20.791482 1.5609
16: -89.54105 1.000000
17: -221.85472 15.000000 1.5609
18: -545.93160 94.869704
ASP:
K 0.000000
A 0.544395E-07 B :0.215984E-l l C :-.742171 E-15 D
E : -.842526E-23 F :0.400806E-27 G :-.786653E-32 H
J :( λOOOOOOE+00 [ TABLE 11 ]
19: -537.46698 68.146148 1.5609 20: -185.68813 1.000000 21 : 1358.57928 59.290438 1.5609 22: -411.10909 350.000000 23: 349.68265 35.976327 1.5609 24: 685.95317 50.519268 25: 173.05876 85.446629 1.5609
ASP:
K -0.055112
A .206180E-08 B :-.200264E-13 C :-.497490E-18 D
E .604734E-28 F :0.125840E-30 G :-.438761E-35 H
J :O.OOOO00E+O0
26: 212.88696 86.259793 27: -998.95131 49.999939 1.5609 28: 3769.06973 138.307322 29: -1 17.99684 15.772799 1.5609 30: -1048.32130 15.537760 31 : -242.51642 19.710571 1.5609
ASP:
K -0.773461 A 0.123158E-07 B :0.163659E-l l C :-.774998E-15 D
E -.304697E-22 F :0.229667E-26 G :-.676526E-31 H
J :0.000000E+00
32: -1223.69397 34.760488 33: -190.33398 -34.760488 REFL 34: -1223.69397 -19.710571 1.5609 35: -242.51642 -15.537760 ASP:
K : -0.773461 A :0.123158E-07 B :0.163659E-l l C :-.774998E-15 D E :-.304697E-22 F :0.229667E-26 G :-.676526E-31 H J :0.000000E+00
36: -1048.32130 -15.772799 1.5609
37: -1 17.99684 -138.307322
38: 3769.06973 -49.999939 1.5609
39: -998.95131 -86.259793
40: 212.88696 -85.446629 1.5609
41: 173.05876 -50.519268 ASP K : -0.0551 12 A :-. 206180E-08 B :-.200264E-13 C :-.497490E-18 D E :-. 604734E-28 F :0.125840E-30 G :-.438761 E-35 H
J :0.0O0O0OE+00
42: 685.95317 -35.976327 1.5609 43: 349.68265 -200.000000 44: INFINITY 224.000098 REFL XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000 ADE: -45.000000 BDE: 0.000000 CDE: 0.000000
45: 2516.11 148 50.000000 1.5609 46: -838.43195 305.999902 47: INFINITY -239.999864 REFL XDE: 0.000000 YDE: 0.000000 ZDE: 0.000000 ADE: 45.00000Q BDE: 0.000000 CDE: 0.000000 [TABLE 12]
48: -328.22610 -60.000512 i.5609
49: -892.10570 -292.724063
50: -2325.32179 -15.000166 1.5609
51: -6929.46433 -1.006491
52: -140.41234 -34.871864 1.5609
53: -323.96046 -34.364690
54: 280.81615 -24.704352 1.5609
55: 282.37274 -18.259658
56: 186.91418 -15.152855 1.5609
57: -934.16884 -18.546783
58: 677.26615 18.546783 REFL
59: -934.16884 15.152855 1.5609
60: 186.91418 18.259658
61: 282.37274 24.704352 1.5609
62: 280.81615 34.364690
63: -323.96046 34.871864 1.5609
64: -140.41234 1.006491
65: -6929.46433 15.000166 1.5609
66: -2325.32179 292.724063
67: -892.10570 60.000512 1.5609
68: -328.22610 339.999864
69: 385.75297 46.799391 1.5609
70: -4307.75030 1.000262
71: 288.64649 47.648996 1.5609
72: 2893.19872 153.092765
73: -269.63720 15.000250 1.5609
ASP:
K : 0.000000
A :-.588661E-08 B :0.275354E-12 C :0.117176E-15 D
E :0.221909E-25 F :0.141463E-27 G :-.814280E-32 H
J :O.OOO00OE+OO
74: 6939.11110 123.943275
75: -146.16118 15.000003 1.5609
ASP:
K : 0.000000
A :0.678172E-07 B :-.104395E-ll C :0.582211E-!8 D
E :O.419942E-24 F :0.713203E-28 G :-.923097E-33 H
J :O.O0O00OE+OO
76: -484.79604 57.503422
77: -566.04200 15.000004 1.5609
78: -652.82327 20.176685
ASP:
K : 0.000000
A :0.213728E-07 B :0.127760E-12 C :-.801025E-16 D
E :0.513370E-24 F :-.199970E-28 G :0.426753E-33 H
J :O.O0O0OOE+0O
79: -530.86037 15.003421 1.5609
80: -506.31641 2.339967
81: 692.05940 15.000030 1.5609
ASP:
K : 0.000000
A :-.105282E-07 B :0.703092E-12 C :-.620475E-16 D
E :0.122167E-26 F :-.773527E-30 G :0.184423E-34 H
J :O.O0000OE+00 [TABLE. 13]
82: 324.94695 24.738619
83: 563.66006 35.734764 1.5609
84: -2543.56392 1.019796
85: 459.43324 53.485458 1.5609
86: -1565.76815 1.000460
87: 340.92688 47.733704 1.5609
88: 1365.22175 1.000200
89: 206.60345 46.497007 1.5609
90: 325.12151 LOOOOOO
91: 148.30076 49.040494 1.5609
92: 200.51665 1.000000
93: 105.24446 50.231191 1.5609
94: 145.59709 1.000000
ASP:
K : 0.000000
A :0.183979E-07 B :0.442211E-12 C : :0.774090E-16 D
E :0.872054E-24 F :0.7G4187E-27 GG ::-.713684E-31 H
J : O.OOOOOOE+00
95: 93.17935 15.000000 1.5609' ASP:
K : 0.000000
A :0.145428E-06 B :-.194086E-10 C :-.398339E-15 D E :-.235117E-21 F :0.634472E-25 G :-.478862E-29 H J :O.00O000E+00
96: 90.62021 1.000000 97: 73.56866 15.000000 1.5609 98: 71.13250 1.000000 ASP:
K : 0.000000 A :0.529641E-06 B :-.855784E-10 C :-.288299E-13 D E :-.222298E-20 F :0.213264E-23 G :-.338743E-27 H J :0.000000E+00
99: 41.63801 46.767047 1.5609 STO: INFINITY 2.007094 1.597 FOURTH EMBODIMENT
Referring now to FIG. 6, a description will now be given of an exposure apparatus 100 to which the projection optical systems shown in FIGs. 1 to 5 are applicable. Here, FIG. 6 is a schematic block diagram of the exposure apparatus 100. As shown in FIG. 6, the exposure apparatus 100 includes an illumination section 110, a mask or reticle 130, a reticle stage 132, a projection optical system 140, a main control unit 150, a monitor and input device 152, a wafer 170, a wafer stage 176, and a liquid 180 as a medium. Thus, the exposure apparatus 100 is an immersion exposure apparatus that partially or' entirely immerses, in the liquid 180, a space between the bottom surface of the projection optical system 140 and the wafer 170, and exposes a pattern of the reticle 130 onto the wafer 170 via the liquid 180. Although the exposure apparatus 100 of this embodiment is a step-and-scan projection exposure apparatus, the present invention is applicable to a step-and-repeat manner and other exposure methods. The illumination apparatus 110 illuminates the reticle 130 that has a circuit pattern to be transferred, and includes a light source section and an illumination optical system.
The light source section includes a laser 112 as a light source, and a beam shaping system 114. The laser 112 may be pulsed laser such as an ArF excimer laser with a wavelength of approximately 193 nm, a KrF excimer laser with a wavelength of approximately 248 run, an F2 laser with a wavelength of approximately 157 nm, etc. A kind of laser, the number of laser units, and a type of light source section are not limited. The beam shaping system 114 can use, for example, a beam expander, etc. , with a plurality of cylindrical lenses, and convert an aspect ratio of the size of the sectional shape of a parallel beam from the laser 112 into a desired value (for example, by changing the sectional shape from a rectangle to a square) , thus reshaping the beam shape into a desired one. The beam shaping system 114 forms a beam that has a size and divergent angle necessary to illuminate an optical integrator 118, which will be described later.
The illumination optical system is an optical system that illuminates the reticle 130, and includes a condenser optical system 116, a polarization control means 117, an optical integrator 118, an aperture stop 120, a condenser lens 122, a deflecting mirror 124, a masking blade 126, and an imaging lens 128 in this embodiment. The illumination optical system 120 can provide various illumination modes, such as a conventional (or circular) illumination, an annular illumination, a quadrupole illumination, etc.
The condenser optical system 116 includes plural optical elements, and efficiently introduces the light with the desired shape to the optical integrator 118. In some cases, the condenser optical system 116 includes a zoom lens system, and controls a shape and an angular distribution of the incident beam to the optical integrator 118.
The condensing optical system 116 further includes an exposure dose regulator that can change an exposure dose of the illumination light for the reticle 130 for each illumination mode. The exposure dose regulator is controlled by the main control unit 150. The exposure dose regulator may be arranged, for example, between the optical integrator 118 and the reticle 130, or at another place to measure the exposure dose and the result can be fed back.
The polarization control means 117 includes, for example, a polarization element arranged at an approximately conjugate to a pupil 142 of the projection optical system 140. The polarization control means 117 controls, as described later, a polarization state in a predetermined region of an effective light source formed on the pupil 142. The polarization control means 117 can include plural types of polarization elements that are provided on a turret rotatable by an actuator (not shown) , and the main control unit 150 may control driving of the actuator.
The optical integrator 118 makes uniform the illumination light that illuminates the reticle 130, includes as a fly-eye lens in the instant embodiment for converting an angular distribution of the incident light into a positional distribution and for exiting the light. The fly-eye lens is so maintained that its incident plane and its exit plane are in a Fourier transformation relationship, and includes a multiplicity of rod lenses (or fine lens elements) . However, the optical integrator 118 usable for the present invention is not limited to the fly-eye lens, and can include an optical rod, a diffraction grating, a plural pairs of cylindrical lens array plates that are arranged so that these pairs are orthogonal to each other, etc.
Right after the exit plane of the optical integrator 118 is provided the aperture stop 120 that has a fixed shape and diameter. The aperture stop 120 is arranged at a position approximately conjugate to the effective light source on the pupil 142 of the projection optical system 140, as described later, and the aperture shape of the aperture stop 120 corresponds to the effective light source shape on the pupil 142 plane in the projection optical system 140. The aperture stop 120 controls a shape of the effective light source, as described later. In the aperture stop 120, as described later, various aperture stops can be switched so that it is located on the optical path by a stop exchange mechanism (or actuator) 121 according to illumination conditions. A drive control unit 151 controlled by the main control unit 150 controls the driving of the actuator 121. The aperture stop 120 may be integrated with the polarization control means 117.
The condenser lens 122 collects all the beams that have exited -from secondary light sources near the exit plane of the optical integrator 118 and passed the aperture stop 120. The beams are reflected by the mirror 124, and uniformly illuminate or Koehler-illuminate the masking blade 126. The masking blade 126 includes plural movable light shielding plates, and has an approximately rectangular opening corresponding to an effective area of the projection optical system 140. The light that has passed the opening of the masking blade 126 is used as the illumination light for the reticle 130. The masking blade 126 is a stop having an automatically variable opening width, thus making a transfer area changeable. The exposure apparatus 100 may further include a scan blade, with a structure similar to the above masking blade 126, which makes the exposure are changeable in the scanning direction. The scan blade is also a stop having an automatically variable opening width, and is placed at an optically approximately conjugate with a reticle 130 plane. Thus, the exposure apparatus 100 can use these two variable blades to set a size of the transfer area in accordance with the exposure shot size.
The imaging lens 128 transfers an aperture shape of the masking blade 126 onto the reticle 130 plane, and projects a reduced pattern of the reticle 130 onto the wafer 170 plane installed on the wafer chuck (not shown) .
The reticle 130 is one embodiment of the first object 101 shown in- FIGs . 1 to 5. The reticle 130 has a p-attern to be transferred, and is supported and driven by a reticle stage 132. The diffracted light emitted from the reticle 130 passes the projection optical system 140, and then is projected onto the wafer 170. The wafer 170 is a plate to be exposed, and the resist is coated thereon. The reticle 130 and the wafer 170 are located in an optically conjugate relationship. The exposure apparatus 100 in this embodiment is a step-and-scan exposure apparatus (i.e., "scanner") and therefore, scans the reticle 130 and the wafer 170 to transfer a pattern of the reticle 130 onto the wafer 170. When it is a step-and-repeat exposure apparatus (i.e., "stepper"), the reticle 130 and the wafer 170 are kept stationary during exposure.
The reticle stage 132 supports the reticle 130, and is connected to a transport mechanism (not shown) . The reticle stage 132 and the projection optical system 140 are installed on a stage barrel stool supported via a damper, for example, to a base frame placed on the floor. The reticle stage 132 can use any structure known in the art. The transport mechanism (not shown) is made up of a linear motor and the like, and drives the reticle stage 132 in the XY directions, thus moving the reticle 130. The exposure apparatus 100 scans the reticle 130 and the wafer 170 in a state synchronized with the main control unit 150. The projection optical system 140 is one embodiment of the projection optical systems shown in FIGs. 1 to 5. The projection optical system 140 serves to ima-ge the diffracted light that has generated by the pattern of the reticle 130 onto the wafer 170.
The main control unit 150 controls the driving of each component, and particularly performs illumination control based on the information input into the input device of the monitor and input device 152, information from the illumination apparatus 110, and a program stored in a memory (not shown) . More specifically, the main control unit 150 controls a shape of the effective light source formed on the pupil 142 of the projection optical system 140, and a polarization state. For example, for the high-resolution imaging performance with the high NA, the polarization state may eliminate the p-polarized light that deteriorates the imaging contrast and use only the s-polarized light for imaging which has a polarization direction in the longitudinal direction of the reticle pattern. Control information and other information for the main control unit 150 are indicated on the display of the monitor and input device 152. The wafer 170 is one embodiment of the second embodiment shown in FIGs. 1 to 5. The wafer 170 is replaced with a liquid crystal plate and another plate to be exposed in another embodiment. The photoresist 172 is coated on a substrate 174. The wafer 170 is supported by a wafer stage 176. The stage 176 may use any structure known in the art, and thus a detailed description of its structure and operations is omitted. For example, the stage 176 uses a linear motor to move the wafer 170 in the XY directions. The reticle 130 and wafer 170 are, for example, scanned synchronously, and the positions of the reticle stage 132 and wafer stage 176 are monitored, for example, by a laser interferometer and the like, so that both are driven at a constant speed ratio. The stage 176 is installed on a stage stool supported on the floor and the like, for example, via a dumper. The final plane of the projection optical system 140 closest to the wafer 170 is immersed in the liquid 180. The liquid 180 selects its material that has a good transmittance to the wavelength of the exposure light, does not contaminate the projection optical system 140, and matches the resist process. The coating of the final plane of the projection optical system 140 protects the element from the liquid 180.
In exposure, a beam emitted from the laser 112 is reshaped into a desired beam shape by the beam shaping system 114, and then enter the illumination optical system. The condenser optical system 116 guides the light to the optical integrator 118 efficiently. At that time, the exposure dose regulator adjusts the exposure dose of the illumination light. The main control unit 150 recognizes reticle pattern information when a user inputs it in the input device in the monitor and input device 152, or by reading, for- example, a barcode of the reticle, and selects the aperture shape and the polarization state among the illumination condition suitable for the reticle pattern, by driving the actuator for the aperture stop 120 and the actuator (not shown) for the polarization control means 117.
The optical integrator 118 makes the illumination light uniform, and the aperture stop 120 sets a desired effective light source shape. Such an illumination light illuminates the reticle 130 under optimal condition through the deflecting mirror 124, the masking blade 126 and imaging lens 128.
The light that has passed the reticle 130 is projected under a predetermined reduction onto the wafer 170 by the projection optical system 140. The step-and-scan exposure apparatus would fix the laser 112 and the projection optical system 140, and synchronously scan the reticle 130 and wafer 170, then exposing the entire shot. The wafer stage 176 is stepped to the next shot and the new scan operation follows. When this scanning and stepping are repeated, many shots are exposed onto the wafer 170. The step-and-repeat exposure apparatus would expose while maintaining the reticle 130 and the wafer 170 stationary.
Since the final plane of the projection optical system
140 closest to the wafer 170 is immersed in the liquid 180 that has a higher refractive index than that of air, the projection optical system 140 has a higher NA, and a resolution becomes finer on the wafer 170. In addition, the reticle plane and the wafer plane can face the gravity direction, the negative influence of the aberration of the reticle 130 due to the self-weight deformation or spilling of the liquid 180 from the wafer 170 can be prevented. Moreover, a pair of concave mirrors Ml and M2 can provide aberrational corrections of the projection optical system 140. Since the concave mirrors Ml and M2 can face the gravity direction, the negative influence of the aberration due to the self-weight deformations can be prevented. Furthermore, the polarization control forms an image with higher contrast on the resist 172. As a result, the exposure apparatus 100 can perform a precise pattern transfer onto the resist, can provide high-quality devices
(e.g., semiconductor devices, LCD devices, photographing devices (such as CCDs, etc.), thin film magnetic heads) .
FIFTH EMBODIMENT
Referring to FIGs. 7 and 8, a description will now be given of an embodiment of a device manufacturing method using the above exposure apparatus 100. FIG. 14 is a flowchart for explaining a fabrication of devices (i.e., semiconductor chips such as IC and LSI, LCDs, CCDs, etc.) . Here, a description will be given of a fabrication of a semiconductor chip as an example. Step 1 (circuit design) designs a semiconductor device circuit. Step 2 (reticle fabrication) forms a reticle having a designed circuit pattern. Step 3 (wafer preparation) manufactures a wafer using materials such as silicon. Step 4 (wafer process) , which is referred to as a pretreatment, forms actual circuitry on the wafer through photolithography using the reticle and wafer. Step 5 (assembly) , which is also referred to as a posttreatment, forms into a semiconductor chip the wafer formed in Step 4 and includes an assembly step {e.g., dicing, bonding), a packaging step (chip sealing), and the like. Step 6 (inspection) performs various tests for the semiconductor device made in Step 5, such as a validity test and a durability test. Through these steps, a semiconductor device is finished and shipped (Step 7) .
FIG. 8 is a detailed flowchart of the wafer process in step 4. Step 11 (oxidation) oxidizes the wafer' s surface . Step 12 (CVD) forms an insulating film on the wafer's surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor disposition and the like. Step 14 (ion implantation) implants ions into the wafer. Step 15 (resist process) applies a photosensitive material onto the wafer. Step 16 (exposure) uses the exposure apparatus 100 to expose a reticle pattern onto the wafer. Step 17 (development) develops the exposed wafer. Step 18 (etching) etches parts other than a developed resist image. Step 19 (resist stripping) removes disused resist after etching. These steps are repeated, and multilayer circuit patterns are formed on the wafer. The device manufacturing method of this embodiment can manufacture higher quality devices than ever. Thus, the device manufacturing method that uses the inventive lithography, and its resultant
(intermediate and final) products also constitute one aspect of the present invention. Such devices include semiconductor chips like an LSI and VLSI, CCDs, LCDs, magnetic sensors, thin film magnetic heads, and the like.
Further, the present invention is not limited to these preferred embodiments, and various modifications and changes may be made in the present invention without departing from the spirit and scope thereof. For example, in FIG. 5, the projection optical system that does not include Field 1 is within a scope of the present invention.
This application claims a foreign priority benefit based on Japanese Patent Application No. 2005-183777, filed on June 23, 2005, which is hereby incorporated by reference herein in its entirety as if fully set forth herein.

Claims

1. A catadioptric projection optical- system configured to form an image of a first object onto a second object, said catadioptric projection optical system comprising: a first imaging optical system configured to form a first intermediate image of the first object; a second imaging optical system configured to form a second intermediate image of the first object based on a light from the first intermediate image; a third imaging optical system configured to form a third intermediate image based on a light from the second intermediate image; a fourth imaging optical system configured to form the image of the first object onto the second object based on a light from the third intermediate image; and a pair of deflecting mirrors provided between the second and third intermediate optical systems.
2. A catadioptric projection optical system according to claim 1, wherein one of said first to fourth imaging optical systems is a dioptric system, and wherein another one of said first to fourth imaging optical systems is a catadioptric system including a concave mirror.
3. A catadioptric projection optical system according to claim 1, wherein said first to fourth imaging optical systems include two pairs of a dioptric system, and a catadioptric system that includes a concave mirror.
4. A catadioptric projection optical system according to claim 1, wherein said first and fourth imaging optical systems include a dioptric system, and said second and third imaging optical systems include a catadioptric system including a concave mirror.
5. A catadioptric projection optical system according to claim 1, further comprising a refractive element between said second and third imaging optical systems.
6. A catadioptric projection optical system according to claim 4, wherein the concave mirrors are not coaxially arranged.
7. A catadioptric projection optical system according to claim 4, wherein one of the concave mirrors is substantially arranged parallel to the first object and the other one of the concave mirrors is substantially arranged parallel to the second object.
8. A catadioptric projection optical system according to claim 1, wherein 0 <β3 β4 • NA< 0.3 is met where β3 is an imaging magnification of said third imaging optical system, β4 is an imaging magnification of said fourth imaging optical system, and NA is an aperture of an overall system.
9. A catadioptric projection optical system according to claim 1, wherein 0. IB < A < 0.9B is met where A is a distance between a light condensing point having an angle of view closest to an optical axis in the second intermediate image and a first deflecting mirror that is a closer one of the pair of deflecting mirrors to the first object along an optical path, and B is an interval between the pair of deflecting mirrors along the optical path.
10. A catadioptric projection optical system according to claim 1, wherein -40° < tel < 40° is met where tel is an angle between a principal ray of an outermost angle of view and an optical axis between the pair of deflecting mirrors.
11. A catadioptric projection optical system configured to form an image of a first object plural times and to serve as an imaging optical system that images the image onto a second object, the first object facing the second object, and a plane of the first object being parallel to a plane of the second object, said catadioptric projection optical system comprising a pair of concave mirrors, one of which opposes to one of the first and second objects, and the other of which opposes to the other of the first and second objects.
12. A catadioptric projection optical system according to claim 11, further comprising a pair of deflecting mirrors, and forming an approximately H-shaped optical path from the first object to the second object.
13. An exposure apparatus comprising: an illumination optical system configured to illuminate a pattern using a light from a light source; and a catadioptric projection optical system according to claim 1, configured to project an image of a pattern onto a plate to be exposed.
14. An exposure apparatus according to claim 13, wherein a liquid is at least partially filled in a space between the plate and a lens closest to the plate in said catadioptric projection optical system.
15. An exposure apparatus comprising: an illumination optical system configured to illuminate a pattern using a light from a light source; and a catadioptric projection optical system according to claim 11, configured to project an image of a pattern onto a plate to be exposed.
16. An exposure apparatus according to claim 15, wherein a liquid is at least partially filled in a space between the plate and a lens closest to the plate in said catadioptric projection optical system.
17. A device manufacturing method comprising the steps of: exposing a plate using an exposure apparatus according to claim 13; and developing the plate that has been exposed.
18. A device manufacturing method comprising the steps of: exposing a plate using an exposure apparatus according to claim 15; and developing the plate that has been exposed.
PCT/JP2006/312205 2005-06-23 2006-06-13 Catadioptric projection optical system, and exposure apparatus having the same WO2006137349A1 (en)

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