WO2006136335A1 - PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2 - Google Patents

PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2 Download PDF

Info

Publication number
WO2006136335A1
WO2006136335A1 PCT/EP2006/005792 EP2006005792W WO2006136335A1 WO 2006136335 A1 WO2006136335 A1 WO 2006136335A1 EP 2006005792 W EP2006005792 W EP 2006005792W WO 2006136335 A1 WO2006136335 A1 WO 2006136335A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
acid
electrodeposition
process according
tio2
Prior art date
Application number
PCT/EP2006/005792
Other languages
English (en)
Inventor
Subbian Karuppuchamy
Naoki Suzuki
Seishiro Ito
Matthias Schweinsberg
Hans Dolhaine
Frank Wiechmann
Christine Schröder
Original Assignee
Henkel Kommanditgesellschaft Auf Aktien
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Kommanditgesellschaft Auf Aktien filed Critical Henkel Kommanditgesellschaft Auf Aktien
Publication of WO2006136335A1 publication Critical patent/WO2006136335A1/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/08Electrolytic coating other than with metals with inorganic materials by cathodic processes

Definitions

  • the present invention relates to a Process for providing a corrosion-protective layer of Ti ⁇ 2 on an electrically conductive substrate by electrodeposition of a electrodeposition material comprising a titanium compound, a complexing agent, water and optionally an accelerator, organic solvents, buffering agents and one or more additives, characterized in that the electrodeposition is carried out under the following conditions:
  • Such Ti ⁇ 2 layer deposited electrochemically may serve as an appropriate primer layer for subsequent coating treatment (e.g. coating with organic materials, such as for instance lacquers, varnishes, paints, organic polymers, adhesives, etc.).
  • organic materials such as for instance lacquers, varnishes, paints, organic polymers, adhesives, etc.
  • the present invention relates to a metal substrate coated with a layer of TiO 2 produced by the process of the invention.
  • the very common industrial task involves providing metallic or non-metallic substrates with a first coating, which has a corrosion-inhibiting effect and/or which constitutes a primer for the application thereon of a subsequent coating containing e.g. organic polymers.
  • An example of such a task is the pre-treatment of metals prior to lacquer coating, for which various processes are available in the art. Examples of such processes are layer-forming or non-layer-forming phosphating, chromating or a chromium-free conversion treatment, for example using complex fluorides of titanium, zirconium, boron or silicon.
  • Technically simpler to perform, but less effective, is the simple application of a primer coat to a metal prior to lacquer-coating thereof. An example of this is the application of red lead.
  • a layer produced or applied in this way may serve as a corrosion-protective primer for subsequent lacquer coating.
  • the layer may also constitute a primer for subsequent bonding.
  • Metallic substrates in particular, but also substrates of plastics or glass, are frequently pre-treated chemically or mechanically prior to bonding in order to improve adhesion of the adhesive to the substrate.
  • metal or plastics components may be bonded metal to metal, plastics to plastics or metal to plastics.
  • front and rear windscreens of vehicles are as a rule bonded directly into the bodywork.
  • Other examples of the use of coupling layers are to be found in the production of rubber/metal composites, in which once again the metal substrate is as a rule pre- treated mechanically or chemically before a coupling layer is applied for the purpose of bonding with rubber.
  • the conventional wet or dry coating processes in each case exhibit particular disadvantages.
  • chromating processes are disadvantageous from both an environmental and an economic point of view owing to the toxic properties of the chromium and the occurrence of highly toxic sludge.
  • chromium- free wet processes such as phosphating, as a rule, also result in the production of sludge containing heavy metals, which has to be disposed of at some expense.
  • Another disadvantage of conventional wet coating processes is the actual coating stage frequently has to be preceded or followed by further stages, thereby increasing the amount of space required for the treatment line and the consumption of chemicals.
  • phosphating which is used virtually exclusively in automobile construction, entails serveral cleaning stages, an activation stage and generally a post-passivation stage. In all these stages, chemicals are consumed and waste is produced which has to be disposed of.
  • dry coating processes entail fewer waste problems, they have the disadvantage of being technically complex to perform (for example requiring a vacuum) or of having high energy requirements. The high operating costs of these processes are therefore a consequence principally of plant costs and energy consumption.
  • thin layers of metals compounds may be produced electrochemically on an electrically conductive substrate.
  • metals compounds for example oxide layers
  • an electrically conductive substrate for example, the articel by Y. Zhou and J. A. Switzer entitled ..Electrochemical Deposition and Microstructure of Copper (I) Oxide Films", Scripta Materialia, Vol. 38, No. 11 , pages 1731 to 1738 (1998), describes the electrochemical deposition and microstructure of copper (I) oxide films on stainless steel.
  • the article investigates above all the influence of deposition conditions on the morphology of the oxide layers; it does not disclose any practical application of the layers.
  • TiO 2 - layers are obtained on a Ti-sheet from H 2 SO 4 aqueous solution by anodic oxidation method. This is obtained at potentials below 50 V. However, this process can produce TiO 2 only on Ti-substrates by anodic oxidation.
  • TiO 2 is obtained on a Ti-sheet from an aqueous solution containing 0.5 mol/L H 2 SO 4 and 0.03 mol/L HNO 3 by anodic oxidation method (titanium anodization). Constant current is 1 mA/cm 2 . The oxidation is performed in a cooled bath of 278 K to 283 K. However, this process can produce TiO 2 only on a Ti-substrate by anodic oxidation.
  • EP 1 285 105 B1 discloses a process for producing a coating comprising at least two layers on an electrically conductive surface wherein in a first stage a chromium-free layer of at least one X-ray crystalline inorganic compound of at least one metal is electrochemically deposited of an electrically conductive surface from a solution containing the metal in dissolved form. Besides many other metals titanium is disclosed.
  • corrosion-protective layers of TiO 2 are electrochemically deposited on a metal substrate from an electrodeposition material comprising titanyl sulfate or titanyl oxalate as titanium component, citrate or citric acid, tatric acid and tartrates, lactid acid and lactates as chelating agents and hydroxylamines and their derivates or nitrates as accelerators.
  • this object can be achieved by the use of a special combination of process parameters during the electrodeposition.
  • Subject-matter of the present invention therefore is a process for providing a corrosion-protective layer of TiO 2 on an electrically conductive substrate by electrodeposition of a electrodeposition material comprising a titanium compound, a complexing agent, water and optionally an accelerator, organic solvents, buffering agents and one or more additives, characterized in that the electrodeposition is carried out under the following conditions:
  • the electroconductive substrate is selected from the group consisting of steel, especially cold rolled steel and galvanized steel, and aluminium.
  • the TiO 2 layer preferably is deposited on the electrically conductive substrate with an essentially uniform layer thickness, calculated as weight per unit area, in the range of 0.01-3.5 g/m 2 , more preferably in the range of from 0.5-1.4 g/m 2 .
  • the titanium compound is titanyl sulfate and/or titanyl oxalate (Kaliumoxalatotitanat)
  • the complexing agent is selected from the group consisting of citric acid, citrates, tatric acid, tartrates, lactid acid, lactates, gluconic acid, gluconates, polyhydroxy-polycarbonic acids, ethylenediaminetetraacetate, methylglycinediacetate, iminodisuccinate, nitrilotriacetic acid and nitrilotriacetate, triethanolamine, phosphonic acid, poly- asparaginic acid and poly-acrylic acid and the accelerator is selected from the group consisting of hydroxylamines and their derivates, nitrates, H 2 O 2 and organic peroxides.
  • the electrodeposition material preferably comprises 0,05 to 0,3 mol/l titanium compound, 0,01 to 0,2 mol/l complexing agent and 0,02 to 0,2 mol/l accelerator.
  • the pH of the electrodeposition material preferably is 5 to 10, more preferably 6 to 9, most preferably 7,5 to 8,0.
  • the electrodeposition material preferably comprises a polymeric cationic binder in addition to the components specified above.
  • cationic binder all electrodepositabel resins known in the art may be used.
  • cationic film-forming resins include amine salt group-containing resins such as the acid-solubilized reaction products of polyepoxides and primary or secondary amines. Usually, these amin salt group-containing resins are used in combination with a blocked isocyanate curing agent.
  • quaternary ammonium salt group-containing resins can also be employed. Examples of these resins are those which are formed from reacting an organic polyepoxide with a tertiary amin salt.
  • film-forming resins which cure via transesterification can be used.
  • cationic compositions prepared from Mannich bases can be used. From an electrodeposition material comprising the components of the present invention combined with a polymeric cationic binder a layer Of TiO 2 and a resinous layer can be deposited simultaneously.
  • the electrodeposition material of the present invention comprises the polymeric cationic binder in an amount of 5 to 60 % by weight based on the total weight of the electrodeposition material.
  • the present invention further relates to a metal substrate coated with a layer of TiO 2 produced by the process of the present invention.
  • the titanium compound was dissolved in deionized water (accelerated by heating to 30 to 50 0 C)
  • the Complexing Agent was added.
  • the pH was adjusted by the addition of KOH (0,5 to 1 ,5 mol/L) at a temperature of 45 to 60 0 C

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)

Abstract

La présente invention concerne un procédé servant à produire une couche de protection contre la corrosion en TiO2 sur un substrat électriquement conducteur par électrodéposition d'une matière d'électrodéposition comprenant un composé du titane, un agent complexant, de l'eau et facultativement un accélérateur, des solvants organiques, des agents tampons et un ou plusieurs additifs, caractérisé en ce qu'on effectue l'électrodéposition dans les conditions suivantes : densité de courant : 0,01 à 100, de préférence 0,1 à 20, de façon plus particulièrement préférable 0,5 à 10 mA/cm2, durée du dépôt : 0,15 à 20, de préférence 0,5 à 10, de façon plus particulièrement préférable 1 à 4 minutes, température : 0 à 100, de préférence 20 à 60°C, pH : 5 à 10, de préférence 6 à 9, de façon plus particulièrement préférable 7,5 à 8,0. L'invention concerne en plus un substrat en métal recouvert d'une couche de TiO2 produite par le procédé de l'invention.
PCT/EP2006/005792 2005-06-22 2006-06-16 PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2 WO2006136335A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05013423 2005-06-22
EP05013423.8 2005-06-22

Publications (1)

Publication Number Publication Date
WO2006136335A1 true WO2006136335A1 (fr) 2006-12-28

Family

ID=36829775

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/005792 WO2006136335A1 (fr) 2005-06-22 2006-06-16 PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2

Country Status (1)

Country Link
WO (1) WO2006136335A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106757249A (zh) * 2016-12-15 2017-05-31 河海大学常州校区 一种阴极表面纳秒脉冲电场制备纳米薄膜的溶液及制备方法
US9859038B2 (en) 2012-08-10 2018-01-02 General Cable Technologies Corporation Surface modified overhead conductor
US10246791B2 (en) 2014-09-23 2019-04-02 General Cable Technologies Corporation Electrodeposition mediums for formation of protective coatings electrochemically deposited on metal substrates
US10726975B2 (en) 2015-07-21 2020-07-28 General Cable Technologies Corporation Electrical accessories for power transmission systems and methods for preparing such electrical accessories
US10957468B2 (en) 2013-02-26 2021-03-23 General Cable Technologies Corporation Coated overhead conductors and methods
WO2023141281A1 (fr) * 2022-01-21 2023-07-27 Meta Platforms Technologies, Llc Commande de microstructure de sol-gel ayant des capacités de remplissage de caractéristiques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864224A (en) * 1971-04-28 1975-02-04 Imp Metal Ind Hynoch Limited Preparation of oxides
JPH11158691A (ja) * 1997-11-25 1999-06-15 Murata Mfg Co Ltd チタン酸化物被膜作製用水溶液、およびチタン酸化物被膜の製造方法
DE10022074A1 (de) * 2000-05-06 2001-11-08 Henkel Kgaa Elektrochemisch erzeugte Schichten zum Korrosionsschutz oder als Haftgrund
EP1548157A1 (fr) * 2003-12-22 2005-06-29 Henkel KGaA Protection contre la corrosion par des couches d'oxide de métal électrochimiquement déposées sur des substrats métalliques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3864224A (en) * 1971-04-28 1975-02-04 Imp Metal Ind Hynoch Limited Preparation of oxides
JPH11158691A (ja) * 1997-11-25 1999-06-15 Murata Mfg Co Ltd チタン酸化物被膜作製用水溶液、およびチタン酸化物被膜の製造方法
DE10022074A1 (de) * 2000-05-06 2001-11-08 Henkel Kgaa Elektrochemisch erzeugte Schichten zum Korrosionsschutz oder als Haftgrund
EP1548157A1 (fr) * 2003-12-22 2005-06-29 Henkel KGaA Protection contre la corrosion par des couches d'oxide de métal électrochimiquement déposées sur des substrats métalliques

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE JPTO 2000, "http://dossier1.ipdl.ncipi.go.jp/AIPN/aipn_call_transl.ipdl?N0000=7413&N0120=01&N2001=2&N3001=H11-158691" *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9859038B2 (en) 2012-08-10 2018-01-02 General Cable Technologies Corporation Surface modified overhead conductor
US10586633B2 (en) 2012-08-10 2020-03-10 General Cable Technologies Corporation Surface modified overhead conductor
US10957468B2 (en) 2013-02-26 2021-03-23 General Cable Technologies Corporation Coated overhead conductors and methods
US10246791B2 (en) 2014-09-23 2019-04-02 General Cable Technologies Corporation Electrodeposition mediums for formation of protective coatings electrochemically deposited on metal substrates
US10726975B2 (en) 2015-07-21 2020-07-28 General Cable Technologies Corporation Electrical accessories for power transmission systems and methods for preparing such electrical accessories
CN106757249A (zh) * 2016-12-15 2017-05-31 河海大学常州校区 一种阴极表面纳秒脉冲电场制备纳米薄膜的溶液及制备方法
CN106757249B (zh) * 2016-12-15 2019-01-15 河海大学常州校区 一种阴极表面纳秒脉冲电场制备纳米薄膜的溶液及制备方法
WO2023141281A1 (fr) * 2022-01-21 2023-07-27 Meta Platforms Technologies, Llc Commande de microstructure de sol-gel ayant des capacités de remplissage de caractéristiques

Similar Documents

Publication Publication Date Title
US20080210567A1 (en) Electrodeposition Material, Process for Providing a Corrosion-Protective Layer of TiO2 on an Electrically Conductive Substrate and Metal Substrate Coated with a Layer of TiO2
JP3221882B2 (ja) 防蝕性のある接着性良好なラッカー被膜の簡易化製造法およびそれによりえられる工作物
JP3883831B2 (ja) 耐白錆性に優れた表面処理鋼板及びその製造方法
US20090162563A1 (en) Electrochemically produced layers for corrosion protection or as a primer
WO2010001861A1 (fr) Liquide de conversion chimique pour structure métallique et procédé de traitement de surface
US20070148479A1 (en) Corrosion-protection by electrochemical deposition of metal oxide layers on metal substrates
AU2013309270B2 (en) Zirconium pretreatment compositions containing molybdenum, associated methods for treating metal substrates, and related coated metal substrates
EP2971234B1 (fr) Procédé de préparation et de traitement d'un substrat d'acier
JP2010090407A (ja) 金属表面処理液、および金属表面処理方法
US10113070B2 (en) Pretreatment compositions and methods of treating a substrate
AU2013309269B2 (en) Zirconium pretreatment compositions containing lithium, associated methods for treating metal substrates, and related coated metal substrates
WO2006136335A1 (fr) PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2
JP3139795B2 (ja) 複合皮膜形成用金属表面処理剤
KR100775109B1 (ko) 내식성이 우수하고 환경 부하가 작은 도장 금속판
WO2006136334A2 (fr) Materiau de depot electrolytique, procede permettant de former une couche anticorrosion de tio2 sur un substrat electroconducteur et substrat metallique recouvert d'une couche de tio2
WO2005056883A1 (fr) Revetement electrolytique d'alliage de zinc presentant une excellente resistance a la corrosion et materiau metallique plaque comprenant ce dernier
JP2886615B2 (ja) リン酸亜鉛処理性に優れる表面を有するアルミニウム合金材料
JPH057477B2 (fr)
JPH0219474A (ja) 耐食性に優れた防錆鋼板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06754400

Country of ref document: EP

Kind code of ref document: A1