WO2006123911A1 - Boitier pour diode electroluminescente comportant une plaque unifiee de dissipation de chaleur et module a boitiers multiples - Google Patents

Boitier pour diode electroluminescente comportant une plaque unifiee de dissipation de chaleur et module a boitiers multiples Download PDF

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Publication number
WO2006123911A1
WO2006123911A1 PCT/KR2006/001878 KR2006001878W WO2006123911A1 WO 2006123911 A1 WO2006123911 A1 WO 2006123911A1 KR 2006001878 W KR2006001878 W KR 2006001878W WO 2006123911 A1 WO2006123911 A1 WO 2006123911A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
heat sink
sink plate
bonding pad
Prior art date
Application number
PCT/KR2006/001878
Other languages
English (en)
Inventor
Chan-Ik Park
Original Assignee
Luxpia Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luxpia Co., Ltd. filed Critical Luxpia Co., Ltd.
Publication of WO2006123911A1 publication Critical patent/WO2006123911A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light emitting diode package and a multi-package module, and more particularly, to a light emitting diode package in which a heat sink plate having a large area that protrudes and extends to an outside of a package insulating body is integrated into a chip bonding pad, so as to effectively dissipate operating heat of a light emitting diode chip, and a multi-light emitting diode package module in which a plurality of packages are arranged on a unified heat sink plate.
  • FIG. 1 illustrates an example of a conventional high-output light emitting diode package 10.
  • the light emitting diode package 10 includes a heat sink plate 20 on which a light emitting diode chip 13 is to be mounted and which dissipates operating heat of the light emitting diode chip 13, and a lead 17 which is electrically connected to the light emitting diode chip 13 via a wire bonding 14 and extends to a package external terminal.
  • the lead 17 and the heat sink plate 20 are fixed by an insulating body 22, and a reflective cup 24 for condensing light emitted from the light emitting diode chip 13 and a transparent light emitting window 26 through which light passes while protecting the light emitting diode chip 13 are provided in the insulating body 22.
  • the heat sink plate 20 is a heat sink having an exposed bottom surface. Heat is emitted to a bottom surface of a package via the heat sink.
  • This structure is a structure in which a lead frame is pre-formed while a space for inserting a heat sink plate is left. If the heat sink plate is inserted into the pre-formed lead frame, the structure has physical vulnerability such as moisture-absorption and exfoliation. Also, the heat sink plate should be separately manufactured and thus, productivity is lowered. In addition, heat dissipation is limited to an exposed portion of the bottom surface of the package via the heat sink plate 20. Thus, a heat diffusion and dissipation effect is lowered and a heat dissipation efficiency is low.
  • the performance and life span of a light emitting diode chip depends on a heat dissipation performance.
  • One of reasons that the use of a light emitting diode has increased instead of other light sources is that the life span of the light emitting diode is longer than other light sources.
  • about 80% of consumed power is consumed by heat.
  • the performance and life span of the light emitting diode are degraded.
  • the surface temperature of the light emitting diode chip exceeds 120 0 C , a normal life span of the light emitting diode cannot be guaranteed.
  • the heat sink plate is unified with the package and an additional heat sink plate is further attached so that the heat dissipation performance of the package can be improved.
  • the large-capacity heat sink plate In order to separately install the large-capacity heat sink plate, an installation space larger than the size of a separate package is needed.
  • the large-capacity heat sink plate may be provided for a high heat dissipation.
  • the heat sink plate is unified with the light emitting diode package, there are difficulties in realizing technology in various fields such as moisture-absorption, structural reliability, reproducibility, mass productivity, and economical efficiency.
  • FIG. 2 illustrates a structure in which a smaller heat sink plate 32 than an insulating body 30 is provided and a package is attached to a heat dissipation printed circuit board (PCB) so as to support heat dissipation.
  • PCB printed circuit board
  • a heat conduction path from a light emitting diode is shown in FIG. 2.
  • a light emitting diode chip 37 is mounted on the heat sink plate 32 and a lead terminal 40 that is electrically connected to the light emitting diode chip 37 extends via a side surface of the insulating body 30 and is exposed.
  • a light emitting diode package is mounted on a heat dissipation printed circuit board (PCB) 33 in which a metal plate 35 is attached to a lower portion of the thin PCB 33 by an insulating adhesive material 34.
  • PCB printed circuit board
  • a heat dissipation path is limited and an adhesive material having a comparatively high thermal resistance on the heat conduction path is inserted such that a heat dissipation efficiency is lowered.
  • FIGS. 3 A, 3B, and 3C illustrate a conventional light emitting diode package having an improved heat dissipation performance by introducing a heat sink plate structure in a conventional package for a power device.
  • a heat sink plate 53 unified with the package extends to an outside of a insulating body 50 of the package.
  • Unexplained reference numeral 55 denotes a lead terminal electrically connected to a chip.
  • the heat sink plate 53 does not occupy the entire width of one side surface 50a of a rectangular package but is limited to a portion thereof and thus, there is a limitation in performing sufficient heat dissipation.
  • the present invention provides a light emitting diode package in which
  • emitting diode package comprising: a chip bonding pad on which a light emitting diode chip is to be mounted; at least one lead electrically connected to the light emitting diode chip and insulated from the chip bonding pad; an insulation body formed around the chip bonding pad, fixing the lead and having a light emitting window through which light emitted from the light emitting diode chip passes; a heat sink plate integrated into the chip bonding pad, protruding from an outside of the insulation body and dissipating operating heat of the light emitting diode chip; and a plurality of division holes which are formed between the chip bonding pad and the heat sink plate and have a stepped shape and into which a resin is injected when the insulation body is formed, wherein the heat sink plate occupies more than a fourth part of the entire outer circumference of the insulation body.
  • the insulation body may have a circular shape.
  • the division holes that are closer to the insulation body may have a smaller
  • emitting diode package comprising: a chip bonding pad on which a light emitting diode chip is to be mounted; at least one lead electrically connected to the light emitting diode chip and insulated from the chip bonding pad; an insulation body formed around the chip bonding pad, fixing the lead and having a light emitting window through which light emitted from the light emitting diode chip passes; a heat sink plate integrated into the chip bonding pad, protruding from an outside of the insulation body and dissipating operating heat of the light emitting diode chip; and a plurality of division holes which are formed between the chip bonding pad and the heat sink plate and have a stepped shape and into which a resin is injected when the insulation body is formed, wherein the insulation body has a rectangular shape and the heat sink plate occupies at least one side surface of a rectangular circumference of the insulation body.
  • the lead may form a bottom surface having the same level as the chip bonding pad and the heat sink plate.
  • the heat sink plate may comprise a plurality of through holes so as to increase a heat dissipation area and to easily perform soldering.
  • the insulation body may be formed in a center of the heat sink plate or may be formed to be eccentric with the heat sink plate.
  • the heat sink plate may have a rectangular shape and the insulation body may be formed at an edge or a corner of the heat sink plate.
  • a multi-light emitting diode package module comprising: a large-area heat sink plate dissipating operating heat of a light emitting diode chip; and a plurality of light emitting diode packages arranged on the heat sink plate to be separated from one another by a predetermined distance, wherein each of the light emitting diode packages comprises: a chip bonding pad which is integrated into the heat sink plate and which is separated from the heat sink plate by zones by a plurality of division holes having a stepped shape and on which the light emitting diode chip is to be mounted; at least one lead electrically connected to the light emitting diode chip and insulated from the chip bonding pad; and an insulation body formed around the chip bonding pad, fixing the lead and having a light emitting window through which light emitted from the light emitting diode chip pass.
  • a heat sink plate is formed to have a large area as possible so as to maximize a heat dissipation performance. This is because the heat sink plate and a chip bonding pad are formed in a single unit and an insulation body is formed thereon and a plurality of stepped division holes are formed so as to be strongly combined with the insulation body so that exfoliation with the insulation body formed thereon can be prevented. Furthermore, a plurality of light emitting diode packages are arranged on one large- area heat sink plate and can be modularized.
  • a large- capacity heat sink plate is provided such that the life span of a light emitting diode is increased, the light emitting diode package is safely and effectively used in malfunction caused by heat dissipation and a heat dissipation system need not to be added and a process of attaching an additional heat sink plate and a material used in the process are reduced.
  • FIG. 1 illustrates a conventional light emitting diode package
  • FIG. 2 illustrates a heat conduction path in a structure in which the conventional Hg ht emitting diode package is mounted on a heat dissipation printed circuit board (PCB);
  • PCB heat dissipation printed circuit board
  • FIG. 3A illustrates a conventional light emitting diode package having a heat sink plate
  • FIG. 3B is a cross-sectional view of FIG. 3A
  • FIG. 3C is a bottom surface view of FIG. 3A;
  • FIG. 4A is a plane view of a lead frame of a light emitting diode package according to an embodiment of the present invention.
  • FIG. 4B is a bottom surface view of FIG. 4A;
  • FIG. 4C is a cross-sectional view taken along line A-A of FIG. 4A;
  • FIG. 5 A is a plane view of a light emitting diode package according to an embodiment of the present invention.
  • FIG. 5B is a bottom surface view of FIG. 5A;
  • FIG. 5C is a cross-sectional view taken along line B-B of FIG. 5A;
  • FIG. 6 illustrates the case where an insulating body is formed in a rectangular shape, in the light emitting diode package illustrated in FIG. 5A;
  • FIG. 7A is a plane view of a lead frame of a light emitting diode package according to another embodiment of the present invention.
  • FIG. 7B is a bottom surface view of FIG. 7A;
  • FIG. 8 is a cross-sectional view taken along line C-C of FIG. 7A;
  • FIG. 9A is a plane view of a light emitting diode package according to another embodiment of the present invention.
  • FIG. 9B is a bottom surface view of FIG. 9A;
  • FIG. 10 is a cross-sectional view taken along line D-D of FIG. 9A;
  • FIG. 11 is a layout view of the light emitting diode package illustrated in FIG. 9 A in which adjacent light emitting diode chips are close to one another;
  • FIG. 12A is a plane view of a multi-light emitting diode package module according to an embodiment of the present invention.
  • FIG. 12B is a bottom surface view of FIG. 12A;
  • FIG. 13A illustrates another modified example of the multi- light emitting diode package module illustrated in FIG. 12A;
  • FIG. 13B is a bottom surface view of FIG. 13 A.
  • FIG. 14 illustrates the case where a light emitting diode package is mounted on a printed circuit board (PCB).
  • PCB printed circuit board
  • a heat sink plate for dissipating heat generated from a light emitting diode chip is integrated into a chip bonding pad on which the light emitting diode chip is to be mounted and is exposed to an outside of an insulating body.
  • FIG. 4A is a plane view of a lead frame 100 of a light emitting diode package according to an embodiment of the present invention
  • FIG. 4B is a bottom surface view of FIG. 4A.
  • the lead frame 100 includes a plurality of unit lead frames 110.
  • the lead frame 100 is cut along a portion indicated by a cut line L and thus is individualized into the unit lead frames 110.
  • the unit lead frames 110 include a chip bonding pad 112 on which a light emitting diode chip that will be described later is to be mounted, a heat sink plate 120 formed with the chip bonding pad 112 in a single unit and partitioned off by a plurality of division holes 118 from the chip bonding pad 112, and a lead 116 that is insulated from the chip bonding pad 112 and the heat sink plate 120 by an insulation hole 114 and is electrically connected to the light emitting diode chip.
  • the heat sink plate 120 is formed around the chip bonding pad 112 so as not to contact the lead 116 and has a relatively larger area compared to the chip bonding pad 112.
  • the heat sink plate 120 can be manufactured in various shapes.
  • the chip bonding pad 112 may be located in the center of the heat sink plate 120 or to be eccentric with the heat sink plate 120.
  • the heat sink plate 120 has a plurality of through holes 122 so as to improve a heat dissipation effect by increasing a surface area for heat dissipation and has a combination hole 124 used in combining the package with another structure.
  • the lead 116 is electrically connected to one electrode of the light emitting diode chip by a bonding wire.
  • the chip bonding pad 112 and the heat sink plate 120 are electrically connected to the other electrode of the light emitting diode chip and supply power required for driving the light emitting diode chip.
  • only one lead is formed but the present invention is not limited to this and a plurality of leads may be provided.
  • connection portion 119 disposed between the insulation hole 114 and the division hole 118 connects the chip bonding pad 112 and the heat sink plate 120.
  • the connection portion 119 minimizes a moisture-absorption path between the heat sink plate 120, the chip bonding pad 112 and an insulation body that will be described later and exfoliation.
  • the connection portion 119 is formed in several portions around the chip bonding pad 112. That is, the connection portion 119 is formed in at least two portions in the insulation hole 114 and the division hole 118 so that the heat sink plate 120 can be stably fixed.
  • heat transmitted from the chip bonding pad 112 can be more effectively transmitted to the heat sink plate 120 via the connection portion 119.
  • connection portion 119 having a small width is formed in several portions around the chip bonding pad 112 so that reliability for a decrease of exfoliation and moisture-absorption can be increased and a bottleneck situation during heat dissipation can be alleviated.
  • the division hole 118 includes a portion 118a having a smaller width (hereinafter, referred to as a relatively narrower portion) disposed on an upper side on which the light emitting diode chip is to be mounted, and a portion 118b having a larger width (hereinafter, referred to as a relatively wider portion) disposed on a lower side.
  • the division hole 118 is formed in a stepped shape.
  • the insulation hole 114 also includes a portion 114a having a smaller width disposed on an upper side of the insulation hole 114 and a portion 114b having a larger width disposed on a lower side of the installation hole 114.
  • the portion 114b of the insulation hole 114 and the portion 118b of the division hole 118 each having a larger width are connected to each other.
  • a plastic resin for insulation body molding is connected by the portions 114b and 118b, and thus the insulation body can be more strongly combined with the heat sink plate 120.
  • FIG. 5A is a plane view of a light emitting diode package in which a plastic resin is injected into the insulation hole 114 and the division hole 118 and an insulation body 130 is formed around the chip bonding pad 112
  • FIG. 5B is a bottom surface view of FIG. 5A
  • FIG. 5C is a cross-sectional view taken along line B-B of FIG. 5A.
  • the insulation body 130 surrounds the chip bonding pad 112 and a light emitting diode chip 115 is mounted on the chip bonding pad 112.
  • the light emitting diode chip 115 may be directly mounted on the chip bonding pad 112 or may be attached to a submount (not shown).
  • the insulation hole 114 and the division hole 118 are formed in a stepped shape so that the moisture-absorption path formed between the insulation body 130 and the chip bonding pad 112 extends and is complicated. Thus, moisture inflow from the outside can be effectively prevented.
  • the insulation body 130 can be more strongly combined with the chip bonding pad 112 and the heat sink plate 120 through the relatively narrower portions 114a and 118a and the relatively wider portions 114b and 118b.
  • the lead frame 110 may be thicker than 0.2-0.25 mm which is a thickness of a general lead frame. That is, the lead frame 110 may be formed to a thickness of about more than 0.4 mm, 0.5 mm, or 0.76 mm.
  • the insulation body 130 is formed around the chip bonding pad 112.
  • the insulation body 130 fixes the lead 116 and has a cavity 140 in its center.
  • the cavity 140 is used to reflect and condense light emitted from the light emitting diode chip 115 and a light emitting window 143 filled with a transparent material is formed inside the cavity 140.
  • the light emitting window 143 protects the light emitting diode chip 115 and allows light emitted from the light emitting diode chip 135 to pass and to be radiated to the outside.
  • the heat sink plate 120 extends to and protrudes from the outside of the insulation body 130.
  • the heat sink plate 120 is integrated into the chip bonding pad 112 and the insulation body 130 and the heat sink plate 120 are combined with each other through the stepped division hole 118 so that the possibility of moisture-absorption or exfoliation can be remarkably reduced.
  • the heat sink plate 120 can extend to the circumference of the insulation body 130. Referring to FIG. 5 A, when the insulation body 130 has a circular shape, the heat sink plate 120 extends to the entire circumference of the insulation body 130. In this way, the heat sink plate 120 can be formed over the entire circumference of the insulation body 130.
  • the heat sink plate 120 does not extend to the entire circumference of the insulation body 130, a contact surface between the insulation body 130 and the heat sink plate 120 can be adjusted in consideration of a proper heat dissipation performance compared to the entire size of the package.
  • the heat sink plate 120 may extend to occupy more than a fourth part of the entire circumference of the insulation body 130 so as to guarantee the heat dissipation performance.
  • the heat sink plate 120 is formed to have a size that occupies more than at least one side surface of the insulation body 130.
  • FIG. 6 illustrates the case where an insulation body 130' is deformed in a rectangular shape from a circular shape in the package illustrated in FIG. 5 A.
  • the case where the heat sink plate 120 is formed over the entire circumference of the insulation body 130' having a rectangular shape is shown.
  • the heat sink plate may be formed to have at least one side surface of the insulation body having a rectangular shape.
  • the heat sink plate can be formed to occupy at least one side surface of the insulation body having a rectangular shape, a problem related to heat dissipation of a high-output light emitting diode package can be solved.
  • the light emitting diode chip 115 is electrically connected to the lead 116 via the wire bonding 117, and the lead 116 forms a bottom surface having the same level as the chip bonding pad 112 and the heat sink plate 120.
  • the lead 116 is formed from the chip bonding pad 112, the heat sink plate 120, and one unit lead frame 110 and may form a bottom surface having the same level as the chip bonding pad 112 and the heat sink plate 120 without the necessity of mechanical folding.
  • FIG. 7A is a plane view of a lead frame 200 of a light emitting diode package.
  • FIG. 7B is a bottom surface view of FIG. 7A.
  • the lead frame 200 includes unit lead frames 210 and is cut along a cut line L, thereby being separated by the unit lead frames 210.
  • the chip bonding pad 212 and the heat sink plate 220 are formed in a single unit. At this time, the chip bonding pad 212 is eccentric with the heat sink plate 220.
  • the chip bonding pad 212 may be eccentric with one side surface of the heat sink plate 220 or may be placed at an edge thereof.
  • FIGS. 7A and 7B illustrate the case where the heat sink plate 220 has a rectangular shape and the chip bonding pad 212 is placed at a corner of the heat sink plate 220 having a rectangular shape.
  • a plurality of through holes 222 are formed in the heat sink plate 220 so as to increase a heat dissipation area, and a combination hole 224 is formed in the heat sink plate 220 for combination with another structure.
  • the chip bonding pad 212 and the heat sink plate 220 are separated from each other by zones by a plurality of division holes 218, and a lead 216 that is electrically insulated from the chip bonding pad 212 and the heat sink plate 220 by an insulation hole 214 is provided.
  • the insulation hole 214 and the division holes 218 include relatively narrower portions 214a and 218a and relatively wider portions 214b and 218b.
  • FIG. 9A is a plane view of a light emitting diode package in which a plastic resin is injected through the insulation hole 214 and the division holes 218 and the insulation body 230 is formed
  • FIG. 9B is a bottom surface view of FIG. 9A
  • FIG. 10 is a cross-sectional view taken along line D-D of FIG. 9A.
  • the insulation body 230 surrounds the chip bonding pad 212, a cavity 240 is formed in the center of the insulation body 230, and a light emitting diode chip 215 is mounted inside the cavity 240.
  • the light emitting diode chip 215 is electrically connected to the lead 216 via the wire bonding 217, and a light emitting window 243 through which light emitted from the light emitting diode chip 215 passes and is emitted to the outside is formed.
  • a first light emitting diode package 250R for emitting red light, a second light emitting diode package 250G for emitting first green light, a third light emitting diode package 250G for emitting second green light, and a fourth light emitting diode package 250B for emitting blue light are arranged so that each light emitting chip is located in the center.
  • Each chip for emitting light having different wavelengths are arranged to be adjacent to one another to be advantageous for color mixture, and each heat sink plate is directed towards the outside so that heat dissipation can be effectively performed.
  • a chip bonding pad 312 on which a light emitting diode chip 315 is to be mounted is formed on a heat sink plate 320 having a large area at predetermined intervals, and first and second leads 316a and 316b for being electrically connected to the light emitting diode chip 315 and supplying power thereto are formed to be insulated from the chip bonding pad 312 and the heat sink plate 320.
  • An insulation body 330 is formed of a plastic resin around the chip bonding pad
  • FIG. 12B illustrates a bottom surface of the multi-light emitting diode package module of FIG. 12A.
  • the heat sink plate 320 and the chip bonding pad 312 are formed in a single unit and are separated from each other by zones by a plurality of division holes 318.
  • the first and second leads 316a and 316b are electrically insulated from the heat sink plate 320 and the chip bonding pad 312 by an insulation hole 314.
  • the first and second leads 316a and 316b are electrically connected to an anode and a cathode of the light emitting diode chip 315 via a wire bonding 317.
  • the leads 316a and 316b placed at the anode and the cathode of the light emitting diode chip 315 extend to one side surface of the module, it is suitable for mounting the module on its side.
  • the chip bonding pad and the heat sink plate are insulated from a lead terminal connected to the two electrodes of the light emitting diode chip and do not have electrical polarity.
  • the first and second leads 316a and 316b may be formed from one lead frame together with the chip bonding pad 312 and the heat sink plate 320.
  • the first and second leads 316a and 316b may be formed so that their bottom surface has the same level as the chip bonding pad 312 and the heat sink plate 320 without the need of mechanical folding.
  • a plurality of through holes 322 are formed in the heat sink plate 320 so that an exhaust surface and a solder surface are increased, soldering quality is improved, a heat dissipation surface area is increased and a heat dissipation effect is improved.
  • Reference numeral 324 denotes a combination hole.
  • a plurality of light emitting diode packages are arranged on one large-area heat sink plate 320 so that a space between packages is used as a heat dissipation space and a heat dissipation effect is improved. Furthermore, the multi-light emitting diode package is modulated so that productivity can be increased and the multi-light emitting diode package can be conveniently used.
  • the chip bonding pad and the heat sink plate are formed in a single unit and a plurality of division holes through which combination with the insulation body can be strongly performed so that an area for installing the heat sink plate need not to be limited due to moisture-absorption and exfoliation.
  • the module can be configured by arranging a plurality of chip packages are arranged on one large-area heat sink plate.
  • a plurality of chips for emitting light having different wavelengths are properly arranged so that color can be implemented.
  • a red light emitting diode package for emitting red light a green light emitting diode package for emitting green light, and a blue light emitting diode package for emitting blue light are sequentially and repeatedly arranged, or a red light emitting diode package, a first green light emitting diode package, a second light emitting diode package, and a blue light emitting diode package are sequentially and repeatedly arranged.
  • the first and second green light emitting diodes may be configured by chips having the same wavelength or chips having different wavelengths.
  • Light-weight, thin, short and small-size are important in a general semiconductor package.
  • a light emitting diode device does not output an electrical signal but outputs light and thus is used in illumination systems or backlights for a large-scale LCD having a relatively larger installation space compared to electronic products for emphasizing small-size.
  • solving of heat dissipation problems is further emphasized than light-weight, thin, short and small-size so that the package module according to the present invention can be usefully used in the light emitting diode device.
  • FIGS. 13A and 13B illustrate another modified example of the multi-light emitting diode package module illustrated in FIG. 12A.
  • a chip boding pad 412 on which a light emitting diode chip 415 is to be mounted is formed on a heat sink plate 420 having a large area at predetermined intervals, and first and second leads 416a and 416b are formed to be insulated from the chip bonding pad 412 and the heat sink plate 420 in the state where the chip bonding pad 412 is placed therebetween.
  • An insulation body 430 is formed of a plastic resin around the chip boding pad 412.
  • a plurality of through holes 422 and a combination hole 424 are formed in the heat sink plate 420.
  • the package module illustrated in FIGS. 13A and 13B are different from the package module illustrated in FIGS. 12A and 12B in the construction of first and second leads.
  • an insulation hole and division holes respectively include relatively narrower portions and relatively wider portions, as illustrated in FIG. 4.
  • a combination area of the insulation body and the chip bonding pad and the heat sink plate is increased so that a combination force can be increased and structural reliability of moisture-absorption and exfoliation can be improved.
  • the chip bonding pad and the heat sink plate are formed in a single unit so that a heat dissipation problem can be solved, and a plurality of light emitting diode packages are arranged on one large-area heat sink plate and thus can be modularized.
  • FIG. 14 illustrates the case where a light emitting diode package 450 is mounted on a printed circuit board (PCB) 460.
  • a path E on which operating heat of the light emitting diode chip 455 is conducted and is emitted is shown in FIG. 14.
  • the chip bonding pad, the large-area heat sink plate and the bottom surface of the lead are directly soldered on the PCB 460 and a PCB in which a copper plate is stacked on both sides of a resin is used as the PCB 460.
  • an expensive heat dissipation PCB is used for heat dissipation.
  • a general PCB having a copper plate-stacked structure may be used as the PCB 460.
  • the heat dissipation PCB is formed by attaching a thin PCB on an aluminum plate using a heat conductive adhesive.
  • thermal resistance is larger than in the copper plate-stacked structure.
  • a general copper plate PCB since heat is effectively transmitted to a copper foil pattern formed on its rear side in a large area as possible through a plurality of plated through holes 463, an improved heat conduction path is formed in the general copper plate-stacked PCB.
  • the plurality of plated through holes are added to the copper plate- stacked PCB and a heat dissipation pattern is made broad, the general copper plate-stacked PCB has smaller thermal resistance that in the expensive heat dissipation PCB and heat dissipation can be effectively performed.
  • a heat sink plate is formed to have a large area as possible so as to maximize a heat dissipation performance. Furthermore, a plurality of light emitting diode packages are arranged on one large-area heat sink plate and can be modularized.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un boîtier pour diode électroluminescente qui comporte une plaque unifiée de dissipation de chaleur et un module à boîtiers multiples. Le boîtier pour diode électroluminescente comprend: une plage de liaison de puce sur laquelle une puce de diode électroluminescente est destinée à être installée; au moins un fil électriquement relié à la puce de diode électroluminescente et isolé de la plage de liaison de puce; un corps isolant qui est formé autour de la plage de liaison de puce et qui fixe le fil, ce corps isolant comportant en outre une fenêtre d'émission de lumière à travers laquelle passe la lumière émise par la puce de diode électroluminescente; une plaque de dissipation de chaleur intégrée dans la plage de liaison de puce, cette plaque dépassant d'un côté extérieur du corps isolant et dissipant la chaleur liée au fonctionnement de la puce de diode électroluminescente, et une pluralité de trous de séparation qui sont formés entre la plage de liaison de puce et la plaque de dissipation de chaleur, ces trous ayant une forme étagée et étant emplis de résine injectée au moment de la formation du corps isolant, ladite plaque de dissipation de chaleur occupant plus d'un quart de tout le pourtour externe du corps isolant. Au moyen de cette structure, étant donné qu'il n'existe pas de problème d'absorption de l'humidité ni d'exfoliation, la plaque de dissipation de chaleur peut être formée de manière à présenter une grande surface utile de sorte que l'effet de dissipation de chaleur soit amélioré et que plusieurs boîtiers de diodes électroluminescentes soient disposés sur une plaque de dissipation de chaleur présentant une grande surface utile, et de sorte également qu'elle soit modulaire.
PCT/KR2006/001878 2005-05-20 2006-05-19 Boitier pour diode electroluminescente comportant une plaque unifiee de dissipation de chaleur et module a boitiers multiples WO2006123911A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050042569A KR100609784B1 (ko) 2005-05-20 2005-05-20 일체형 방열판을 가지는 발광다이오드 패키지 및 멀티패키지 모듈
KR10-2005-0042569 2005-05-20

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WO2006123911A1 true WO2006123911A1 (fr) 2006-11-23

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WO (1) WO2006123911A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010076435A1 (fr) 2008-12-31 2010-07-08 Finan Trading Company Système d'éclairage à diodes électroluminescentes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422159A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd 半導体集積回路装置およびその製造方法
JPH0653389A (ja) * 1992-08-03 1994-02-25 Nec Corp 半導体パッケージ
JPH1117231A (ja) * 1997-06-27 1999-01-22 Sharp Corp 光半導体装置
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
KR20050035638A (ko) * 2003-10-14 2005-04-19 바이오닉스(주) 고출력 엘이디패키지 제작방법 및 이를 이용한 고출력엘이디패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422159A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd 半導体集積回路装置およびその製造方法
JPH0653389A (ja) * 1992-08-03 1994-02-25 Nec Corp 半導体パッケージ
JPH1117231A (ja) * 1997-06-27 1999-01-22 Sharp Corp 光半導体装置
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
KR20050035638A (ko) * 2003-10-14 2005-04-19 바이오닉스(주) 고출력 엘이디패키지 제작방법 및 이를 이용한 고출력엘이디패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010076435A1 (fr) 2008-12-31 2010-07-08 Finan Trading Company Système d'éclairage à diodes électroluminescentes

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