WO2006106302A1 - Appareil de reglage de temperature - Google Patents

Appareil de reglage de temperature Download PDF

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Publication number
WO2006106302A1
WO2006106302A1 PCT/GB2006/001121 GB2006001121W WO2006106302A1 WO 2006106302 A1 WO2006106302 A1 WO 2006106302A1 GB 2006001121 W GB2006001121 W GB 2006001121W WO 2006106302 A1 WO2006106302 A1 WO 2006106302A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
cooling circuit
temperature
component
fluid
Prior art date
Application number
PCT/GB2006/001121
Other languages
English (en)
Inventor
Charles Henry Fitz Eustace
Paul Edward Zaft
Rupert Christopher Shaw
Robert George Duggan
Derek Graeme Madgewick Savidge
Original Assignee
Edwards Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edwards Limited filed Critical Edwards Limited
Publication of WO2006106302A1 publication Critical patent/WO2006106302A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06—Control using electricity
    • F04B49/065—Control using electricity and making use of computers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps

Definitions

  • the present invention relates to apparatus for, and a method of, controlling the temperature of an electrical circuit or other moisture sensitive component of a vacuum pump.
  • Vacuum processing is commonly used in the manufacture of semiconductor devices and flat panel displays to deposit thin films on to substrates.
  • a processing chamber is evacuated using a vacuum pumping system and feed gases are introduced to the evacuated chamber to cause the desired material to be deposited on one or more substrates located in the chamber.
  • the substrate is removed from the chamber and another substrate is inserted for repetition of the deposition process.
  • Evacuated load lock chambers are used to transfer substrates to and from the processing chamber.
  • Booster pumps typically have oil-free pumping mechanisms, as any lubricants present in the pumping mechanism could cause contamination of the clean environment in which the vacuum processing is performed.
  • Such "dry" vacuum pumps are commonly single or multi-stage positive displacement pumps employing inter-meshing rotors in the pumping mechanism.
  • the rotors may have the same type of profile in each stage or the profile may change from stage to stage.
  • the backing pumps may have a similar pumping mechanism to the booster pumps, or a different pumping mechanism.
  • a synchronous AC motor typically rotates the pumping mechanism of a booster pump.
  • a variable frequency drive unit may be provided between the motor and a power source for the motor.
  • the power supplied to the motor is controlled by controlling the current supplied to the motor, which in turn is controlled by adjusting the frequency and/or amplitude of the voltage in the motor.
  • the current supplied to the motor determines the amount of torque produced in the motor, and thus determines the torque available to rotate the pumping mechanism.
  • the frequency of the power determines the speed of rotation of the pumping mechanism.
  • a cooling circuit is normally provided for cooling the drive unit.
  • a cooling circuit typically comprises a cooling circuit positioned adjacent the drive unit and having an inlet for receiving a flow of cooling fluid, typically water from a mains water supply.
  • a flow of cooling fluid typically water from a mains water supply.
  • the degree of cooling of the drive unit at relatively low ambient temperatures is a small fraction of that available.
  • High operating temperatures reduce the lifetime of the components of the drive unit.
  • the critical components are the DC power supply capacitors, the lifetime of which is a function of ripple current and temperature.
  • the present invention provides a method of controlling the temperature of an electrical circuit or other moisture sensitive component of a vacuum pump, the method comprising the steps of flowing a cooling fluid through a component cooling circuit to cool the component, receiving data 5 indicative of the temperature of the cooling circuit and at least one of the air humidity and ambient temperature proximate the component, and controlling the supply of cooling fluid to the cooling circuit in dependence on the received data to decrease the temperature of the cooling circuit with decreasing ambient temperature whilst maintaining the temperature of the component 10 above the dew point at the monitored ambient temperature.
  • the temperature of the cooling circuit can "track" the ambient temperature, for example to maintain the average temperature of the component a predetermined number of degrees above the dew point at the
  • the temperature of the component can thus be much lower at lower ambient temperatures than in the prior cooling system where the temperature of the component is maintained at a constant, relatively high temperature over the full ambient temperature range of the vacuum pump.
  • Condensation on the surface of the component can thus be inhibited over the entire ambient temperature range whilst optimising the cooling of the component. This can increase the reliability and lifetime of the component, thereby reducing servicing intervals and reducing costs.
  • the temperature of the cooling circuit is preferably increased by reducing the rate of supply of cooling fluid to the cooling circuit.
  • the temperature of the cooling circuit is increased by diverting the cooling fluid away from the cooling circuit.
  • the rate of supply of cooling fluid to the cooling circuit is preferably reduced when the difference between 0 the monitored temperatures is equal to or below a first predetermined value ki, where ki __ ⁇ , and the rate of supply of cooling fluid is preferably increased when the difference between the monitored temperatures is equal to or above a second predetermined value k 2 , where k 2 >ki. This can maintain the temperature of the electronic component within a narrow temperature range (between ki and k 2 ) above the dew point at the monitored ambient temperature, thus preventing unnecessary over-heating of the component. •
  • One or both of these predetermined values may be dynamically altered to optimise the cooling of the component whilst inhibiting condensation of the surface of the component.
  • at least one of the first and second predetermined values may be varied in dependence on the air humidity at the ambient temperature so that the average temperature of the component increases with increasing air humidity at a given ambient temperature. This can enable the cooling of the component to be optimised based on the actual humidity level, so that more cooling could be applied under relatively dry conditions.
  • at least one of the first and second predetermined values may be varied in dependence on the ambient temperature itself, and/or on the air pressure. Dynamic alteration of k 2 is subject to the normal constraint that k 2 ⁇ T maXj where T ma ⁇ is the maximum operating temperature of the component.
  • the flow of cooling fluid is preferably diverted towards a pump cooling circuit for cooling at least part of the pumping mechanism of the vacuum pump.
  • a single flow of cooling fluid can thus be conveniently used to cool both the drive circuit for the motor of the pump and, for example, the stator of the pumping mechanism of the pump.
  • the present invention provides apparatus for controlling the temperature of an electrical circuit or other moisture sensitive component of a vacuum pump, the apparatus comprising a component cooling circuit, means for supplying a flow of cooling fluid through the cooling circuit to cool the component, control means, means for supplying to the control means data indicative of at least one of the air humidity and the ambient temperature proximate the component, and means for supplying to the control means data indicative of the temperature of the cooling circuit, wherein the control means is configured to control the fluid supply means in dependence on the received data to decrease the temperature of the cooling circuit with decreasing ambient temperature whilst maintaining the temperature of the component above the dew point at the monitored ambient temperature.
  • Figure 1 illustrates schematically an example of a pumping system for evacuating an enclosure
  • Figure 2 illustrates schematically an example of a system for driving a motor of the booster pump of the pumping system of Figure 1 ;
  • Figure 3 illustrates an example of an apparatus for cooling the booster pump of the pumping system of Figure 1 ;
  • Figure 4 illustrates a first example of a control system for controlling the temperature of the drive unit of the booster pump
  • Figure 5 is a graph illustrating schematically the variation with ambient temperature of the average temperature of the cooling circuit for the drive unit of the booster pump
  • Figure 6 illustrates the variation with time of both the temperature of the cooling circuit for the drive unit and the temperature of the drive unit itself at two different ambient temperatures; and Figure 7 illustrates a second example of a control system for controlling the temperature of the drive unit of the booster pump.
  • FIG. 1 illustrates a vacuum pumping system for evacuating an enclosure 10, such as a load lock chamber or other relatively large chamber.
  • the system comprises a booster pump 12 connected in series with a backing pump 14.
  • the booster pump 12 has an inlet 16 connected by an evacuation passage 18, preferably in the form of a conduit 18, to an outlet 20 of the enclosure 10.
  • An exhaust 22 of the booster pump 12 is connected by a conduit 24 to an inlet 26 of the backing pump 14.
  • the backing pump 14 has an exhaust 28 that exhausts the gas drawn from the enclosure 10 to the atmosphere.
  • booster pumps Whilst the illustrated pumping system includes a single booster pump and a single backing pump, any number of booster pumps may be provided depending on the pumping requirements of the enclosure. Where a plurality of booster pumps are provided, these are connected in parallel so that each booster pump can be exposed to the same operating conditions. Where a relatively high number of booster pumps are provided, two or more backing pumps may be provided in. parallel. Furthermore, an additional row or rows of booster pumps similarly connected in parallel may be provided as required between the first row of booster pumps and the backing pumps.
  • the booster pump 12 comprises a pumping mechanism 30 driven by a variable speed motor 32.
  • Booster pumps typically include an essentially dry (or oil free) pumping mechanism 30, but generally also include some components, such as bearings and transmission gears, for driving the pumping mechanism 30 that require lubrication in order to be effective.
  • dry pumps include Roots, Northey (or "claw") and screw pumps. Dry pumps incorporating Roots and/or Northey mechanisms are commonly multi-stage positive displacement pumps employing intermeshing rotors in each pumping chamber. The rotors are located on contra-rotating shafts, and may have the same type of profile in each chamber or the profile may change from chamber to chamber.
  • the backing pump 14 may have either a similar pumping mechanism to the booster pump 12, or a different pumping mechanism.
  • the backing pump 14 may be a rotary vane pump, a rotary piston pump, a Northey, or "claw", pump, or a screw pump.
  • the motor 32 of the booster pump 12 may be any suitable motor for driving the pumping mechanism 30 of the booster pump 12.
  • the motor 32 comprises a synchronous AC motor.
  • a control system 36 receives AC power supplied by a power source 38 and converts the received AC power into a power supply for the motor 32.
  • the control system 36 comprises a variable frequency drive unit 40 and a controller 42.
  • the drive unit 40 comprises a rectifier circuit for converting the AC power from the power source 38 into DC power and an inverter for converting the DC power back into AC power for driving the motor 32 at the desired amplitude and frequency.
  • the controller 42 controls the operation of the drive unit 40 so that the motor has the desired rotational frequency.
  • the control system 36 is thus able to vary the speed of the booster pump 12 during the evacuation of the enclosure 10 to optimise the performance of the booster pump 12.
  • the apparatus comprises a conduit system having an inlet 46 for receiving a stream of cooling fluid for cooling the booster pump 12 and an outlet 48 from which the cooling fluid is subsequently exhaust from the conduit system.
  • the cooling fluid is water supplied from a mains supply, but any other suitable liquid or gaseous coolant may provide the cooling fluid.
  • the conduit system comprises a first, component cooling circuit 50 located adjacent an electrical circuit or other moisture sensitive component of the booster pump 12 for cooling that component.
  • the moisture sensitive component is the drive unit 40 of the control system 36.
  • the first cooling circuit 50 has an inlet 52 for receiving the flow of cooling fluid entering the system from inlet 46 of the conduit system, and an outlet 54 for outputting the cooling fluid.
  • the conduit system further comprises a second, pumping mechanism cooling circuit 56 for conveying cooling fluid about various parts of the pumping mechanism 30, such as one or more of the gearbox, stator and bearings of the pumping mechanism 30.
  • the second cooling circuit 56 may also convey cooling fluid to a jacket surrounding the motor 32 of the booster pump 12.
  • the two cooling circuits 50, 56 are connected in series, that is, the second cooling circuit 56 having an inlet 58 for receiving the flow of cooling from the outlet 54 of the first cooling circuit 50, and an outlet 60 for outputting the cooling fluid to the outlet 48 of the conduit system.
  • the two cooling circuits 50, 56 may be connected in parallel to receive the water from the inlet 48 of the conduit system.
  • the conduit system also comprises a first solenoid valve 62 for selectively supplying the cooling fluid either to the inlet 52 of the first cooling circuit 50 or diverting the cooling fluid away from the first cooling circuit 50 to the inlet 58 of the second cooling circuit 56.
  • the position of the first valve 62 is controlled by signals output from the controller 42 of the booster pump 12.
  • the controller 42 controls the position of the first valve 62 in dependence on signals received from a first temperature sensor 64 and a second temperature sensor 66.
  • the first temperature sensor 64 is located within the control system 36 adjacent the drive unit 40 to monitor the ambient temperature proximate the drive unit 40, and as indicated by arrow 70, the second temperature sensor 66 is located in thermal contact with the first cooling circuit 50 to monitor the temperature of the first cooling circuit 50.
  • the first valve 62 is initially open to supply cooling fluid to the first cooling circuit 50 to cool the drive unit 40.
  • the controller 42 continually, or periodically, receives signals from the first and second temperature sensors 64, 66 and uses the data contained within the signals to monitor the ambient temperature (T A ) and the temperature of the first cooling circuit (TH), and also monitor the temperature difference between these two temperatures.
  • the controller 42 is configured to maintain TH above the dew point at the monitored ambient temperature T A (the dew point at 90 %RH humidity is typically between 1 and 2°C below TA over the operating range of the booster pump).
  • the controller monitors the temperature difference between T H and T A from the signals output from the sensors 64, 66.
  • the controller 42 outputs a signal to the first valve 62 to divert the flow of cooling fluid away from the inlet 52 of the first cooling circuit and directly to the inlet 58 of the second cooling circuit 58, thereby causing the temperature of the first cooling circuit 50 to increase.
  • the controller 42 When the temperature difference is equal to or falls below a second predetermined value k 2 ⁇ ki, the controller 42 outputs a signal to the first valve 62 to divert the flow of cooling fluid back towards the inlet 52 of the first cooling circuit, thereby causing the temperature of the first cooling circuit 50 to decrease.
  • the values of ki and k 2 may be constant between T m j n to T ma ⁇ , or these values may be dynamically varied with one or more of TA, the current air humidity and the current air pressure (as indicated by signals output from dedicated sensors).
  • Figure 6 illustrates the variation with time of both T H and the temperature of the drive unit 40 at two different values of TA.
  • the temperature of the cooling fluid in this example water from a mains supply, varies between 10 0 C and 12 0 C, as indicated by line 78 in Figure 6.
  • T A 40 0 C
  • the dew point is approximately 38°C, as indicated by line 80.
  • T H varies between approximately 4O 0 C and 50 0 C, as indicated by line 82, which maintains the temperature of the drive unit 40, as indicated by line 84, between approximately 47°C and 52°C.
  • T A is 2O 0 C
  • the dew point is approximately 18.3°C, as indicated by line 86.
  • TH varies between approximately 26°C and 33°C, as indicated by line 88, which maintains the temperature of the drive unit 40, as indicated by line 90, between approximately 31 0 C and 36°C.
  • the temperature of the drive unit 40 is maintained above the dew point at the ambient temperature, whilst the average temperature of the cooling circuit decreases with decreasing ambient temperature to optimise the cooling of the drive unit 40 and thus prolong the lifetime of the drive unit 40.
  • the cooling fluid output from the outlet 60 of the second cooling circuit 56 can be selectively diverted to a third cooling circuit 100 extending about the exhaust 22 of the booster pump 12.
  • a third temperature sensor 102 is provided in thermal contact with the exhaust 22, as indicated by arrow 104 in Figure 3. The third temperature sensor 102 outputs a signal indicative of the monitored temperature to the controller 42.
  • the controller 42 controls the position of a second solenoid valve 106 located between the outlet 60 of the second cooling circuit 56 and the outlet 48 from the conduit system, to selectively divert the cooling fluid towards the inlet 108 of the third cooling circuit 100 and thereby reduce the temperature of the exhaust 22 of the booster pump 12.
  • the diverted fluid passes through the third cooling circuit 100, and then from the outlet 110 of the third cooling circuit 100 to the outlet 48 of the conduit system.
  • data indicative of the air humidity proximate the drive unit 40 may be supplied to the controller 42 from a humidity sensor 120.
  • This sensor 120 may also be located proximate the drive unit 40, as indicated by arrow 68 in Figure 3.
  • the controller 42 can then adjust the rate of supply of water to the first cooling circuit 50, for example by varying the value of at least one of ki and k 2 , in dependence on the current air humidity so as to optimise the cooling of the drive unit 40. For example, when the air humidity is relatively low at a particular ambient temperature, the dew point at that temperature will also be relatively low. As a result, the drive unit 40 requires less self-heating to inhibit condensation, and so the temperature of the first cooling circuit 50 can be lowered, prolonging the lifetime of the drive unit 40 through increased cooling.
  • the first valve 62 may be configured to supply a proportion of the cooling fluid to one inlet 52, with the remainder being supplied to the other inlet 58.
  • the valve 62 may then be configured to vary the rate at which the cooling fluid is supplied to the inlet 52 of the first cooling circuit 50 in response to signals received from the controller 42 to control the temperature of the drive unit 40.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Control Of Non-Electrical Variables (AREA)

Abstract

La présente invention décrit un procédé de réglage de la température d'un circuit électronique ou d'un autre composant de pompe à vide sensible à l'humidité. Le procédé comprend les étapes suivantes : écoulement d'un fluide de refroidissement dans un circuit de refroidissement de composant afin de refroidir le composant, surveillance de l'un des paramètres humidité de l'air ou température ambiante à proximité du composant, surveillance de la température du circuit de refroidissement et réglage de l'alimentation en fluide de refroidissement dans le circuit de refroidissement en fonction des paramètres enregistrés de manière que la température du circuit de refroidissement diminue lorsque la température ambiante diminue tout en maintenant la température du composant au-dessus du point de rosée à la température ambiante enregistrée.
PCT/GB2006/001121 2005-04-07 2006-03-27 Appareil de reglage de temperature WO2006106302A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0506987.7 2005-04-07
GB0506987A GB0506987D0 (en) 2005-04-07 2005-04-07 Temperature control apparatus

Publications (1)

Publication Number Publication Date
WO2006106302A1 true WO2006106302A1 (fr) 2006-10-12

Family

ID=34586801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2006/001121 WO2006106302A1 (fr) 2005-04-07 2006-03-27 Appareil de reglage de temperature

Country Status (3)

Country Link
GB (1) GB0506987D0 (fr)
TW (1) TW200706760A (fr)
WO (1) WO2006106302A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2071186A3 (fr) * 2007-12-12 2014-09-03 Pfeiffer Vacuum GmbH Pompe à vide et procédé de son fonctionnement
KR20150048159A (ko) * 2012-08-28 2015-05-06 가부시끼가이샤 오오사까 신꾸우기끼 세이사꾸쇼 분자 펌프
CN107191358A (zh) * 2017-06-28 2017-09-22 无锡市银杏塑业科技有限公司 一种真空泵冷却装置
WO2022091054A1 (fr) * 2020-11-02 2022-05-05 Edwards Korea Limited Système de gestion thermique
DE102020214450A1 (de) 2020-11-17 2022-05-19 Fronius International Gmbh Verfahren und Vorrichtung zur Vermeidung von Kondenswasserbildung bei einem Inverter
GB2604863A (en) * 2021-03-12 2022-09-21 Leybold Gmbh Method for operating a vacuum pump and vacuum pump
GB2624987A (en) * 2021-03-12 2024-06-05 Leybold Gmbh Method for operating a vacuum pump and vacuum pump

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526011A (en) * 1983-03-03 1985-07-02 Control Data Corporation Dew point sensitive computer cooling system
EP0768592A1 (fr) * 1995-10-09 1997-04-16 Ebara Corporation Méthode de refroidissement d'un onduleur par liquide
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4526011A (en) * 1983-03-03 1985-07-02 Control Data Corporation Dew point sensitive computer cooling system
EP0768592A1 (fr) * 1995-10-09 1997-04-16 Ebara Corporation Méthode de refroidissement d'un onduleur par liquide
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2071186A3 (fr) * 2007-12-12 2014-09-03 Pfeiffer Vacuum GmbH Pompe à vide et procédé de son fonctionnement
KR20150048159A (ko) * 2012-08-28 2015-05-06 가부시끼가이샤 오오사까 신꾸우기끼 세이사꾸쇼 분자 펌프
KR101974692B1 (ko) * 2012-08-28 2019-05-02 가부시끼가이샤 오오사까 신꾸우기끼 세이사꾸쇼 분자 펌프
CN107191358A (zh) * 2017-06-28 2017-09-22 无锡市银杏塑业科技有限公司 一种真空泵冷却装置
WO2022091054A1 (fr) * 2020-11-02 2022-05-05 Edwards Korea Limited Système de gestion thermique
DE102020214450A1 (de) 2020-11-17 2022-05-19 Fronius International Gmbh Verfahren und Vorrichtung zur Vermeidung von Kondenswasserbildung bei einem Inverter
GB2604863A (en) * 2021-03-12 2022-09-21 Leybold Gmbh Method for operating a vacuum pump and vacuum pump
GB2604863B (en) * 2021-03-12 2024-04-17 Leybold Gmbh Method for operating a vacuum pump and vacuum pump
GB2624987A (en) * 2021-03-12 2024-06-05 Leybold Gmbh Method for operating a vacuum pump and vacuum pump

Also Published As

Publication number Publication date
GB0506987D0 (en) 2005-05-11
TW200706760A (en) 2007-02-16

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