WO2006093040A1 - Matériau de formation de motifs, appareil de formation de motifs et procédé de formation de motifs - Google Patents

Matériau de formation de motifs, appareil de formation de motifs et procédé de formation de motifs Download PDF

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Publication number
WO2006093040A1
WO2006093040A1 PCT/JP2006/303404 JP2006303404W WO2006093040A1 WO 2006093040 A1 WO2006093040 A1 WO 2006093040A1 JP 2006303404 W JP2006303404 W JP 2006303404W WO 2006093040 A1 WO2006093040 A1 WO 2006093040A1
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WIPO (PCT)
Prior art keywords
layer
pattern forming
photosensitive layer
forming material
pattern
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PCT/JP2006/303404
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English (en)
Japanese (ja)
Inventor
Morimasa Sato
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Fujifilm Corporation
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Publication of WO2006093040A1 publication Critical patent/WO2006093040A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Definitions

  • the present invention relates to a pattern forming material suitable for dry film resist (DFR), etc., a pattern forming apparatus provided with the pattern forming material, and a pattern forming method using the pattern forming material.
  • DFR dry film resist
  • a pattern forming material in which a photosensitive layer is formed by applying and drying a photosensitive resin composition on a support has been used.
  • a laminate is formed by laminating the pattern forming material on a substrate such as a copper clad laminate on which the permanent pattern is formed, and the photosensitive layer in the laminate is formed on the photosensitive layer.
  • the permanent pattern is formed by exposing to light, developing the light-sensitive layer to form a pattern after the exposure, and then performing an etching process or the like.
  • the surface of a substrate such as PWB (printed wired board) has fine irregularities due to chemical polishing and irregularities caused by uneven thickness of the glass fiber, so that a high-definition permanent pattern is formed.
  • the pattern forming material to be laminated must have an uneven follow-up property.
  • thermoplastic resin layer is provided between the support and the photosensitive layer, and the irregularities on the surface of the substrate are absorbed when transferred under heat and pressure (See Patent Document 1).
  • Patent Document 2 In order to cope with downsizing and high performance of printed wiring boards and the like, a technique for multilayering a photosensitive layer has been developed (see Patent Document 2).
  • pattern forming materials are known in which a plurality of photosensitive layers having different physical properties are laminated in order to improve the coverage of the holes (see Patent Documents 3 and 4).
  • Patent Document 3 a pattern forming material comprising a support on which a first photosensitive layer having low fluidity by heating is provided and a second photosensitive layer having high fluidity by heating is provided thereon.
  • a technique for filling a through-hole with a second photosensitive layer having high fluidity by heating at the time of transfer to a substrate is proposed.
  • the pattern forming material having the multilayer structure has the unevenness following property of the surface of the substrate, but the film thickness is absorbed by absorbing the unevenness.
  • the photosensitive layer in contact with the substrate surface has a softening point lower than that of the outer photosensitive layer or the thermoplastic resin layer
  • the photosensitive layer is softened by heating and pressurizing at the time of lamination.
  • the concave portion on the surface of the base is thick, and the convex portion on the surface of the base is thin.
  • a pattern forming material that is capable of forming a high-definition pattern that is excellent in unevenness followability on the surface of the substrate and that has excellent tent properties and etching uniformity, and a pattern forming apparatus including the pattern forming material, and A pattern forming method using the pattern forming material has not yet been provided, and further improvement and development are desired.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-72724
  • Patent Document 2 Japanese Patent Laid-Open No. 3-17650
  • Patent Document 3 JP-A-8-54732
  • Patent Document 4 Japanese Patent Laid-Open No. 10-111573
  • the present invention has been made in view of the current situation, and it is an object of the present invention to solve the above-described problems and achieve the following objects. That is, the present invention relates to a pattern forming material that is capable of forming a high-definition pattern that is excellent in unevenness followability on the surface of a substrate and that is excellent in tent properties and etching uniformity, and a pattern forming apparatus including the pattern forming material. Another object of the present invention is to provide a pattern forming method using the pattern forming material.
  • the first layer and the second layer are provided in this order, and the glass of the first layer A pattern forming material characterized in that B ⁇ A, where A is the transition temperature (Tg) and B is the glass transition temperature (Tg) of the second layer.
  • A is the transition temperature (Tg)
  • B is the glass transition temperature (Tg) of the second layer.
  • ⁇ 2> The pattern forming material according to ⁇ 1>, wherein the glass transition temperature A of the first layer is -20 to 30 ° C, and the glass transition temperature B of the second layer is 10 to 40 ° C. It is.
  • ⁇ 4> The pattern forming material according to any one of ⁇ 1> to ⁇ 3>, wherein the first layer has a thickness of 5 to 30 ⁇ m, and the second layer has a thickness of 2 to 15 ⁇ m.
  • ⁇ 5> The pattern forming material according to any one of ⁇ 1> to ⁇ 4>, wherein the first layer is a cushion layer and the second layer is a photosensitive layer.
  • thermoplastic resin has a softening point of 80 ° C or lower.
  • the minimum exposure amount capable of pattern formation of the first photosensitive layer is larger than the minimum exposure amount capable of pattern formation of the second photosensitive layer. Pattern forming material.
  • the photosensitive layer contains a binder, a polymerizable compound, and a photopolymerization initiator.
  • ⁇ 14> The pattern forming material according to any one of ⁇ 10> and ⁇ 13>, wherein the polymerizable compound contains a monomer having at least one of a urethane group and an aryl group.
  • Photopolymerization initiators are halogenated hydrocarbon derivatives, hexaryl biimidazoles, oxime derivatives, organic peroxides, thio compounds, ketone compounds, aromatic onium salts and
  • ⁇ 17> The pattern forming material according to any one of ⁇ 1> to ⁇ 16>, wherein a barrier layer capable of controlling the movement of a substance is provided between the first layer and the second layer.
  • ⁇ 18> The pattern forming material according to ⁇ 17>, wherein the Noria layer includes at least one of a bull polymer and a bull copolymer.
  • Pattern forming material force The pattern forming material according to any one of ⁇ 1> to ⁇ 20>, which is long and wound in a roll shape.
  • a light irradiating means capable of irradiating light; and a light modulating means for modulating light from the light irradiating means and exposing the photosensitive layer in the pattern forming material.
  • This is a pattern forming apparatus.
  • the light modulation unit further includes a pattern signal generation unit that generates a control signal based on the pattern information to be formed, and the control generated by the pattern signal generation unit generates light emitted from the light irradiation unit.
  • the pattern forming apparatus according to ⁇ 23> wherein the pattern is modulated according to a signal.
  • the light modulation unit since the light modulation unit includes the pattern signal generation unit, the light emitted from the light irradiation unit is converted into a control signal generated by the pattern signal generation unit. Modulated accordingly.
  • the light modulation means has n pixel parts, and forms any less than n of the pixel parts continuously arranged from the n pixel parts. 25.
  • any less than n pixel parts arranged continuously from the n pixel parts in the light modulation unit are controlled according to pattern information. As a result, the light of the light irradiation means power is modulated at high speed.
  • ⁇ 26> The pattern forming apparatus according to any one of ⁇ 23>, ⁇ 25>, wherein the light modulation means is a spatial light modulation element.
  • ⁇ 27> The pattern forming apparatus according to ⁇ 26>, wherein the spatial light modulation element is a digital 'micromirror' device (DMD).
  • DMD digital 'micromirror' device
  • ⁇ 28> The pattern forming apparatus according to any one of the above ⁇ 25>, ⁇ 27>, wherein the pixel part is a micromirror.
  • ⁇ 29> The pattern forming apparatus according to any one of the above ⁇ 23>, ⁇ 28>, wherein the light irradiation means can synthesize and irradiate two or more lights.
  • the pattern forming apparatus described in 29> above since the light irradiating means can synthesize and irradiate two or more lights, exposure is performed with exposure light having a deep focal depth. As a result, the pattern forming material is exposed with extremely high definition. For example, when the photosensitive layer is subsequently developed, an extremely fine pattern is formed.
  • the light irradiating means includes a plurality of lasers, a multimode optical fiber, and a collective optical system that collects the laser beams irradiated with the plurality of laser forces and couples them to the multimode optical fiber.
  • the putter according to any one of the above Forming device.
  • the light irradiating means may collect the laser light respectively emitted from the plurality of lasers by the collective optical system and be coupled to the multimode optical fiber.
  • exposure is performed with exposure light having a deep focal depth.
  • the exposure to the pattern forming material is performed with extremely high definition. For example, when the photosensitive layer is subsequently developed, a very fine pattern is formed.
  • a pattern forming method comprising at least exposing the photosensitive layer in the pattern forming material according to any one of ⁇ 1> to ⁇ 22>.
  • ⁇ 32> The pattern forming method according to ⁇ 31>, wherein the pattern forming material is laminated on the substrate while being heated and pressurized and exposed.
  • ⁇ 33> The pattern forming method according to any one of ⁇ 31>, ⁇ 32>, wherein the exposure is performed imagewise based on pattern information to be formed.
  • ⁇ 34> The pattern forming method according to ⁇ 31>, ⁇ 33>, wherein the exposure is performed using light modulated based on the pattern information to be formed and modulated in accordance with the control signal. It is.
  • the exposure is performed through a microlens array in which microlenses having aspherical surfaces capable of correcting aberrations due to distortion of the exit surface of the picture element portion in the light modulation means are arranged.
  • the pattern forming method according to any one of the above 31> Karaku 35>.
  • ⁇ 38> The pattern forming method according to any one of ⁇ 31>, ⁇ 37>, wherein the exposure is performed through an aperture array.
  • the extinction ratio is improved by performing exposure through the aperture array.
  • the exposure is performed with extremely high definition. For example, when the photosensitive layer is subsequently developed, an extremely fine pattern is formed.
  • ⁇ 39> The pattern forming method according to any one of ⁇ 31>, ⁇ 38>, wherein the exposure is performed while relatively moving the exposure light and the photosensitive layer.
  • exposure is performed at a high speed by performing exposure while relatively moving the modulated light and the photosensitive layer. For example, when the photosensitive layer is subsequently developed, a high-definition pattern is formed.
  • ⁇ 41> The pattern forming method according to any one of ⁇ 31> to ⁇ 40>, wherein the photosensitive layer is developed after the exposure.
  • ⁇ 43> The pattern formation method according to ⁇ 42>, wherein the permanent pattern is a wiring pattern, and the formation of the permanent pattern is performed by at least one of an etching process and a plating process.
  • a pattern forming material that can solve the conventional problems, can form a high-definition pattern that is excellent in uneven surface followability on the substrate surface, and excellent in tent properties and etching uniformity.
  • a pattern forming apparatus including the pattern forming material and a pattern forming method using the pattern forming material.
  • FIG. 1 is an example of a front view of a microlens constituting a microlens array.
  • FIG. 2 is an example of a side view of a microlens constituting a microlens array.
  • FIG. 3 is an example of a front view of a microlens constituting a microlens array.
  • FIG. 4 is an example of a side view of a microlens constituting a microlens array.
  • FIG. 5 is an example of a schematic diagram showing a condensing state by a microlens in one cross section.
  • FIG. 6 is an example of a schematic view showing a condensing state by a microlens in one cross-section in FIG. 5 and another cross-section.
  • FIG. 7 is an example of a cross-sectional view along the optical axis showing the configuration of another exposure head having a different coupling optical system.
  • FIG. 8 is an example of a plan view showing an optical image projected on an exposed surface when a microlens array or the like is not used.
  • FIG. 9 is an example of a plan view showing an optical image projected on an exposed surface when a microlens array or the like is used.
  • FIG. 10 is a perspective view showing a configuration of a fiber array light source.
  • FIG. 11 is an example of a front view showing an arrangement of light emitting points in a laser emitting portion of a fiber array light source.
  • FIG. 12 is an example of a diagram showing a configuration of a multimode optical fiber.
  • FIG. 13 is an example of a plan view showing a configuration of a combined laser light source.
  • FIG. 14 is an example of a plan view showing a configuration of a laser module.
  • FIG. 15 is an example of a side view showing the configuration of the laser module shown in FIG.
  • FIG. 16 is a partial side view showing the configuration of the laser module shown in FIG.
  • FIG. 17 is an example of a diagram illustrating an example of a DMD usage area.
  • FIG. 18 is an example of a diagram showing an example of a DMD usage area similar to FIG.
  • FIG. 19 is an example of a schematic perspective view showing an appearance of an example of a pattern forming apparatus.
  • the pattern forming material of the present invention has a first layer and a second layer in this order on a support, the glass transition temperature (Tg) of the first layer is A, and the second layer has a glass transition temperature (Tg).
  • Tg glass transition temperature
  • B glass transition temperature
  • the first layer is a cushion And an embodiment in which the second layer is a photosensitive layer, and (2) an embodiment in which the first layer is a first photosensitive layer and the second layer is a second photosensitive layer.
  • the pattern forming material may have a barrier layer capable of suppressing the movement of a substance between the first layer and the second layer as necessary.
  • the glass transition temperature of the second layer is preferably within the temperature range at the time of lamination, and within the range in which the unevenness followability of the second layer to the substrate can be controlled by controlling the temperature conditions at the time of lamination. I prefer to be there.
  • the glass transition temperature B of the second layer is preferably ⁇ 10 to 40 ° C., more preferably 10 to 40 ° C.
  • the followability to irregularities on the substrate surface may be reduced under general lamination conditions, and is less than ⁇ 10 ° C. Under general lamination conditions, irregularities on the surface of the substrate may be absorbed, resulting in non-uniform film thickness.
  • the glass transition temperature A of the first layer is not particularly limited as long as it is equal to or lower than B of the second layer, but it is preferably 20-30 ° C and 20-20 ° C. Is more preferable.
  • the glass transition temperature A of the first layer exceeds the glass transition temperature B of the second layer, the deformation of the second layer is suppressed and the film thickness may be nonuniform.
  • the measuring method of the glass transition temperature can be appropriately selected according to the purpose without any particular limitation.
  • the TMA method using a thermal analyzer the DSC method using a differential scanning calorimeter, A known method such as a DMA method using a viscosity elasticity measuring apparatus may be used.
  • the measurement sample for example, 10 to 500 mg each of the prepared first layer and the second layer collected using a microtome can be used.
  • the melt viscosity of the second layer is preferably from 500 to 30,000 (Pa 'S), more preferably from 1,000 to 30,000 (Pa ⁇ S) in the range of 40 to 100 ° C! /.
  • the method for measuring the melt viscosity is not particularly limited and can be appropriately selected depending on the purpose. Examples thereof include a solid-liquid dynamic viscoelasticity measuring device, a cantilever rheometer, a cone / disk rheometer, Examples thereof include a measurement method using a uniaxial elongation viscosity, a melt indexer and the like.
  • the measurement sample can be appropriately prepared according to the measurement device.
  • the first layer and the second layer force also use a microtome or the like. Can be used.
  • the thickness of the first layer is preferably 5 to 30 ⁇ m, more preferably 10 to 30 ⁇ m. If the thickness of the first layer exceeds 30 m, the resolution may decrease and the load during image formation may increase, and if it is less than 5 m, the transferability to the substrate may deteriorate. .
  • the thickness of the second layer is preferably 2 to 10 m, more preferably 2 to 15 m.
  • the etching property may be deteriorated, and when it is less than 2 m, the cured film may be peeled off during the etching.
  • the cushion layer is not particularly limited as long as it satisfies the glass transition temperature, melt viscosity, and thickness ranges of the first layer, and can be appropriately selected according to the purpose. The inclusion is preferred.
  • the thermoplastic resin mainly comprises an alkali-soluble thermoplastic polymer, and other components as necessary. Including, ok.
  • the acid value (mgKOH / g) of the thermoplastic polymer is not particularly limited.
  • a force that can be appropriately selected according to the purpose 50 to 300 force S, preferably 60 to 270 S, more preferably 70 to 250 is particularly preferred.
  • the acid value is within the above range, the developability of the cushion layer can be ensured.
  • the acid value is less than 50, development failure may occur.
  • the acid value exceeds 300, the cushion layer becomes too hard, and uneven followability and laminating properties may be deteriorated.
  • the weight average molecular weight of the thermoplastic polymer is not particularly limited.
  • the force to be selected as appropriate S The force that can be applied S 1,000-300,000 force S is preferable, 3,000-200,000 force is more preferable 5,000-150,000 is particularly preferable.
  • the weight average molecular weight is within the above range, the developability of the cushion layer can be ensured, and the viscosity r? Can be easily adjusted. Further, the effect can be further obtained by the combination with the above acid value range. If the weight average molecular weight is less than 1,000, the membrane may become fragile or the cushion layer may exude during lamination. If it exceeds 300,000, the cushion layer may become too hard, and the unevenness followability and laminating properties may deteriorate.
  • the content of the thermoplastic polymer in the cushion layer is not particularly limited.
  • a force that can be appropriately selected according to the purpose For example, 35 mass% with respect to the total solid content of the cushion layer. It is preferable that the content is 55% by mass or more.
  • the soft soft point (Vicat) of the thermoplastic polymer is not particularly limited.
  • the force can be appropriately selected according to the purpose.
  • the soft soft point of the cushion layer is 80 ° C or lower.
  • those having a substantial soft spot of 80 ° C or less are preferred.
  • alkali-soluble thermoplastic polymers having a softening point of 80 ° C. or lower include ethylene and acrylate copolymer cans, styrene and (meth) acrylate copolymer cans and vinyls.
  • the thermoplastic resin having a softening point of 80 ° C or lower includes, in addition to the above-described thermoplastic resin, “Plastic Performance Handbook” (edited by the Japan Plastics Industry Federation, All Japan Plastics Molding Industry Association, industrial research). Of organic polymers with a soft spot of about 80 ° C or less (published on October 25, 1968) by the Society). In addition, even in an organic polymer material having a soft softening point of 80 ° C or higher, various plasticizers compatible with the organic polymer material are added to the organic polymer material so that a substantial softness can be obtained. It is also possible to lower the point below 80 ° C Noh.
  • the plasticizer is not particularly limited and may be appropriately selected depending on the purpose.
  • polypropylene glycol polyethylene glycol, dioctyl phthalate, diheptino phthalate, dibutino phthalate, tricres Alcohols and esters such as zircphosphate, uddernoresiphosphate and biphenyldiphosphate, amides such as toluenesulfonamide, and the like.
  • the interlayer adhesive force of the pattern forming material is not particularly limited and can be appropriately selected according to the purpose.
  • the interlayer adhesive force between the support and the cushion layer is the smallest among the interlayer adhesive strengths of the respective layers.
  • the interlayer adhesive strength only the support is peeled off from the laminate, the photosensitive layer is exposed through the cushion layer, and then the photosensitive layer is developed using an alkaline developer. be able to.
  • the photosensitive layer can be developed using an alkaline developer.
  • the method for adjusting the interlayer adhesive force is not particularly limited, and can be appropriately selected according to the purpose.
  • a known polymer, supercooling substance, or adhesion improver in the thermoplastic resin can be selected.
  • a method of adding a surfactant, a release agent and the like can be selected.
  • thermoplastic resin examples include a copolymer whose main component is an essential copolymer component of ethylene.
  • the copolymer having ethylene as an essential copolymer component is not particularly limited and can be appropriately selected according to the purpose.
  • ethylene vinyl acetate copolymer (EV A) ethylene-ethyl acrylate. Copolymer (EEA) and the like.
  • the interlayer adhesive force of the pattern forming material can be appropriately selected according to the purpose without any particular limitation.
  • the adhesive strength between the photosensitive layer as the second layer and the cushion layer is preferably the smallest.
  • the method for adjusting the interlayer adhesion can be appropriately selected according to the purpose for which there is no particular limitation.
  • various polymers, supercooled substances, adhesion improvers in the thermoplastic resin can be selected.
  • the ethylene copolymerization ratio in the copolymer having ethylene as an essential copolymerization component is a force that can be appropriately selected according to the purpose without any particular limitation. For example, 60-90% by mass is preferable. 60-80% by mass is more preferred. 65-80% by mass is particularly preferred.
  • the ethylene copolymerization ratio is less than 60% by mass, the interlayer adhesive force between the cushion layer and the photosensitive layer increases, and it becomes difficult to peel off at the interface between the cushion layer and the photosensitive layer. If the amount exceeds 90% by mass, the indirect adhesion between the cushion layer and the photosensitive layer becomes too small, and the cushion layer and the photosensitive layer are very easily peeled off. It may be difficult to produce a pattern forming material containing
  • the interlayer adhesion of each layer is the smallest.
  • the support, the cushion layer, and the barrier layer are peeled from the laminate, and the photosensitive layer is exposed, and then the photosensitive layer is exposed to an alkaline developer.
  • the layer can be developed. Further, the photosensitive layer is exposed through the cushion layer while leaving the support without being peeled, and then the support, the cushion layer, and the barrier layer are peeled from the laminate, and the alkaline layer
  • the photosensitive layer can be developed using a developing solution.
  • the method for adjusting the interlayer adhesive force can be appropriately selected according to the purpose without any particular limitation.
  • a method of containing a release agent in the photosensitive layer, the cushion layer and the barrier A method for surface-treating an adhesive surface with a layer, the support and the cushion layer A method of surface-treating the adhesive surface, a method of adjusting at least one content selected from components contained in at least one of the layers, and a method of containing or applying a component that improves the adhesive force
  • a method of containing a release agent in the photosensitive layer, the cushion layer and the barrier A method for surface-treating an adhesive surface with a layer, the support and the cushion layer
  • a method of surface-treating the adhesive surface a method of adjusting at least one content selected from components contained in at least one of the layers
  • a method of containing or applying a component that improves the adhesive force may be used alone or in combination of two or more.
  • the release agent can be appropriately selected from known release agents with no particular limitations. Examples thereof include silicone compounds and compounds having a fluorinated alkyl group.
  • silicone compound examples include Daicel UCB Co., Ltd., Evecril 1360, 350, Toshiba Silicone Co., Ltd., dimethyl silicone oil TSF400, methylphenol silicone, 1-year-old Inole TSF4300, TSF4446, TSF4460, TSF4452 etc. are listed.
  • Examples of the compound having a fluorinated alkyl group include a fluorine-based surfactant (for example, perfluoroalkyl group 'hydrophilic group-containing oligomer F-171, manufactured by Dainippon Ink & Chemicals, Inc.
  • a fluorine-based surfactant for example, perfluoroalkyl group 'hydrophilic group-containing oligomer F-171, manufactured by Dainippon Ink & Chemicals, Inc.
  • Examples of the surface treatment include plasma treatment, electron beam treatment, glow discharge treatment, corona discharge treatment, and ultraviolet irradiation treatment.
  • the ethylene copolymerization ratio in the copolymer is less than 60% by mass. The method of doing is mentioned.
  • Examples of the component for improving the adhesive strength include phenolic substances (for example, cresol monovolac resin, phenol resin, etc.), polysalt-vinylidene resin, styrene butadiene rubber, gelatin, polybulu alcohol, cellulose And the like. These may be included in at least one of the support, the cushion layer, and the barrier layer, if necessary, on the contact surface between the support and the cushion layer, the cushion layer, and the barrier layer. You may apply
  • crosslinking agent examples include borax, boric acid, borates (for example, orthoborate, InBO
  • Aldehyde compounds such as formaldehyde, glyoxal, and glutaraldehyde; ketone compounds such as diacetyl and cyclopentanedione; bis (2-chlorodiethylurea) -2 hydroxy 4, 6 dichloro 1, 3, 5 Active halogen compounds such as triazine, 2, 4 dichloro-6-S-triazine 'sodium salt; divinyl sulfonic acid, 1,3 berylsulfolulu 2-propanol, ⁇ , ⁇ , monoethylenebis (birusulfuluolacetamide) ), 1, 3, 5 Tributyloyl-hexahydro S Triazine and other active bur compounds; dimethylol urea, methylol dimethylhydantoin and other ⁇ -methylol compounds; Epoxy resin; 1, 6-hexamethylene diis
  • silane coupling agent examples include: ⁇ -2 (aminoethyl) 3aminopropyl methyldimethoxysilane, ⁇ -2 (aminoethyl) 3aminopropyltrimethoxysilane, ⁇ - 2 (Aminoethyl) 3 Aminopropyltriethoxysilane, 3 Aminopropyltrimethoxysilane, 3 Aminopropyltriethoxysilane, 3 Triethoxysilyl mono N— (1, 3 Dimethyl
  • a silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd. can be suitably used.
  • the layer containing at least one of the cross-linking agent and the silane coupling agent can be appropriately selected depending on the purpose without any particular limitation.
  • the cushion layer and the noria layer are preferable. More preferably, the cushion layer alone is more preferable.
  • At least one of the components included in the support at least one selected from the component force included in the cushion layer, and the components included in the noria layer.
  • the component force contained in the cushion layer is selected from the components contained in the photosensitive layer, wherein at least one selected from the component force and at least one selected from the components contained in the barrier layer are made into a hydrophobic substance.
  • the component is polybulal alcohol
  • the polybulal alcohol having a saponification degree of 85% or less or a modified polybulal alcohol can be appropriately selected and used.
  • the polybulal alcohol may be used in combination with the crosslinking agent, the silane coupling agent, or the like.
  • modified polybulal alcohol examples include cation-modified polybulal alcohol (for example, carboxy-modified polybulal alcohol), cation-modified polybulal alcohol, acetoacetylated polybulal alcohol, silanol-modified polybulal alcohol, hydrophobic group-modified polybutyl alcohol.
  • examples include polybulal alcohol (for example, terminal alkylpolybulal alcohol), hydrophilic group-modified polyvinyl alcohol (for example, ethylene oxide-modified polybulal alcohol), terminal thiol polybulal alcohol, exeval (manufactured by KURARENE), and the like.
  • the cushion layer is prepared by dissolving the thermoplastic resin and, if necessary, other components in an organic solvent to prepare a coating solution (a coating solution for a thermoplastic resin layer). It can be formed by coating on the support.
  • a coating solution a coating solution for a thermoplastic resin layer.
  • the organic solvent include methyl ethyl ketone and 1-methoxy-2-propanol.
  • the photosensitive layer contains a binder, a polymerizable compound, and a photopolymerization initiator, and appropriately contains other components as necessary.
  • the photosensitive layer has a glass transition temperature, a melt viscosity, and a thickness range of the second layer. As long as it is satisfied, it can be appropriately selected according to the purpose for which there is no restriction.
  • the first photosensitive layer has a glass transition temperature of the first layer, The range of melt viscosity and thickness is satisfied, and the second photosensitive layer satisfies the range of glass transition temperature, melt viscosity, and thickness of the second layer.
  • the photosensitivity of the second photosensitive layer is higher than the photosensitivity of the first photosensitive layer.
  • the first photosensitive layer is irradiated with light having a wavelength of 405 nm. It is preferable that the minimum exposure amount that can be patterned on the photosensitive layer is larger than the minimum exposure amount that can be patterned on the second photosensitive layer.
  • the light irradiated from the support side during exposure proceeds in the order of the support, the first photosensitive layer, and the second photosensitive layer when the support is provided, and the curing of the second photosensitive layer is Before the first photosensitive layer, the process starts with a small amount of light energy.
  • the amount of light energy is increased after the entire second photosensitive layer is cured, curing of the first photosensitive layer starts, and when the amount of light energy is further increased, the entire first photosensitive layer is cured.
  • the amount of light energy at which the second photosensitive layer begins to cure is preferably in the range of 0.05-: LOmjZcm 2 , more preferably in the range of 0.1-5 mjZcm 2 0 A range of 15 to 2.5 mjZcm 2 is particularly preferred.
  • the amount of light energy required of the second photosensitive layer in order to cure in the range of preferably tool 0. 2 ⁇ 15mj / cm 2 in the range of 0. l ⁇ 20mj / cm 2 More preferably 0.4 to: LOmj / cm 2 is particularly preferable.
  • the ratio (AZB) of the amount of light energy A required to cure the second photosensitive layer to the amount of light energy B necessary to cure the first photosensitive layer is 0.005-0.
  • a force S in the range of 5 is preferable, a force in the range of 0.01 to 0.4 is more preferable than a force S, and a range of 0.02 to 0.35 is particularly preferable.
  • the ratio (CZA) between the amount of light energy A required to cure the second photosensitive layer and the amount of light energy C required until the first photosensitive layer begins to cure (CZA) is in the range of 1-10. It is particularly preferable that it is in the range of 1.1-9, and it is particularly preferable that it is in the range of 1.3-8.
  • the light energy C is particularly preferably in the range of 0.1 ⁇ 200MjZcm 2 is in the range of more preferably tool 2 ⁇ 50MiZcm 2 in the range of good Mashigu l ⁇ 100mjZcm 2.
  • the noinder is more preferably soluble in an alkaline liquid, preferably swellable in an alkaline liquid.
  • Suitable examples of the binder exhibiting swellability or solubility with respect to the alkaline liquid include those having an acidic group.
  • the acidic group is not particularly limited and may be appropriately selected depending on the purpose. Examples thereof include a carboxyl group, a sulfonic acid group, and a phosphoric acid group, and among these, a carboxyxenore group is preferable. .
  • binder having a carboxyl group examples include a vinyl copolymer having a carboxyl group, polyurethane resin, polyamic acid resin, and modified epoxy resin.
  • solubility in a coating solvent Viewpoints such as solubility in alkaline developer, suitability for synthesis, and ease of adjustment of film properties.
  • Vinyl copolymers having a carboxyl group are preferred.
  • the vinyl copolymer having a carboxyl group can be obtained by copolymerization with at least (1) a vinyl monomer having a carboxyl group, and (2) a monomer copolymerizable therewith. Examples thereof include compounds described in paragraphs 0164 to 0205 of 2005-258431.
  • the binder content in the photosensitive layer is not particularly limited. For example, 10 to 90% by mass is preferable, and 20 to 80% by mass is more preferable, and 40 to 80% by mass is particularly preferable.
  • the content is less than 10% by mass, the alkali developability and the adhesion to a printed wiring board forming substrate (for example, a copper-clad laminate) may be deteriorated. The stability against image time and the strength of the cured film (tent film) may be reduced.
  • the above content may be the total content of the binder and the polymer binder used in combination as necessary.
  • the binder content in the second photosensitive layer is included in the second photosensitive layer within the above range for sensitivity adjustment. If it is contained in the first photosensitive layer !, make adjustments such as lowering the binder content (higher content of the polymerizable compound).
  • the acid value of the binder can be appropriately selected depending on the purpose for which there is no particular limitation. For example, 100 to 250 (mgKOH / g) is preferable, and 120 to 220 (mgKOHZ g) is more preferable. The preferred range is 150 to 220 (mgKOH / g).
  • the acid value is less than lOO (mgKOHZg)
  • developability may be insufficient
  • resolution may be inferior
  • permanent patterns such as wiring patterns may not be obtained with high definition.
  • the amount exceeds / g
  • at least one of the developer resistance and adhesion of the pattern deteriorates, and a permanent pattern such as a wiring pattern may not be obtained with high definition.
  • the polymerizable compound can be appropriately selected according to the purpose without any particular limitation.
  • a monomer or oligomer having at least one of a urethane group and an aryl group is preferably exemplified. These preferably have two or more polymerizable groups.
  • Examples of the polymerizable group include an ethylenically unsaturated bond (for example, a (meth) atalyl group, a (meth) acrylamide group, a styryl group, a beryl group such as a butyl ester or a butyl ether, a allylic ether or the like.
  • Aryl groups such as aryl esters
  • polymerizable cyclic ether groups for example, epoxy groups, oxetane groups, etc.
  • the monomer having a urethane group is not particularly limited as long as it has a urethane group, and can be appropriately selected according to the purpose. For example, it is described in paragraphs 0210 to 0262 of JP 2005-258431 A. And the like.
  • the monomer having an aryl group is not particularly limited as long as it has an aryl group, and can be appropriately selected according to the purpose. For example, it is described in paragraphs 0263 to 0271 of JP 2005-258431 A. And the like.
  • a polymerizable monomer other than the monomer having a urethane group and the monomer having an aryl group may be used.
  • Examples of the polymerizable monomer other than the monomer containing a urethane group and the monomer containing an aromatic ring include the compounds described in paragraphs 0272 to 0284 of JP-A-2005-258431. It is done.
  • the content of the polymerizable compound in the photosensitive layer is, for example, preferably 5 to 90% by mass, more preferably 15 to 60% by mass, and particularly preferably 20 to 50% by mass.
  • the strength of the tent film may be reduced, and if it exceeds 90% by mass, edge fusion during storage (extruding failure of the roll end force) may be deteriorated. is there.
  • the monomer content of the second photosensitive layer is adjusted within the above range to adjust the sensitivity. Adjustment, such as making it higher than a content rate, may be performed.
  • the content of the polyfunctional monomer having two or more of the polymerizable groups in the polymerizable compound is preferably 5 to: L00 mass% is preferable 20 to: L00 mass% is more preferable 40 to 40 : L00% by mass is particularly preferable.
  • the photopolymerization initiator can be appropriately selected from known photopolymerization initiators that are not particularly limited as long as they have the ability to initiate polymerization of the polymerizable compound.
  • known photopolymerization initiators that are not particularly limited as long as they have the ability to initiate polymerization of the polymerizable compound.
  • the compound described in paragraphs 0286 to 0310 of JP-A-2005-258431 can be mentioned.
  • the content of the photopolymerization initiator in the photosensitive layer is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, and particularly preferably 0.5 to 15% by mass.
  • the amount of the photopolymerization initiator contained in the photosensitive layer may be larger than the amount of the photopolymerization initiator contained in the first photosensitive layer.
  • the photopolymerization initiator content of the second photosensitive layer is preferably 1.5 to L00 times the content of the photopolymerization initiator of the first photosensitive layer, and more preferably 1.8 times to A 50-fold amount is preferable, and a 2 to 20-fold amount is particularly preferable.
  • Examples of the other components include sensitizers, thermal polymerization inhibitors, plasticizers, color formers, colorants, and the like, and adhesion promoters to the substrate surface and other auxiliary agents (for example, pigments). , Conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, release accelerators, antioxidants, fragrances, thermal crosslinking agents, surface tension modifiers, chain transfer agents, etc.) .
  • Examples of these compounds include, for example, compounds described in JP-A-2005-258431, paragraphs 0312 and 0336, and the like. Properties such as stability, photographic properties, print-out properties, film properties, etc. can be adjusted.
  • the barrier layer can be appropriately selected according to the purpose without particular limitation as long as the movement of the substance can be suppressed, and is soluble in an alkaline liquid which may be water-soluble or water-dispersible. It may be insoluble.
  • the ability to suppress the movement of the substance means that the content of the target substance in the first layer and the second layer adjacent to the barrier layer is increased compared to the case where the barrier layer is not provided. Or it means that the decrease is suppressed.
  • the substance can be appropriately selected depending on the purpose for which there is no particular limitation.
  • the substance is included in at least one of oxygen, water, the first layer, and the second layer. Substances.
  • the barrier layer is water-soluble or water-dispersible
  • the barrier layer when the barrier layer is soluble in an alkaline liquid that preferably contains a water-soluble or water-dispersible resin, the alkaline liquid It is preferable to contain soluble greaves.
  • the water solubility is preferably, for example, preferably 0.1% by mass or more, and more preferably 1% by mass or more, with respect to 25 ° C. water.
  • the resin can be appropriately selected according to the purpose for which there is no particular limitation.
  • various alcohol-soluble resins, water-soluble resins, alcohol-dispersible resins, water-dispersible resins examples include fats, emulsifiable fats, and fats that are soluble in alkaline liquids.
  • specific examples include bulle polymers (for example, polybulal alcohol (including modified polybulal alcohols), polyvinylpyrrolidone, etc.), Examples thereof include the above-mentioned vinyl copolymers, water-soluble polyamides, gelatin, cellulose, and derivatives thereof.
  • the thermoplastic resin described in Japanese Patent No. 2794242 and the compounds used in the intermediate layer, the binder, and the like can also be used. These may be used alone or in combination of two or more.
  • the barrier layer is insoluble in the alkaline liquid
  • Examples of the resin insoluble in the alkaline liquid include a copolymer whose main component is ethylene as a necessary copolymer component.
  • the copolymer having ethylene as an essential copolymer component is a force that can be appropriately selected according to the purpose without any particular limitation.
  • ethylene vinyl acetate copolymer (EV A) ethylene-ethyl acrylate. Copolymer (EEA) and the like.
  • the thickness of the barrier layer can be appropriately selected according to the purpose for which there is no particular limitation. For example, it is preferably less than 10 ⁇ m, more preferably 0.1 to 6 ⁇ m 1 ⁇ 5 ⁇ m is particularly preferred.
  • the thickness is 10 / z m or more, light scattering occurs in the barrier layer during exposure, and at least one of resolution and adhesion may be deteriorated.
  • the support can be appropriately selected according to the purpose without particular limitation, Those having good light transmittance are preferred, and the surface smoothness is more preferred.
  • the support is preferably made of a synthetic resin and transparent, for example, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethylene, cellulose triacetate, cellulose diacetate, poly (meth) acrylic.
  • plastic films such as butyl acetate copolymer, polytetrafluoroethylene, polytrifluoroethylene, cellulose-based film, nylon film and the like can be mentioned, and among these, polyethylene terephthalate is particularly preferable. These may be used alone or in combination of two or more.
  • the thickness of the support is not particularly limited, and can be appropriately selected according to the purpose.
  • F column; t is 2-150 ⁇ m force S girlish, 5-: LOO ⁇ m force SJ-like girls, 8-50 ⁇ m force S Particularly preferred.
  • the shape of the support is not particularly limited and may be appropriately selected depending on the purpose, but is preferably long.
  • the length of the long support is not particularly limited, and examples thereof include a length of 10 m to 20000 m.
  • the pattern forming material may form a protective film on the second layer (photosensitive layer).
  • Examples of the protective film include those used for the support, paper, polyethylene, paper laminated with polypropylene, and the like. Among these, a polyethylene film and a polypropylene film are preferable.
  • the thickness of the protective film is not particularly limited and can be appropriately selected according to the purpose. For example, 5 to: LOO / zm force is preferable, 8 to 50 111 is preferable, and 10 to 30 / zm is preferable. Particularly preferred.
  • the interlayer adhesive force between the protective film and the second layer (photosensitive layer) is preferably the smallest among the interlayer adhesive forces of the other layers.
  • the support and the protective film examples include polyethylene terephthalate z polypropylene, polyethylene terephthalate z polyethylene, polychlorinated bur Z cellophane, polyimide Z polypropylene, polyethylene terephthalate z polyethylene terephthalate, and the like.
  • the above-described adhesive force relationship can be satisfied by surface-treating at least one of the support and the protective film.
  • the surface treatment of the support may be performed in order to increase the adhesive force with the first layer (cushion layer or first photosensitive layer).
  • coating of an undercoat layer corona discharge treatment
  • examples thereof include flame treatment, ultraviolet irradiation treatment, high frequency irradiation treatment, glow discharge irradiation treatment, active plasma irradiation treatment, and laser beam irradiation treatment.
  • the coefficient of static friction between the support and the protective film is preferably 0.3 to 1.4, more preferably 0.5 to 1.2 force! / !.
  • the pattern forming material is preferably stored, for example, wound around a cylindrical core and wound into a long roll.
  • the length of the long pattern forming material is not particularly limited, and can be appropriately selected, for example, a range force of 10 m to 20, OOOm.
  • slitting may be performed so that it is easy for the user to use, and a long body in the range of 100 m to l, OOOm may be rolled.
  • the support is wound up so as to be the outermost side.
  • the roll-shaped pattern forming material may be slit into a sheet shape.
  • a separator especially moisture-proof and desiccant-containing
  • the protective film may be surface-treated in order to adjust the adhesion between the protective film and the second layer (photosensitive layer).
  • an undercoat layer having a polymer strength such as polyorganosiloxane, fluorinated polyolefin, polyfluoroethylene, polyvinyl alcohol or the like is formed on the surface of the protective film.
  • the undercoat layer can be formed by applying the polymer coating solution to the surface of the protective film and then drying at 30 to 150 ° C (especially 50 to 120 ° C) for 1 to 30 minutes. it can.
  • the photosensitive layer, the barrier layer, the support, and the protective film in addition to the cushion layer, the photosensitive layer, the barrier layer, the support, and the protective film, as long as the glass transition point of the layer that contacts the substrate is the highest.
  • You may have layers, such as a layer and a surface protective layer. Each of the layers may have one layer or two or more layers.
  • the pattern forming material can be manufactured, for example, as follows. First, the materials contained in the first layer, the second layer, and the barrier layer are dissolved, emulsified or dispersed in water or a solvent to prepare a coating solution.
  • the solvent of the coating solution can be appropriately selected according to the purpose without any particular limitation.
  • methanol, ethanol, n-propanol, isopropanol, n-butanol, sec butanol, n- Alcohols such as hexanol; Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diisoptyl ketone; Ethyl acetate, butyl acetate, n-amyl acetate, methyl sulfate, ethyl ethyl propionate, phthalic acid Esters such as dimethyl, ethyl benzoate, and methoxypropyl acetate; aromatic hydrocarbons such as toluene, xylene, benzene, ethylbenzene; tetrasalt carbon, trichloroethylene, chloroform, 1, 1, 1-
  • Hydrogen fluorides such as tetrahydrofuran, jetyl ether, ethylenic glycolenomonoethylenoateol, ethyleneglycolenomonoethylenotenole, 1-methoxy-2-propanol; dimethylformamide, dimethylacetamide , Dimethyl sulfoxide, sulfolane and the like. These may be used alone or in combination of two or more. Moreover, you may add a well-known surfactant.
  • the first layer coating solution (cushion layer coating solution or first photosensitive layer coating solution) is applied onto the support and dried to form the first layer.
  • the noria layer coating solution is applied and dried to form a noria layer
  • the second layer coating solution (photosensitive layer coating solution) is formed on the barrier layer.
  • a coating solution for the second photosensitive layer and dried to form the second layer, whereby a pattern forming material can be produced.
  • the method of applying the coating solution is appropriately selected according to the purpose for which there is no particular limitation. For example, spray coating, roll coating, spin coating, slit coating, etching coating, curtain coating, die coating, gravure coating, wire bar coating, knife coating, etc. A method is mentioned.
  • the drying conditions vary depending on each component, the type of solvent, the ratio of use, etc., but are usually 60 to 110 ° C. for 30 seconds to 15 minutes.
  • the pattern forming material of the present invention is capable of forming a high-definition pattern excellent in uneven surface followability on the substrate surface and excellent in tent property and etching uniformity, various pattern formations are possible.
  • Suitable for forming permanent patterns such as wiring patterns, color filters, column materials, rib materials, spacers, liquid crystal structural members such as partition walls, and forming patterns for holograms, micromachines, proofs, etc.
  • it can be suitably used in the pattern forming method and pattern forming apparatus of the present invention.
  • the pattern forming apparatus of the present invention includes the pattern forming material of the present invention, and has at least light irradiation means and light modulation means.
  • the pattern forming method of the present invention includes at least an exposure step, and includes other steps appropriately selected.
  • the said exposure process is a process of exposing with respect to the photosensitive layer in the pattern formation material of this invention.
  • the pattern forming material of the present invention is as described above.
  • the exposure target is not particularly limited as long as it is a photosensitive layer in the pattern forming material, and can be appropriately selected according to the purpose.
  • the pattern forming material is formed on a substrate. It is preferable to be performed on the laminated body.
  • the substrate may be appropriately selected from known materials having no particular limitation, medium strength, high surface smoothness, force, and a surface having an uneven surface, but a plate-shaped substrate (substrate) may be used.
  • a plate-shaped substrate for example, copper-clad laminate
  • glass plate for example, soda glass plate
  • synthetic resin film for example, paper, metal plate, etc.
  • the layer structure of the laminate includes at least the second layer and the first layer in this order on a substrate, for example, (1) the substrate, the photosensitive layer, the cushion layer, And (2) a layer configuration having the substrate, the second photosensitive layer, the first photosensitive layer, and the support in this order, and (3) the substrate, the photosensitive layer.
  • a layer structure having and in this order is preferred.
  • the method of forming the laminate can be appropriately selected according to the purpose without any particular limitation, but at least one of heating and pressurizing the pattern forming material on the substrate is performed! While preferred, laminating.
  • the heating temperature can be appropriately selected without particular limitation as long as the temperature exceeds the glass transition temperature of the second layer, and is preferably 40 to 150 ° C., for example.
  • the pressure of the pressurization is a force that can be appropriately selected according to the purpose for which there is no particular limitation.
  • F column; t is preferably 0.1 to 1. OMPa force, 0.2 to 0.8 MPa force ⁇ More preferred! / ⁇ .
  • the apparatus for performing at least one of heating and pressurization can be appropriately selected according to the purpose of restriction, and examples thereof include a laminator and a vacuum laminator.
  • the apparatus for performing at least one of the heating and pressurization can be appropriately selected according to the purpose of restriction, such as a laminator (for example, VP-— manufactured by Taisei Laminator Co., Ltd.) Are preferable.
  • a laminator for example, VP-— manufactured by Taisei Laminator Co., Ltd.
  • the exposure of the laminate can be appropriately selected according to the purpose without any particular limitation.
  • the photosensitive layer may be exposed through the support, the cushion layer, and the barrier layer. After the support, cushion layer and barrier layer are peeled off, the photosensitive layer may be exposed.
  • the exposure can be appropriately selected according to the purpose for which there is no particular limitation, and powers such as digital exposure, analog exposure, etc. Among these, digital exposure is preferable.
  • the digital exposure can be appropriately selected according to the purpose without particular limitation. For example, it is preferable to generate a control signal based on the pattern formation information to be formed, and to use light modulated in accordance with the control signal.
  • the digital exposure means can be appropriately selected according to the purpose without any particular limitation.
  • Examples thereof include a light modulation unit that modulates the irradiated light.
  • the light modulating means can be appropriately selected according to the purpose without any limitation as long as light can be modulated.
  • the light modulating means preferably has n pixel portions.
  • the light modulation means having the n picture elements can be appropriately selected according to the purpose without any particular limitation, and for example, a spatial light modulation element is preferable.
  • Examples of the spatial light modulator include a digital micromirror device (DMD), a MEMS (Micro Electro Mechanical Systems) type spatial light modulator (SLM; Special Light Modulator), and transmission by an electro-optic effect.
  • Examples include optical elements that modulate light (PLZT elements) and liquid crystal light shirts (FLC). Among these, DMD is preferred.
  • the light modulation means includes pattern signal generation means for generating a control signal based on pattern information to be formed.
  • the light modulating means modulates light according to the control signal generated by the pattern signal generating means.
  • control signal can be appropriately selected according to the purpose for which there is no particular limitation.
  • a digital signal is preferably used.
  • Examples of the light modulation means include those described in paragraphs 0016 to 0047 of JP-A-2005-258431.
  • the light irradiation means can be appropriately selected according to the purpose without any particular limitation.
  • a known light source such as a semiconductor laser or means capable of combining and irradiating two or more lights can be mentioned. Among these, means capable of combining and irradiating two or more lights are preferable.
  • the light emitted from the light irradiation means is, for example, an electromagnetic wave that passes through the support and activates the photopolymerization initiator and sensitizer used when the light is irradiated through the support. In particular, ultraviolet to visible light, electron beams, X-rays, laser light, etc.
  • laser light is preferred.
  • Laser that combines two or more lights (hereinafter sometimes referred to as “combined laser”) ) Is more preferable. Even when the support is peeled off and the light is irradiated with light, the same light can be used.
  • the ultraviolet power is preferably 300 to 1500 nm, more preferably 320 to 800 mn, and 330 ⁇ ! ⁇ 650mn force ⁇ especially preferred!
  • the wavelength of the laser beam is, for example, preferably 200 to 1500 nm force S, more preferably 300 to 800 nm force S, and 330 mm! ⁇ 500mn force more preferred, 400 ⁇ ! ⁇ 450mn power ⁇ especially preferred! /,
  • a plurality of lasers, a multimode optical fiber, and a laser beam irradiated with each of the plurality of laser forces are condensed and coupled to the multimode optical fiber.
  • Means having a collective optical system to be used is preferable.
  • Examples of means (fiber array light source) that can irradiate the combined laser include means described in paragraphs 0110 to 0146 of JP-A No. 2005-258431.
  • the exposure is preferably performed using the modulated light through a microlens array, and may be performed through an aperture array, an imaging optical system, or the like.
  • the microlens array is a force that can be appropriately selected according to the purpose without any particular limitation.
  • a microlens having an aspherical surface capable of correcting aberration due to distortion of the exit surface in the pixel portion Preferred are those arranged.
  • the aspherical surface can be appropriately selected according to the purpose for which there is no particular limitation.
  • a toric surface is preferable.
  • Examples of the means such as the microlens array, the aperture array, and the imaging optical system include the means described in Paragraph 0050 Force et al. .
  • the light of the microlens 55a is used.
  • the end surface on the emission side is an aspheric surface (toric surface)
  • a microlens array is configured by using microlenses in which one of the two light passing end surfaces is a spherical surface and the other is a cylindrical surface. Similar effects can be obtained.
  • the microlens force of the microlens array is an aspherical shape that corrects aberration due to distortion of the reflecting surface of the micromirror, but such an aspherical shape is adopted.
  • the same effect can be obtained by providing each microphone lens constituting the microlens array with a refractive index distribution that corrects aberration due to distortion of the reflection surface of the micromirror.
  • FIG. 1 and FIG. 2 respectively show the front shape and the side shape of the micro lens 155a.
  • the external shape of the micro lens 155a is a parallel plate shape.
  • the x and y directions in the figure are as described above.
  • FIG. 1 and 2 schematically show the condensing state of the laser beam B in the cross section parallel to the X direction and the y direction by the microlens 155a.
  • the microlens 155a has a refractive index distribution that gradually increases toward the outside of the optical axis O force.
  • the broken line shown in the microlens 155a in FIG. The position changed with the pitch is shown.
  • the ratio of the refractive index change of the microlens 155a is larger in the latter cross section, and the focal length Is getting shorter. Even when a microlens array composed of such a refractive index distribution type lens is used, the same effect as in the case of using the microlens array 55 can be obtained.
  • microlens having the aspherical surface shape like the microlens 55a shown in Figs. 3 to 6 the above refractive index distribution is given together, and both the surface shape and the refractive index distribution are provided. However, it is possible to correct the aberration caused by distortion of the reflecting surface of the micromirror 62.
  • the aberration due to the distortion of the reflection surface of the micromirror 62 constituting the DMD 50 is corrected.
  • the pattern forming method of the present invention using a spatial light modulation element other than the DMD.
  • the present invention is applied to correct the aberration caused by the distortion, and the beam shape may be distorted. Can be prevented.
  • the cross-sectional area force of the light beam reflected by the DMD 50 in the ON direction is several times by the lens systems 454 and 458 (for example, 2x).
  • the expanded laser light is condensed by each microlens of the microlens array 472 so as to correspond to each pixel part of the DMD 50 and passes through a corresponding aperture of the aperture array 476.
  • the laser beam that has passed through the aperture is imaged on the lens system 480, 482 [exposed surface 56].
  • the laser beam reflected by the DMD 50 is magnified several times by the magnifying lenses 454 and 458 and projected onto the exposed surface 56, so that the entire image area is widened. .
  • the microlens array 472 and the aperture array 476 are not arranged, one pixel size (spot size) of each beam spot BS projected onto the exposure surface 56 is exposed as shown in FIG.
  • the size increases according to the size of area 468, and the MTF (Modulation Transfer Function) characteristic representing the sharpness of exposure area 468 is degraded.
  • the laser light reflected by the DMD50 corresponds to each pixel part of the DMD50 by each microlens of the microlens array 472. Focused. As a result, as shown in FIG. 9, even when the exposure area is enlarged, the spot size of each beam spot BS can be reduced to a desired size (for example, lO ⁇ mX lO ⁇ m). It is possible to perform high-precision exposure by preventing a decrease in the exposure time.
  • the exposure area 468 is inclined because the DMD 50 is inclined to eliminate the gap between the pixels.
  • the aperture array can shape the beam so that the spot size on the exposed surface 56 is constant. At the same time, by passing through an aperture array provided corresponding to each pixel, crosstalk between adjacent pixels can be prevented.
  • the angle of the light beam incident on each microlens of the microlens array 472 from the lens 458 becomes small. It is possible to prevent a part of the light beam from entering. That is, high quenching Ratio can be realized.
  • the pattern forming method of the present invention may be used in combination with other optical systems appropriately selected from known optical systems, for example, a light quantity distribution correcting optical system composed of a pair of combination lenses.
  • the light quantity distribution correcting optical system changes the light flux width at each exit position so that the ratio of the light flux width in the peripheral portion to the light flux width in the central portion close to the optical axis is smaller on the exit side than on the entrance side.
  • Examples of the light quantity distribution correcting optical system include means described in paragraphs 0090 to 0105 of JP-A-2005-258431.
  • the developing step exposes the photosensitive layer in the pattern forming material in the exposing step, cures the exposed region of the photosensitive layer, and then removes the uncured region to form an image, thereby forming a no-turn. It is a process.
  • the development step can be preferably carried out, for example, by a developing means.
  • the developing means is not particularly limited as long as it can be developed using a developer, and can be appropriately selected according to the purpose.
  • the means for spraying the developer, and applying the developer And means for immersing in the developer may be used alone or in combination of two or more.
  • the developing unit may include a developing solution replacing unit that replaces the developing solution, a developing solution supply unit that supplies the developing solution, and the like.
  • the developer can be appropriately selected depending on the purpose without any particular limitation, and examples thereof include alkaline solutions, aqueous developers, organic solvents, and the like. Alkaline aqueous solutions are preferred.
  • the basic component of the weak alkaline liquid include lithium hydroxide, sodium hydroxide, potassium hydroxide, lithium carbonate, sodium carbonate, potassium carbonate, lithium hydrogen carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium phosphate, phosphorus
  • Examples include potassium acid, sodium pyrophosphate, potassium pyrophosphate, and borax.
  • the pH of the weakly alkaline aqueous solution is more preferably about 9 to 11 force, for example, preferably about 8 to 12.
  • Examples of the weak alkaline aqueous solution include 0.1 to 5% by mass of sodium carbonate aqueous solution or potassium carbonate aqueous solution.
  • the temperature of the developer can be appropriately selected according to the developability of the photosensitive layer, and for example, about 25 ° C. to 40 ° C. is preferable.
  • the developer is a surfactant, an antifoaming agent, an organic base (for example, ethylenediamine, ethanolamine, tetramethylammonium hydroxide, diethylenetriamine, triethylenepentamine, morpholine, triethanolamine, etc.)
  • an organic solvent for example, alcohols, ketones, esters, ethers, amides, latatones, etc.
  • the developer may be an aqueous developer obtained by mixing water or an alkaline aqueous solution and an organic solvent, or may be an organic solvent alone.
  • the etching step can be performed by a method appropriately selected from among known etching methods.
  • the etching solution used for the etching treatment can be appropriately selected according to the purpose without any particular limitation.
  • a cupric chloride solution examples thereof include a ferric solution, an alkaline etching solution, and a hydrogen peroxide-based etching solution.
  • a point strength of etching factor—a salty ferric solution is preferable.
  • a permanent pattern can be formed on the surface of the substrate by removing the pattern after performing the etching process in the etching step.
  • the permanent pattern is not particularly limited and can be appropriately selected according to the purpose, and examples thereof include a wiring pattern.
  • the plating step can be performed by an appropriately selected method selected from known plating processes.
  • the plating treatment include copper plating such as copper sulfate plating and copper pyrophosphate plating, solder plating such as high-flow solder plating, nickel plating such as watt bath (nickel sulfate-salt nickel nickel) plating, and nickel sulfamate.
  • gold plating such as hard gold plating and soft gold plating.
  • a permanent pattern can be formed on the surface of the substrate by removing the pattern after performing a plating process in the plating process, and further removing unnecessary portions by an etching process or the like as necessary.
  • the pattern forming method of the present invention can be suitably used for the production of a printed wiring board, particularly for the production of a printed wiring board having a hole portion such as a through hole or a via hole.
  • a hole portion such as a through hole or a via hole.
  • the second pattern forming material is placed on the printed wiring board forming substrate having the hole portion as the base.
  • Layers photosensitive layer or second photosensitive layer
  • the photosensitive layer is cured by irradiation, (3) the support in the pattern forming material and the cushion layer are removed from the laminate when the cushion layer is provided, and (4) the photosensitive layer in the laminate is developed.
  • the pattern can be formed by removing the uncured portion in the laminate.
  • the removal of the cushion layer is not particularly limited, and may be performed anywhere after (2).
  • the cushion layer is insoluble in the alkaline liquid, it is preferably removed before (4).
  • the removal of the support in (3) may be performed between (1) and (2) instead of between (2) and (4).
  • the barrier layer May be removed together with the support in (3) or may be removed during development in (4).
  • a method of etching or plating the printed wiring board forming substrate using the formed pattern for example, a known subtractive method or additive method (for example, Semi-additive method and full additive method)).
  • the subtractive method is preferable in order to form a printed wiring board with industrially advantageous tenting.
  • the cured resin remaining on the printed wiring board forming substrate is peeled off.
  • the copper thin film portion is further etched after the peeling to produce a desired printed wiring board. can do.
  • a multilayer printed wiring board can also be manufactured in the same manner as the printed wiring board manufacturing method.
  • a printed wiring board forming substrate having through holes and having a surface covered with a metal plating layer is prepared.
  • the printed wiring board forming substrate for example, a copper clad laminated substrate and a substrate in which a copper plating layer is formed on an insulating base material such as glass-epoxy, or an interlayer insulating film is laminated on these substrates, and a copper plating layer is formed.
  • a formed substrate (laminated substrate) can be used.
  • the protective film is peeled off, and the second layer (photosensitive layer or second photosensitive layer) in the pattern forming material becomes the print Pressure is applied using a pressure roller so as to be in contact with the surface of the wiring board forming substrate (lamination process).
  • the laminated body which has the said board
  • the lamination temperature of the pattern forming material is preferably a force that can be appropriately selected as long as it exceeds the glass transition temperature of the second layer. For example, 40 to 150 ° C. is preferable.
  • the roll pressure of the pressure-bonding roll is not particularly limited and can be appropriately selected. For example, 0.1 to LMPa is preferable.
  • the speed of the crimping can be selected as appropriate without any particular limitation. z minutes are preferred.
  • the printed wiring board forming substrate may be preheated or laminated under reduced pressure.
  • the photosensitive layer is cured by irradiating light from the surface of the laminate opposite to the substrate.
  • the support may be peeled off and the force may be exposed.
  • the barrier layer may be peeled off and the force may be exposed.
  • the uncured region of the photosensitive layer on the printed wiring board forming substrate is dissolved and removed with an appropriate developer, and the cured layer for forming the wiring pattern and the curing for protecting the metal layer of the through hole are performed.
  • a layer pattern is formed to expose the metal layer on the surface of the printed wiring board forming substrate (development process).
  • a post-heating treatment or a post-exposure treatment may be performed to further accelerate the curing reaction of the cured portion.
  • the development may be a wet development method as described above or a dry development method.
  • etching step the metal layer exposed on the surface of the printed wiring board forming substrate is dissolved and removed with an etching solution (etching step). Since the opening of the through hole is covered with a cured resin composition (tent film), the metal coating of the through hole prevents the etching solution from entering the through hole and corroding the metal plating in the through hole. Will remain in the prescribed shape. Thereby, a wiring pattern is formed on the printed wiring board forming substrate.
  • the etching solution is not particularly limited and can be appropriately selected depending on the purpose.
  • a cupric chloride solution examples thereof include a ferric solution, an alkaline etching solution, a hydrogen peroxide-based etching solution, and the like.
  • a salty ferric solution is preferable from the viewpoint of an etching factor.
  • the printed wiring board is formed by using the hardened layer as a release piece with a strong alkaline aqueous solution or the like. Remove from the forming substrate (cured product removal step).
  • the base component in the strong alkaline aqueous solution is not particularly limited, and examples thereof include sodium hydroxide and potassium hydroxide.
  • the pH of the strong alkaline aqueous solution is, for example, preferably about 13-14, more preferably about 12-14.
  • the strong alkaline aqueous solution is not particularly limited, and examples thereof include 1 to 10% by mass of sodium hydroxide aqueous solution or potassium hydroxide aqueous solution.
  • the printed wiring board may be a multilayer printed wiring board.
  • the pattern forming material may be used in a Meki process that is performed only by the etching process.
  • the plating method include copper plating such as copper sulfate plating and copper pyrophosphate plating, solder plating such as high-throw solder plating, watt bath (nickel sulfate-salt nickel) plating, nickel plating such as nickel sulfamate, Examples include hard gold plating and gold plating such as soft gold plating.
  • the pattern forming method of the present invention uses the pattern forming material of the present invention, formation of various patterns, formation of permanent patterns such as wiring patterns, color filters, pillar materials, rib materials, spacers, etc. It can be suitably used for the production of liquid crystal structural members such as partition walls, holograms, micromachines, proofs, etc., and can be particularly suitably used for the formation of high-definition wiring patterns.
  • the pattern forming apparatus of the present invention includes the pattern forming material of the present invention, it forms various patterns, forms permanent patterns such as wiring patterns, color filters, pillar materials, rib materials, spacers, partition walls It can be suitably used for the production of liquid crystal structure members such as holograms, micromachines, and proofs, and can be particularly suitably used for the formation of high-definition wiring patterns.
  • 16 ⁇ m thick polyethylene terephthalate film (16QS52, East (Co., Ltd.) is coated with a coating solution for the first layer (first photosensitive layer) having the following composition and dried to form the first layer (first photosensitive layer) 25 ⁇ m thick did.
  • first photosensitive layer On the formed first layer (first photosensitive layer), a coating solution for the second layer (second photosensitive layer) having the following composition was applied and dried to give a thickness of 5 m. A second layer (second photosensitive layer) was formed.
  • a 12 m thick polypropylene film (E501, manufactured by Oji Paper Co., Ltd.) was laminated as a protective film on the formed second layer (second photosensitive layer) to produce a pattern forming material. It was.
  • the glass transition temperature (Tg) and the melt viscosity at 60 ° C. of the first layer and the second layer were measured by the following methods. The results are shown in Table 3.
  • Samples for measurement in which the first layer and the second layer were formed with a thickness of 1 cm were prepared.
  • the viscosity of the sample for measurement was measured by increasing the temperature from room temperature at a rate of 20 ° CZ using a solid meter MR300 (manufactured by Rheology).
  • a copper-clad laminate (no through hole, copper thickness 12 / zm) whose surface was polished, washed with water and dried was prepared, and on the copper-clad laminate, a second of the pattern forming material was prepared.
  • Laminator MODEL8B-720-PH, manufactured by Taisei Laminator Co., Ltd.
  • a laminate was prepared in which the copper-clad laminate, the second layer (second photosensitive layer), the first layer (first photosensitive layer), and the support were laminated in this order.
  • the crimping conditions were a crimping roll temperature of 105 ° C, a crimping roll pressure of 3 kgZcm 2 , and a crimping speed of lmZ.
  • the thickness of the film composed of the first layer and the second layer laminated on the substrate was measured using a stylus type film thickness meter (Surfcom 1400D, manufactured by Tokyo Seimitsu Co., Ltd.), and a surface of 510 X 610 cm In product, 50 arbitrary points on the substrate surface were measured. As a result, the film thickness variation is ⁇ 0.1 ⁇ m.
  • the peeled off the laminate strength the support it was sprayed at a pressure of 0. 15 MPa 1 mass 0/0 aqueous sodium carbonate 30 ° C to the first photosensitive layer over the force over the entire surface of the copper-clad laminates, sodium carbonate
  • the time required from the start of spraying of the aqueous solution until the photosensitive layer on the copper clad laminate was dissolved and removed was measured, and this was taken as the shortest development time. As a result, the shortest image time was 25 seconds.
  • the following pattern forming apparatus having a 405 nm laser light source as the light irradiating means is used, from 0. lmj / cm 2 to 2 1/2 Exposure was performed by irradiating with different light energy amounts up to 100 mj / cm 2 at double intervals to cure a part of the photosensitive layer. After standing at room temperature for 10 minutes, the support was peeled off from the laminate, and an aqueous sodium carbonate solution (30 ° C, 1% by mass) was applied to the entire surface from the first photosensitive layer on the copper clad laminate.
  • Spraying was performed at a spray pressure of 0.15 MPa for twice the minimum development time determined in (1) above, and the uncured area was dissolved and removed, and the thickness of the remaining cured area was measured. Subsequently, the relationship between the light irradiation amount and the thickness of the cured layer was plotted to obtain a sensitivity curve. As a result, when the thickness of the hardened layer becomes the thickness of the second layer (5 ⁇ m), the amount of light energy S 1 is 4 mjZcm 2 , and the thickness of the hardened layer is the same as that of the first layer and the second layer.
  • the amount of light energy S2 when the thickness with the second layer (30 ⁇ m) is 40 mjZcm 2
  • the amount of light energy when the thickness of the hardened layer exceeds the thickness of the second layer (5 ⁇ m) S3 was 14 mjZcm 2 .
  • S1 is the light energy necessary to cure the second photosensitive layer
  • S2 is the light energy necessary to cure the first photosensitive layer
  • S3 is necessary before the first photosensitive layer is cured.
  • the combined laser light source shown in FIGS. 10 to 16 as the light irradiating means, and the micromirror array in which 1024 micromirrors are arranged in the main scanning direction shown in FIGS. 17 and 18 as the light modulating means are in the sub-scanning direction.
  • the pattern forming apparatus including the microlens array 472 and the optical systems 480 and 482 for forming an image of the light passing through the microlens array on the photosensitive layer was used.
  • a vacuum frame (not shown) in which the laminate is stored is arranged on a stage 152 of the pattern forming apparatus shown in FIG. 19, and the photosensitive layer 150 of the laminate is exposed.
  • the aperture array 59 disposed in the vicinity of the condensing position of the microlens array 55 is disposed so that only light that has passed through the corresponding microlens 55a is incident on each aperture 59a.
  • the surface of a copper clad laminate having a through hole with a diameter of 3 mm having a copper plating layer on the inner wall was polished, washed with water, and dried to prepare a substrate.
  • a laminator (MODEL8B-720-PH) is formed on the copper clad laminate while peeling off the protective film so that the second layer (second photosensitive layer) of the pattern forming material is in contact with the copper clad laminate.
  • the copper clad laminate, the second layer (second photosensitive layer), the first layer (first photosensitive layer), and the support are laminated using a Taisei Laminator Co., Ltd.
  • a laminate was prepared in which and were laminated in this order.
  • the pressing conditions were a pressure roll temperature of 105 ° C, a pressure roll pressure of 3 kgZcm 2 , and a pressure bonding speed of lmZ.
  • the substrate was allowed to stand at room temperature for 10 minutes, and then the support was peeled off from the laminate, and the upper force of the first layer (first photosensitive layer) on the copper-clad laminate was also applied to the entire surface with an aqueous sodium carbonate solution ( (30 ° C, 1% by mass) was sprayed at a spray pressure of 0.15 MPa for twice the minimum development time obtained in (1) above, and uncured areas were dissolved and removed to form a cured layer pattern. .
  • an aqueous sodium carbonate solution (30 ° C, 1% by mass
  • the thickness of the cured layer pattern was measured. In addition, the pattern was observed with a microscope to observe the presence or absence of pattern defects. As a result, the thickness of the hardened layer was 5 ⁇ m ⁇ 0.05 ⁇ m, and no pattern defects were observed.
  • an iron chloride etchant (ferric chloride-containing etching solution) is sprayed on the surface of the laminate on which the hardened layer pattern is formed, and the hardened layer pattern is not formed and the exposed copper layer is not exposed. Was dissolved and removed. Thereafter, a 2% by mass aqueous solution of sodium hydroxide and sodium hydroxide was sprayed to remove the hardened layer pattern to obtain a printed wiring board.
  • Example 1 support was conducted in the same manner as in Example 1 except that the coating solution for the cushion layer was not added without adding 4,4 bis (jetylamino) benzophenone and benzophenone in the coating solution for the first layer.
  • a pattern forming material having a body, a first layer (cushion layer), a second layer (photosensitive layer), and a protective film in this order was produced.
  • a laminate having a substrate, a second layer (photosensitive layer), a first layer (cushion layer), and a support in this order, and a printed wiring board were produced.
  • Table 3 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • Example 1 a coating solution for the NORA layer having the following composition was applied on the first layer and dried to form a 1.6 m thick NORA layer.
  • a pattern forming material having a support, a first layer (first photosensitive layer), a barrier layer, a second layer (second photosensitive layer), and a protective film in this order was produced.
  • Table 3 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • the amount of light energy S2 required to cure the first photosensitive layer was the amount of light energy when the thickness of the cured layer reached 31.6 ⁇ m.
  • Example 1 the same procedure as in Example 1 was applied, except that a barrier layer coating solution similar to that in Example 3 was applied and dried to form a 1.6 ⁇ -thick noria layer.
  • a laminated body having a substrate, a second layer (photosensitive layer), a barrier layer, a first layer (cushion layer), and a support in this order, and a printed wiring board were produced. did.
  • Table 3 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • Example 1 the blending amount of dodecapropylene glycol ditalylate in the coating solution for the first layer (first photosensitive layer) was 3.5 parts by mass, A support, a first layer (first photosensitive layer), a second layer (second photosensitive layer), the same as in Example 1 except that the blending amount of dimetatalylate was 0.5 parts by mass, And the pattern formation material which has a protective film in this order was manufactured. Further, in the same manner as in Example 1, a laminated body having a substrate, a second layer (second photosensitive layer), a first layer (first photosensitive layer), and a support in this order, and a printed wiring board are manufactured. did.
  • Table 3 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • Example 2 the blending amount of dodecapolypropylene glycol diatalylate in the coating solution for the first layer (cushion layer) is 3.5 parts by mass, and the blending amount of tetraethylene glycol dimetatalylate is 0.5 parts by mass.
  • a pattern forming material having a support, a first layer (cushion layer), a second layer (photosensitive layer), and a protective film in this order was produced in the same manner as in Example 2 except that.
  • a laminate having a substrate, a second layer (photosensitive layer), a first layer (cushion layer), and a support in this order, and a printed wiring board were produced.
  • Table 3 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • Example 3 the blending amount of dodecapropylene glycol ditalarirate in the coating solution for the first layer (first photosensitive layer) is 3.5 parts by mass, and the blending amount of tetraethylenedaricol dimetatalylate is 0.
  • a support, a first layer (first photosensitive layer), a barrier layer, a second layer (second photosensitive layer), and a protective film were prepared in the same manner as in Example 3 except that the content was 5 parts by mass.
  • the pattern formation material which has in order was manufactured. Further, in the same manner as in Example 3, a laminate having a substrate, a second layer (second photosensitive layer), a barrier layer, a first layer (first photosensitive layer), and a support in this order, and a print A wiring board was manufactured.
  • Table 3 shows the temperature (Tg) and melt viscosity at 60 ° C.
  • Table 4 shows the film thickness variation, sensitivity, resolution, and etching line width variation in the laminate.
  • Example 4 the blending amount of dodecapolypropylene glycol diatalylate in the coating solution for the first layer (cushion layer) is 3.5 parts by mass, and the blending amount of tetraethylene glycol dimetatalylate is 0.5 parts by mass.
  • a pattern forming material having a support, a first layer (cushion layer), a barrier layer, a second layer (photosensitive layer), and a protective film in this order was produced in the same manner as in Example 4. did. Further, in the same manner as in Example 1, a laminate having a substrate, a second layer (photosensitive layer), a barrier layer, a first layer (cushion layer), and a support in this order, and a printed wiring board were produced. .
  • Table 1 shows the glass transition temperatures (Tg) of the first layer and the second layer in the pattern forming material and the melt viscosity at 60 ° C.
  • Table 2 shows the variation in film thickness, sensitivity, resolution, and etching line width in the laminate.
  • the pattern forming material of the present invention is capable of forming a pattern capable of forming a high-definition pattern excellent in uneven surface followability on the substrate surface and excellent in tent properties and etching uniformity.
  • Suitable for pattern formation formation of permanent patterns such as wiring patterns, manufacturing of liquid crystal structural members such as color filters, pillars, ribs, spacers, partition walls, holograms, micromachines, proofs, etc. In particular, it can be suitably used for forming a high-definition wiring pattern.
  • the pattern forming apparatus of the present invention includes the pattern forming material of the present invention, it forms various patterns, forms permanent patterns such as wiring patterns, color filters, pillar materials, rib materials, spacers, partition walls It can be suitably used for the production of liquid crystal structural members such as holograms, micromachines, and proofs, and can be particularly suitably used for the formation of high-definition wiring patterns.
  • the pattern forming method of the present invention uses the pattern forming material of the present invention, the formation of various patterns, the formation of permanent patterns such as wiring patterns, color filters, pillar materials, rib materials, and spacers. It can be suitably used for the production of liquid crystal structural members such as sir and partition walls, the production of holograms, micromachines, and proofs, and is particularly suitable for the formation of high-definition wiring patterns.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

L’invention concerne un matériau de formation de motifs permettant d’obtenir un motif extrêmement fin, avec une excellente caractéristique d’irrégularité suivante d’une surface de matériau de base et d’une excellente uniformité dans un film de tente et une gravure, un appareil de formation de motifs pourvu du matériau de formation de motifs, et un procédé de formation de motifs utilisant le matériau de formation de motifs. Le matériau de formation de motifs est muni successivement d’une première couche et d’une seconde couche sur un corps support et satisfait à la relation B ≥ A, où A est une température de transition vitreuse (Tg) de la première couche, et B est une température de transition vitreuse (Tg) de la seconde couche. L'invention concerne également un appareil de formation de motifs pourvu d‘un tel matériau de formation de motifs. De plus, elle porte sur un procédé de formation de motifs qui englobe au moins une phase d’exposition d’une couche photosensible dans le matériau de formation de motifs.
PCT/JP2006/303404 2005-03-04 2006-02-24 Matériau de formation de motifs, appareil de formation de motifs et procédé de formation de motifs WO2006093040A1 (fr)

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WO2022215283A1 (fr) * 2021-04-06 2022-10-13 株式会社 ムラカミ Film stratifié pour formation de motif, plaque de sérigraphie non photosensible et son procédé de fabrication

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JP5068603B2 (ja) * 2007-08-22 2012-11-07 富士フイルム株式会社 感光性転写材料、隔壁及びその形成方法、カラーフィルタ及びその製造方法、並びに表示装置
KR101396621B1 (ko) * 2012-10-15 2014-05-16 삼성전기주식회사 드라이 필름 및 이를 이용한 회로 기판 제조 방법
JP2016080803A (ja) * 2014-10-14 2016-05-16 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
JP6018664B2 (ja) * 2015-04-13 2016-11-02 三菱製紙株式会社 サンドブラスト用感光性フィルム
WO2019022089A1 (fr) * 2017-07-28 2019-01-31 富士フイルム株式会社 Composition de résine photosensible, matériau de transfert photosensible, procédé de production de câblage de circuit, et procédé de production de panneau tactile
WO2019151534A1 (fr) * 2018-02-05 2019-08-08 富士フイルム株式会社 Matériau de transfert photosensible, procédé de fabrication de câblage de circuit, et procédé de fabrication d'écran tactile
CN111684359A (zh) * 2018-02-05 2020-09-18 富士胶片株式会社 感光性转印材料、电路布线的制造方法及触摸面板的制造方法

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