WO2006088276A1 - Insulation based ring of condenser microphone having ventilation pattern - Google Patents
Insulation based ring of condenser microphone having ventilation pattern Download PDFInfo
- Publication number
- WO2006088276A1 WO2006088276A1 PCT/KR2005/002615 KR2005002615W WO2006088276A1 WO 2006088276 A1 WO2006088276 A1 WO 2006088276A1 KR 2005002615 W KR2005002615 W KR 2005002615W WO 2006088276 A1 WO2006088276 A1 WO 2006088276A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- based ring
- ring
- casing
- insulation based
- insulation
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 117
- 238000009423 ventilation Methods 0.000 title claims abstract description 74
- 239000002184 metal Substances 0.000 claims description 50
- 125000006850 spacer group Chemical group 0.000 claims description 33
- 230000035515 penetration Effects 0.000 claims description 10
- 230000035945 sensitivity Effects 0.000 abstract description 9
- 230000007547 defect Effects 0.000 abstract description 7
- KENZYIHFBRWMOD-UHFFFAOYSA-N 1,2-dichloro-4-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C=C(Cl)C(Cl)=CC=2)=C1 KENZYIHFBRWMOD-UHFFFAOYSA-N 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Abstract
The present invention relates to a condenser microphone and an insulation based ring thereof comprising a ventilation pattern, and more particularly to an insulation based ring for insulating an internal component from a casing of the condenser microphone characterized in that a side ventilation pattern having a predetermined shape is formed on an outer sidewall facing an inner sidewall of the casing so that a portion of the outer sidewall is in contact with the casing to prevent a defect in sensitivity caused by a shutdown of the ventilation path during an assembly of the condenser microphone due to an adhesion of component or faulty dimension of the internal components, and to easily adjust a characteristic of the condenser microphone by controlling the number, a width, a depth, and a shape of the side ventilation pattern.
Description
Description
INSULATION BASED RING OF CONDENSER MICROPHONE HAVING VENTILATION PATTERN
Technical Field
[1] The present invention relates to an insulation based ring having a side ventilation slit and a condenser microphone including the same. Background Art
[2] As a technology develops, a size of electronic devices such as a cellular phone, telephone and a camcorder is reduced. In addition, a size of a condenser microphone which is an acoustic input component used for the electronic devices is also reduced. As shown in Fig. 1, a back type condenser microphone commonly used generally includes a casing 10 for defining an external shape and for providing a electrical path between a PCB 70 and a diaphragm 22, a vibrating plate 20 comprising the diaphragm 22 vibrating according to an acoustic pressure and a polar ring 24 for fixing the diaphragm 22 and for providing an electrical path between the diaphragm 22 and the casing 10, a back electret 50 for accumulating a charge and facing the diaphragm 22 to form a capacitor, a metal based ring 60 for providing an electrical path between the back electret 50 and the PCB 70, and an insulation based ring 40 for providing an electrical insulation between the metal based ring 60 and the casing 10. In case of a front type condenser microphone, positions of the vibrating plate 20 and the back electret 50 are interchanged.
[3] However, in order to improve a sensitivity of the condenser microphone 100, an environment where the diaphragm 22 responses to the acoustic pressure sensitively must be provided. When a pressure of an outside air from which a sound flows in differs from a pressure of a chamber which is an internal space of the diaphragm 22, the diaphragm 22 does not response to the acoustic pressure sensitively. Therefore, in order to improve a sensitivity of the condenser microphone 100, a ventilation path connecting the air inside the chamber and the outside air should be provided to maintain the pressures of the outside air and the chamber substantially the same.
[4] An arrow shown in Fig. 1 denotes the ventilation path between the outside air and the air inside the chamber of the condenser microphone 100. The air inside the chamber passes between the metal based ring 60 and the PCB 70 through a ventilation pattern (a pattern such as a groove formed on a bottom surface of the PCB to discharge an air inside the metal based ring 60 to outside of the metal based ring 60) formed on the PCB 70, and then flows between the insulation based ring 40 and the metal based ring 60. The air inside the chamber is again connected to the outside air through a mi-
croscopic gap which may be formed between a spacer ring 30 and the insulation based ring 40, and through a space between an inner wall of the casing 10 and the polar ring 24 of the vibrating plate 20. The air may be ventilated between the polar ring 24 and the casing 10 by forming a ventilation pattern at a bottom surface of the casing 10 similar to that of the PCB 70.
[5] However, in case of a structure wherein the air is ventilated between the based rings
40 and 60, when the spacer ring 30 and the insulation based ring 40 are compressed together excessively, the air inside the chamber is isolated from the outside air, resulting in a defect by degradation of a sensitivity of the condenser microphone. Moreover, during a manufacturing process of the insulation based ring 40 and the metal based ring 60, an inner diameter of the insulation based ring 40 and an outer diameter of the metal based ring 60 may be almost the same although they are within a tolerable error range so that the both based rings 40 and 60 are adhered during assembly. In such case, the ventilation path is not secured, resulting in a defect by degradation of a sensitivity of the condenser microphone. In order to prevent such defects, a degree of process precision of the insulation based ring 40 and the metal based ring 60 must be improved, resulting in a problem of an increase in manufacturing cost of components.
[6] In addition, in case of the conventional condenser microphone 100, since the ventilation path formed between the air inside the chamber and the outside air is arbitrarily formed according to an assembly result, an adjustment of a characteristic of the condenser microphone by a shrinkage or enlargement of the ventilation path is not possible. Disclosure of Invention
Technical Problem
[7] It is an object of the present invention to provide a condenser microphone and an insulation based ring thereof wherein a side ventilation pattern is formed on an outer sidewall of the insulation based ring for securing a ventilation path formed between the a casing and the insulation based ring to prevent a defect in sensitivity caused by a shutdown of the ventilation path during an assembly of the condenser microphone due to an adhesion of component or faulty dimension of the internal components, and to easily adjust a characteristic of the condenser microphone by controlling the number, a width, a depth, and a shape of the side ventilation pattern. Technical Solution
[8] In order to achieve the above-described object, there is provided an insulation based ring for insulating an internal component from a casing of a condenser microphone characterized in that a side ventilation pattern having a predetermined shape is formed
on an outer sidewall facing an inner sidewall of the casing so that a portion of the outer sidewall is in contact with the casing.
[9] There is provided a condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a vibrating plate for converting an acoustic pressure to a vibration, the vibrating plate including a polar ring in contact with the bottom portion of the casing and a diaphragm, a spacer ring disposed above the vibrating plate, an insulation based ring disposed above the spacer ring, the insulation based ring being in contact with an inner sidewall of the casing, a dielectric plate enclosed by the insulating base ring, dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal based ring enclosed by the insulating base ring, the metal based ring being disposed above the dielectric plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulating base ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the casing and the polar ring.
[10] There is also provided a condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a dielectric plate having a penetration hole therethrough, the dielectric plate being in contact with the casing, a spacer ring disposed above the dielectric plate, an insulation based ring disposed above the spacer ring, the insulation based ring being in contact with an inner sidewall of the casing, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and disposed above the spacer ring, a metal based ring enclosed by the insulating base ring, metal based ring being disposed above the vibrating plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulating base ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the casing and the dielectric plate.
[11] There is provided a condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an
insulation based ring enclosed to be in contact with an inner sidewall and the bottom portion of the casing, a vibrating plate for converting an acoustic pressure to a vibrati on including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and being in contact with the bottom portion of the casing, a spacer ring enclosed by the insulating base ring, the spacer ring being disposed above the vibrating plate, a dielectric plate enclosed by the insulating base ring, the dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal based ring enclosed by the insulating base ring, the metal based ring being disposed above the dielectric plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulating base ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the insulation based ring at the bottom portion of the casing and the polar ring.
[12] There is provided a condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an insulation based ring enclosed by the casing, the insulation based ring being in contact with an inner sidewall and the bottom portion of the casing, a dielectric plate enclosed by the insulating base ring, the dielectric plate having a penetration hole therethrough and being in contact with the bottom portion of the casing, a spacer ring enclosed by the insulating base ring, the spacer ring disposed above the dielectric plate, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and being disposed above the spacer ring, a metal based ring enclosed by the insulating base ring, the metal based ring being disposed above the vibrating plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulating base ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the insulation based ring at the bottom portion of the casing and the polar ring.
Advantageous Effects
[13] As described above, in accordance with the condenser microphone and the
insulation based ring thereof of the present invention, a side ventilation pattern is formed on an outer sidewall of the insulation based ring for securing a ventilation path formed between the a casing and the insulation based ring to prevent a defect in sensitivity caused by a shutdown of the ventilation path during an assembly of the condenser microphone due to an adhesion of component or faulty dimension of the internal components, and to easily adjust a characteristic of the condenser microphone by controlling the number, a width, a depth, and a shape of the side ventilation pattern.
[14] While the present invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be effected therein without departing from the spirit and scope of the invention as defined by the appended claims. Brief Description of the Drawings
[15] Fig. 1 is cross-sectional view illustrating a structure of an air flow of a conventional the condenser microphone.
[16] Figs. 2a through 2e are perspective views illustrating an insulation based ring of a condenser microphone in accordance with the present invention.
[17] Fig. 3 is cross-sectional view illustrating a structure of an air flow in accordance with a first embodiment of the present invention.
[18] Fig. 4 is cross-sectional view illustrating a structure of an air flow in accordance with a second embodiment of the present invention.
[19] Fig. 5 is cross-sectional view illustrating a structure of an air flow in accordance with a third embodiment of the present invention.
[20] Fig. 6 is cross-sectional view illustrating a structure of an air flow in accordance with a fourth embodiment of the present invention. Best Mode for Carrying Out the Invention
[21] The above-described objects and other objects and characteristics and advantages of the present invention will now be described in detail with reference to the accompanied drawings.
[22] Figs. 2a through 2e illustrate an insulation based ring 40 of a condenser microphone in accordance with the present invention. The insulation based ring 40 of the condenser microphone consists of a nonconductor such as a plastic resin material, and its inner portion hollow. The insulation based ring 40 has a shape of a circular or a rectangular pipe with its top and bottom portion open, and encloses the metal based ring 60 and the dielectric plate 50.
[23] On the other hand, in order to form a ventilation path between an air in a chamber and an outside air, the insulation based ring 40 comprises side ventilation patterns 42, 44, 46 and 48 having a predetermined shape on an outer sidewall of the insulation
based ring 40 facing an inner sidewall of the casing 10 so that only a portion of the outer sidewall of the insulation based ring the insulation based ring 40 is in contact with the inner sidewall of the casing 10. The side ventilation patterns 42, 44, 46 and 48 is formed by cutting a portion of the outer sidewall of the insulation based ring 40 having a cylinder shape or by an injection molding so that the sidewall of the insulation based ring 40 forms a polygon 42, a protruding portion 44, a cross-section 46 or a concaved portion 46 as shown in Figs. 2a through 2e respectively.
[24] The number of the side ventilation patterns 42, 44, 46 and 48 may be one as shown in Fig, 2c, two in a direction opposite to each other as shown in Figs. 2d and 2e, or more than two as shown in Figs. 2a and 2b. The present invention is advantageous in that a characteristic of the condenser microphone may be facilely adjusted by controlling the number, a width, a depth, and a shape of the side ventilation patterns 42, 44, 46 and 48 to shrink or enlarge the ventilation path.
[25] Even in case that the outer sidewall of the insulation based ring 40 wherein the side ventilation patterns 42, 44, 46 and 48 are formed is adhered to the inner sidewall of the casing 10, a degradation of a sensitivity characteristic caused by a faulty assembly or dimension of components does not occur compared to conventional base rings 40 and 60 denoted as an arrow in Fig. 1 since an outside ventilation path is secured through the side ventilation patterns 42, 44, 46 and 48 as shown in Figs. 3 through 6.
[26] On the other hand, the side ventilation patterns 42, 44, 46 and 48 is connected to a bottom ventilation pattern disposed on a inner portion of a bottom surface of the casing 10 so that the air in the chamber that has passed through the side ventilation patterns 42, 44, 46 and 48 may flow out to outside. Mode for the Invention
[27] Figs. 4 through 6 illustrate embodiments wherein the casing of the present invention is applied to various condenser microphones. In accordance with a first embodiment, a back type condenser microphone 200 wherein a polar ring 24 of a vibrating plate 20 is in contact with a bottom surface of a casing the condenser microphone casing 10 is shown. In accordance with a second embodiment, a front type condenser microphone 300 wherein a dielectric plate 50 is in contact with a bottom surface of a condenser microphone casing 10 is shown. In accordance with a third embodiment, a back type condenser microphone 400 wherein an insulation based ring 40 is in contact with a bot torn surface of a condenser microphone casing 10 is shown. In accordance with a fourth embodiment, a front type condenser microphone 500 wherein an insulation based ring 40 is in contact with a bottom surface of a casing the condenser microphone casing 10 is shown.
[28] In accordance with the first embodiment, the condenser microphone 200, similar to
the conventional condenser microphone 100, comprises a casing 10 having an acoustic hole 12 at a bottom portion thereof for enclosing an internal component, a vibrating plate 20 for converting an acoustic pressure to a vibration, the vibrating plate 20 including a polar ring 24 which is in contact with the bottom portion of the casing 10 and a diaphragm 22, a spacer ring 30 disposed above the vibrating plate 20, an insulation based ring 40 disposed above the spacer ring 30, the insulation based ring 40 being in contact with an inner sidewall of the casing 10, a dielectric plate 50 enclosed by the insulation based ring 40, dielectric plate 50 having a penetration hole 52 therethrough and being disposed above the spacer ring 30, a metal based ring 60 enclosed by the insulation based ring 40, the metal based ring 60 being disposed above the dielectric plate 50, and a PCB 70 disposed above the metal based ring 60.
[29] In accordance with the condenser microphone 200 of the present invention, the PCB
70 comprises a first ventilation pattern for ventilating an air through an interface between the PCB 70 and the metal based ring 60, the insulation based ring 40 comprises side ventilation patterns 42, 44, 46 and 48 for ventilating the air through an interface between the casing 10 and the insulation based ring 40 wherein a portion of an outer sidewall of the insulation based ring 40 is in contact with the casing 10, and the casing 10 comprises a second ventilation pattern 16 for ventilating the air through an interface between the casing 10 and the polar ring 24.
[30] In case of the second embodiment shown in Fig. 4, the condenser microphone 300 of the second embodiment is identical to that of the first embodiment except that position relations of the vibrating plate 20 and the spacer ring 30 are interchanged. Therefore, a description in detail is omitted.
[31] In accordance with the third and the fourth embodiments, contrary to the first and the second embodiments, the insulation based ring 40 encloses internal components 20, 30, 50, and 60 except a PCB 70.
[32] The condenser microphone 400 in accordance with the third embodiment comprises a casing 10 having an acoustic hole 12 at a bottom portion thereof for enclosing the internal components 20, 30, 40, 50, 60 and 70, an insulation based ring 40 enclosed to be in contact with an inner sidewall and the bottom portion of the casing 10, a vibrating plate 20 for converting an acoustic pressure to a vibration including a polar ring 24 and a diaphragm 22, the vibrating plate 20 being enclosed by the insulation based ring 40 and being in contact with the bottom portion of the casing 10, a spacer ring 30 enclosed by the insulation based ring 40, the spacer ring 30 being disposed above the vibrating plate 20, a dielectric plate 50 enclosed by the insulation based ring 40, the dielectric plate 50 having a penetration hole 52 therethrough and being disposed above the spacer ring 30, a metal based ring 60 enclosed by the insulation based ring 40, the metal based ring 60 being disposed above the dielectric plate 50, and
a PCB 70 disposed above the metal based ring 60.
[33] In accordance with the condenser microphone 400 of the present invention, the PCB
70 comprises a first ventilation pattern for ventilating an air through an interface between the PCB 70 and the metal based ring 60, the insulation based ring 40 comprises side ventilation patterns 42, 44, 46 and 48 for ventilating the air through an interface between the casing 10 at a side portion and the insulation based ring 40 wherein a portion of an outer sidewall of the insulation based ring 40 is in contact with the casing 10, and the casing 10 comprises a second ventilation pattern 16 for ventilating the air through an interface between the insulation based ring 40 at the bottom portion of the casing 10 and the polar ring 24.
[34] In case of the fourth embodiment shown in Fig. 6, the condenser microphone 500 of the fourth embodiment is identical to that of the third embodiment except that position relations of the vibrating plate 20 and the dielectric plate 50 are interchanged. Therefore, a description in detail is omitted. Industrial Applicability
[35] There is provided a condenser microphone and an insulation based ring thereof wherein a side ventilation pattern is formed on an outer sidewall of the insulation based ring for securing a ventilation path formed between the a casing and the insulation based ring to prevent a defect in sensitivity caused by a shutdown of the ventilation path during an assembly of the condenser microphone due to an adhesion of component or faulty dimension of the internal components, and to easily adjust a characteristic of the condenser microphone by controlling the number, a width, a depth, and a shape of the side ventilation pattern.
[36]
[37]
Claims
[1] An insulation based ring of a condenser microphone for insulating an internal component from a case of the condenser microphone, the insulation based ring comprising a side ventilation pattern along an outer sidewall of the insulation based ring facing an inner sidewall of the case, whereby a portion of the outer sidewall of insulation based ring is in contact with the case.
[2] The insulation based ring in accordance with claim 1, wherein the side ventilation pattern has a shape of a polygon when the insulation based ring is cross-sectioned horizontally.
[3] The insulation based ring in accordance with one of claims 1 and 2, wherein the side ventilation pattern comprises at least one protruding portion disposed in a vertical direction on the outer sidewall of the insulation based ring.
[4] The insulation based ring in accordance with one of claims 1 and 2, the side ventilation pattern comprises at least one cross-section formed by cutting the outer sidewall of the insulation based ring vertically.
[5] The insulation based ring in accordance with one of claims 1 and 2, the side ventilation pattern comprises at least one concaved portion disposed in a vertical direction on the outer sidewall of the insulation based ring.
[6] A condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a vibrating plate for converting an acoustic pressure to a vibration, the vibrating plate including a polar ring in contact with the bottom portion of the casing and a diaphragm, a spacer ring disposed above the vibrating plate, an insulation based ring disposed above the spacer ring, the insulation based ring being in contact with an inner sidewall of the casing, a dielectric plate enclosed by the insulation based ring, dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal based ring enclosed by the insulation based ring, the metal based ring being disposed above the dielectric plate, and a PCB disposed above the metal based ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal based ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulation based ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the casing and the polar ring.
[7] A condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a dielectric plate having a penetration hole therethrough, the dielectric plate being in contact with the casing, a spacer ring disposed above the dielectric plate, an insulation based ring disposed above the spacer ring, the insulation based ring being in contact with an inner sidewall of the casing, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and disposed above the spacer ring, a metal based ring enclosed by the insulation based ring, metal based ring being disposed above the vibrating plate, and a PCB disposed above the metal based ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal based ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulation based ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the casing and the dielectric plate.
[8] A condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an insulation based ring enclosed to be in contact with an inner sidewall and the bottom portion of the casing, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and being in contact with the bottom portion of the casing, a spacer ring enclosed by the insulation based ring, the spacer ring being disposed above the vibrating plate, a dielectric plate enclosed by the insulation based ring, the dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal based ring enclosed by the insulation based ring, the metal based ring being disposed above the dielectric plate, and a PCB disposed above the metal based ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal based ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulation based ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air
through an interface between the insulation based ring at the bottom portion of the casing and the polar ring.
[9] A condenser microphone comprising a casing having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an insulation based ring enclosed by the casing, the insulation based ring being in contact with an inner sidewall and the bottom portion of the casing, a dielectric plate enclosed by the insulation based ring, the dielectric plate having a penetration hole therethrough and being in contact with the bottom portion of the casing, a spacer ring enclosed by the insulation based ring, the spacer ring disposed above the dielectric plate, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulation based ring and being disposed above the spacer ring, a metal based ring enclosed by the insulation based ring, the metal based ring being disposed above the vibrating plate, and a PCB disposed above the metal based ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal based ring, wherein the insulation based ring comprises a side ventilation pattern for ventilating the air through an interface between the casing and the insulation based ring, a portion of an outer sidewall of the insulation based ring being in contact with the casing, and wherein the casing comprises a second ventilation pattern for ventilating the air through an interface between the insulation based ring at the bottom portion of the casing and the polar ring.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2005-0013645 | 2005-02-18 | ||
| KR20050013645A KR100673845B1 (en) | 2005-02-18 | 2005-02-18 | Insulation Base Ring of Condenser Microphone having Ventilation Pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006088276A1 true WO2006088276A1 (en) | 2006-08-24 |
Family
ID=36916654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2005/002615 WO2006088276A1 (en) | 2005-02-18 | 2005-08-11 | Insulation based ring of condenser microphone having ventilation pattern |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100673845B1 (en) |
| WO (1) | WO2006088276A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100797439B1 (en) * | 2006-11-21 | 2008-01-23 | 주식회사 비에스이 | Polygonal condenser microphone assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6496588B1 (en) * | 1999-03-11 | 2002-12-17 | Ching-Lu Chang | Directional dynamic microphone interchangeable to have unidirectional and superdirectional characteristics |
| EP1427250A2 (en) * | 2002-12-03 | 2004-06-09 | Hosiden Corporation | Electret microphone |
| US6857569B1 (en) * | 1989-04-24 | 2005-02-22 | Ultracard, Inc. | Data storage card having a non-magnetic substrate and data surface region and method for using same |
-
2005
- 2005-02-18 KR KR20050013645A patent/KR100673845B1/en not_active IP Right Cessation
- 2005-08-11 WO PCT/KR2005/002615 patent/WO2006088276A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6857569B1 (en) * | 1989-04-24 | 2005-02-22 | Ultracard, Inc. | Data storage card having a non-magnetic substrate and data surface region and method for using same |
| US6496588B1 (en) * | 1999-03-11 | 2002-12-17 | Ching-Lu Chang | Directional dynamic microphone interchangeable to have unidirectional and superdirectional characteristics |
| EP1427250A2 (en) * | 2002-12-03 | 2004-06-09 | Hosiden Corporation | Electret microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100673845B1 (en) | 2007-01-24 |
| KR20060092622A (en) | 2006-08-23 |
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