WO2006077964A1 - ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 - Google Patents

ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体

Info

Publication number
WO2006077964A1
WO2006077964A1 PCT/JP2006/300844 JP2006300844W WO2006077964A1 WO 2006077964 A1 WO2006077964 A1 WO 2006077964A1 JP 2006300844 W JP2006300844 W JP 2006300844W WO 2006077964 A1 WO2006077964 A1 WO 2006077964A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide
formula
polyimide resin
repeating unit
unit represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/300844
Other languages
English (en)
French (fr)
Other versions
WO2006077964A2 (ja
WO2006077964A3 (ja
Inventor
Tsuyoshi Bito
Shuta Kihara
Jitsuo Oishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to KR1020077016561A priority Critical patent/KR101252875B1/ko
Priority to US11/814,499 priority patent/US8293371B2/en
Priority to JP2006553964A priority patent/JP5470678B2/ja
Publication of WO2006077964A2 publication Critical patent/WO2006077964A2/ja
Publication of WO2006077964A1 publication Critical patent/WO2006077964A1/ja
Publication of WO2006077964A3 publication Critical patent/WO2006077964A3/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Abstract

　下記式（１）： で表される繰り返し単位、又は、前記式（１）で表される繰り返し単位と下記式（２）： （式中、Xは明細書で定義したとおり）で表される少なくとも１種の繰り返し単位からなるポリイミド樹脂は熱可塑性、溶剤可溶性、耐熱性が良好、低吸水率で接着性に優れる。該ポリイミド樹脂は絶縁基材、金属層、および絶縁基材と金属層との間に配置された接着層を含む金属張積層体の接着層の材料として有用である。                                                                                 
PCT/JP2006/300844 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体 Ceased WO2006077964A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020077016561A KR101252875B1 (ko) 2005-01-21 2006-01-20 폴리이미드 수지, 폴리이미드 필름 및 폴리이미드 적층체
US11/814,499 US8293371B2 (en) 2005-01-21 2006-01-20 Polyimide resin, polyimide film, and polyimide laminate
JP2006553964A JP5470678B2 (ja) 2005-01-21 2006-01-20 ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005-013720 2005-01-21
JP2005013720 2005-01-21
JP2005-020655 2005-01-28
JP2005020655 2005-01-28
JP2005028466 2005-02-04
JP2005-028466 2005-02-04

Publications (3)

Publication Number Publication Date
WO2006077964A2 WO2006077964A2 (ja) 2006-07-27
WO2006077964A1 true WO2006077964A1 (ja) 2006-07-27
WO2006077964A3 WO2006077964A3 (ja) 2006-12-21

Family

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WO2006077964A1 (ja) ポリイミド樹脂、ポリイミドフィルム及びポリイミド積層体