WO2006077833A1

WO2006077833A1 - Objective lens socket

Info

Publication number: WO2006077833A1
Application number: PCT/JP2006/300538
Authority: WO
Inventors: Yoshio Isobe; Ikuo Arata; Hiroshi Tanabe
Original assignee: Hamamatsu Photonics K.K.
Priority date: 2005-01-19
Filing date: 2006-01-17
Publication date: 2006-07-27
Also published as: JP2006227565A; TW200636317A; JP4772394B2; TWI408433B

Abstract

An objective lens socket (9) comprising a base (70) being fixed to the distal end of the lens-barrel (26) of an objective lens (21), and a movable member (80) which is mounted to the base (70) slidably in the direction of the optical axis L of the objective lens while being fixed with a solid immersion lens holder (8), wherein the solid immersion lens holder is arranged in front of the objective lens. In this arrangement, the solid immersion lens holder can be arranged suitably in front of the objective lens. A solid immersion lens held by the solid immersion lens holder can be moved in the direction of the optical axis L and, as a result, the solid immersion lens (6) can be easily brought into tight contact with an observation object (11). Consequently, an objective lens socket by which the solid immersion lens can be brought into tight contact with the observation object through a simple arrangement is realized.

Description

Specification

Objective lens socket

Technical field

The present invention relates to an objective lens socket for mounting a solid immersion lens holder that holds a solid immersion lens in front of the objective lens.

Background art

[0002] A solid immersion lens (SIL) is known as a lens for enlarging an image of an observation object. This solid immersion lens is a hemispherical lens or a super hemispherical lens called a Weierstrass sphere, and is a minute lens having a size of about 1 mm to 5 mm. When this solid immersion lens is placed in close contact with the surface of the observation object, both the numerical aperture (NA) and the magnification are enlarged, so that observation with high spatial resolution becomes possible.

As a semiconductor inspection apparatus to which this solid immersion lens is applied, for example, one disclosed in Patent Document 1 is known. In the semiconductor inspection apparatus described in Patent Document 1, a solid immersion lens is placed in front of the objective lens (on the observation object side) by attaching a sleeve (solid immersion lens holder) containing the solid immersion lens to the tip of the objective lens. Is arranged. Then, by adjusting the pressure of the chamber formed in the sleeve through a valve provided on the sleeve, the solid immersion lens is moved in the optical axis direction of the solid immersion lens, and the optical object between the observation object and the solid immersion lens is moved. Realization.

Patent Document 1: US Patent No. 6621275

Disclosure of the invention

Problems to be solved by the invention

However, in the semiconductor inspection device described in Patent Document 1, the movement of the solid immersion lens in the optical axis direction is realized by adjusting the pressure of the chamber in the solid immersion lens holder.

In addition, a valve for supplying gas into the chamber and a gas to be supplied must be prepared, and the configuration becomes complicated.

[0005] Accordingly, an object of the present invention is to provide an objective lens socket capable of bringing a solid immersion lens into close contact with an observation object with a simple configuration. Means for solving the problem

[0006] In order to solve the above problems, an objective lens socket according to the present invention includes a base portion attached to a tip portion of a lens barrel of an objective lens, a solid immersion lens holder, and an objective lens socket attached to the base portion. And a movable member attached to be slidable in the optical axis direction. The solid immersion lens holder is disposed in front of the objective lens.

In this configuration, since the movable member is attached to the base part attached to the tip of the lens barrel of the objective lens, the solid immersion lens holder attached to the movable member is arranged in front of the objective lens. . Since the movable member is slidably attached to the base portion, the solid immersion lens holder is movable relative to the base portion in the optical axis direction of the objective lens. As a result, for example, when an observation object is observed using a solid immersion lens held by a solid immersion lens holder, the solid immersion lens can be brought into close contact with the observation object, and that state can be maintained. Easy.

The invention's effect

[0008] According to the objective lens socket of the present invention, the solid immersion lens can be brought into close contact with the observation object with a simple configuration.

Brief Description of Drawings

FIG. 1 is a configuration diagram of a semiconductor inspection apparatus to which an embodiment of an objective lens socket according to the present invention is applied.

FIG. 2 is a configuration diagram showing a configuration of an objective lens equipped with an objective lens socket.

FIG. 3 is an exploded perspective view of the solid immersion lens holder shown in FIG. 2.

FIG. 4 is a sectional view of the objective lens socket.

FIGS. 5A and 5B are (a) a view of the objective lens socket as viewed from the objective lens side, (b) a cross-sectional view of the objective lens socket, and (c) a view of the objective lens socket as viewed from the sample side.

FIG. 6 is a configuration diagram showing a configuration of member position detection means.

FIG. 7 is a cross-sectional view of an objective lens socket for illustrating the operation of the member position detecting means.

FIG. 8 is a configuration diagram showing a configuration of a holder detection sensor.

FIG. 9 is a configuration diagram showing a configuration of a sensor head. 10 is a cross-sectional view of the objective lens socket when the solid immersion lens holder is detected, and FIG. 10B is a cross-sectional view of the objective lens socket when the solid immersion lens holder is not detected.

[FIG. 11] FIG. 11 is a configuration diagram showing the configuration of the objective lens when the objective lens socket is attached for normal observation, and (b) the objective lens is viewed from the sample side.

FIG. 12 is a configuration diagram showing a configuration of an objective lens socket equipped with another solid immersion lens holder as a modified example.

FIG. 13 is a configuration diagram showing the configuration of another example of the objective lens socket.

FIG. 14 is a cross-sectional view of another embodiment of the objective lens socket according to the present invention.

FIG. 15 is a perspective view of a solid immersion lens holder attached to the objective lens socket shown in FIG.

FIG. 16 is a side view of the objective lens socket.

FIG. 17 is a top view of the objective lens socket.

FIG. 18 is a bottom view of the objective lens socket.

FIG. 19 is a cross-sectional view taken along line XIX—XIX in FIG.

20 is a cross-sectional view showing a state in which the movable member has moved from the state shown in FIG. 19 to the sample side, and FIG. 20 (b) from the state shown in FIG. It is sectional drawing which showed the state which moved to.

Explanation of symbols

[0010] 6 ... Solid immersion lens, 8, 160 ... Solid immersion lens Honoreda, 9, 170 ... Objective lens socket, 11 ... Semiconductor device (observation object), 21 ... Objective lens, 26 ... Objective lens barrel (mirror) Cylinder), 70 ... base part, 74 ... peripheral wall, 74a ... peripheral wall outer surface, 76 ... panel housing groove (elastic body housing groove), 80 · · · movable member, 100, 162 ... panel (elastic body), 110 ... member position Detection means 112 ... Proximity sensor (contact position detection unit) 113 ... Proximity sensor (stop position detection unit) 140 ... Sensor head (holder detection unit) 190 ... Linear guide 200 ... Proximity sensor (holder detection unit) , D ... Detected object, L ... Optical axis direction.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferred embodiments of the objective lens socket according to the present invention will be described with reference to the drawings. To do. In each figure, the same elements are denoted by the same reference numerals, and redundant description is omitted.

[0012] (First embodiment)

FIG. 1 is a configuration diagram showing a semiconductor inspection apparatus provided with an objective lens socket as one embodiment of the present invention. FIG. 2 is a configuration diagram showing the configuration of the objective lens to which the objective lens socket is attached. FIG. 3 is an exploded perspective view of the solid immersion lens holder attached to the objective lens socket.

[0013] FIG. 2 shows a state during observation of the sample. Further, as shown in the characteristic part of the objective lens socket, the panel housing groove (elastic body housing groove) 76 for housing the panel 100 and the through-hole 85 for inserting the pin P1 have the same cross section. Displayed forces These arrangements are actually different. This actual arrangement is shown in FIG. Fig. 3 shows a state in which the solid immersion lens holder holds the solid immersion lens. In the following description, the objective lens side is the upper side, and the sample side and the lower side are described with respect to the solid immersion lens.

As shown in FIGS. 1 and 2, the semiconductor inspection apparatus 1 uses, for example, a semiconductor device 11 (see FIG. 2) of a mold type semiconductor device that is a sample 10 as an observation object, and an image of the semiconductor device 11 It is an inspection device that acquires information and inspects its internal information.

“Molded semiconductor device” is a semiconductor device 11 molded with a resin 12. “Internal information” includes circuit patterns of semiconductor devices and weak light emission from semiconductor devices. Examples of the weak light emission include those caused by an abnormal portion based on a defect in a semiconductor device, and transient light emission accompanying a switching operation of a transistor in the semiconductor device. Furthermore, it includes heat generation due to defects in semiconductor devices.

[0016] In the sample 10, the back surface of the semiconductor device 11 is placed on the stage 2 provided in the observation section A in a state where the resin 12 is cut so that the back surface of the semiconductor device 11 embedded in the resin 12 is exposed. Is placed facing up. Thus, since a part of the sample 10 is cut to expose the back surface of the semiconductor device 11, the semiconductor device 11 is positioned on the bottom surface of the recess 13 formed by cutting the resin 12. Then, in this embodiment, the inspection apparatus 1 is formed on the lower surface of the semiconductor device 11 (formed on the substrate surface of the semiconductor device 11). Inspect integrated circuits, etc.).

The semiconductor inspection apparatus 1 includes an observation unit A that observes the semiconductor device 11, a control unit B that controls the operation of each unit of the observation unit A, and processes and instructions necessary for the inspection of the semiconductor device 11. And an analysis unit C to perform.

The observation unit A includes a high-sensitivity camera 3 and a laser scanning optical system (LSM: Laser Scanning Microscope) unit 4 as image acquisition means for acquiring an image from the semiconductor device 11, and a high-sensitivity camera 3 and an LSM unit. 4 and an optical system 20 including an objective lens 21 of a microscope 5 disposed between the semiconductor device 11 and a solid immersion lens 6 for obtaining an enlarged observation image of the semiconductor device 11 (see FIG. 2). And an X stage 7 that is moved in the X_Y_Z directions orthogonal to each other.

The optical system 20 includes a camera optical system 22 and an LSM unit optical system 23 in addition to the objective lens 21. A plurality of objective lenses 21 having different magnifications are provided and can be switched. In addition, the objective lens 21 has a correction ring 24, and by adjusting the correction ring 24, it is possible to reliably focus on a portion to be observed. The camera optical system 22 guides the light from the semiconductor device 11 that has passed through the objective lens 21 to the high-sensitivity lens 3, and the high-sensitivity camera 3 acquires an image such as a circuit pattern of the semiconductor device 11.

[0020] On the other hand, the optical system 23 for the LSM unit reflects the infrared laser light from the LSM unit 4 to the objective lens 21 side by a beam splitter (not shown), guides it to the semiconductor device 11, and passes through the objective lens 21 to increase the height. The reflected laser beam from the semiconductor device 11 facing the sensitivity camera 3 is guided to the LS Μ unit 4.

The LSM unit 4 scans infrared laser light in the Χ-Χ direction and emits it to the semiconductor device 11 side, while detecting reflected light from the semiconductor device 11 with a photodetector (not shown). The intensity of the detection light reflects the circuit pattern of the semiconductor device 11. Therefore, the LSM unit 4 acquires an image of the circuit pattern or the like of the semiconductor device 11 by scanning the semiconductor device 11 with the infrared laser light.

[0022] In addition, the stage 7 has the high-sensitivity camera 3, the LSM unit 4, the optical system 20, the solid immersion lens 6 and the like in the Χ_Υ direction (horizontal direction; parallel to the semiconductor device 11 that is the observation object. ) And the z direction (vertical direction) perpendicular thereto, as necessary.

The control unit B includes a camera controller 31, a laser scan (LSM) controller 32, and a peripheral controller 33. The camera controller 31 and the LSM controller 32 control the operation of the high-sensitivity camera 3 and the LSM unit 4 respectively, thereby performing observation (acquisition of images) of the semiconductor device 11 performed in the observation unit A, setting of observation conditions, etc. Is controlled.

The peripheral controller 33 controls the operation of the XYZ stage 7 to move the high-sensitivity camera 3, the LSM unit 4, the optical system 20, and the like to a position corresponding to the observation position of the semiconductor device 11. , Control alignment, focusing and so on. At this time, the peripheral controller 33 controls the operation of the XYZ stage 7 according to the detection results of various sensors attached to the objective lens socket 9 and the solid immersion lens holder 8. The peripheral controller 33 adjusts the correction ring 24 by driving a correction ring adjustment motor 25 attached to the objective lens 21.

The analysis unit C includes an image analysis unit 41 and an instruction unit 42, and is configured by a computer. The image analysis unit 41 performs necessary analysis processing on the image information from the camera controller 31 and the LSM controller 32, and the instruction unit 42 displays the input content from the operator and the analysis content by the image analysis unit 41. With reference to the control unit B, necessary instructions regarding the execution of the inspection of the semiconductor device 11 in the observation unit A are given. In addition, images, data, and the like acquired or analyzed by the analysis unit C are displayed on the display device 43 connected to the analysis unit C as necessary.

[0026] As shown in FIG. 2, the solid immersion lens 6 is a hemispherical microlens, and is formed into a spherical shape as well as an input / output surface for light with respect to the outside (for example, an objective lens of a microscope). It has an upper surface 6a and a bottom surface 6b which is a mounting surface for the semiconductor device 11 and is formed in a planar shape. The solid immersion lens 6 obtains an enlarged observation image of the front surface (illustrated lower surface) of the semiconductor device 11 on the back side when the bottom surface 6b is in close contact with the observation position (illustrated upper surface).

Specifically, the solid immersion lens used in the semiconductor inspection apparatus has a high refractive index material force that is substantially the same as or close to the refractive index of the substrate material of the semiconductor device. That Typical examples include Si, GaP, and GaAs.

[0028] By optically contacting such a small optical element to the substrate surface of the semiconductor device, the semiconductor substrate itself is used as a part of the solid immersion lens. According to the backside analysis of a semiconductor device using a solid immersion lens, when the focus of the objective lens is adjusted to the integrated circuit formed on the surface of the semiconductor substrate, due to the effect of the solid immersion lens, the substrate has a high NA. It is possible to pass the light beam, and high resolution can be expected.

[0029] The lens shape of such a solid immersion lens 6 is determined by the condition that the aberration is eliminated. In the solid immersion lens 6 having a hemispherical shape, the spherical center is a focal point. At this time, the numerical aperture (NA) and the magnification are both n times. The shape of the solid immersion lens 6 is not limited to a hemispherical shape, and may be, for example, a Weierstrass shape.

A solid immersion lens holder 8 that suitably holds the solid immersion lens 6 with respect to the objective lens 21 is attached to the front of the objective lens 21 via the objective lens socket 9. The objective lens socket 9 will be described later in detail.

As shown in FIGS. 2 and 3, the solid immersion lens holder 8 has a lens holding portion 60 extending from the center of the disc-shaped objective lens cap 50 in a direction substantially perpendicular to the objective lens cap 50. When viewed from the direction of the arrow A1 shown in FIG. 3, the outer shape is substantially T-shaped.

The objective lens cap 50 has a peripheral wall 51 that is screwed into the objective lens socket 9 (see FIG. 2). The objective lens cap 50 is attached to the tip of the objective lens 21 via the objective lens socket 9. Will be attached. Therefore, the position of the solid immersion lens 6 held by the solid immersion lens holder 8 can be adjusted by driving the XYZ stage 7.

[0033] Further, the bottom plate 52 of the objective lens cap 50 has three openings 53, 53, 53 for allowing the light beam to pass therethrough. Each aperture 53 allows light output from the LSM unit 4 to pass through the solid immersion lens 6 side, and allows light reflected from the semiconductor device 11 and output from the solid immersion lens 6 to pass through the objective lens 21 side.

Each opening 53 is substantially fan-shaped and is concentric with the center of the objective lens cap 50 and is arranged at equal intervals in the circumferential direction. As a result, the lens holding part 60 and the bottom plate 52 are connected between the adjacent openings 53, 53, and three connecting parts 54, 54, 54 extending radially from the center of the objective lens cap 50 are equally spaced. Will be formed. The lens holding unit 60 includes a lens holding member 61 that extends in a direction substantially orthogonal to the objective lens cap 50 (in the optical axis L direction of the objective lens 21) from the intersection of the three coupling parts 54. The lens holding member 61 is positioned on each of the connecting portions 54, 54, 54 and includes three holding pieces 62, 62, 62 that receive the solid immersion lens 6.

[0036] The holding pieces 62, 62, 62 are radially arranged with respect to the center line of the lens holding member 61, and have a tapered shape in which the width d becomes narrower toward the center line of the lens holding member 61 as the force is applied. is doing.

[0037] Lens receiving surfaces 62a, 62a, 62a having the same curvature as the curvature of the upper surface 6a of the solid immersion lens 6 are formed at the front end of each holding piece 62 (the end opposite to the objective lens cap 50). Accordingly, the lens holding member 61 receives the solid immersion lens 6 by the three lens receiving surfaces 62a. For this reason, the lens holding member 61 can receive the solid immersion lens 6 stably.

[0038] Further, a claw portion 62b for fixing the cylindrical lens cover 63 is formed at the tip of each holding piece 62, respectively. The lens cover 63 has a bottom plate 64, and a peripheral wall 65 fitted to the claw portion 62 b is provided on the peripheral edge of the bottom plate 64. The bottom plate 64 is formed with an opening 64a for projecting the bottom surface 6b of the solid immersion lens 6 to the outside (sample 10 side).

In this configuration, the solid immersion lens 6 is disposed between the lens receiving surface 62a and the lens cover 63, and then the lens cover 63 is fixed to the lens holding member 61 with an adhesive or the like, thereby fixing the lens. The immersion lens 6 is accommodated between the lens receiving surface 62a and the lens cover 63 with the bottom surface 6b protruding from the opening 64a, and the solid immersion lens 6 is held by the solid immersion lens holder 8.

Then, the solid immersion lens 6 is grounded to the semiconductor device 11 when the objective lens 21 is moved in the direction of the optical axis L by the operation of the XYZ stage 7.

If the solid immersion lens 6 is further pushed down by adjusting the focus position while the solid immersion lens 6 is grounded, the semiconductor device 11 may be damaged by the force applied from the solid immersion lens 6.

[0042] Therefore, the solid immersion lens holder 8 preferably has a stress detection sensor S at each connecting portion 54 as shown in FIG. [0043] When the solid immersion lens 6 applies a force to the semiconductor device 11, the solid immersion lens 6 is pressed against the holding piece 62 by the counteraction, and as a result, stress is generated in the connecting portion 54. . The stress detection sensor S detects the stress applied to the semiconductor device 11 by the solid immersion lens 6 by detecting the stress applied to the connecting portion 54.

[0044] Then, the stress detection sensor S is electrically connected to the peripheral controller 33. When the stress detection sensor S detects a force greater than or equal to a predetermined stress, the peripheral controller 33 is connected to the XYZ stage 7. Stop driving. As a result, a force greater than a predetermined load is not applied to the semiconductor device 11, so

[0045] Next, the objective lens socket 9 that characterizes the present embodiment will be described in detail. FIG. 4 is a cross-sectional view of the objective lens socket 9. FIG. 5 is a configuration diagram showing the configuration of the base portion and the movable member of the objective lens socket 9. FIG. 5 (a) is a view of the base portion and the movable member as viewed from the side of the object lens. FIG. 5 (b) is a side view of the base portion and the movable member. FIG. 5 (c) is a view of the base portion and the movable member as viewed from the sample side. In Fig. 4, as in Fig. 2, the characteristic part appears. Further, FIG. 5 shows a state in which the movable member is fitted to the base portion, but description of pins and the like is omitted.

As shown in FIGS. 2, 4, and 5, the objective lens socket 9 includes a cylindrical base portion 70 fitted to the distal end portion of the object lens barrel 26 of the objective lens 21, and a base portion. And a movable member 80 fitted to 70.

[0047] The base 70 and the movable member 80 have bottom plates 71 and 81, respectively. Each of the bottom plates 71 and 81 is output from the objective lens 21 or incident on the objective lens 21 with the center at the center. Circular openings 72 and 82 for passing the light flux to be transmitted. As long as the diameters of the openings 72 and 82 are large enough not to block the light beam, the diameter of the opening 82 is larger than the diameter of the opening 72. A plurality of through holes 73 are formed around the opening 72 of the base portion 70, and the base portion 70 is screwed to the objective lens 21 through the through holes 73. More specifically, it is screwed to an objective lens barrel 26 (see FIG. 2) that houses a lens group that the objective lens 21 has. However, the method of fixing the base portion 70 to the objective lens 21 is not limited to the above method.

[0048] Peripheral walls 74 and 83 are provided on the peripheral portions of the bottom plates 71 and 81, respectively. Of the peripheral wall 74 The base 70 having a diameter equal to the outer diameter of the tip of the objective lens barrel 26 is fitted and attached to the tip of the objective lens barrel 26 of the objective lens 21.

In addition, the movable member 80 in which the outer diameter of the peripheral wall 74 and the inner diameter of the peripheral wall 83 are equal is fitted to the base portion 70. The outer surface of the peripheral wall 74 and the inner surface of the peripheral wall 83 are in sliding contact, and as a result, the movable member 80 is slidable in the optical axis L direction with respect to the base portion 70. The outer diameter of the peripheral wall 83 (the outer diameter of the movable member 80) is equal to the outer peripheral surface of the end on the bottom plate 81 side of the movable member 80 equal to the outer diameter of the peripheral wall 51 of the objective lens cap 50 (see FIG. 2). A screw groove 84 (see FIG. 5B) for screwing the peripheral wall 51 of the objective lens cap 50 is formed, and the objective lens cap 50 can be attached to the movable member 80.

[0050] The peripheral wall 83 of the movable member 80 has a pair of through holes 85 and 85 facing each other, and is formed at positions corresponding to the through holes 85 and 85 on the peripheral wall 74 of the base portion 70, respectively. The movable member 80 is connected to the base portion 70 by inserting the pin P1 into the through holes 75 and 75. The through hole 85 has an oval shape in which the length in the optical axis L direction is longer than the length in the circumferential direction, and the circumferential length of the through hole 85 is substantially the same as the outer diameter of the pin P1. As a result, the movable member 80 can move with respect to the base portion 70 by the length of the elliptical optical axis L direction in the optical axis L direction, and is prevented from rotating in the circumferential direction. It will be.

[0051] The base portion 70 and the movable member 80 are made up of three panel receiving grooves (elastic body receiving grooves) 76, 76, 76 formed on the bottom surface of the peripheral wall 74 of the base portion 70, respectively. Body) 1 00, 100, 100 are fitted together. Since the depth of the spring accommodating groove 76 is shorter than the natural length of the spring 100, the front end portion of the panel 100 protrudes from the panel accommodating groove 76.

Therefore, in a state where the movable member 80 is fitted to the base portion 70, both ends of the spring 100 are the bottom surface 76 a (upper surface in FIG. 4) of the panel receiving groove 76 and the movable member 80. Abutting against the bottom plate 81, the movable member 80 is urged in the optical axis L direction. As a result, when observing the semiconductor device 11, the solid immersion lens 6 is urged by the semiconductor device 11 and is securely adhered.

Further, since the peripheral wall 74 is located outside the outer peripheral portion of the objective lens barrel 26 (see FIG. 2), the spring 100 is disposed around the objective lens barrel 26 included in the objective lens 21. Nina The As a result, the length of the objective lens socket 9 in the optical axis L direction is shorter, and the reduction of the working distance of the objective lens 21 due to the mounting of the object lens socket 9 can be suppressed.

Incidentally, if the panel 100 is contracted and the urging force of the panel 100 is too strong, the semiconductor device 11 may be damaged as described above. Therefore, the objective lens socket 9 is

As shown in FIG. 4, it has member position detecting means 110 for detecting the position (member position) of the movable member 80 in the optical axis L direction with respect to the base portion 70.

FIG. 6 is a configuration diagram showing the configuration of the member position detecting means included in the objective lens socket 9. FIG. 6 shows a state viewed from the direction of arrow A2 in FIG. 4, and shows a state where the solid immersion lens holder 8 is attached.

[0056] As shown in FIGS. 4 and 6, the member position detecting means 110 includes a sensor holding member 111, two proximity sensors 112 and 113 held by the sensor holding member 111, and a substantially L-shape. Metal plate

114.

The sensor holding member 111 has a substantially rectangular parallelepiped shape and is screwed into a screw hole 77 (see FIG. 5A) formed in the upper surface of the peripheral wall 74 of the base 70. The proximity sensors 112 and 113 are held so that the front ends of the proximity sensors 112 and 113 protrude from the end of the sensor holding member 111.

[0058] The metal plate 114 is screwed into a screw hole 86 (see FIG. 5A) formed in the upper surface of the peripheral wall 83 of the movable member 80. Therefore, it moves in the optical axis L direction according to the movable member 80. The metal plate 114 is disposed so as to face part of the force proximity sensors 112 and 113 (part extending in the optical axis L direction).

The proximity sensors 112 and 113 are held by the sensor holding member 111 while being arranged in parallel in the direction perpendicular to the optical axis L, which are different from each other in the optical axis L direction. The proximity sensors 112 and 113 are electrically connected to the peripheral controller 33 (see FIG. 1), and generate a magnetic field in the vicinity of the tip thereof. Then, the member position of the movable member 80 with respect to the base portion 70 is detected by detecting the metal plate 114 by a change in the magnetic field due to the metal plate 114 approaching and moving upward in FIG.

[0060] The proximity sensor (contact position detecting unit) 112 is disposed between the base unit 70 and the movable member 80. The panel 100 is arranged so as to face the metal plate 114 when it starts to shrink from its natural length. Thus, when the solid immersion lens 6 comes into contact with the semiconductor device 11, the proximity sensor 112 detects the metal plate 114, so the proximity sensor 112 starts contact between the solid immersion lens 6 and the semiconductor device 11. It functions as a sensor that detects the position of the movable member 80 corresponding to the position.

Further, the proximity sensor (stop position detection unit) 113 is arranged above the proximity sensor 112 and is used to stop the biasing of the panel 100 via the solid immersion lens 6 to the semiconductor device 11. The member position of the movable member 80 is detected. That is, it is possible to detect the position of the movable member 80 with respect to the base portion 70 that generates the maximum urging force within a range that does not damage the semiconductor device 11 among the urging forces applied to the semiconductor device 11 through the solid immersion lens 6. Thus, it is disposed above the proximity sensor 112.

Here, the operation of the member position detecting means 110 will be described with reference to FIG. FIG. 7 is a diagram for explaining the operation of the member position detecting means 110.

As shown in FIG. 7 (a), first, when the focus position of the objective lens 21 is adjusted by the peripheral controller 33, the objective lens socket 9 is attached to the semiconductor device 11 side along with the objective lens 21. When pressed down, the solid immersion lens 6 comes into contact with the semiconductor device 11.

[0064] Since the solid immersion lens 6 is held by the solid immersion lens holder 8 attached to the movable member 80, when the solid immersion lens 6 contacts the semiconductor device 11, the movable member 80 is pushed toward the base portion 70 side. As a result, the metal plate 114 also moves upward, so that the proximity sensor 112 detects the metal plate 114. That is, the contact of the solid immersion lens 6 with the semiconductor device 11 is detected.

The detection result of the proximity sensor 112 is input to the instruction unit 42 via the peripheral controller 33 and notifies the operator that the solid immersion lens 6 is grounded to the semiconductor device 11.

Then, as shown in FIG. 7B, in the state where the objective lens 21 is further pushed down to the semiconductor device 11 side (that is, the state where the objective lens socket 9 is pushed down), the proximity sensor 112 is When the detection result indicating that the metal plate 114 is detected continues to be output and the proximity sensor 113 does not detect the metal plate 114, the focus position adjustment is continued. Applied.

Further, as shown in FIG. 7 (c), when the objective lens socket 9 is further pushed down to the semiconductor device 11 side and the proximity sensor 113 detects the metal plate 114, the peripheral controller 33 Stop pressing down. Since a load exceeding the set urging force is not applied to the semiconductor device 11, damage to the semiconductor device 11 due to adjustment of the focus position or the like is suppressed.

[0068] Further, at the time of observing the semiconductor device 11, the microscope 5 is usually put in a box, so it is preferable that it can be automatically confirmed whether or not the solid immersion lens holder 8 is attached to the movable member 80. . Therefore, the semiconductor inspection apparatus 1 has a holder detection sensor 120 that detects the mounting state of the solid immersion lens holder 8 as shown in FIGS. FIG. 8 is a block diagram showing a configuration of a holder detection sensor included in the semiconductor inspection device 1. The holder detection sensor 120 includes an amplifier unit 130 and a sensor head (holder detection unit) 140 that forms part of the objective lens socket 9.

The amplifier unit 130 has a light emitting element 131 and a light receiving element 132 and is electrically connected to the peripheral controller 33. The light emitting element 131 of the amplifier unit 130 is optically connected to the light projecting side fiber 151, and the light projecting side fiber 151 is connected to the sensor head 140. The light receiving element 132 of the amplifier unit 130 is optically connected to the light receiving side fiber 152, and the light receiving side fiber 152 is connected to the sensor head 140.

FIG. 9 is a configuration diagram showing the configuration of the sensor head. FIG. 9 shows a state seen from the arrow A3 side in FIG. FIG. 9 shows a state where the solid immersion lens holder 8 is attached.

[0071] The sensor head 140 includes a fiber holding member 141, a reflection mirror 142, and a condenser lens 143 covered with a cover 144. The sensor head 140 is formed on the upper surface of the peripheral wall 74 of the base portion 70 of the objective lens socket 9. It is screwed using the formed screw hole 78 (see FIG. 5 (a)).

[0072] As shown in FIG. 9, the fiber holding member 141 has the light projecting side fiber 151 and the light receiving side fiber 152 inserted therein, and holds them in parallel. The reflection mirror 142 is fixed to the fiber holding member 141 in front of the output end of the light projecting side fiber 151, and reflects the light 153 output from the light projecting side fiber 151 to the solid immersion lens holder 8 side. At the same time, the return light (reflected light) from the solid immersion lens holder 8 is incident on the light receiving side fiber 152.

In addition, the condenser lens 143 is fixed to the fiber holding member 141 below the reflection mirror 142 (the lower side in FIG. 9), and is output from the light projecting side fiber 151 and reflected by the reflection mirror 142. The collected light is condensed on the upper surface of the peripheral wall 51 of the solid immersion lens holder 8 and the return light from the solid immersion lens holder 8 is condensed and incident on the light receiving side fiber 152.

Here, the operation of the holder detection sensor will be described with reference to FIG. FIG. 10 is a diagram illustrating the operation of the holder detection sensor.

As shown in FIG. 10 (a), when the solid immersion lens holder 8 is attached to the movable member 80, the light 153 output from the light projecting side fiber 151 is transmitted by the condenser lens 143. The light is reflected from the upper surface of the peripheral wall 51 of the objective lens cap 50, condensed by the condenser lens 143, and incident on the light receiving side fiber 152.

That is, the reflected light from the solid immersion lens holder 8 is acquired by the sensor head 140.

As a result, the light receiving element 132 detects return light.

On the other hand, as shown in FIG. 10 (b), when the solid immersion lens holder 8 is not attached to the movable member 80, the light 153 output from the light projecting side fiber 151 is incident on the light receiving side fiber 152. Therefore, the light receiving element 132 does not detect return light.

Therefore, the mounting state of the solid immersion lens holder 8 can be detected based on whether or not the light receiving element 132 has detected return light. This makes it possible to observe the semiconductor device 11 with the solid immersion lens holder 8 securely attached even when the microscope 5 is placed in the box, for example.

[0080] Next, an example of a method for acquiring an image of the semiconductor device 11 using the semiconductor inspection apparatus 1 will be described.

First, a structure in which the semiconductor device 11 is observed by the solid immersion lens 6 is specified with the objective lens 21 that is not attached with the solid immersion lens 6 among the plurality of objective lenses 21 of the microscope 5. This observation position is specified by the instruction unit 42 via the peripheral controller 33. This is done by driving Z stage 7.

[0082] When the operator specifies the observation position to be observed with the solid immersion lens 6, the operator activates the solid immersion lens mode to enter an observation state using the solid immersion lens 6. At this time, the operator inputs the model number of the solid immersion lens 6 held by the solid immersion lens holder 8, the thickness and material of the substrate included in the semiconductor device 11, to the instruction unit 42. As a result, the instruction unit 42 refers to the pre-input data, and calculates five parameters for calculating the position of the correction ring 24 and the focus position of the objective lens 21, that is, the solid immersion lens 6. The thickness, refractive index, radius of curvature of the upper surface 6a, substrate thickness and substrate refractive index are specified.

Next, the instruction unit 42 outputs light from the light emitting element 131 of the holder detection sensor 120 via the peripheral controller 33, and the solid immersion lens holder 8 is attached to the objective lens 21 used for solid immersion lens observation. Detect whether or not

That is, when light is output by the light emitting element 131, the instruction unit 42 assumes that the solid immersion lens holder 8 is attached if the light receiving element 1 32 detects return light, and the light receiving element 132 is If no return light is detected, it is determined that the solid immersion lens holder 8 is not attached. Then, the detection result of the light receiving element 132, that is, the mounting state of the solid immersion lens holder 8 is transmitted to the operator.

In addition, when it is confirmed that the solid immersion lens holder 8 is attached, the output of the light emitting element 131 can be stopped from the viewpoint of preventing other light from being mixed in the observation of the semiconductor device 11. preferable.

When the solid immersion lens holder 8 is attached, the instruction unit 42 switches the objective lens 21 to which the solid immersion lens 6 is attached by driving the revolver via the peripheral controller 33. Next, the instruction unit 42 drives the correction ring adjustment motor 25 via the peripheral controller 33 according to the five parameters specified according to the input model number of the solid immersion lens 6, the thickness and material of the substrate. , Adjust the correction ring 24 to the proper position.

Subsequently, the instruction unit 42 adjusts the focus position of the objective lens 21 by driving the XYZ stage 7 via the peripheral controller 33 according to the above five parameters. In this case, when the proximity sensor 112 detects the metal plate 114, the instruction unit 42 notifies the operator that the semiconductor device 11 is being pressed by the spring 100. Also for force In the adjustment of the position, when the proximity sensor 113 detects the metal plate 114 or when the stress detection sensor S detects a stress greater than a predetermined stress, the peripheral controller 33 stops driving the XY Z stage 7.

[0088] Then, in the range where the proximity sensor 112 detects the metal plate 114 while the proximity sensor 113 does not detect the metal plate 114, for example, an image acquired by the high-sensitivity camera 3 is regarded as a manual. By operation, finely adjust the focus position of the objective lens 21. Then, in a state where the focus position of the objective lens 21 is in alignment, the instruction unit 42 observes the semiconductor device 11 using the LSM unit 4 and the high-sensitivity camera 3 etc. via the LSM controller 32 and the force controller 31. To implement.

If it is necessary to replace the solid immersion lens 6, the solid immersion lens 6 is replaced by replacing the solid immersion lens holder 8. In this case, since the minute solid immersion lens 6 need not be handled directly, the solid immersion lens 6 can be easily replaced.

In the above description, the case where the semiconductor device 11 is observed in a state where the solid immersion lens holder 8 is mounted on the objective lens socket 9 has been described. However, the solid immersion lens holder 8 is mounted on the objective lens socket 9. Normal observation is also possible in a state in which it is not.

That is, as shown in FIGS. 5 (a) and 5 (b), the peripheral wall 83 of the movable member 80 of the objective lens socket 9 is in a state where all the springs 100 are accommodated in the spring accommodating grooves 76. And has a through hole 87 for fixing the movable member 80 to the base portion 70.

Further, a screw hole 79 is formed at a position corresponding to the through hole 87 in the peripheral wall 74 of the base portion 70. As a result, by using the fixing screw P2 corresponding to the screw hole 79, the movable member 80 can be fixed to the base portion 70 in a state in which the spring 100 is fully accommodated in the spring accommodating groove 76.

Therefore, the semiconductor device 11 may be observed as shown in FIG. 11 (a) with the length of the objective lens socket 9 in the optical axis L direction minimized. FIG. 11 (b) is a view of the objective lens 21 of FIG. 11 (a) as viewed from the semiconductor device 11 side.

In this case, since the length of the objective lens socket 9 in the optical axis L direction can be shortened, the working distance of the objective lens 21 can be secured. Further, the solid immersion lens holder 8 can be immediately attached by removing the fixing screw P2. As described above, in the observation of the semiconductor device 11 using the objective lens socket 9, the solid immersion lens 6 is biased toward the semiconductor device 11 by the spring 100 of the objective lens socket 9. The solid immersion lens 6 can be securely adhered to the semiconductor device 11 and optically bonded.

The objective lens socket 9 is attached to the objective lens barrel 26, and the spring 100 is positioned around the objective lens barrel 26 of the objective lens 21, so the objective lens socket 9 is attached. As a result, the reduction of the working distance of the objective lens 21 is suppressed.

Further, the objective lens socket 9 preferably has the solid immersion lens holder 8 holding the solid immersion lens 6 attached to the objective lens 21 and biases the solid immersion lens 6 against the semiconductor device 11 by the spring 100. It is preferable to apply not only to an upright type like the microscope 5 shown in 1 but also to an inverted type. Also in this case, the solid immersion lens 6 is preferably held in front of the objective lens 21 (the direction in which the front focal point is located), and is reliably urged to the semiconductor device 11 as the observation object. When applied to an inverted type, it is preferable that the force of the panel 100 is always applied to the movable member 80 by adjusting the length of the panel 100 and the length of the through hole 85 in the optical axis L direction.

[0098] By the way, when the solid immersion lens is accommodated in the chamber and gas is introduced into the chamber and the solid immersion lens is urged to the semiconductor device by the gas pressure as in the conventional technique, the chamber is filled with gas. The gas introduction pipe to be introduced must also be connected. In this case, there is a possibility that it is difficult to put a solid immersion lens in the recess 13 or the observation range in the recess is reduced.

On the other hand, when the objective lens socket 9 is used, the solid immersion lens 6 is urged toward the semiconductor device 11 by the spring 100 arranged around the objective lens 21. A gas introduction pipe is not required. Therefore, it becomes easier to observe the semiconductor device 11 in the recess 13. In particular, since the solid immersion lens holder 8 having a substantially T-shaped outer shape is used, interference (contact) between the solid immersion lens holder 8 and the side wall 13a of the recess 13 is also reduced. It is possible to observe up to the peripheral edge of the semiconductor device 11 located in the position.

[0100] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. It is not limited. For example, as shown in FIG. 12, the objective lens socket 9 has a solid immersion lens holder 8 with a substantially T-shaped outer shape. In addition, a taper-shaped solid immersion lens holder 160 with an expanded outer diameter may be used.

[0101] The number of springs 100 is three, but this number is not limited to three. For example, as shown in FIG. 13, the spring accommodating groove 161 is formed over the entire circumference of the peripheral wall 74, and one spring 162 provided continuously in the circumferential direction disposed in the spring accommodating groove 161. As good as you can. In this case, change the shape and thickness of the peripheral wall 74 so that the pin P1 can be fixed. Also, the number of springs 100 may be two, and even four or more. Furthermore, the elastic body is not limited to the panel, but can be biased in the optical axis L direction.

[0102] Further, the holder detection sensor 120 is not limited to a sensor that uses force light, which is a sensor using light, and may be any sensor that can detect the solid immersion lens holder 8. Furthermore, the member position detecting means 110 does not necessarily need to include both the force S having the proximity sensor 112 as the contact position detecting unit and the proximity sensor 113 as the stop position detecting unit. Either one is fine. Further, the member position detecting means 110 is not limited to the proximity sensors 112 and 113, and it is sufficient that the position of the movable member 80 relative to the base portion 70 can be measured.

Furthermore, the spring 100 is provided around the objective lens barrel 26 of the objective lens 21. For example, the spring 100 is located below the objective lens barrel 26 of the objective lens 21 and is provided on the objective lens 21. The lens group in the lens is the closest to the sample and may be placed around the lens. However, from the viewpoint of securing a working distance, it is preferable that the lens is disposed around the objective lens 21 as described above.

[0104] Further, in the above-described embodiment, the case where the semiconductor device 11 provided in the recess 13 is observed with the semiconductor inspection device 1 including the objective lens socket 9, but the objective lens socket 9 is The present invention can also be suitably applied to observation of the semiconductor device 11 that is not disposed in the recess 13. Furthermore, the objective lens socket 9 can be suitably used for observation of an observation object other than the semiconductor device 11.

[0105] Furthermore, the base portion 70 and the movable member 80 are not limited to cylindrical shapes. The base part 70 is attached to the tip of the objective lens barrel 26, and the movable member 80 is opposed to the base part 70. Then, it should be attached to the base part 70 so as to be slidable in the optical axis L direction. In addition, the sensor head 140 as the holder detection unit and the member position detection means 110 are not necessarily attached.

FIG. 14 is a cross-sectional view of still another embodiment (second embodiment) of the objective lens socket according to the present invention. FIG. 14 shows a state in which the objective lens socket 170 is attached to the objective lens 21 of the semiconductor inspection apparatus 1 and the sample 10 is observed. In FIG. 14, the cross-sectional structure is shown so as to show the characteristic portion of the objective lens socket 170, and the arrangement relationship of each component is actually different.

FIG. 15 is a perspective view of the solid immersion lens holder shown in FIG. FIG. 16 is a side view of the state in which the objective lens socket and the solid immersion lens holder are disassembled. FIG. 17 is a top view of the objective lens socket. FIG. 18 is a bottom view of the objective lens socket. FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. In FIG. 16, the description of the proximity sensor 200 to be described later is omitted. FIG. 16 shows the state before attaching the solid immersion lens holder to the objective lens socket. In FIG. 17, the description of the member position detecting means 110 and the metal plate 114 is omitted. In the following description, the same reference numerals are given to the same elements as those in the first embodiment, and duplicate descriptions are omitted.

As shown in FIGS. 14 and 15, the solid immersion lens holder 8 has a peripheral wall 55 provided on the peripheral edge of the bottom plate 52 of the objective lens cap 50. A plate-like detection object D is screwed to the peripheral wall 55. The detection object D is made of nickel-plated iron and extends to the objective lens 21 side.

Furthermore, three magnets 181 to 183 force S each of the magnets 181 to 183 are embedded in the peripheral wall 55 so that the upper end portion of the magnet 183 is substantially at the same position as the upper surface 55a of the peripheral wall 55. The objective lens cap 50 is attached to the movable member 80 by magnetically attracting the magnets 181 to 183 force S to magnets 184 to 186 provided on the movable member 80 as will be described later.

[0110] The objective lens socket 170 to which the solid immersion lens holder 8 is attached will be described. [0111] As shown in FIGS. Three linear guides 190, 190, 190 extending in the direction of the optical axis L are provided at equal intervals on the wall outer surface 74a. Each linear guide 190 is screwed to the peripheral wall 74, for example.

The movable member 80 includes a slider 191 that slides in the optical axis L direction while being guided by the linear guide 190. The slider 191 is screwed to a slider holding member 192 having a substantially rectangular parallelepiped shape and formed with a recess for accommodating the slider 191. The slider 191 is fitted to the linear guide 190 via a ball, for example. The slider holding member 192 is fixed to the flange portion 88 protruding from the peripheral wall 83 of the movable member 80 by screwing.

[0113] Since the slider holding member 192 is fixed to the movable member 80 as described above, when the movable member 80 moves relative to the base portion 70, the slider is prevented from contacting the linear guide 190 and the peripheral wall 83. A notch 83a is formed inside the peripheral wall 83 in the region where the holding member 192 is provided.

In the above configuration, the movable member 80 is attached to the base unit 70 via the slider 191 and the linear guide 190. Therefore, as shown in FIGS. 20 (a) and 20 (b), the movable member 80 moves smoothly in the direction of the optical axis L with respect to the base portion 70. Further, the play between the base portion 70 and the movable member 80 can be further reduced by using the linear guide 190 and the slider 191. Therefore, the positional accuracy of the movable member 80 with respect to the base portion 70 becomes higher. In addition, since the backlash can be reduced as described above, it is possible to suppress the twisting that may occur when the backlash is large.

Further, as shown in FIG. 18, three magnets 184 to 186 force S are provided on the lower surface of the flange portion 88. Magnets 184 to 186 are, for example, rod-shaped, and are carried in the flange portion 88 so that the lower end portion protrudes slightly. The solid immersion lens holder 8 is attached to the movable member 80 by the magnetic attractive force of the magnets 184 to 186 and the three magnets 181 to 183 provided on the peripheral wall 55 of the objective lens cap 50. As for the magnetic poles of magnets 181 to 186, f array is', magnets 181 and 183 are N poles, magnet 182 is S poles, magnets 184 and 186 are S poles, and magnet 185 is N poles. I can think of it.

[0116] By attaching the solid immersion lens holder 8 to the movable member 80 using the magnets 181 to 186 as described above, the solid immersion lens holder 8 can be easily attached and detached.

[0117] The objective lens socket 170 has the solid immersion lens holder 8 attached to the movable member 80. Proximity sensor (holder detection unit) 200 for detecting whether or not the power is present. The proximity sensor 200 is electrically connected to the peripheral controller 33 (see FIG. 1). The proximity sensor 200 is held by a sensor holding member 201 fixed to the flange portion 88, and generates a magnetic field using a coil in the vicinity of the tip portion thereof. The proximity sensor 200 detects the detected object D by a change in magnetic field generated by the position of the detected object D ahead (specifically, a change in impedance of the coil).

[0118] In order to securely arrange the detected object D in front of the proximity sensor 200, as shown in FIG. 17, the flange 88 has a recess 88a for allowing the detected object D to pass therethrough. .

[0119] In the objective lens socket 170, when the solid immersion lens holder 8 is attached to the movable member 80 by aligning the magnets 181 to 183 and the magnets 184 to 186, the object D to be detected passes through the recess 88a. The proximity sensor 200 detects the object D to be detected. In other words, whether or not the solid immersion lens holder 8 is attached to the movable member 80 can be determined based on whether or not the detection object D is detected by the proximity sensor 200.

[0120] Further, in the objective lens socket 170, since the solid immersion lens holder 8 is attached using the magnets 181 to 186, the detection object D can be reliably arranged in front of the proximity sensor 200.

[0121] In the objective lens socket 170, the base 70 and the movable member 80 are fitted with the springs (elastic bodies) 100, 100, 100 accommodated in the three spring accommodating grooves 76, 76, 76, respectively. The matching is the same as in the case of the objective lens socket 9. Thus, when observing the semiconductor device 11, the solid immersion lens 6 is urged by the semiconductor device 11 and is securely adhered.

It should be noted that the fact that the metal plate 114 is provided on the movable member 80 of the objective lens socket 170 and that the member position detecting means 110 is provided on the base portion 70 are the same as in the case of the objective lens socket 9. It is the same.

The observation method of the semiconductor inspection apparatus 1 using the objective lens socket 170 described above is the same as that of the objective lens socket 9 except that the attachment state of the solid immersion lens holder 8 is checked using the proximity sensor 200. This is the same as in the case of the first embodiment using. [0124] That is, after the proximity sensor 200 detects the detection object D, it is confirmed that the solid immersion lens holder 8 is attached, and then the first implementation using the objective lens socket 9 is performed. Observe sample 10 in the same way as for morphology.

[0125] In this case, for example, the proximity sensor 200 using a magnetic field is simpler than in the case of optical detection, and the ON / OFF control is performed like a laser, for example. There is no need to do. As a result, the operation of the semiconductor inspection apparatus 1 becomes easier.

Here, the force that the objective lens socket 170 to which the solid immersion lens holder 8 having the detection object D is attached has the linear guide 190. The objective lens socket 9 shown in FIG. 2 has the linear guide 190. Anyway. Also, the number of linear guides 190 is not limited to three, but one or two, and even four or more. However, it is preferable that a plurality of linear guides 190 are provided from the viewpoint of sliding the movable member 80 with respect to the base portion 70 more stably.

[0127] Furthermore, in the above description, the objective lens socket 9, 170 is assumed to have the spring 100 as the elastic body, and the force S is applied when the objective lens socket 9, 170 is applied to an upright microscope. In addition, since it adheres to the semiconductor device 11 by its own weight, it is not always necessary to use an elastic body.

Further, in the objective lens socket 170, as in the case of the objective lens socket 9, a panel housing groove formed over the entire circumference of the peripheral wall 55 like the panel housing groove 161 shown in FIG. Is possible. Further, it is possible to attach the solid immersion lens holder 160 to the objective lens socket 170. At this time, magnets 181 to 183 may be provided on the peripheral wall of the solid immersion lens holder 160.

[0129] When observing the semiconductor device 11 using the solid immersion lens 6, the optical parameters of the solid immersion lens 6 attached to the objective lens 21 should be grasped in advance in order to obtain optimal observation conditions. It is necessary to keep. For example, the optical parameters of the solid immersion lens 6 include a refractive index n, a thickness d, and a radius of curvature R of a spherical lens surface (upper surface 6a).

R

[0130] This will be specifically described with reference to FIGS. A solid immersion lens 6 having optical parameters suitable for observation is selected for the semiconductor device 11 to be inspected, and the solid immersion lens 6 is set on the objective lens 21. And the refractive index n, thickness d,

R

And an optical device (not shown) provided in the analysis unit C for each optical parameter of the radius of curvature R Enter through. Next, the control unit B calculates optimal observation conditions using the input refractive index and thickness of the substrate of the semiconductor device 11 and the input optical parameters of the solid immersion lens 6.

[0131] Here, in addition to the configuration in which the optical parameters of the solid immersion lens 6 are individually input via the input device, the parameters prepared in advance are read by selecting the model number of the solid immersion lens 6. For example, a configuration in which a storage medium such as an IC chip in which parameter values are stored is provided in the detection target D and data is read out during use may be used.

[0132] For example, optical parameters of the solid immersion lens 6 are input to a storage medium such as a semiconductor device Z magnetic device attached to the detection object D, the model number, serial number, radius of curvature, and thickness of the solid immersion lens 6 A configuration in which parameters such as a refractive index are stored can be used. In this case, the data reading method includes reception by radio waves and reception through electrical contact by an arm and a manipulator. In this case, instead of the proximity sensor 200, a sensor applicable to each receiving method may be attached to the sensor holding member 201. Further, a configuration may be adopted in which data is read by attaching a barcode or the like to the detection object D and reading it.

[0133] By adopting such a configuration, it is possible to determine whether or not the solid immersion lens holder 8 is attached to the movable member 80, and when it is attached, the optical parameters of the solid immersion lens 6 are determined. Can be easily grasped.

Here, as described above, the objective lens socket is provided with a base portion attached to the tip of the lens barrel of the objective lens and a solid immersion lens holder, and the light of the objective lens is attached to the base portion. And a movable member that is slidably mounted in the axial direction, and the solid immersion lens holder is preferably disposed in front of the objective lens.

[0135] In the objective lens socket, a linear guide extending in the optical axis direction is provided on the outer peripheral surface of the base portion, and the movable member is slidably attached to the base portion via the linear guide. It is preferable. Since the movable member is slidably attached to the base portion via the linear guide, the backlash between the base portion and the movable member can be reduced, and high positioning accuracy can be realized.

[0136] Further, the objective lens socket is provided between the base portion and the movable member. It is preferable to provide an elastic body that urges the movable member in the optical axis direction.

[0137] In this configuration, an elastic body is provided between the base portion slidably attached and the movable member, and the movable member is urged by the elastic body in the optical axis direction of the objective lens. The solid immersion lens held by the solid immersion lens holder is also biased in the optical axis direction of the objective lens. As a result, for example, when observing the observation object using the solid immersion lens held by the solid immersion lens holder, the solid immersion lens is pressed toward the observation object.

[0138] In the objective lens socket, it is preferable that the elastic body is disposed around the lens barrel of the objective lens. As a result, even if the objective lens socket is attached to the lens barrel of the objective lens, the length of the objective lens socket in the optical axis direction of the objective lens can be shortened. A working distance can be secured.

[0139] Furthermore, in the objective lens socket, the peripheral wall of the base portion is formed with an elastic body accommodating groove that extends in the optical axis direction and accommodates the elastic body, and the elastic body is formed in the elastic body accommodating groove. The capacity to be accommodated S is suitable. Since the elastic body is housed in the elastic body housing groove, the length of the objective lens socket in the optical axis direction of the objective lens can be further shortened, and as a result, the working distance of the objective lens is ensured. be able to.

[0140] The objective lens socket preferably further includes a holder detection unit that detects the attachment state of the solid immersion lens holder to the movable member. Thereby, for example, even when the observation object is observed in the tub room, it can be easily detected whether or not the solid immersion lens holder is attached to the movable member.

[0141] It is preferable that the holder detection unit detects the solid immersion lens holder by detecting an object to be detected that is previously attached to the solid immersion lens holder. In this case, it is possible to easily determine the mounting state of the solid immersion lens holder based on whether or not the detection object is detected by the holder detection unit.

[0142] It is also effective for the holder detection unit to detect the solid immersion holder by acquiring the reflected light from the solid immersion lens holder. By detecting the solid immersion lens holder optically in this way, the solid immersion lens holder can be detected in a non-contact manner. It is possible to reduce the influence on

[0143] Further, it is preferable that the objective lens socket further includes a member position detecting means for detecting a member position in the optical axis direction of the movable member with respect to the base portion. The urging force received from the elastic body changes according to the position of the movable member. Therefore, the biasing force applied to the movable member from the elastic body can be detected by detecting the member position of the movable member by the member position detecting means. The urging force that the movable member receives the elastic body force is applied to the observation object through the solid immersion lens at the time of observation. Therefore, the observation object is obtained by knowing the urging force applied to the observation object as described above. It is possible to observe the observation object without damaging it.

[0144] Further, the member position detecting means of the objective lens socket may include a contact position detecting unit that detects a member position when the solid immersion lens held by the solid immersion lens holder comes into contact with the observation object. preferable. The contact position detection unit can know that the solid immersion lens has contacted the observation object.

[0145] Further, the member position detecting means of the objective lens socket detects a member position for stopping the urging of the object to be observed by the elastic body via the solid immersion lens held by the solid immersion lens holder. It is preferable to have a stop position detection unit. In this configuration, since the stop position detection unit detects the member position, the urging of the elastic body to the observation target object is stopped, so that a certain load is not applied to the observation target object. As a result, the observation object is protected.

Industrial applicability

The present invention can be used as an objective lens socket capable of bringing a solid immersion lens into close contact with an observation object with a simple configuration.

Claims

The scope of the claims

[1] a base part attached to the tip of the objective lens barrel;

A movable member attached to the base portion so as to be slidable in the optical axis direction of the objective lens;

With

An objective lens socket, wherein the solid immersion lens holder is disposed in front of the objective lens.

[2] A linear guide extending in the optical axis direction is provided on the outer peripheral surface of the base portion,

2. The objective lens socket according to claim 1, wherein the movable member is slidably attached to the base portion via the linear guide.

[3] The objective lens socket according to claim 1 or 2, further comprising an elastic body provided between the base portion and the movable member and biasing the movable member in the optical axis direction. .

4. The objective lens socket according to claim 3, wherein the elastic body is disposed around the lens barrel of the objective lens.

[5] An elastic body accommodating groove that extends in the optical axis direction and accommodates the elastic body is formed on the peripheral wall of the base portion,

5. The objective lens socket according to claim 3, wherein the elastic body is accommodated in the elastic body accommodating groove.

6. The objective lens socket according to any one of claims 1 to 5, further comprising a holder detection unit that detects an attachment state of the solid immersion lens holder to the movable member.

7. The objective lens socket according to claim 6, wherein the holder detection unit detects the solid immersion lens holder by detecting a detection object attached in advance to the solid immersion lens holder. .

8. The objective lens socket according to claim 6, wherein the holder detection unit detects the solid immersion lens holder by acquiring reflected light from the solid immersion lens holder.

[9] A member position in the optical axis direction of the movable member with respect to the base portion is detected. The objective lens socket according to any one of claims 1 to 8, further comprising a member position detecting unit.

10. The objective lens socket according to claim 9, wherein the member position detection means includes a contact position detection unit that detects the position of the member when the solid immersion lens contacts an observation object. .

[11] The member position detecting means includes a stop position detecting unit that detects the member position for stopping the biasing of the elastic body to the observation object via the solid immersion lens. The objective lens socket according to claim 9 or 10.