JP4772394B2 - Objective lens socket - Google Patents

Description

  The present invention relates to an objective lens socket for attaching a solid immersion lens holder for holding a solid immersion lens in front of the objective lens.

  A solid immersion lens (SIL) is known as a lens for enlarging an image of an observation object. This solid immersion lens is a hemispherical lens or a super hemispherical lens called a Weierstrass sphere, and is a minute lens having a size of about 1 mm to 5 mm. When this solid immersion lens is placed in close contact with the surface of the observation object, both the numerical aperture (NA) and the magnification are enlarged, so that observation with high spatial resolution becomes possible.

As a semiconductor inspection apparatus to which this solid immersion lens is applied, for example, one disclosed in Patent Document 1 is known. In the semiconductor inspection apparatus described in Patent Document 1, a solid immersion lens is mounted in front of the objective lens (on the observation object side) by attaching a sleeve (solid immersion lens holder) containing the solid immersion lens to the tip of the objective lens. It is arranged. Then, by adjusting the pressure of the chamber formed in the sleeve through a valve provided in the sleeve, the solid immersion lens is moved in the optical axis direction of the solid immersion lens, and the optical object between the observation object and the solid immersion lens is moved. Realize the bond.
US Pat. No. 6,612,275

  However, in the semiconductor inspection apparatus described in Patent Document 1, since the movement of the solid immersion lens in the optical axis direction is realized by adjusting the pressure of the chamber in the solid immersion lens holder, gas is injected into the chamber. The valve and the gas to be charged must be prepared, and the configuration becomes complicated.

  Therefore, an object of the present invention is to provide an objective lens socket capable of bringing a solid immersion lens into close contact with an observation object with a simple configuration.

In order to solve the above-described problems, an objective lens socket according to the present invention is provided with a base portion attached to a tip portion of a lens barrel of an objective lens and a solid immersion lens holder for holding a solid immersion lens, and attached to the base portion. A movable member that is slidably mounted in the optical axis direction of the objective lens, and a member position detecting unit that detects a member position of the movable member in the optical axis direction with respect to the base portion, and the solid immersion lens holder is disposed in front of the objective lens. It arrange | positions at the feature.
The objective lens socket according to the present invention includes a base part attached to the tip of the objective lens barrel and a solid immersion lens holder for holding the solid immersion lens, and the optical axis direction of the objective lens in the base part. A movable member that is slidably attached to the movable member, and a holder detection unit that detects a state of attachment of the solid immersion lens holder to the movable member, and the solid immersion lens holder is disposed in front of the objective lens. .

  In this configuration, since the movable member is attached to the base portion attached to the distal end portion of the lens barrel of the objective lens, the solid immersion lens holder attached to the movable member is arranged in front of the objective lens. Since the movable member is slidably attached to the base portion, the solid immersion lens holder is movable with respect to the optical axis direction of the objective lens with respect to the base portion. As a result, for example, when observing an observation object using a solid immersion lens held by a solid immersion lens holder, the solid immersion lens can be brought into close contact with the observation object, and the state can be maintained. Easy.

  Further, in the objective lens socket according to the present invention, a linear guide extending in the optical axis direction is provided on the outer peripheral surface of the base portion, and the movable member is slidably attached to the base portion via the linear guide. It is preferable. Since the movable member is slidably attached to the base portion via the linear guide, the backlash between the base portion and the movable member can be reduced, and high positional accuracy can be realized.

  Furthermore, the objective lens socket according to the present invention preferably includes an elastic body that is provided between the base portion and the movable member and biases the movable member in the optical axis direction.

  In this configuration, an elastic body is provided between the slidably attached base portion and the movable member, and the movable member is biased in the optical axis direction of the objective lens by the elastic body. The solid immersion lens held by the holder is also biased in the optical axis direction of the objective lens. As a result, for example, when observing the observation object using the solid immersion lens held by the solid immersion lens holder, the solid immersion lens is pressed toward the observation object.

  In the objective lens socket according to the present invention, it is preferable that the elastic body is disposed around the lens barrel of the objective lens. As a result, even if the objective lens socket is attached to the lens barrel of the objective lens, it is possible to shorten the length of the objective lens socket in the optical axis direction of the objective lens, and as a result, the working distance of the objective lens is reduced. Can be secured.

  Furthermore, in the objective lens socket according to the present invention, the peripheral wall of the base portion is formed with an elastic body accommodating groove that extends in the optical axis direction and accommodates the elastic body, and the elastic body is formed in the elastic body accommodating groove. It is preferable to be accommodated. Since the elastic body is housed in the elastic body housing groove, the length of the objective lens socket in the optical axis direction of the objective lens can be further shortened, and as a result, the working distance of the objective lens is ensured. Can do.

  In the objective lens socket according to the present invention, it is preferable that the objective lens socket further includes a holder detection unit that detects the attachment state of the solid immersion lens holder to the movable member. Thereby, for example, even when the observation object is observed in a dark room, it is possible to easily detect whether or not the solid immersion lens holder is attached to the movable member.

  It is preferable that the holder detection unit detects the solid immersion lens holder by detecting an object to be detected that is attached to the solid immersion lens holder in advance. In this case, it is possible to easily determine the mounting state of the solid immersion lens holder based on whether or not the detection target is detected by the holder detection unit.

  It is also effective for the holder detection unit to detect the solid immersion holder by acquiring reflected light from the solid immersion lens holder. Since the solid immersion lens holder can be detected in a non-contact manner by optically detecting the solid immersion lens holder in this way, it is possible to reduce the influence on the solid immersion lens holder accompanying the detection.

  Furthermore, it is preferable that the objective lens socket according to the present invention further includes a member position detecting means for detecting a member position in the optical axis direction of the movable member with respect to the base portion. The urging force received from the elastic body changes according to the position of the movable member. Therefore, the biasing force applied to the movable member from the elastic body can be detected by detecting the member position of the movable member by the member position detecting means. The urging force that the movable member receives from the elastic body is applied to the observation object through the solid immersion lens at the time of observation. Therefore, the observation object is obtained by knowing the urging force applied to the observation object as described above. It is possible to observe the observation object without damaging the object.

  In addition, the member position detection means included in the objective lens socket according to the present invention preferably includes a contact position detection unit that detects a member position when the solid immersion lens held by the solid immersion lens holder comes into contact with the observation object. . The contact position detector can know that the solid immersion lens has contacted the observation object.

  Further, the member position detecting means included in the objective lens socket according to the present invention detects a member position for stopping the biasing of the object to be observed by the elastic body through the solid immersion lens held by the solid immersion lens holder. It is preferable to have a stop position detector. In this configuration, since the urging of the elastic object to the observation object is stopped when the stop position detection unit detects the member position, a load exceeding a certain level is not applied to the observation object. As a result, the observation object is protected.

  According to the objective lens socket of the present invention, the solid immersion lens can be brought into close contact with the observation object with a simple configuration.

  Hereinafter, preferred embodiments of the objective lens socket according to the present invention will be described with reference to the drawings. In each figure, the same symbols are attached to the same elements, and duplicate descriptions are omitted.

(First embodiment)
FIG. 1 is a configuration diagram showing a semiconductor inspection apparatus having an objective lens socket as one embodiment of the present invention. FIG. 2 is a configuration diagram showing the configuration of the objective lens to which the objective lens socket is attached. FIG. 3 is an exploded perspective view of a solid immersion lens holder attached to the objective lens socket.

  FIG. 2 shows a state during observation of the sample. Further, as shown in the characteristic part of the objective lens socket, the spring accommodating groove (elastic body accommodating groove) 76 that accommodates the spring 100 and the through hole 85 for inserting the pin P1 are displayed in the same cross section. However, their arrangement is actually different. This actual arrangement is shown in FIG. FIG. 3 shows a state in which the solid immersion lens holder holds the solid immersion lens. In the following description, the objective lens side will be described as the upper side, and the sample side and the lower side with respect to the solid immersion lens.

  As illustrated in FIGS. 1 and 2, the semiconductor inspection apparatus 1 acquires an image of the semiconductor device 11 using, for example, a semiconductor device 11 (see FIG. 2) included in a mold type semiconductor device that is a sample 10 as an observation target. It is an inspection device that inspects the internal information.

  The “molded semiconductor device” is a semiconductor device 11 molded with a resin 12. “Internal information” includes circuit patterns of semiconductor devices and weak light emission from the semiconductor devices. Examples of the weak light emission include those caused by an abnormal portion based on a defect in a semiconductor device, transient light emission accompanying a switching operation of a transistor in the semiconductor device, and the like. Furthermore, heat generation due to defects in the semiconductor device is also included.

  In the sample 10, the back surface of the semiconductor device 11 faces upward on the stage 2 provided in the observation section A in a state where the resin 12 is cut so that the back surface of the semiconductor device 11 embedded in the resin 12 is exposed. Is placed as follows. Thus, since a part of sample 10 is cut and the back surface of semiconductor device 11 is exposed, semiconductor device 11 will be located in the bottom of crevice 13 formed by resin 12 being cut. In the present embodiment, the inspection apparatus 1 inspects the illustrated lower surface of the semiconductor device 11 (such as an integrated circuit formed on the substrate surface of the semiconductor device 11).

  The semiconductor inspection apparatus 1 includes an observation unit A that observes the semiconductor device 11, a control unit B that controls the operation of each unit of the observation unit A, and an analysis unit C that performs processing and instructions necessary for the inspection of the semiconductor device 11. And.

  The observation unit A includes a high-sensitivity camera 3 and a laser scanning optical system (LSM) unit 4 as image acquisition means for acquiring an image from the semiconductor device 11, and the high-sensitivity camera 3 and LSM unit 4 and the semiconductor device. 11, an optical system 20 including the objective lens 21 of the microscope 5 disposed between the solid immersion lens 6 and the solid immersion lens 6 (see FIG. 2) for obtaining an enlarged observation image of the semiconductor device 11, and XY orthogonal to these. And an XYZ stage 7 that is moved in the −Z direction.

  The optical system 20 includes a camera optical system 22 and an LSM unit optical system 23 in addition to the objective lens 21. A plurality of objective lenses 21 having different magnifications are provided and can be switched. In addition, the objective lens 21 has a correction ring 24, and by adjusting the correction ring 24, it is possible to focus on a portion to be observed with certainty. The camera optical system 22 guides light from the semiconductor device 11 that has passed through the objective lens 21 to the high-sensitivity camera 3, and the high-sensitivity camera 3 acquires an image such as a circuit pattern of the semiconductor device 11.

  On the other hand, the LSM unit optical system 23 reflects the infrared laser light from the LSM unit 4 to the objective lens 21 side by a beam splitter (not shown) and guides it to the semiconductor device 11, and passes the objective lens 21 through the high sensitivity camera 3. The reflected laser beam from the semiconductor device 11 directed to is guided to the LSM unit 4.

  The LSM unit 4 scans infrared laser light in the X-Y direction and emits it to the semiconductor device 11 side, while detecting reflected light from the semiconductor device 11 with a photodetector (not shown). The intensity of the detection light is an intensity reflecting the circuit pattern of the semiconductor device 11. Therefore, the LSM unit 4 acquires an image such as a circuit pattern of the semiconductor device 11 by XY scanning the semiconductor device 11 with the infrared laser light.

  The XYZ stage 7 moves the high-sensitivity camera 3, LSM unit 4, optical system 20, solid immersion lens 6, and the like in the XY direction (horizontal direction; the semiconductor device 11 that is the observation target). It is for moving as needed in each of a direction (parallel direction) and a Z direction (vertical direction) perpendicular thereto.

  The control unit B includes a camera controller 31, a laser scan (LSM) controller 32, and a peripheral controller 33. The camera controller 31 and the LSM controller 32 control the operations of the high-sensitivity camera 3 and the LSM unit 4 respectively, thereby performing observation (acquisition of images) of the semiconductor device 11 performed in the observation unit A, setting of observation conditions, and the like. To control.

  The peripheral controller 33 controls the operation of the XYZ stage 7 to move and align the high-sensitivity camera 3, the LSM unit 4, the optical system 20, and the like to the position corresponding to the observation position of the semiconductor device 11. Control focusing, etc. At this time, the peripheral controller 33 controls the operation of the XYZ stage 7 according to detection results of various sensors attached to the objective lens socket 9 and the solid immersion lens holder 8. The peripheral controller 33 adjusts the correction ring 24 by driving a correction ring adjustment motor 25 attached to the objective lens 21.

  The analysis unit C includes an image analysis unit 41 and an instruction unit 42, and is configured by a computer. The image analysis unit 41 performs necessary analysis processing on the image information from the camera controller 31 and the LSM controller 32, and the instruction unit 42 displays input contents from the operator, analysis contents by the image analysis unit 41, and the like. With reference to the control unit B, necessary instructions regarding the execution of the inspection of the semiconductor device 11 in the observation unit A are given. In addition, images, data, and the like acquired or analyzed by the analysis unit C are displayed on the display device 43 connected to the analysis unit C as necessary.

  As shown in FIG. 2, the solid immersion lens 6 is a hemispherical microlens, which serves as an input / output surface for light to the outside (for example, an objective lens of a microscope) and has an upper surface 6 a formed in a spherical shape, and a semiconductor. It has a bottom surface 6b which is a mounting surface for the device 11 and is formed in a planar shape. The solid immersion lens 6 obtains an enlarged observation image of the front surface (lower surface in the drawing) of the semiconductor device 11 on the back side by the bottom surface 6b being in close contact with the observation position (upper surface in the drawing).

  Specifically, the solid immersion lens used in the semiconductor inspection apparatus is made of a high refractive index material that is substantially the same as or close to the refractive index of the substrate material of the semiconductor device. Typical examples include Si, GaP, and GaAs.

  Such a small optical element is optically brought into close contact with the substrate surface of the semiconductor device, whereby the semiconductor substrate itself is used as a part of the solid immersion lens. According to the backside analysis of a semiconductor device using a solid immersion lens, when the focus of the objective lens is adjusted to the integrated circuit formed on the surface of the semiconductor substrate, the effect of the solid immersion lens causes a high NA flux in the substrate. High resolution can be expected.

  The lens shape of such a solid immersion lens 6 is determined by the condition that the aberration is eliminated. In the solid immersion lens 6 having a hemispherical shape, the spherical center is a focal point. At this time, the numerical aperture (NA) and the magnification are both n times. The shape of the solid immersion lens 6 is not limited to a hemispherical shape, and may be, for example, a Weierstrass shape.

  A solid immersion lens holder 8 that preferably holds the solid immersion lens 6 with respect to the objective lens 21 is attached to the front of the objective lens 21 via an objective lens socket 9. The objective lens socket 9 will be described in detail later.

  As shown in FIGS. 2 and 3, the solid immersion lens holder 8 has a lens holding portion 60 extending from the center of the disc-shaped objective lens cap 50 in a direction substantially orthogonal to the objective lens cap 50. When viewed from the direction of the arrow A1 shown in FIG. 3, the outer shape is substantially T-shaped.

  The objective lens cap 50 has a peripheral wall 51 that is screwed into the objective lens socket 9 (see FIG. 2), and the objective lens cap 50 is attached to the tip of the objective lens 21 via the objective lens socket 9. become. Therefore, the position of the solid immersion lens 6 held by the solid immersion lens holder 8 can be adjusted by driving the XYZ stage 7.

  The bottom plate 52 of the objective lens cap 50 has three openings 53, 53, 53 for allowing the light beam to pass therethrough. Each opening 53 allows light output from the LSM unit 4 to pass to the solid immersion lens 6 side, and allows light reflected by the semiconductor device 11 and output from the solid immersion lens 6 to pass to the objective lens 21 side.

  Each opening 53 is substantially fan-shaped and is concentric with the center of the objective lens cap 50 and is arranged at equal intervals in the circumferential direction. Thus, between the adjacent openings 53, 53, the lens holding portion 60 and the bottom plate 52 are connected, and three connecting portions 54, 54, 54 extending radially from the center of the objective lens cap 50 are formed at equal intervals. Will be.

  The lens holding unit 60 includes a lens holding member 61 that extends in a direction substantially orthogonal to the objective lens cap 50 (in the optical axis L direction of the objective lens 21) from the intersection of the three connecting parts 54. The lens holding member 61 includes three holding pieces 62, 62, 62 that are positioned on the respective connecting portions 54, 54, 54 and receive the solid immersion lens 6.

  The holding pieces 62, 62, 62 are arranged radially with respect to the center line of the lens holding member 61, and have a tapered shape in which the width d becomes narrower toward the center line of the lens holding member 61.

  Lens receiving surfaces 62a, 62a, and 62a having the same curvature as the curvature of the upper surface 6a of the solid immersion lens 6 are formed at the distal end portion (the end portion opposite to the objective lens cap 50) of each holding piece 62, and the lens holding portion The member 61 receives the solid immersion lens 6 by the three lens receiving surfaces 62a. For this reason, the lens holding member 61 can receive the solid immersion lens 6 stably.

  Further, a claw portion 62b for fixing the cylindrical lens cover 63 is formed at the tip of each holding piece 62, respectively. The lens cover 63 has a bottom plate 64, and a peripheral wall 65 fitted to the claw portion 62 b is provided on the periphery of the bottom plate 64. The bottom plate 64 is formed with an opening 64a for projecting the bottom surface 6b of the solid immersion lens 6 to the outside (sample 10 side).

  In this configuration, the solid immersion lens 6 is disposed between the lens receiving surface 62a and the lens cover 63, and then the lens cover 63 is fixed to the lens holding member 61 with an adhesive or the like. The bottom surface 6b is accommodated between the lens receiving surface 62a and the lens cover 63 so as to protrude from the opening 64a, and the solid immersion lens 6 is held by the solid immersion lens holder 8.

  The solid immersion lens 6 is grounded to the semiconductor device 11 by moving the objective lens 21 in the direction of the optical axis L by operating the XYZ stage 7.

  If the solid immersion lens 6 is further pushed down by adjusting the focus position while the solid immersion lens 6 is grounded, the semiconductor device 11 may be damaged by the force applied from the solid immersion lens 6.

  Therefore, it is preferable that the solid immersion lens holder 8 has a stress detection sensor S in each connecting portion 54 as shown in FIG.

  When the solid immersion lens 6 applies a force to the semiconductor device 11, the solid immersion lens 6 is pressed against the holding piece 62 by its reaction, and as a result, stress is generated in the connecting portion 54. The stress detection sensor S detects the force applied to the semiconductor device 11 by the solid immersion lens 6 by detecting the stress applied to the connecting portion 54.

  The stress detection sensor S is electrically connected to the peripheral controller 33, and when the stress detection sensor S detects a force greater than a predetermined stress, the peripheral controller 33 drives the XYZ stage 7. To stop. As a result, a force exceeding a predetermined load is not applied to the semiconductor device 11.

  Next, the objective lens socket 9 that characterizes the present embodiment will be described in detail. FIG. 4 is a cross-sectional view of the objective lens socket 9. FIG. 5 is a configuration diagram showing the configuration of the base portion and the movable member of the objective lens socket 9. FIG. 5A is a view of the base portion and the movable member as viewed from the objective lens side. FIG. 5B is a side view of the base portion and the movable member. FIG. 5C is a view of the base portion and the movable member as viewed from the sample side. In FIG. 4, it is described so that a characteristic part appears as in FIG. Further, FIG. 5 shows a state in which the movable member is fitted to the base portion, but the description of pins and the like is omitted.

  As shown in FIGS. 2, 4, and 5, the objective lens socket 9 is fitted to the base portion 70 and a cylindrical base portion 70 that is fitted to the distal end portion of the objective lens barrel 26 of the objective lens 21. And a movable member 80.

  The base unit 70 and the movable member 80 have bottom plates 71 and 81, respectively. Each of the bottom plates 71 and 81 receives a light beam output from the objective lens 21 or incident on the objective lens 21 with the center at the center. Circular openings 72 and 82 are provided for passing through. The diameter of the openings 72 and 82 may be a size that does not block the light beam, and the diameter of the opening 82 is larger than the diameter of the opening 72. A plurality of through holes 73 are formed around the opening 72 of the base portion 70, and the base portion 70 is screwed to the objective lens 21 through the through holes 73. More specifically, it is screwed to an objective lens barrel 26 (see FIG. 2) that houses a lens group that the objective lens 21 has. However, the method of fixing the base unit 70 to the objective lens 21 is not limited to the above method.

  Peripheral walls 74 and 83 are provided on the peripheral portions of the bottom plates 71 and 81, respectively. The inner diameter of the peripheral wall 74 is equal to the outer diameter of the distal end portion of the objective lens barrel 26, and the base portion 70 is fitted and attached to the distal end portion of the objective lens barrel 26 of the objective lens 21.

  Further, the outer diameter of the peripheral wall 74 and the inner diameter of the peripheral wall 83 are equal, and the movable member 80 is fitted to the base portion 70. The outer surface of the peripheral wall 74 and the inner surface of the peripheral wall 83 are in sliding contact with each other. As a result, the movable member 80 can slide in the optical axis L direction with respect to the base portion 70. The outer diameter of the peripheral wall 83 (the outer diameter of the movable member 80) is equal to the outer diameter of the peripheral wall 51 of the objective lens cap 50 (see FIG. 2), and the outer peripheral surface of the end of the movable member 80 on the bottom plate 81 side is A screw groove 84 (see FIG. 5B) for screwing the peripheral wall 51 of the objective lens cap 50 is formed, and the objective lens cap 50 can be attached to the movable member 80.

  The peripheral wall 83 of the movable member 80 has a pair of through holes 85, 85 facing each other, and the through holes 75 formed at positions corresponding to the through holes 85, 85 on the peripheral wall 74 of the base portion 70. , 75, the movable member 80 is connected to the base portion 70 by inserting the pin P1. The through hole 85 has an oval shape whose length in the optical axis L direction is longer than the length in the circumferential direction, and the circumferential length of the through hole 85 is substantially the same as the outer diameter of the pin P1. As a result, the movable member 80 can move with respect to the base portion 70 by the length of the elliptical optical axis L direction in the optical axis L direction, and is prevented from rotating in the circumferential direction. It will be.

  The base portion 70 and the movable member 80 include springs (elastic bodies) 100 housed in three spring housing grooves (elastic body housing grooves) 76, 76, 76 formed on the bottom surface of the peripheral wall 74 of the base portion 70. , 100, 100 are fitted together. Since the depth of the spring accommodating groove 76 is shorter than the natural length of the spring 100, the tip of the spring 100 protrudes from the spring accommodating groove 76.

  Therefore, in a state where the movable member 80 is fitted to the base portion 70, both end portions of the spring 100 abut against the bottom surface 76 a (the upper surface in FIG. 4) of the spring accommodating groove 76 and the bottom plate 81 of the movable member 80. In contact therewith, the movable member 80 is urged in the direction of the optical axis L. Thus, when observing the semiconductor device 11, the solid immersion lens 6 is urged by the semiconductor device 11 and is securely adhered.

  Further, since the peripheral wall 74 is located outside the outer peripheral portion of the objective lens barrel 26 (see FIG. 2), the spring 100 is disposed around the objective lens barrel 26 included in the objective lens 21. As a result, the length of the objective lens socket 9 in the optical axis L direction is shorter, and the reduction of the working distance of the objective lens 21 due to the mounting of the objective lens socket 9 can be suppressed.

  By the way, if the spring 100 is contracted and the biasing force by the spring 100 is too strong, the semiconductor device 11 may be damaged as described above. Therefore, as shown in FIGS. 2 and 4, the objective lens socket 9 includes a member position detection unit 110 that detects a position (member position) of the movable member 80 in the optical axis L direction with respect to the base portion 70.

  FIG. 6 is a configuration diagram showing the configuration of the member position detecting means included in the objective lens socket 9. FIG. 6 shows a state viewed from the direction of the arrow A2 in FIG. 4 and shows a state where the solid immersion lens holder 8 is attached.

  4 and 6, the member position detecting means 110 includes a sensor holding member 111, two proximity sensors 112 and 113 held by the sensor holding member 111, a substantially L-shaped metal plate 114, and the like. Have

  The sensor holding member 111 has a substantially rectangular parallelepiped shape and is screwed into a screw hole 77 (see FIG. 5A) formed on the upper surface of the peripheral wall 74 of the base portion 70. The sensor holding member 111 is close to the sensor holding member 111. The proximity sensors 112 and 113 are held such that the tip ends of the sensors 112 and 113 protrude from the end of the sensor holding member 111.

  The metal plate 114 is screwed into a screw hole 86 (see FIG. 5A) formed in the upper surface of the peripheral wall 83 of the movable member 80. Therefore, it moves in the optical axis L direction according to the movable member 80. The metal plate 114 is disposed such that a part thereof (a portion extending in the optical axis L direction) faces the proximity sensors 112 and 113.

  Proximity sensors 112 and 113 are arranged in parallel in a direction that is different from each other in the optical axis L direction and orthogonal to the optical axis L, and are held by the sensor holding member 111. The proximity sensors 112 and 113 are electrically connected to the peripheral controller 33 (see FIG. 1), and generate a magnetic field in the vicinity of the tip thereof. And the member position of the movable member 80 with respect to the base part 70 is detected by detecting the metal plate 114 by the change of the magnetic field due to the metal plate 114 approaching (moving upward in FIG. 4).

  The proximity sensor (contact position detection unit) 112 is arranged so as to face the metal plate 114 when the spring 100 arranged between the base unit 70 and the movable member 80 starts to contract from the natural length. . As a result, when the solid immersion lens 6 comes into contact with the semiconductor device 11, the proximity sensor 112 detects the metal plate 114. Therefore, the proximity sensor 112 detects the contact start position between the solid immersion lens 6 and the semiconductor device 11. It functions as a sensor for detecting the member position of the movable member 80 corresponding to.

  Further, the proximity sensor (stop position detection unit) 113 is disposed above the proximity sensor 112, and a movable member 80 for stopping the biasing of the spring 100 through the solid immersion lens 6 to the semiconductor device 11. The position of the member is detected. That is, it is possible to detect the position of the movable member 80 relative to the base portion 70 that generates the maximum urging force within a range that does not damage the semiconductor device 11 among the urging forces applied to the semiconductor device 11 via the solid immersion lens 6. Thus, it is arranged above the proximity sensor 112.

  Here, the operation of the member position detecting means 110 will be described with reference to FIG. FIG. 7 is a diagram for explaining the operation of the member position detecting means 110.

  As shown in FIG. 7A, first, when the focus position of the objective lens 21 is adjusted by the peripheral controller 33, the objective lens socket 9 is pushed down toward the semiconductor device 11 along with the objective lens 21. The solid immersion lens 6 comes into contact with the semiconductor device 11.

  Since the solid immersion lens 6 is held by the solid immersion lens holder 8 attached to the movable member 80, the movable member 80 is pushed toward the base portion 70 when the solid immersion lens 6 contacts the semiconductor device 11. As a result, the metal plate 114 also moves upward, so that the proximity sensor 112 detects the metal plate 114. That is, the contact of the solid immersion lens 6 with the semiconductor device 11 is detected.

  The detection result of the proximity sensor 112 is input to the instruction unit 42 via the peripheral controller 33 and informs the operator that the solid immersion lens 6 is grounded to the semiconductor device 11.

  7B, the proximity sensor 112 detects the metal plate 114 when the objective lens 21 is further pushed down toward the semiconductor device 11 (that is, when the objective lens socket 9 is pushed down). When the proximity sensor 113 has not detected the metal plate 114, the focus position is continuously adjusted.

  Further, as shown in FIG. 7C, when the objective lens socket 9 is further pushed down toward the semiconductor device 11 and the proximity sensor 113 detects the metal plate 114, the peripheral controller 33 stops pushing down the objective lens 21. To do. Since a load greater than the set urging force is not applied to the semiconductor device 11, damage to the semiconductor device 11 due to adjustment of the focus position or the like is suppressed.

  When observing the semiconductor device 11, the microscope 5 is usually placed in a dark box, so it is preferable that it can be automatically confirmed whether or not the solid immersion lens holder 8 is attached to the movable member 80. Therefore, the semiconductor inspection apparatus 1 includes a holder detection sensor 120 that detects the mounting state of the solid immersion lens holder 8 as shown in FIGS. 1, 2, and 8. FIG. 8 is a block diagram illustrating a configuration of a holder detection sensor included in the semiconductor inspection apparatus 1. The holder detection sensor 120 includes an amplifier unit 130 and a sensor head (holder detection unit) 140 that constitutes a part of the objective lens socket 9.

  The amplifier unit 130 includes a light emitting element 131 and a light receiving element 132 and is electrically connected to the peripheral controller 33. The light emitting element 131 of the amplifier unit 130 is optically connected to the light projecting side fiber 151, and the light projecting side fiber 151 is connected to the sensor head 140. The light receiving element 132 of the amplifier unit 130 is optically connected to the light receiving side fiber 152, and the light receiving side fiber 152 is connected to the sensor head 140.

  FIG. 9 is a configuration diagram showing the configuration of the sensor head. FIG. 9 shows a state viewed from the arrow A3 side in FIG. FIG. 9 shows a state where the solid immersion lens holder 8 is attached.

  In the sensor head 140, a fiber holding member 141, a reflection mirror 142, and a condenser lens 143 are covered with a cover 144, and a screw formed on the upper surface of the peripheral wall 74 of the base portion 70 of the objective lens socket 9. The holes 78 (see FIG. 5A) are screwed.

  As shown in FIG. 9, the fiber holding member 141 has the light projecting side fiber 151 and the light receiving side fiber 152 inserted therein and holds them in parallel.

  The reflection mirror 142 is fixed to the fiber holding member 141 in front of the output end of the light projecting side fiber 151, reflects the light 153 output from the light projecting side fiber 151 to the solid immersion lens holder 8 side, and fixes the light. Return light (reflected light) from the immersion lens holder 8 is incident on the light receiving side fiber 152.

  The condensing lens 143 is fixed to the fiber holding member 141 below the reflecting mirror 142 (the lower side in FIG. 9), and the light output from the light projecting side fiber 151 and reflected by the reflecting mirror 142 is received. The condensed light is condensed on the upper surface of the peripheral wall 51 of the solid immersion lens holder 8 and the return light from the solid immersion lens holder 8 is condensed and incident on the light receiving side fiber 152.

  Here, operation | movement of a holder detection sensor is demonstrated using FIG. FIG. 10 is a diagram illustrating the operation of the holder detection sensor.

  As shown in FIG. 10A, when the solid immersion lens holder 8 is attached to the movable member 80, the light 153 output from the light projecting side fiber 151 is held by the objective lens cap 50 by the condenser lens 143. The light is reflected from the upper surface of the peripheral wall 51, collected by the condenser lens 143, and incident on the light receiving side fiber 152.

  That is, the reflected light from the solid immersion lens holder 8 is acquired by the sensor head 140. As a result, the light receiving element 132 detects return light.

  On the other hand, as shown in FIG. 10B, when the solid immersion lens holder 8 is not attached to the movable member 80, the light 153 output from the light projecting side fiber 151 is incident on the light receiving side fiber 152. Therefore, the light receiving element 132 does not detect return light.

  Therefore, the attachment state of the solid immersion lens holder 8 can be detected based on whether or not the light receiving element 132 has detected return light. Thereby, for example, even when the microscope 5 is placed in a dark box, the semiconductor device 11 can be observed in a state where the solid immersion lens holder 8 is securely attached.

  Next, an example of a method for acquiring an image of the semiconductor device 11 using the semiconductor inspection apparatus 1 will be described.

  First, a structure in which the semiconductor device 11 is observed by the solid immersion lens 6 is identified by the objective lens 21 that is not attached with the solid immersion lens 6 among the plurality of objective lenses 21 included in the microscope 5. The observation position is specified by driving the XYZ stage 7 via the peripheral controller 33 by the instruction unit 42.

  When the operator specifies the observation position to be observed with the solid immersion lens 6, the operator activates the solid immersion lens mode to set the observation state using the solid immersion lens 6. At this time, the operator inputs the model number of the solid immersion lens 6 held by the solid immersion lens holder 8 and the thickness and material of the substrate included in the semiconductor device 11 to the instruction unit 42. As a result, the instruction unit 42 refers to previously input data, and calculates five parameters for calculating the position of the correction ring 24 and the focus position of the objective lens 21, that is, the thickness of the solid immersion lens 6, The refractive index, the radius of curvature of the upper surface 6a, the substrate thickness, and the refractive index of the substrate are specified.

  Next, the instruction unit 42 outputs light from the light emitting element 131 of the holder detection sensor 120 via the peripheral controller 33, and whether the solid immersion lens holder 8 is attached to the objective lens 21 used for solid immersion lens observation. Detect whether or not.

  That is, when light is output by the light emitting element 131, the instruction unit 42 determines that the solid immersion lens holder 8 is attached if the light receiving element 132 detects return light, and the light receiving element 132 detects return light. Otherwise, it is determined that the solid immersion lens holder 8 is not attached. Then, the detection result of the light receiving element 132, that is, the mounting state of the solid immersion lens holder 8 is transmitted to the operator.

  Further, when it is confirmed that the solid immersion lens holder 8 is attached, it is preferable to stop the output of the light emitting element 131 from the viewpoint of preventing mixing of other light in the observation of the semiconductor device 11.

  When the solid immersion lens holder 8 is attached, the instruction unit 42 drives the revolver via the peripheral controller 33 to switch to the objective lens 21 to which the solid immersion lens 6 is attached. Next, the instruction unit 42 drives the correction ring adjusting motor 25 via the peripheral controller 33 according to the five parameters specified according to the input model number of the solid immersion lens 6, the thickness and material of the substrate. The correction ring 24 is adjusted to an appropriate position.

  Subsequently, the instruction unit 42 adjusts the focus position of the objective lens 21 by driving the XYZ stage 7 via the peripheral controller 33 according to the above five parameters. In this case, when the proximity sensor 112 detects the metal plate 114, the instruction unit 42 notifies the operator that the semiconductor device 11 is being pressed by the spring 100. Further, in the adjustment of the focus position, when the proximity sensor 113 detects the metal plate 114 or when the stress detection sensor S detects a stress greater than or equal to a predetermined stress, the peripheral controller 33 drives the XYZ stage 7. Stop.

  The proximity sensor 112 detects the metal plate 114 while the proximity sensor 113 does not detect the metal plate 114, for example, by manually operating the objective lens 21 while viewing an image acquired by the high-sensitivity camera 3. Fine-tune the focus position. The instruction unit 42 observes the semiconductor device 11 using the LSM unit 4 and the high-sensitivity camera 3 through the LSM controller 32 and the camera controller 31 in a state where the focus position of the objective lens 21 is in alignment. To do.

  If the solid immersion lens 6 needs to be replaced, the solid immersion lens 6 is replaced by replacing the solid immersion lens holder 8. In this case, since the minute solid immersion lens 6 does not need to be handled directly, the solid immersion lens 6 can be easily replaced.

  In the above description, the case where the semiconductor device 11 is observed with the solid immersion lens holder 8 mounted on the objective lens socket 9 has been described. However, the solid immersion lens holder 8 is not mounted on the objective lens socket 9. Ordinary observation is also possible.

  That is, as shown in FIGS. 5A and 5B, the movable member 80 in a state where the spring 100 is housed in the spring housing groove 76 on the peripheral wall 83 of the movable member 80 of the objective lens socket 9. Has a through hole 87 for fixing to the base portion 70.

  A screw hole 79 is formed in the peripheral wall 74 of the base portion 70 at a position corresponding to the through hole 87. As a result, by using the fixing screw P <b> 2 corresponding to the screw hole 79, the movable member 80 can be fixed to the base portion 70 in a state where the spring 100 is fully accommodated in the spring accommodating groove 76.

  Therefore, the semiconductor device 11 may be observed as shown in FIG. 11A with the length of the objective lens socket 9 in the optical axis L direction being minimized. FIG. 11B is a diagram of the objective lens 21 of FIG. 11A viewed from the semiconductor device 11 side.

  In this case, since the length of the objective lens socket 9 in the optical axis L direction can be shortened, the working distance of the objective lens 21 can be ensured. Further, the solid immersion lens holder 8 can be immediately attached by removing the fixing screw P2.

  As described above, in the observation of the semiconductor device 11 using the objective lens socket 9, the solid immersion lens 6 is urged toward the semiconductor device 11 by the spring 100 included in the objective lens socket 9. The immersion lens 6 can be optically bonded to the semiconductor device 11 in close contact.

  The objective lens socket 9 is attached to the objective lens barrel 26, and the spring 100 is positioned around the objective lens barrel 26 of the objective lens 21, so that the objective lens socket 9 is attached to the objective lens socket 9. A reduction in the working distance of the lens 21 is suppressed.

  Further, the objective lens socket 9 preferably has a solid immersion lens holder 8 holding the solid immersion lens 6 attached to the objective lens 21 and biases the solid immersion lens 6 against the semiconductor device 11 by a spring 100, and is shown in FIG. It is also preferable to apply not only to an upright type like the microscope 5 but also to an inverted type. Also in this case, the solid immersion lens 6 is suitably held in front of the objective lens 21 (the direction with the front focal point), and is reliably urged to the semiconductor device 11 as the observation object. When applied to the inverted type, it is preferable that the force of the spring 100 is always applied to the movable member 80 by adjusting the length of the spring 100 and the length of the through hole 85 in the optical axis L direction.

  By the way, as in the prior art, when a solid immersion lens is housed in a chamber, gas is introduced into the chamber and the solid immersion lens is urged toward the semiconductor device by gas pressure, the gas is introduced into the chamber. Pipes etc. must also be connected. In this case, there is a possibility that it is difficult to put a solid immersion lens in the recess 13 or the observation range in the recess is reduced.

  On the other hand, when the objective lens socket 9 is used, since the solid immersion lens 6 is urged toward the semiconductor device 11 by the spring 100 arranged around the objective lens 21, the gas introduction pipe or the like It is unnecessary. Therefore, it is easier to observe the semiconductor device 11 in the recess 13. In particular, since the solid immersion lens holder 8 having a substantially T-shaped outer shape is used, interference (contact) between the solid immersion lens holder 8 and the side wall 13a of the recess 13 is also reduced. Observation is possible up to the peripheral edge of the semiconductor device 11 positioned.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. The objective lens socket 9 is attached with a solid immersion lens holder 8 having a substantially T-shaped outer shape. For example, as shown in FIG. A taper-shaped solid immersion lens holder 160 with an expanded diameter may be used.

  Further, although the number of springs 100 is three, the number is not limited to three. For example, as shown in FIG. 13, the spring accommodating groove 161 is formed over the entire circumference of the peripheral wall 74, and one spring 162 provided continuously in the circumferential direction disposed in the spring accommodating groove 161. It is good. At this time, the shape and thickness of the peripheral wall 74 may be changed so that the pin P1 can be fixed. Further, the number of springs 100 may be two, and may be four or more. Furthermore, the elastic body is not limited to a spring, and it is sufficient that it can be urged in the direction of the optical axis L.

  In addition, the holder detection sensor 120 is a sensor that uses light, but is not limited to a sensor that uses light, and only needs to be able to detect the solid immersion lens holder 8. Furthermore, although the member position detection unit 110 includes the proximity sensor 112 as a contact position detection unit and the proximity sensor 113 as a stop position detection unit, it is not always necessary to include both. Either one may be used. Further, the member position detecting unit 110 is not limited to the proximity sensors 112 and 113, and it is sufficient that the position of the movable member 80 with respect to the base unit 70 can be measured.

  Furthermore, the spring 100 is provided around the objective lens barrel 26 of the objective lens 21. For example, the spring 100 is provided on the lower side of the objective lens barrel 26 of the objective lens 21 and the lens included in the objective lens 21. It may be provided around the lens closest to the sample in the group. However, as described above, it is preferable that the lens is disposed around the objective lens 21 from the viewpoint of securing a working distance.

  Moreover, although the said embodiment demonstrated the case where the semiconductor inspection apparatus 1 provided with the objective lens socket 9 observed the semiconductor device 11 arrange | positioned in the recessed part 13, the objective lens socket 9 is arrange | positioned in the recessed part 13 The present invention can also be suitably applied to observation of a semiconductor device 11 that has not been performed. Furthermore, the objective lens socket 9 can be suitably used for observation of an observation object other than the semiconductor device 11.

  Further, the base portion 70 and the movable member 80 are not limited to cylindrical shapes. The base part 70 is attached to the tip part of the objective lens barrel 26, and the movable member 80 only needs to be attached to the base part 70 so as to be slidable in the optical axis L direction with respect to the base part 70. . Further, the sensor head 140 as the holder detection unit and the member position detection unit 110 do not necessarily have to be attached.

  FIG. 14 is a cross-sectional view of still another embodiment (second embodiment) of the objective lens socket according to the present invention. FIG. 14 shows a state where the objective lens socket 170 is attached to the objective lens 21 of the semiconductor inspection apparatus 1 and the sample 10 is observed. In FIG. 14, the cross-sectional structure is displayed so as to show the characteristic part of the objective lens socket 170, and the arrangement relationship of each component is actually different.

  FIG. 15 is a perspective view of the solid immersion lens holder shown in FIG. FIG. 16 is a side view of the state in which the objective lens socket and the solid immersion lens holder are disassembled. FIG. 17 is a top view of the objective lens socket. FIG. 18 is a bottom view of the objective lens socket. FIG. 19 is a cross-sectional view taken along line XIX-XIX in FIG. In FIG. 16, description of a proximity sensor 200 described later is omitted. FIG. 16 shows a state before the solid immersion lens holder is attached to the objective lens socket. In FIG. 17, description of the member position detection means 110 and the metal plate 114 is omitted. In the following description, the same reference numerals are given to the same elements as those in the first embodiment, and duplicate descriptions are omitted.

  As shown in FIGS. 14 and 15, the solid immersion lens holder 8 has a peripheral wall 55 provided at the peripheral edge of the bottom plate 52 of the objective lens cap 50. A plate-like detection object D is screwed to the peripheral wall 55. The detection object D is made of nickel-plated iron and extends to the objective lens 21 side.

  Further, three magnets 181 to 183 are embedded in the peripheral wall 55 so that the upper end portions of the magnets 181 to 183 are substantially at the same position as the upper surface 55a of the peripheral wall 55. As will be described later, the objective lens cap 50 is attached to the movable member 80 by magnetically attracting the magnets 181 to 183 to the magnets 184 to 186 provided on the movable member 80.

  The objective lens socket 170 to which the solid immersion lens holder 8 is attached will be described.

  As shown in FIGS. 16-19, the base part 70 which the objective lens socket 170 has is provided with three linear guides 190, 190, 190 extending in the optical axis L direction at equal intervals on the outer peripheral surface 74a thereof. Each linear guide 190 is screwed to the peripheral wall 74, for example.

  The movable member 80 has a slider 191 that slides in the optical axis L direction while being guided by the linear guide 190. The slider 191 is screwed to a slider holding member 192 having a substantially rectangular parallelepiped shape and formed with a recess for accommodating the slider 191. The slider 191 is fitted to the linear guide 190 via a ball, for example. The slider holding member 192 is fixed to the flange portion 88 protruding from the peripheral wall 83 of the movable member 80 by screwing.

  Since the slider holding member 192 is fixed to the movable member 80 in this way, the slider holding member 192 is prevented from contacting the linear guide 190 and the peripheral wall 83 when the movable member 80 moves relative to the base portion 80. A notch 83a is formed on the inner side of the peripheral wall 83 in the region where the is provided.

  In the above configuration, the movable member 80 is attached to the base portion 70 via the slider 191 and the linear guide 190. Accordingly, as shown in FIGS. 20A and 20B, the movable member 80 moves smoothly in the optical axis L direction with respect to the base portion 70. Further, the play between the base portion 70 and the movable member 80 can be further reduced by using the linear guide 190 and the slider 191. For this reason, the positional accuracy of the movable member 80 with respect to the base portion 70 becomes higher. In addition, since the backlash can be reduced as described above, it is possible to suppress the twisting that may occur when the backlash is large.

  As shown in FIG. 18, three magnets 184 to 186 are provided on the lower surface of the flange portion 88. The magnets 184 to 186 are, for example, rod-shaped and embedded in the flange portion 88 so that the lower end portion slightly protrudes. The solid immersion lens holder 8 is attached to the movable member 80 by magnetic attraction between the magnets 184 to 186 and the three magnets 181 to 183 provided on the peripheral wall 55 of the objective lens cap 50. As the magnetic poles of the magnets 181 to 186, for example, when the magnets 181 and 183 are N poles and the magnet 182 is S poles, the magnets 184 and 186 may be S poles and the magnet 185 may be N poles.

  By attaching the solid immersion lens holder 8 to the movable member 80 using the magnets 181 to 186 in this way, the solid immersion lens holder 8 can be easily attached and detached.

  The objective lens socket 170 includes a proximity sensor (holder detection unit) 200 for detecting whether or not the solid immersion lens holder 8 is attached to the movable member 80. The proximity sensor 200 is electrically connected to the peripheral controller 33 (see FIG. 1). The proximity sensor 200 is held by a sensor holding member 201 fixed to the flange portion 88, and generates a magnetic field using a coil in the vicinity of the tip portion thereof. And the proximity sensor 200 detects the to-be-detected body D by the change (more specifically, the change of the impedance of a coil) of the magnetic field produced when the to-be-detected body D is located ahead.

  In order to reliably arrange the detection object D in front of the proximity sensor 200, as shown in FIG. 17, the flange portion 88 is formed with a recess 88a for allowing the detection object D to pass therethrough.

  In the objective lens socket 170, when the solid immersion lens holder 8 is attached to the movable member 80 by combining the magnets 181 to 183 and the magnets 184 to 186, the detected object D is surely placed in front of the proximity sensor 200 through the recess 88 a. The proximity sensor 200 detects the detection object D. That is, whether or not the solid immersion lens holder 8 is attached to the movable member 80 can be determined based on whether or not the detection object D is detected by the proximity sensor 200.

  Moreover, in the objective lens socket 170, since the solid immersion lens holder 8 is attached using the magnets 181 to 186, the detection object D can be reliably arranged in front of the proximity sensor 200.

  Further, in the objective lens socket 170, the base portion 70 and the movable member 80 are fitted together with the springs (elastic bodies) 100, 100, 100 housed in the three spring housing grooves 76, 76, 76, respectively. Is the same as that of the objective lens socket 9. Thus, when observing the semiconductor device 11, the solid immersion lens 6 is urged by the semiconductor device 11 and is securely adhered.

  It is to be noted that the metal plate 114 is provided on the movable member 80 of the objective lens socket 170 and the member position detecting means 110 is provided on the base portion 70 as in the case of the objective lens socket 9.

  The observation method of the semiconductor inspection apparatus 1 using the objective lens socket 170 described above is the first method using the objective lens socket 9 except that the attachment state of the solid immersion lens holder 8 is confirmed using the proximity sensor 200. This is the same as in the first embodiment.

  That is, in the case of the first embodiment using the objective lens socket 9 after confirming that the solid immersion lens holder 8 is mounted by detecting the detection object D by the proximity sensor 200. Similarly, the sample 10 is observed.

  In this case, for example, since the configuration is simple and the proximity sensor 200 using a magnetic field is employed as compared with the case of optical detection, it is necessary to perform ON / OFF control like a laser, for example. Absent. As a result, the operation of the semiconductor inspection apparatus 1 is easier.

  Here, the objective lens socket 170 to which the solid immersion lens holder 8 having the detection object D is attached has the linear guide 190. However, the objective lens socket 9 shown in FIG. . Further, the number of linear guides 190 is not limited to three, but may be one or two, and further four or more. However, a plurality of linear guides 190 are preferably provided from the viewpoint of allowing the movable member 80 to slide more stably with respect to the base portion 70.

  Furthermore, in the above description, the objective lens sockets 9 and 170 are provided with the spring 100 as an elastic body. However, when the objective lens sockets 9 and 170 are applied to an upright microscope, the objective lens sockets 9 and 170 are self-weighted. Therefore, the elastic body is not necessarily used.

  Further, in the objective lens socket 170, similarly to the objective lens socket 9, a spring accommodating groove formed over the entire circumference of the peripheral wall 55 like the spring accommodating groove 161 shown in FIG. . Furthermore, it is possible to attach the solid immersion lens holder 160 to the objective lens socket 170. In this case, magnets 181 to 183 may be provided on the peripheral wall of the solid immersion lens holder 160.

When observing the semiconductor device 11 using the solid immersion lens 6, it is necessary to grasp in advance the optical parameters of the solid immersion lens 6 attached to the objective lens 21 in order to obtain optimal observation conditions. For example, the optical parameters of the solid immersion lens 6 include a refractive index n, a thickness d _R , and a radius of curvature R of a spherical lens surface (upper surface 6a).

Specifically, description will be made with reference to FIGS. A solid immersion lens 6 having optical parameters suitable for observation is selected for the semiconductor device 11 to be inspected, and the solid immersion lens 6 is set on the objective lens 21. Then, the optical parameters such as the refractive index n, the thickness d _R , and the curvature radius R of the selected solid immersion lens 6 are input via an input device (not shown) provided in the analysis unit C. Next, the control unit B calculates an optimum observation condition using the input refractive index and thickness of the substrate of the semiconductor device 11 and the input optical parameters of the solid immersion lens 6.

  Here, the input of the optical parameters of the solid immersion lens 6 includes a configuration in which a parameter prepared in advance is read by selecting a model number of the solid immersion lens 6 in addition to a configuration in which the solid immersion lens 6 is individually input via an input device. A configuration in which a storage medium such as an IC chip in which a value is stored is provided in the detection object D and data is read out during use may be used.

  For example, the optical parameters of the solid immersion lens 6 are input to a storage medium such as a semiconductor device / magnetic device attached to the detection object D, the model number, serial number, radius of curvature, thickness, refractive index, etc. of the solid immersion lens 6. A configuration in which the parameters are stored can be used. As a data reading method in this case, there are reception by radio waves, reception through electrical contact by an arm and a manipulator, and the like. In this case, instead of the proximity sensor 200, a sensor applied to each receiving method may be attached to the sensor holding member 201. Moreover, it is good also as a structure which attaches barcode etc. to the to-be-detected body D, and reads data by reading it.

  By adopting such a configuration, it is possible to determine whether or not the solid immersion lens holder 8 is attached to the movable member 80, and when it is attached, the optical parameters of the solid immersion lens 6 can be simply set. I can grasp it.

It is a block diagram of the semiconductor inspection apparatus to which one Embodiment of the objective lens socket which concerns on this invention is applied. It is a block diagram which shows the structure of the objective lens which mounted | wore with the objective lens socket. FIG. 3 is an exploded perspective view of the solid immersion lens holder shown in FIG. 2. It is sectional drawing of an objective lens socket. (A) is the figure which looked at the objective-lens socket from the objective-lens side. (B) is sectional drawing of an objective-lens socket. (C) is the figure which looked at the objective lens socket from the sample side. It is a block diagram which shows the structure of a member position detection means. It is sectional drawing of the objective lens socket for showing operation | movement of a member position detection means. It is a block diagram which shows the structure of a holder detection sensor. It is a block diagram which shows the structure of a sensor head. (A) is sectional drawing of an objective-lens socket in case a solid immersion lens holder is detected. (B) is sectional drawing of an objective lens socket when a solid immersion lens holder is not detected. (A) is a block diagram which shows the structure of an objective lens when mounting | wearing an objective lens socket and carrying out normal observation. (B) is the figure which looked at the objective lens of (a) from the sample side. It is a block diagram which shows the structure of the objective-lens socket equipped with the other solid immersion lens holder as a modification. It is a block diagram which shows the structure of the other example of an objective lens socket. It is sectional drawing of other embodiment of the objective lens socket which concerns on this invention. It is a perspective view of the solid immersion lens holder attached to the objective lens socket shown in FIG. It is a side view of an objective lens socket. It is a top view of an objective lens socket. It is a bottom view of an objective lens socket. It is sectional drawing along the XIX-XIX line | wire of FIG. (A) is sectional drawing which showed the state which the movable member moved to the sample side from the state shown in FIG. FIG. 20B is a cross-sectional view showing a state where the movable member has moved to the objective lens side from the state shown in FIG.

Explanation of symbols

  6 ... Solid immersion lens, 8, 160 ... Solid immersion lens holder, 9, 170 ... Objective lens socket, 11 ... Semiconductor device (observation object), 21 ... Objective lens, 26 ... Objective lens barrel (lens barrel), 70 ... base part, 74 ... peripheral wall, 74a ... peripheral wall outer surface, 76 ... spring accommodating groove (elastic body accommodating groove), 80 ... movable member, 100, 162 ... spring (elastic body), 110 ... member position detecting means, 112 ... proximity Sensor (contact position detector), 113 ... Proximity sensor (stop position detector), 140 ... Sensor head (holder detector), 190 ... Linear guide, 200 ... Proximity sensor (holder detector), D ... Object to be detected, L: Optical axis.

Claims (11)

A base attached to the tip of the objective lens barrel;
A solid immersion lens holder that holds the solid immersion lens is attached, and a movable member that is slidably attached to the base portion in the optical axis direction of the objective lens;
Member position detecting means for detecting a member position of the movable member in the optical axis direction with respect to the base portion;
With
An objective lens socket, wherein the solid immersion lens holder is disposed in front of the objective lens. 2. The objective lens socket according to claim 1 , wherein the member position detection unit includes a contact position detection unit that detects the position of the member when the solid immersion lens comes into contact with an observation object. Objective lens socket according to claim 1 or 2, further comprising a holder detector for detecting a mounting state of the solid immersion lens holder to said movable member. A base attached to the tip of the objective lens barrel;
A solid immersion lens holder that holds the solid immersion lens is attached, and a movable member that is slidably attached to the base portion in the optical axis direction of the objective lens;
A holder detection unit that detects an attachment state of the solid immersion lens holder to the movable member;
With
An objective lens socket, wherein the solid immersion lens holder is disposed in front of the objective lens. 5. The objective lens socket according to claim 3 , wherein the holder detection unit detects the solid immersion lens holder by detecting an object to be detected that is attached to the solid immersion lens holder in advance. 5. The objective lens socket according to claim 3 , wherein the holder detection unit detects the solid immersion lens holder by acquiring reflected light from the solid immersion lens holder. 6. The objective according to any one of claims 1 to 6 , further comprising an elastic body that is provided between the base portion and the movable member and biases the movable member in the optical axis direction. Lens socket. An elastic body provided between the base portion and the movable member, and urging the movable member in the optical axis direction;
The member position detection means, according to claim 1, characterized in that it comprises a stop position detecting unit that detects the member position for stopping the energization of the observation object by the elastic body via the solid immersion lens The objective-lens socket as described in any one of -3. The objective lens socket according to claim 7 or 8 , wherein the elastic body is disposed around the lens barrel of the objective lens. An elastic body receiving groove that extends in the optical axis direction and stores the elastic body is formed in the peripheral wall of the base portion,
The objective lens socket according to claim 7 , wherein the elastic body is accommodated in the elastic body accommodation groove. A linear guide extending in the optical axis direction is provided on the outer peripheral surface of the base portion,
The objective lens socket according to any one of claims 1 to 10, wherein the movable member is slidably attached to the base portion via the linear guide.

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