WO2006077767A1

WO2006077767A1 - Organic el element manufacturing method and organic el element obtained by the same

Info

Publication number: WO2006077767A1
Application number: PCT/JP2006/300298
Authority: WO
Inventors: Ayako Yoshida
Original assignee: Pioneer Corporation
Priority date: 2005-01-21
Filing date: 2006-01-12
Publication date: 2006-07-27
Also published as: TW200633572A; JP2008097828A

Abstract

There is provided an organic EL element manufacturing method for forming a seal film on a layered body of at least a first electrode, an organic light emitting layer, and a second electrode formed on a substrate. After the layered body is formed, electric connection is made between the first electrode and the second electrode. When a potential defective portion of the layered body is found by the electric connection, this is actively made explicit as an initial defective portion and it is repaired. Next, a convex/concave portions on the surface of the second electrode caused by the repair is smoothed. After this, the seal film is formed on the smoothed layered body. In manufacturing an organic EL element, it is possible to eliminate generation of defects in the seal film formed and reduce enlargement of a dark spot after the organic EL element is stored.

Description

Specification

Manufacturing method of organic EL element and organic EL element obtained thereby

[0001] The present technology relates to a method for manufacturing an organic electoric luminescent element (hereinafter referred to as "organic EL element") and an organic EL element obtained thereby. More specifically, the present technology relates to improvement of sealing film formation in an organic EL element having a sealing film. Background art

An organic EL element has been attracting attention in recent years because it can be driven at a relatively low voltage, can produce a flat panel display with a high luminance and does not require a backlight, and is lightweight.

[0003] This organic EL element has, for example, a configuration in which an organic light emitting layer is sandwiched between opposing first and second electrodes formed on a substrate.

[0004] However, the organic EL element absorbs moisture and oxygen in the atmosphere, and for example, a black spot-like dark spot is generated in the light emitting element, and the generated dark spot grows. As a result, there is a problem that the lifetime and display quality of the organic EL element are lowered.

[0005] In order to protect such an organic layer with moisture and oxygen, conventionally, an organic EL element is sealed with an enclosure called a sealing can containing a desiccant. FIG. 1 is a cross-sectional view schematically showing the structure of an organic EL element having such a sealing can. In the figure, reference numeral 10 denotes a substrate, 20 denotes a first electrode, 30 denotes an organic light emitting layer, 40 denotes a second electrode, and 50 denotes a sealing can.

[0006] However, when such a sealing can is formed, the thickness of the display panel is increased, which does not meet the demand for the thin film panel.

For this reason, attempts have been made to seal the organic EL element with a thin film in contact with the organic EL element. FIG. 2 is a cross-sectional view schematically showing the structure of the organic EL element having such a sealing film. . In the figure, reference numeral 10 denotes a substrate, 20 denotes a first electrode, 30 denotes an organic light emitting layer, 40 denotes a second electrode, and 60 denotes a sealing film.

In the conventional example as shown in FIG. 1, since the sealing is performed by the sealing can 50, There is a space between the two electrodes 40 and the sealing can 50. For this reason, even if a leak or short circuit occurs in the element part, the damage caused by the force leak that causes the electrode at that point to be damaged and becomes a non-light emitting part will not be expanded. Moreover, since the desiccant is usually contained in the inside of the sealing can, the non-light emitting part does not expand after storage.

On the other hand, in the case of the element configuration using the sealing film 60 as shown in FIG. 2A, when leakage or short occurs, as shown in FIG. The sealing film 60 in contact with the film is also damaged, and moisture, oxygen, and other gases enter the element part not only from the initial non-light emitting part but also from the damaged part of the sealing film after storage, as shown in FIG. 3A. The area of the non-light emitting portion 100 after storage shown in FIG. 3B is expanded from the non-light emitting portion 100 before storage. Further, when the substrate 10 is a plastic substrate rather than a glass substrate, a barrier film is interposed between the substrate 10 and the first electrode 20 in order to prevent intrusion of moisture or gas as much as possible on the substrate 10 side as shown in FIG. 1 1 is provided, but this noria film will be damaged by heat due to leakage, and the damage will be enormous.

[0010] Thus, in an organic EL element having a protective structure with a sealing film, it is important how to prevent damage to the sealing film due to leakage as described above.

In such a viewpoint, K. et al., In Patent Document 1, aging was performed by applying a current between the first electrode and the second electrode before the protective film was formed, and an initial leak was generated. A method for forming a sealing film later is disclosed. According to this method, since the sealing film is not damaged due to the occurrence of the initial leak, the possibility that the non-light emitting portion 100 is enlarged after storage as described above is reduced. However, when the initial defect removal operation by energization such as this aging is performed, as shown in Fig. 4, bumping or turning over of the electrode 40 is performed at the portion where the short circuit is caused or the portion where the leak is actively repaired. As a result, unevenness is generated on the surface, and flatness is lacking.

On the other hand, since the sealing film formed on the upper part is required to have high moisture-proof and gas-proof performance, for example, silicon nitride, silicon oxynitride, acid-aluminum, acid-silicon, etc. are generally covered. · This is due to the thin deposition of inorganic materials with inferior surface follow-up properties. If formed on a surface lacking flatness, defects in the encapsulating film would occur immediately.

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-173873 Disclosure of the invention

Problems to be solved by the invention

[0013] Therefore, an object of the present technology is to provide a method of manufacturing an organic EL element obtained by solving the above-described problems in the prior art and an organic EL element obtained thereby. This technology also provides technical improvements such as eliminating the generation of defects in the formed sealing film and reducing the expansion of dark spots after storage of the organic EL element in the manufacture of organic EL elements having a sealing film. An example of the problem is to provide a method for manufacturing an organic EL element that can be manufactured and an organic EL element obtained thereby.

Means for solving the problem

[0014] The present technology for solving the above-described problem is to manufacture an organic EL element in which a sealing film is formed on a laminate including at least a first electrode, an organic light emitting layer, and a second electrode formed on a substrate. A method,

After the formation of the laminate, energization is performed between the first electrode and the second electrode, and when energization has a potential defect portion in the laminate, this is positively manifested as an initial defect. And repair it,

Next, the unevenness of the surface of the second electrode caused by the repair is flattened, and then a sealing film is formed on the flattened laminate.

The technology according to claim 3, which solves the above problem, is an organic EL device in which a sealing film is formed on a laminate including at least a first electrode, an organic light emitting layer, and a second electrode formed on a substrate. A method for manufacturing an element, comprising:

Next, a first sealing film is formed on the repaired second electrode surface, and then the unevenness on the surface of the first sealing film is flattened, and a second sealing film is formed from the top. This is a method for manufacturing an organic EL device characterized by the fact that it exists. Brief Description of Drawings

FIG. 1 is a schematic cross-sectional view showing an example of the structure of a conventional organic EL element.

FIG. 2A is a schematic cross-sectional view showing another example of the structure of a conventional organic EL device, showing a state of occurrence of a leak.

FIG. 2B is a schematic cross-sectional view showing another example of the structure of a conventional organic EL element, showing a state in which the protective film is damaged by the leak.

FIG. 3A is a diagram schematically showing the change over time of dark spots generated in a conventional organic EL device, showing a state before storage.

FIG. 3B is a diagram schematically showing the change over time of dark spots generated in a conventional organic EL device, showing the state after storage.

FIG. 4 is a schematic sectional view showing still another example of the structure of a conventional organic EL element.

FIG. 5 is a schematic cross-sectional view showing an example of the structure of an organic EL element obtained by the first technique.

FIG. 6 is a schematic sectional view showing an example of the structure of an organic EL element obtained by the second technique.

FIG. 7 is a flowchart showing the flow of each step in the method of manufacturing an organic EL element according to the first technology.

FIG. 8 is a flowchart showing the flow of each step in the method for manufacturing an organic EL element according to the second technique.

Explanation of symbols

[0016] 10 substrate

11 Protective film

20 First electrode

30 Organic light emitting layer

40 Second electrode

42 Unevenness on the surface of the second electrode 61 First sealing film

62 Second sealing film

70 Planarization layer

100 Non-light emitting part

L Leakage site

D Repair location

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, with reference to the drawings, an organic EL device manufacturing method according to an embodiment of the present technology and the organic EL device obtained thereby will be specifically described.

FIG. 5 is a cross-sectional view in the thickness direction schematically showing the structure of the organic EL device obtained by the method for manufacturing an organic EL device according to one embodiment of the present technology. In FIG. 5, the thickness of each layer is exaggerated. FIG. 7 is a flowchart showing the flow of each process in the method for manufacturing an organic EL element according to the present technology.

[0019] As shown in FIG. 5, the disclosed first technique is a laminate formed of at least a first electrode 20, an organic light emitting layer 30, and a second electrode 40 formed on a substrate 10. A method of manufacturing an organic EL element in which a sealing film 60 is formed, as shown in FIG. 7, after the formation of the laminate, prior to the formation of the sealing film 60, the first electrode 20 and the first When energization is performed between the two electrodes 40 and there is a potential defect in the laminate, the potential defect is positively manifested as an initial defect such as an initial leak or a short circuit by energization, The repair is performed, and then the unevenness 42 on the surface of the second electrode 40 generated by the repair is flattened, and then the sealing film 60 is formed on the flattened laminate. This is a method for manufacturing organic EL devices.

[0020] The structure of the laminated body in the organic EL device according to the first technique is not limited to that in the example shown in Fig. 5 and may have various known configurations. For example, the organic light emitting layer can be divided into a hole transport layer and an electron transport layer to improve the light emission efficiency in addition to a single layer type as shown in the drawing, and can be made into a function separation type. In addition, a configuration in which an electron injecting and transporting layer is provided between the light emitting layer and the second electrode, a configuration in which both a hole injecting and transporting layer and an electron injecting and transporting layer are provided, or a hole injecting and transporting layer is mixed with the light emitting layer. It can be set as the configuration etc. When a plastic substrate is used as the substrate, the substrate 10 and the first electrode 20 as shown in FIG. 4 are used to prevent intrusion of moisture, oxygen gas, etc. from the substrate side. A barrier film 11 can be provided between the two. Furthermore, the first electrode provided on the substrate side can be an anode or, conversely, a cathode, and the second electrode can be a cathode or an anode correspondingly.

[0021] Further, the material in the substrate and the laminate formed thereon is not particularly limited, and various conventionally known materials can be used.

[0022] As the substrate 10, for example, quartz glass or glass plate, metal plate or metal foil, plastic glass or sheet, or the like glass plate, or transparent such as polyester, polymeta acrylate, poly strength polycarbonate, polysulfone, etc. A plastic substrate can also be used. Further, a top emission type in which the above substrate is used and the cathode is made transparent or semi-transparent may be used. In the case of using a plastic substrate, it is desirable to further provide a noria film 11 on the upper portion in order to prevent intrusion of moisture, gas, etc. from the substrate side. As this barrier film 11, for example, a nitride key is used. For example, silicon, silicon oxynitride, aluminum oxide, or silicon oxide can be used.

[0023] The first electrode 20 can be an anode or a cathode, and the second electrode 40 can be a cathode or an anode accordingly.

[0024] The anode is a force that plays a role of hole injection into the organic light emitting layer 30. For example, metals such as aluminum, gold, silver, nickel, palladium, tellurium, indium and Z or tin oxides It is composed of a metal oxide such as ITO (typically ITO), copper iodide, carbon black, or a conductive polymer such as poly (3-methylthiophene). The anode is formed by a sputtering method, a vacuum deposition method, or the like, but when it is made of a conductive polymer, it can also be formed by a coating method, a CVD method, or the like. On the other hand, the cathode plays a role of injecting electrons into the organic light emitting layer 30, and the material used for the anode can be used. For efficient electron injection, for example, A suitable metal such as tin, magnesium, indium, aluminum, silver, or an alloy thereof is used.

[0025] The organic light emitting layer 30 includes holes injected from the anode between electrodes to which an electric field is applied. It is formed from a material that efficiently transports and recombines electrons injected from the cathode and emits light efficiently by recombination.

[0026] Examples of the single-layer type organic light-emitting layer include poly (p-phenylene vinylene), poly [2-methyoxy 5- (2-ethylhexyloxy) 1,4 phenol-biylene], poly A polymer material such as (3 alkylthiophene) or a system in which a light-emitting material and an electron transfer material are mixed with a polymer such as polyvinylcarbazole can be used. Such a single layer type organic light emitting layer can be formed by, for example, a coating method or a vacuum deposition method.

[0027] On the other hand, in the case of the functional separation type of the hole transport layer and the electron transport layer, the hole transport layer is, for example, a tertiary fragrance such as 1, 1 bis (4 di-p-triarylaminophenol) cyclohexane. Aromatic diamine compounds in which aromatic amine units are linked, having 4 or more tertiary amino groups typified by 4, 4'-bis [phenyl-1-naphthylamino] biphenyl, and two or more Aromatic amines in which the condensed aromatic ring is substituted with a nitrogen atom, derivatives of triphenylbenzene, and aromatic triamines with a starburst structure, N, N, diphenol-N, N, monobis (3-methylphenol) — (1, 1, Biphenyl) 4, 4, — Aromatic diamines such as diamine, α, α, α ', α' — Tetramethyl mono α,, monobis (4-di-p-tolylaminophenol) p Xylene, a sterically asymmetric triphenylamine derivative, an aromatic diamine on the pyrenyl group A compound in which a plurality of alkyl groups are substituted, an aromatic diamine in which a tertiary aromatic amine unit is linked by an ethylene group, an aromatic diamine having a styryl structure, a compound in which an aromatic tertiary amine unit is linked by a thiophene group, Starburst type aromatic triamine, benzylphenol compound, compound with tertiary amine linked by fluorene group, triamine compound, bis (dipyridylamino) biphenyl, N, N, N-triphenylamine derivative, phenoxazine structure Aromatic diamines, diaminophenol enanthridine derivatives, hydrazone compounds, silazane compounds, silanamine compounds, phosphamine derivatives, quinacridone compounds, etc., having a fragrance can be constituted alone or in combination. . It is also possible to use a hole transporting polymer, for example, a hole transporting polymer such as polyvinylcarbazole or polysilane. Furthermore, p-type hydrogenated amorphous silicon, P-type hydrogenated amorphous silicon carbide, p-type hydrogenated microcrystalline silicon carbide, or inorganic materials such as p-type zinc sulfide and p-type selenium zinc can also be used. it can . In the case of organic materials, the hole transport layer can be used for vacuum deposition, coating, or CVD. Therefore, in the case of an inorganic substance, it is formed by a CVD method, a plasma CVD method, a vacuum deposition method, a sputtering method, or the like.

Next, as the electron transport layer, for example, aromatic compounds such as tetraphenylbutadiene, metal complexes such as aluminum complexes of 8-hydroxyquinoline, cyclopentagen derivatives, perinone derivatives, oxadiazole derivatives, bisstyrylbenzene derivatives , Perylene derivatives, coumarin derivatives, rare earth complexes, distyryl virazine derivatives, p-phenylene di compounds, thiadiazolo pyridine derivatives, pyroguchi pyridine derivatives, naphthyridine derivatives, and the like. Is possible. Note that an electron transport layer using these compounds simultaneously plays a role of transporting electrons and a role of emitting light upon recombination of holes and electrons. When the organic hole transport layer has a light emitting function, the electron transport layer only plays a role of transporting electrons. Furthermore, for the purpose of improving the light emission efficiency of the device and changing the emission color, it is possible to dope a laser fluorescent dye such as coumarin using, for example, an aluminum complex of 8-hydroxyquinoline as a host material. The organic electron transport layer can also be formed by the same method as the organic hole transport layer, but usually a vacuum deposition method is used, but a spin coating method may also be used.

[0029] As a method for further improving the luminous efficiency of the organic electroluminescent device, another electron transport layer can be further laminated on the electron transport layer. The other electron transport layer is, for example, an oxaziazole derivative or a system in which they are dispersed in a resin such as polymethylmethacrylate, a phenantorin phosphorus derivative, n-type hydrogenated amorphous silicon carbide, n-type zinc sulfide, n-type selenium zinc can be used.

[0030] Furthermore, if necessary, it is possible to form a hole injection layer having a function of increasing the efficiency of hole injection with an anodic power and lowering the driving voltage. The hole injection layer can be composed of, for example, a phthalocyanine compound or a borfilin compound. In addition, an interface layer can be formed as needed to improve the contact between the cathode and the organic layer. The interface layer is, for example, an aromatic diamine compound, a quinacridone compound, a naphthacene derivative, an organic silicon compound, an organic phosphorus compound, an N-phenylcarbazole derivative, or an N-vinylcarbazole polymer. Etc. can be constituted by.

[0031] In the method of manufacturing the organic EL element according to the first technique, for example, as described above. After cleaning the substrate 10, the first electrode 20 is formed on the top thereof by, for example, a sputtering method, and after polishing the surface, the organic light emitting layer 30 composed of a single layer or a plurality of layers is formed by a vacuum deposition method or the like. Then, the second electrode is further formed by, for example, vapor deposition or sputtering to form a laminated body having a predetermined organic EL element structure, and then the first electrode 20 and the second electrode 40 are energized. Test whether or not the device has initial defects such as initial leak or short circuit.

This energization is performed by applying a higher load between the electrodes than the driving conditions in the market of the organic EL element to be manufactured. Although not particularly limited, for example, driving is performed in advance at a current density within a predetermined range of driving current density used when actually driving the element.

[0033] The energization process that causes the occurrence of such an initial defect can be performed as a part of a process generally called "aging". Moreover, you may carry out by a reverse bias application process. This aging process is a process in which initial defects in the use of organic EL elements are generated and removed in advance. By applying the current as described above between the first electrode and the second electrode for a predetermined period of time, a small leak path existing in the element is self-repaired due to initial defects, and contact at the interface between the electrode and the organic layer is made. It improves and stabilizes the light emission characteristics. Such an aging process can be completed in a short time if the current density is increased. Practically, the aging treatment is preferably completed within 10 hours. The current waveform during aging may be any of direct current, alternating current, and pulse.

The aging process is performed as follows, for example. First, usually, the substrate 10 on which the stacked body as described above is formed is transported to a globe box connected to a film forming apparatus that is not exposed to the atmosphere. This glove box is filled with a mixed gas of dry nitrogen and oxygen. The dew point is, for example, at least −50 ° C. or lower, more preferably −80 ° C. or lower, and is a condition in which dark spots are not easily generated and grown. The oxygen concentration is preferably about 1 to 10%, for example. If it is extremely lower than this range, the aging effect is weakened, the short circuit between the cathode and the anode frequently occurs, and it may be difficult to produce a desired initial defect. On the other hand, if it is extremely high, the growth of dark spots may become prominent. However, the dew point and oxygen concentration conditions depend on the exposure time to the aging atmosphere. The shorter the interval, the higher the dew point and the higher the oxygen concentration.

It should be noted that the process for repairing the generated initial defect is not limited to the self-repairing method such as aging as described above in which a current is applied for a predetermined time or thermal aging by annealing.

[0036] In the first technique, before forming the sealing film 60 on the stacked body in this way, in order to generate and repair the initial defect mode, the location where the leak occurred or the repair was performed. In place D, the sealing film 60 is essentially not damaged. In addition, since the force prior to manufacturing the sealing film 60 is easy to self-repair due to, for example, aging, damage due to heat generation due to leakage is reduced, especially in the case of organic EL elements using plastic substrates. Damage to the barrier film 12 provided to prevent the entry of moisture, etc., with 10 side forces can be minimized. Further, since the sealing film is not provided, the laser beam irradiation can be adopted as the repair process.

[0037] In this way, when a current is applied between the first electrode and the second electrode and there are potential defect portions, initial defects such as short-circuits and leaks are positively generated in these portions. When the process of repairing this is performed, at the location where the short circuit occurred or at the repaired location D, as shown in FIG. Occurs and is in a state of lack of flatness.

Therefore, in the first technique, after the repair process, a flattening process is performed to cover the irregularities 42 generated on the surface of the second electrode 40. This planarization process is performed by forming a planarization layer 70 that covers the unevenness 40 of the second electrode 40 and planarizes the exposed surface.

[0039] The flattened layer 70 is not particularly limited as long as it is formed by a material that can fill the unevenness 40 and has a good surface coverage or shape following property and a film forming method. For example, UV curable resins, electron beam curable resins, epoxy resins, silicone resins, and other curable type resins; for example, polyparaxylylene films, etc., CVD films; Plasma polymerized films of resins such as organic silicone resins such as siloxane, fluorine-containing resins, polyethylene, polystyrene, and (meth) acrylic resins; vapor deposited polymer films of resins such as polyimides; or various Examples thereof include a film formed by a thermoplastic resin coating method. Furthermore, an inorganic film formed by a coating method having good shape following property can also be used. [0040] The thickness of the flattened layer 70 is particularly limited because it depends on the structure of the laminated body to be coated, the material constituting the flattened layer, the forming method, and the like. is not. If the thickness of the flat layer 70 is extremely thin, the unevenness 40 as described above cannot be sufficiently filled, and the original function may not be achieved. If it is thick, it will be against the demand for thinner devices.

In the present technology, after the flat layer 70 is formed and the unevenness 40 is filled, finally, the sealing film 60 is formed on the upper portion so as to cover the stacked body.

The sealing film 60 to be formed is not particularly limited as long as it has no moisture or low gas permeability such as oxygen, and examples thereof include silicon oxide and aluminum oxide. Metal oxides such as aluminum fluoride, metal fluorides such as aluminum fluoride, metal nitrides such as silicon nitride, aluminum nitride, and chromium nitride, single layers and laminates such as amorphous silicon and amorphous carbon, vacuum deposition, sputtering, etc. Examples thereof include those formed by a CVD method or the like.

[0043] The thickness of the sealing film 60 is not particularly limited. Even if the thickness of the sealing film 60 is thin to some extent as described above, since the covering surface is flattened by the flat layer 70 as described above, the sealing film 60 is good without defects. A film can be formed. In addition, there is less risk of the occurrence of film cracking or the like due to a thicker film made of a material with less good shape followability.

[0044] In the present technology, as described above, the surface of the laminated body to be covered with the sealing film 60 is flattened by the planarizing layer 70. Therefore, the sealing formed in this step is performed. Even if the film 60 is thin and is not very good in shape followability, the laminate can be coated very well and defects in the sealing film are unlikely to occur. Therefore, in the organic EL device obtained by this technology, the expansion of dark spots (non-light-emitting parts) after storage is effectively suppressed.

Next, a method for manufacturing an organic EL element according to the second technique will be described.

FIG. 6 is a cross-sectional view in the thickness direction schematically showing the structure of the organic EL device obtained by the method of manufacturing an organic EL device according to one embodiment of the present technology. In FIG. 6, the thickness of each layer is exaggerated. FIG. 8 is a flowchart showing the flow of each step in the method for manufacturing an organic EL element according to the present technology. [0046] As shown in FIG. 6, the disclosed second technique is based on a laminate including at least the first electrode 20, the organic light emitting layer 30, and the second electrode 40 formed on the substrate 10. FIG. 8 shows a method of manufacturing an organic EL element in which a sealing film is formed, and as shown in FIG. 8, after the formation of the stacked body, prior to the formation of the sealing films 61 and 62, the first electrode 20 and When energization is performed between the second electrodes 40 and a potential defect exists in the laminate, the current is made to manifest as an initial defect such as an initial leak by this energization, and the initial defect Next, a first sealing film 61 is formed on the surface of the repaired second electrode 40, and then a flat layer 70 is deposited on the first sealing film 61. Thus, the unevenness on the surface of the first sealing film is flattened, and then the upper force also forms the second sealing film 62.

[0047] The second technique is substantially the same as the first technique, except that after the repair of the initial defect portion, the process of forming the sealing film 61 is once considered. .

[0048] When the sealing film is directly formed on the second electrode 40 after the repair process of the initial defect portion, the first sealing film is formed by the presence of the unevenness 42 on the surface of the second electrode 40 as described above. Although there is a possibility that 61 itself is not formed as a good film without defects, in this second technique, the upper portion of the first sealing film 61 is then covered with a flat layer 70 and then again. The second sealing film 62 is sealed by the second sealing film 62. From the same point as in the first technique, the second sealing film 62 covers the entire element as a good film having no defect. Therefore, as with the organic EL device obtained with the first technology, the expansion of dark spots (non-light emitting parts) after storage is effectively suppressed in the organic EL device obtained with the second technology. It becomes. Furthermore, although the number of manufacturing steps is increased compared to the first technology, a double sealing film is formed, so that an improvement in reliability can be expected.

[0049] In the second technique, a method of forming the first sealing film 61 and the second sealing film 62, materials used, and the like will be described with respect to the sealing film 60 in the first technique. It is the same as that. Further, the thicknesses of the first sealing film 61 and the second sealing film 62 are not particularly limited.

[0050] In the second technique, the material of the substrate, the material and the forming method of the first and second electrodes, the material and the forming method of the organic light emitting layer, various aspects of the laminated body, the method of energization and repair processing , Other aspects such as the material, thickness and formation method of the planarization layer Since this is almost the same as that described in detail with respect to the first technology, the description thereof will be omitted.

Claims

The scope of the claims

[1] A method for producing an organic EL element, in which a sealing film is formed on a laminate comprising at least a first electrode, an organic light emitting layer, and a second electrode formed on a substrate,

Next, the unevenness of the surface of the second electrode generated by the repair is flattened, and then a sealing film is formed on the flattened laminate.

[2] The method for producing an organic EL device according to [1], wherein the unevenness on the surface of the upper electrode is flattened by depositing an organic thin film on the surface of the second electrode.

[3] A method for producing an organic EL element, in which a sealing film is formed on a laminate composed of at least a first electrode, an organic light emitting layer and a second electrode formed on a substrate,

Next, a first sealing film is formed on the repaired second electrode surface, and then the unevenness on the surface of the first sealing film is flattened, and a second sealing film is formed from the top. A method for producing an organic EL element, characterized in that

[4] The method of manufacturing an organic EL element according to claim 3, wherein the unevenness on the surface of the first sealing film is flattened by depositing an organic thin film on the first sealing film.

[5] The repair of the initial defect portion is performed using laser light irradiation in combination.

2. A method for producing an organic EL device according to 1.

[6] The repair of the initial defect portion is performed using laser light irradiation in combination.

4. A method for producing an organic EL device according to 3.

[7] An organic EL element in which a sealing film is formed on a laminate composed of at least a first electrode, an organic light emitting layer and a second electrode formed on a substrate,

After the laminate is formed, energization is performed between the first electrode and the second electrode, and when energization has a potential defect portion in the laminate, this is positively manifested as an initial defect. And then repair it,

Next, an organic EL device obtained by flattening irregularities on the surface of the second electrode caused by repair, and then forming a sealing film on the flattened laminate.

An organic EL element in which a sealing film is formed on a laminate including at least a first electrode, an organic light emitting layer, and a second electrode formed on a substrate,

Next, a first sealing film is formed on the repaired second electrode surface, and then the unevenness on the surface of the first sealing film is flattened, and a second sealing film is formed from the top. An organic EL device characterized by