WO2006071114A1 - Vertical furnace for processing materials consisting of semiconductors at high temperature - Google Patents
Vertical furnace for processing materials consisting of semiconductors at high temperature Download PDFInfo
- Publication number
- WO2006071114A1 WO2006071114A1 PCT/NL2005/000894 NL2005000894W WO2006071114A1 WO 2006071114 A1 WO2006071114 A1 WO 2006071114A1 NL 2005000894 W NL2005000894 W NL 2005000894W WO 2006071114 A1 WO2006071114 A1 WO 2006071114A1
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- WO
- WIPO (PCT)
- Prior art keywords
- loading
- chamber
- transport
- products
- space
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Definitions
- the invention relates to a device which is used for treating products or materials, such as wafers consisting of semiconductor material, under a defined gas atmosphere, such as nitrogen, which device comprises a gastight space which is delimited by walls, which gastight space is divided into a plurality of parts, namely a treatment chamber provided with a vertically positioned furnace, for treating one or more wafers, and adjacent beneath the treatment chamber a loading chamber, in which there is a loading member (boat), into which loading member one or more products can be placed, and which loading member, together with the products which have been placed therein, can be moved into and out of the treatment chamber, and adjacent to the loading chamber is a transport chamber, which transport chamber is provided in the outer wall with a lock, and in the transport chamber there is a displacement member enabling products to be moved from the lock to the loading member, the lock being used to enable materials to pass from outside the gastight space to inside the gastight space and vice versa, which lock comprises a space which is enclosed by walls, the gas atmosphere of which can be
- a device which comprises a furnace in which wafers consisting of semiconductor material can be treated for a certain time at a defined, constant temperature and under an atmosphere in which there is no oxygen or only a very small concentration of oxygen, such as a nitrogen atmosphere, is generally known.
- the existing furnaces can be divided into vertical and horizontal furnaces.
- the present invention relates to a device with a vertical furnace.
- Furnaces for the heat treatment of materials which are used for example to carry out one or more treatments on semiconductor materials, such as wafers, such as: annealing, i.e. a heat treatment for relieving stresses in materials, diffusion, i.e. causing a substance to diffuse into the material at a defined temperature, forming or applying an oxide layer, depositing a thin film of a defined substance are always placed in a gastight space, delimited by walls, in a low-dust space, likewise delimited by walls, known as a clean room. Since the costs of a clean room are very high, a clean room always has to take up as little surface area as possible, i.e. has to be used as efficiently as possible. If a plurality of furnaces are placed in a clean room, they have to be positioned in such a way that the clean room is utilized as economically as possible.
- annealing i.e. a heat treatment for relieving stresses in materials
- diffusion i.e. causing a substance to diffuse into
- Known devices for treating wafers under conditioned parameters always comprise a treatment chamber with, directly adjoining it, a loading chamber, adjacent to which there is a space for moving the wafers from an access port, such as a lock, to the loading chamber.
- American patent US 5,388,944 has disclosed a device which comprises a loading chamber adjoined by two furnaces, with the result that two furnaces can be served with the aid of one loading chamber. Since devices of this type have to be inspected regularly in order, for example, to clean components or carry out repairs, all parts of the device have to be externally accessible. For this purpose, sufficient free space has to be available around the device to enable a person to carry out the required operations in the device.
- the object of the invention is to provide a device with a vertical furnace with which it is possible to produce an arrangement with a plurality of devices with vertical furnaces according to the invention, wherein a plurality of devices can be positioned at a very short distance from one another or butting against one another, with the result that it is possible to place more furnaces adjacent to a clean room over a defined length of a wall of a clean room than was hitherto possible with an arrangement of devices with a vertical furnace that have been generally disclosed hitherto, with the result that with devices according to the invention it is possible to make more economic use of a clean room.
- the closed space is furthermore divided into another treatment chamber or two treatment chambers with a vertical furnace, and adjacent beneath the second treatment chamber an associated loading chamber or second loading chamber, likewise provided with a loading member for loading the associated second treatment chamber, the first treatment chamber with associated first loading chamber being positioned opposite the second treatment chamber with associated second loading chamber, on either side of and adjacent to the transport chamber, so that the transport member can also be used to transport materials from the lock to the loading member in the second loading chamber.
- each device can be positioned with their sides close together, and each device is arranged in the wall of the clean room, with the front side of each device, where the lock is located, facing toward the clean room, with the result that each furnace can be loaded via a lock, while the rear side of each device faces toward a chamber from which repairs can be carried out.
- the design of the device means that each device can be opened from the rear, and there is sufficient space to carry out repairs on the device if devices are positioned with their sides against one another.
- only one transport member is required for transporting materials to two furnaces, it is possible to save costs compared to other devices, since in most arrangements which have been generally disclosed hitherto, one transport member is required for each furnace.
- a device according to the invention is loaded at the front, the side adjoining the clean room, with the aid of locks, while each component of the device can be reached from the rear to carry out repairs, which rear side can then adjoin a space which does not have to be as clean and dust-free as the clean room. Since the side does not need to be opened, the devices can be placed against one another or next to one another with only a very small space between them.
- Figure 1 shows a view of a device according to the invention
- Figure 2 shows a cross section through the device according to the invention as shown in Figure 1, on line II - II from Figure 3;
- Figure 3 shows a cross section through the device according to the invention on line III - III from Figure 2;
- Figure 4 shows an arrangement of more devices according to the invention adjacent to a clean room.
- Figure 1 shows a device 1 according to the invention comprising a first section, which is a gastight space 2 delimited by walls, and a second section 3, which is used to feed a desired gas mixture to certain parts of the delimited gastight space 2.
- Two locks 5, 6 are arranged in the front wall 4 of the delimited space 2, enabling materials to pass through from the space outside the device to the gastight space 2 or in the opposite direction.
- FIG. 2 shows, in cross section, the device 1 according to the invention as illustrated in Figure 1, on line I - 1 from Figure 3.
- the gastight space 2 is divided into a plurality of parts, namely a transport chamber 7, with a loading chamber on either side, namely a first loading chamber 8 on one side, with a first treatment chamber 9 above it, and a second loading chamber 10 on the other side of the transport chamber 7, with a second treatment chamber 11 above it.
- a vertically positioned furnace 12, 13, in which one or more wafers can be treated, is arranged in both the first treatment chamber 9 and the second treatment chamber 11.
- a vertically moveable loading member (known as a boat) 14 is installed in the loading chamber 8 with the associated treatment chamber 9.
- a vertically moveable loading member (known as a boat) 15 is also arranged in the second loading chamber 10 with associated second treatment chamber 11.
- One or more products can be placed in each loading member 14, 15, while each loading member 14 and 15, with the products placed therein, can be moved into and out of the associated furnace 12 or 13, respectively, in the treatment chamber 9 or 11, respectively.
- Figure 3 shows a cross section through the device 1 according to the invention on line III - III from figure 2.
- Two locks 5, 6 are arranged in the outer wall 4 of the transport chamber 7, which wall faces toward the clean room 16, and a transport member 17, by means of which products that are to be treated can be transported from one of the locks 5, 6 to one of the loading members 14, 15, is arranged in the transport chamber 7, the locks 5, 6 enabling materials that are to be treated or have already been treated to be passed from the clean room 16 to the gastight space 2 or in the opposite direction.
- the two locks 5, 6 comprise a space which is enclosed by walls, the gas atmosphere of which can be changed and which is provided with a closeable opening through which products or a cassette containing products can be placed into or removed from one of the locks 5, 6.
- the first and second loading chambers 8 and 10 are located on either side of the transport chamber 7.
- a transport member 17 for moving wafers from one of the locks 5, 6 toward one of the loading members 14, 15 in order for the wafers subsequently to be placed in one of the furnaces.
- a partition wall 18 in which there is an opening that can be closed off using a door 19, rotatable about a pin 20.
- a partition wall 21 with an opening 22 that can be closed off by a door 23 which can rotate about a pin 24.
- the intermediate chamber 7 there are also two storage sites 25 allowing the temporary storage of products that are to be treated or have already been treated or products which can be treated more than once and are used only to occupy certain positions in the furnace, so as to improve the results of the other products to be treated, known as dummy items.
- the transport member 17 can be used to move wafers between the locks 5, 6, the storage sites 25 and the two loading members 14, 15.
- Figure 4 shows an arrangement of a plurality of devices 1 according to the invention which on the one hand have the front side, in which the locks are located, adjoining a clean room 16 and on the other hand have the rear side adjoining a chamber 26 enabling repairs to be carried out on the devices 1.
- a device according to the invention comprises (cf.
Abstract
Device for treating wafers consisting of semiconductor material under a defined gas atmosphere, such as nitrogen. The device (1) comprises a gastight space (2), which is divided into a transport chamber (7), with a loading chamber (8, 10) on either side, and above each loading chamber (8, 10) a treatment chamber (9, 11), with, in each treatment chamber (9, 11), a vertically positioned furnace (12, 13) and a loading member (boat 14, 15) for loading the furnaces. The device is also provided with a lock (5, 6), and a transport member (17) is arranged in the transport chamber (7) enabling products to be moved from the lock (5, 6) to the loading member (14).
Description
VERTICAL FURNACE FOR PROCESSING MATERIALS CONSISTING OF SEMICONDUCTORS AT HIGH TEMPERATURE
The invention relates to a device which is used for treating products or materials, such as wafers consisting of semiconductor material, under a defined gas atmosphere, such as nitrogen, which device comprises a gastight space which is delimited by walls, which gastight space is divided into a plurality of parts, namely a treatment chamber provided with a vertically positioned furnace, for treating one or more wafers, and adjacent beneath the treatment chamber a loading chamber, in which there is a loading member (boat), into which loading member one or more products can be placed, and which loading member, together with the products which have been placed therein, can be moved into and out of the treatment chamber, and adjacent to the loading chamber is a transport chamber, which transport chamber is provided in the outer wall with a lock, and in the transport chamber there is a displacement member enabling products to be moved from the lock to the loading member, the lock being used to enable materials to pass from outside the gastight space to inside the gastight space and vice versa, which lock comprises a space which is enclosed by walls, the gas atmosphere of which can be changed and which is provided with a closeable opening through which products or a cassette containing products can be placed into and removed from the lock.
A device which comprises a furnace in which wafers consisting of semiconductor material can be treated for a certain time at a defined, constant temperature and under an atmosphere in which there is no oxygen or only a very small concentration of oxygen, such as a nitrogen atmosphere, is generally known. The existing furnaces can be divided into vertical and horizontal furnaces. The present invention relates to a device with a vertical furnace.
Furnaces for the heat treatment of materials, which are used for example to carry out one or more treatments on semiconductor materials, such as wafers, such as: annealing, i.e. a heat treatment for relieving stresses in materials, diffusion, i.e. causing a substance to diffuse into the material at a defined temperature, forming or applying an oxide layer, depositing a thin film of a defined substance are always placed in a gastight space, delimited by walls, in a low-dust space, likewise delimited by walls, known as a clean room. Since the costs of a clean room are very high, a clean room always has to take up as little surface area as possible, i.e. has to be used as efficiently as possible. If a plurality of furnaces are placed in a clean room, they have to be positioned in such a way that the clean room is utilized as economically as possible.
Known devices for treating wafers under conditioned parameters always comprise a treatment chamber with, directly adjoining it, a loading chamber, adjacent to which there is a
space for moving the wafers from an access port, such as a lock, to the loading chamber. American patent US 5,388,944 has disclosed a device which comprises a loading chamber adjoined by two furnaces, with the result that two furnaces can be served with the aid of one loading chamber. Since devices of this type have to be inspected regularly in order, for example, to clean components or carry out repairs, all parts of the device have to be externally accessible. For this purpose, sufficient free space has to be available around the device to enable a person to carry out the required operations in the device. Since sufficient space always also has to be available at the side of these known devices, since otherwise it is not possible for all the components to be reached from the outside, however, this space also has to be available in the clean room, in other words if a plurality of furnaces are placed at the same clean room, these furnaces can never be positioned flat against one another, but rather a reasonable amount of space always has to remain available between the furnaces. Moreover, if repairs need to be carried out from the clean room, the clean room cannot be used.
The object of the invention is to provide a device with a vertical furnace with which it is possible to produce an arrangement with a plurality of devices with vertical furnaces according to the invention, wherein a plurality of devices can be positioned at a very short distance from one another or butting against one another, with the result that it is possible to place more furnaces adjacent to a clean room over a defined length of a wall of a clean room than was hitherto possible with an arrangement of devices with a vertical furnace that have been generally disclosed hitherto, with the result that with devices according to the invention it is possible to make more economic use of a clean room.
This is achieved by the device according to the invention by virtue of the fact that the closed space is furthermore divided into another treatment chamber or two treatment chambers with a vertical furnace, and adjacent beneath the second treatment chamber an associated loading chamber or second loading chamber, likewise provided with a loading member for loading the associated second treatment chamber, the first treatment chamber with associated first loading chamber being positioned opposite the second treatment chamber with associated second loading chamber, on either side of and adjacent to the transport chamber, so that the transport member can also be used to transport materials from the lock to the loading member in the second loading chamber.
The result of these measures is that with the device according to the invention a plurality of devices can be positioned with their sides close together, and each device is arranged in the wall of the clean room, with the front side of each device, where the lock is located, facing toward the clean room, with the result that each furnace can be loaded via a lock, while the rear side of each device faces toward a chamber from which repairs can be carried out. The
design of the device means that each device can be opened from the rear, and there is sufficient space to carry out repairs on the device if devices are positioned with their sides against one another. As a result, it is possible to carry out repairs on a furnace while just one of the devices is out of use, whereas the other devices can continue to be used as normal from the clean room. Moreover, on account of the fact that only one transport member is required for transporting materials to two furnaces, it is possible to save costs compared to other devices, since in most arrangements which have been generally disclosed hitherto, one transport member is required for each furnace.
It has been found that the surface area of the clean room which is required per furnace, when using a plurality of furnaces, is much smaller than has hitherto been customary, on account of the fact that a plurality of devices can be placed with their side edges flat against one another, and only part of each furnace takes up space in the clean room.
A device according to the invention is loaded at the front, the side adjoining the clean room, with the aid of locks, while each component of the device can be reached from the rear to carry out repairs, which rear side can then adjoin a space which does not have to be as clean and dust-free as the clean room. Since the side does not need to be opened, the devices can be placed against one another or next to one another with only a very small space between them.
The invention will be explained in more detail with reference to the drawing, in which: Figure 1 shows a view of a device according to the invention;
Figure 2 shows a cross section through the device according to the invention as shown in Figure 1, on line II - II from Figure 3; Figure 3 shows a cross section through the device according to the invention on line III - III from Figure 2;
Figure 4 shows an arrangement of more devices according to the invention adjacent to a clean room.
Figure 1 shows a device 1 according to the invention comprising a first section, which is a gastight space 2 delimited by walls, and a second section 3, which is used to feed a desired gas mixture to certain parts of the delimited gastight space 2. Two locks 5, 6 are arranged in the front wall 4 of the delimited space 2, enabling materials to pass through from the space outside the device to the gastight space 2 or in the opposite direction.
Figure 2 shows, in cross section, the device 1 according to the invention as illustrated in Figure 1, on line I - 1 from Figure 3. The gastight space 2 is divided into a plurality of parts, namely a transport chamber 7, with a loading chamber on either side, namely a first loading chamber 8 on one side, with a first treatment chamber 9 above it, and a second loading
chamber 10 on the other side of the transport chamber 7, with a second treatment chamber 11 above it. A vertically positioned furnace 12, 13, in which one or more wafers can be treated, is arranged in both the first treatment chamber 9 and the second treatment chamber 11. A vertically moveable loading member (known as a boat) 14 is installed in the loading chamber 8 with the associated treatment chamber 9. A vertically moveable loading member (known as a boat) 15 is also arranged in the second loading chamber 10 with associated second treatment chamber 11. One or more products can be placed in each loading member 14, 15, while each loading member 14 and 15, with the products placed therein, can be moved into and out of the associated furnace 12 or 13, respectively, in the treatment chamber 9 or 11, respectively.
Figure 3 shows a cross section through the device 1 according to the invention on line III - III from figure 2. Two locks 5, 6 are arranged in the outer wall 4 of the transport chamber 7, which wall faces toward the clean room 16, and a transport member 17, by means of which products that are to be treated can be transported from one of the locks 5, 6 to one of the loading members 14, 15, is arranged in the transport chamber 7, the locks 5, 6 enabling materials that are to be treated or have already been treated to be passed from the clean room 16 to the gastight space 2 or in the opposite direction. The two locks 5, 6 comprise a space which is enclosed by walls, the gas atmosphere of which can be changed and which is provided with a closeable opening through which products or a cassette containing products can be placed into or removed from one of the locks 5, 6.
The first and second loading chambers 8 and 10 are located on either side of the transport chamber 7. In the transport chamber 7 there is a transport member 17 for moving wafers from one of the locks 5, 6 toward one of the loading members 14, 15 in order for the wafers subsequently to be placed in one of the furnaces. Between the first loading chamber 8 and the transport chamber 7 is a partition wall 18 in which there is an opening that can be closed off using a door 19, rotatable about a pin 20. Between the second loading chamber 10 and the transport chamber 7 there is also a partition wall 21 with an opening 22 that can be closed off by a door 23 which can rotate about a pin 24. In the intermediate chamber 7 there are also two storage sites 25 allowing the temporary storage of products that are to be treated or have already been treated or products which can be treated more than once and are used only to occupy certain positions in the furnace, so as to improve the results of the other products to be treated, known as dummy items. The transport member 17 can be used to move wafers between the locks 5, 6, the storage sites 25 and the two loading members 14, 15.
Figure 4 shows an arrangement of a plurality of devices 1 according to the invention which on the one hand have the front side, in which the locks are located, adjoining a clean room 16 and on the other hand have the rear side adjoining a chamber 26 enabling repairs to be carried
out on the devices 1. On account of the fact that a device according to the invention comprises (cf. Figure 3) two vertically positioned furnaces 12, 13 located on either side of the transport chamber 7, which furnaces are each positioned in a treatment chamber 9, 11 above the associated loading chambers 8, 10, the result is an arrangement in which a number of devices which are all designed in accordance with the invention adjoin a clean room, so that more efficient use can be made of the clean room and therefore costs can be saved, since these devices can be positioned very close together or even butting against one another.
Claims
1. A device which is used for treating products or materials, such as wafers consisting of semiconductor material, under a defined gas atmosphere, such as nitrogen, which device (1) comprises a gastight space (2) which is delimited by walls, which gastight space (2) is divided into a plurality of parts, namely a treatment chamber (9) provided with a vertically positioned furnace (12), in which furnace (12) one or more wafers can be treated at a defined, desired temperature, and adjacent beneath the treatment chamber (9) a loading chamber (10), in which there is a loading member (boat 14), into which loading member (14) one or more products can be placed, and which loading member (14), together with the products which have been placed therein, can be moved into and out of the treatment chamber (9), and adjacent to the loading chamber (10) is a transport chamber (7), which transport chamber (7) is provided in the outer wall with a lock (5, 6), and in the transport chamber (7) there is a transport member (17) enabling products to be moved from the lock (5, 6) to the loading member (14), the lock being used to enable materials to pass from outside the gastight space (16) to inside the gastight space (2) and vice versa, which lock (5, 6) comprises a space which is enclosed by walls, the gas atmosphere of which can be changed and which is provided with a closeable opening through which products or a cassette containing products can be placed into and removed from the lock, the closed space (2) furthermore being divided, namely into a second treatment chamber (11) with a furnace (11), and adjacent beneath the second treatment chamber (11) a second loading chamber (10), likewise provided with a loading member (15) for loading the associated second treatment chamber (11), and the transport member (17) can transport products or materials both to the first loading member (14) and to the second loading member (15), characterized in that each of the loading chambers (8, 10) is positioned adjacent to and on either side of the transport chamber (7).
2. The device as claimed in claim 1, characterized in that the device is installed in the wall of a clean room, with the side for loading the device being adjacent to and directed toward the clean room, with the result that the device can be loaded from the clean room, while the rear side of the device is adjacent to a space from which repairs to the device can be carried out.
3. The device as claimed in either of claims 1 and 2, characterized in that the side of the device is placed against or at a very short distance from a device of the same type.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1027903 | 2004-12-28 | ||
| NL1027903A NL1027903C2 (en) | 2004-12-28 | 2004-12-28 | Vertical oven for high temperature machining of semiconductor materials. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006071114A1 true WO2006071114A1 (en) | 2006-07-06 |
Family
ID=34974940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/NL2005/000894 WO2006071114A1 (en) | 2004-12-28 | 2005-12-23 | Vertical furnace for processing materials consisting of semiconductors at high temperature |
Country Status (2)
| Country | Link |
|---|---|
| NL (1) | NL1027903C2 (en) |
| WO (1) | WO2006071114A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5217501A (en) * | 1989-07-25 | 1993-06-08 | Tokyo Electron Limited | Vertical wafer heat treatment apparatus having dual load lock chambers |
| US5388944A (en) * | 1992-02-07 | 1995-02-14 | Tokyo Electron Tohoku Kabushiki Kaisha | Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus |
| US5697749A (en) * | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
| US6261048B1 (en) * | 1996-06-13 | 2001-07-17 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
| US6273802B1 (en) * | 1993-09-19 | 2001-08-14 | Kabushiki Kaisha Toshiba | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58111315A (en) * | 1981-12-25 | 1983-07-02 | Hitachi Ltd | Lid opening/closing device |
| JP2968062B2 (en) * | 1991-02-20 | 1999-10-25 | 富士通株式会社 | Semiconductor heat treatment equipment |
-
2004
- 2004-12-28 NL NL1027903A patent/NL1027903C2/en not_active IP Right Cessation
-
2005
- 2005-12-23 WO PCT/NL2005/000894 patent/WO2006071114A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5217501A (en) * | 1989-07-25 | 1993-06-08 | Tokyo Electron Limited | Vertical wafer heat treatment apparatus having dual load lock chambers |
| US5388944A (en) * | 1992-02-07 | 1995-02-14 | Tokyo Electron Tohoku Kabushiki Kaisha | Vertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatus |
| US5697749A (en) * | 1992-07-17 | 1997-12-16 | Tokyo Electron Kabushiki Kaisha | Wafer processing apparatus |
| US6273802B1 (en) * | 1993-09-19 | 2001-08-14 | Kabushiki Kaisha Toshiba | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| US6261048B1 (en) * | 1996-06-13 | 2001-07-17 | Brooks Automation, Inc. | Multi-level substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| NL1027903C2 (en) | 2006-06-29 |
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