WO2006051900A1 - 有機層形成方法及び有機層形成装置 - Google Patents
有機層形成方法及び有機層形成装置 Download PDFInfo
- Publication number
- WO2006051900A1 WO2006051900A1 PCT/JP2005/020713 JP2005020713W WO2006051900A1 WO 2006051900 A1 WO2006051900 A1 WO 2006051900A1 JP 2005020713 W JP2005020713 W JP 2005020713W WO 2006051900 A1 WO2006051900 A1 WO 2006051900A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film formation
- vibration
- organic layer
- formation target
- layer forming
- Prior art date
Links
- 239000012044 organic layer Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000011368 organic material Substances 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 83
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
Definitions
- the present invention relates to, for example, an organic electoluminescence display device, and more particularly to a technique for forming an organic film for each element by an ink jet method.
- organic EL display device an organic electoluminescence display device (hereinafter referred to as “organic EL display device”) is composed of a plurality of light emitting elements.
- a transparent electrode made of, for example, ITO is formed, and an insulating layer exemplified by polyimide is formed thereon. Thereafter, the polyimide in the element portion is removed by etching, and a recess in which ITO is exposed is formed at the bottom.
- the position under the droplet 3 the viscosity of the organic material solution, the surface tension, etc., the surface of the organic layer 101 may become uneven as shown in FIGS. 9 (b) and 9 (c). If the organic layer 101 has irregularities, uneven current flow occurs when a voltage is applied to the organic layer 101, and uneven emission occurs in the device.
- PEDTZPSS polyethylene dioxythiophene Z polystyrene sulfate
- ITO polyethylene dioxythiophene Z polystyrene sulfate
- the organic layer is dropped by inkjet, there is a case where a shift occurs from the planned dropping position in the recess to the actual dropping position, and the organic layer may not be spread uniformly.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-142261 describes a technique for flattening an organic layer by applying a solvent after forming the organic layer by inkjet in order to make the thickness of the organic layer uniform. ing.
- this conventional technique has a problem that a process for applying a solvent is required and the number of processes is increased, and that drying takes time when an excessive amount of solvent is applied.
- Patent Document 2 Japanese Patent Application Laid-Open No. 2004-127897 describes a technique using an organic solvent with a small change in viscosity with time in order to make the thickness of the organic layer uniform. Even if it is adjusted so that it does not change with time, it is difficult to completely adjust the viscosity of the organic material, and unevenness may occur in the organic layer.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-142261
- Patent Document 2 Japanese Unexamined Patent Application Publication No. 2004-127897
- the present invention has been made to solve the problems of the conventional technology, and the purpose of the present invention is to make the organic layer uniform in thickness when the organic layer is formed by an inkjet method. It is an object to provide an organic layer forming method and an organic layer forming apparatus capable of achieving the above.
- the present invention made to achieve the above object includes a step of dropping a liquid organic material into a recess provided on a film formation target, and a method for applying the organic material dropped into the recess. And an organic layer forming method having a step of applying vibration.
- the film formation object is transferred to a shaker to give vibration to the film formation object. It can also have a process.
- the film formation target object in which the elongated recess is formed A step of applying vibration in the longitudinal direction of the concave portion can be included.
- the method of the present invention may further include a step of applying ultrasonic vibration to the film formation target.
- the method includes the step of subjecting the film formation target to vibration caused by ultrasonic irradiation.
- an ultrasonic vibration means may be brought into contact with the film formation target.
- the method of the present invention may further include a step of applying vibration to the film formation target during the dropping of the organic material into the recess of the film formation target.
- a PEDTZPSS solution is used as the organic material.
- the present invention provides a stage for placing a film formation target, and a dropping head that is provided so as to be relatively movable with respect to the stage and drops an organic material into a recess provided in the film formation target.
- an organic layer forming apparatus having vibration applying means for applying vibration to the dropped organic material.
- the vibration applying means is configured to apply ultrasonic vibration to the film formation target.
- the vibration applying unit includes an ultrasonic wave generation source for irradiating the film formation target with ultrasonic waves.
- the vibration applying means includes ultrasonic vibration means provided on the stage.
- the organic material by applying vibration to the organic material dropped into the recess on the film formation target, the organic material becomes flat in the recess, thereby making the thickness of the organic layer uniform. It becomes possible to plan.
- the organic material is flattened in a short time by vibration, the organic layer can be formed efficiently.
- the film formation target is transferred to a shaker to give vibration to the film formation target. Since the shaker is configured separately, there is an effect that it is not necessary to modify the stage for placing the film formation target.
- the film thickness of the organic layer can be made more uniform by applying vibration in the longitudinal direction of the concave portion to the film formation target in which the elongated concave portion is formed. become.
- the vibration frequency is high, so that it is possible to cope with high-viscosity organic materials.
- the film formation target can be integrated with the stage on which the film formation target is placed. Therefore, there is an effect that it is not necessary to move the film formation target after dropping the organic material.
- the film thickness can be made uniform in a shorter time. Is possible.
- an organic layer forming apparatus capable of efficiently forming an organic layer having a uniform film thickness can be provided.
- the present invention it is possible to make the film thickness uniform when the organic layer used in the organic EL element is formed by an inkjet method.
- FIG. 1 (a) (b): Schematic structural cross-sectional view showing a first embodiment of an organic layer forming method according to the present invention.
- FIG. 2 (a): Plan view showing the appearance of the film formation object in the same embodiment (b): Explanatory drawing showing the dropping position of the organic material into the recess of the film formation object
- FIG. 3 (a) and (b): Longitudinal enlarged cross-sectional views showing the configuration and operation of the recesses on the film formation target.
- FIG. 4 (a) (b): Expanded cross-sectional view in the width direction showing the configuration and operation of the recesses on the film formation target.
- FIG. 5 (a) and (b) are schematic cross-sectional views showing a second embodiment of the organic layer forming method according to the present invention, and the first embodiment of the organic layer forming apparatus according to the present invention is used. thing
- FIG. 6 (a) and (b): schematic cross-sectional views showing a third embodiment of the organic layer forming method according to the present invention, wherein the second embodiment of the organic layer forming apparatus according to the present invention is used. thing
- FIG. 7 (a): Graph showing the results of the example (b): Enlarged view of part A in Fig. 7 (a)
- FIG. 8 (a): Graph showing the results of the comparative example (b): Enlarged view of part B of Fig. 8 (a)
- FIG. 9 (a): Explanatory drawing showing the dropping position of the organic material into the concave portion of the film formation target. Expanded cross-sectional view in the width direction showing the configuration of the recesses on the membrane object
- FIG. 1 (a) and 1 (b) are schematic cross-sectional views showing a first embodiment of the organic layer forming method according to the present invention
- FIG. 2 (a) is a diagram of a film formation target in the same embodiment. Plan view showing the appearance, figure
- 2 (b) is an explanatory view showing a dropping position of the organic material into the concave portion of the film formation target.
- FIGS. 3 (a) and 3 (b) are enlarged longitudinal sectional views showing the configuration and operation of the recesses on the film formation object
- FIGS. 4 (a) and 4 (b) are the film formation object. It is a width direction expanded sectional view which shows the structure and operation
- FIG. 1 (a) As shown in Fig. 1 (a), in the present embodiment, an XY scan that is movable in the horizontal direction is used. A film formation object 3 is mounted on the cottage 2.
- a plurality of elongated recesses 4 such as rectangular shapes corresponding to the organic EL elements are formed in the film formation target 3 in a matrix shape, for example. Yes.
- the recess 4 has an ITO electrode 6 formed on the substrate 5 and a partition wall portion 7 made of polyimide, for example, on the ITO electrode 6. Provided at intervals of
- the size of the recess 4 is not particularly limited, but the length 120 / z m to the width 4
- an inkjet head 8 that is movable relative to the XY stage 2 is provided above the film formation target 3.
- the inkjet head 8 is configured to discharge and drop an organic material (for example, a PEDTZPSS solution) 10 for forming an organic layer of an organic EL element! RU
- an organic material for example, a PEDTZPSS solution
- the organic material 10 is dropped into the respective concave portions 4 of the film formation target 3 by operating the inkjet head 8 along with the movement of the XY stage 2.
- the viscosity of the organic material 10 to be dropped is not particularly limited, but 1 X 1
- the inkjet head 8 is operated at a predetermined timing while moving the XY stage 2 in the horizontal direction.
- the organic material 10 is dropped into each recess 4 of the film formation target 3.
- the film formation target 3 is transferred and mounted on a shaker 20 to give vibration to the film formation target 3.
- the frequency of vibration applied to the film formation target 3 is not particularly limited, but from the viewpoint of ensuring a uniform film thickness, it is 0. It is preferable to give a vibration of 2 Hz to 60 Hz.
- the direction of vibration applied to the film formation target 3 is not particularly limited, the viewpoint power for ensuring uniform film thickness is also the longitudinal direction of the recess of the film formation target 3 (in the figure). Y axis direction) It is preferable to give motion.
- the amplitude of vibration applied to the film formation target 3 is not particularly limited, but from the viewpoint of ensuring a uniform film thickness, the amplitude lOmn! ⁇ It is preferable to give vibration of 50mm ⁇
- the vibration time applied to the film formation target 3 is not particularly limited, but the viewpoint power for ensuring a uniform film thickness can be a vibration of 0.5 seconds to 1 minute. preferable.
- FIGS. 5 (a) and 5 (b) are schematic cross-sectional views showing a second embodiment of the organic layer forming method according to the present invention, and the first embodiment of the organic layer forming apparatus according to the present invention. Is used.
- parts corresponding to those of the above embodiment are given the same reference numerals, and detailed descriptions thereof are omitted.
- the organic layer forming apparatus 1 of the present embodiment has the same basic configuration as that of the above-described embodiment. 3. That is, an ultrasonic wave generation source 30 is provided above the XY stage 2 as vibration applying means.
- the ultrasonic wave generation source 30 is configured to irradiate the surface of the film formation target 3 mounted on the XY stage 2, for example, the ultrasonic wave S onto the partition wall 7. .
- the inkjet head 8 is operated at a predetermined timing while moving the XY stage 2 in the horizontal direction.
- the organic material 10 is dropped into each recess 4 of the film formation target 3.
- the film formation target 3 is vibrated by irradiating the film formation target 3 with ultrasonic waves S from the ultrasonic wave generation source 30. .
- the frequency of vibration applied to the film-forming object 3 is not particularly limited, but from the viewpoint of ensuring a uniform film thickness, the film-forming object 3 has a frequency of 20 kHz to It is preferable to give 2MHz vibration.
- FIGS. 6 (a) and 6 (b) are schematic sectional views showing a third embodiment of the organic layer forming method according to the present invention
- FIG. 6 (a) and FIG. 6 (b) are the second embodiment of the organic layer forming apparatus according to the present invention. Is used.
- parts corresponding to those of the above embodiment are given the same reference numerals, and detailed descriptions thereof are omitted.
- the organic layer forming apparatus 1A of the present embodiment has the same basic configuration as that of the above embodiment, and further includes an XY stage 2
- An ultrasonic vibration means 40 is provided as a vibration generating means at the lower part of the screen.
- the ultrasonic vibration means 40 is attached to the lower part of the XY stage 2 and is configured to contact the XY stage 2 and apply ultrasonic vibration.
- the inkjet head 8 is operated at a predetermined timing while moving the XY stage 2 in the horizontal direction.
- the organic material 10 is dropped into each recess 4 of the film formation target 3.
- the ultrasonic vibration means 40 is operated to vibrate the XY stage 2, thereby vibrating the film formation target 3.
- the frequency of vibration applied to the XY stage 2 is not particularly limited, but from the viewpoint of ensuring a uniform film thickness, 20kHz relative to the XY stage 2. Preferred to give ⁇ 2M Hz vibration.
- the organic material is dropped into the recess of the film formation target.
- the present invention is not limited to this, and for example, it is possible to apply vibration to the film formation target during the dropping of the organic material.
- the present invention can be applied not only to PEDTZPSS but also to other organic materials.
- the viscosity of the PEDT / PSS solution was 1 X 10- 3 Pa 's.
- the vibration applied to the film formation target was an amplitude of 50 mm and a vibration frequency of 5 Hz in the longitudinal direction of the recess.
- the film formation target was dried for 10 minutes under the conditions of atmospheric pressure and temperature of 200 ° C to form a film, and the film thickness was measured. The results are shown in Figs. 7 (a) and 7 (b).
- a film was formed by the same method as in Example except that vibration was not applied to the film formation target, and the film thickness was measured. The results are shown in Fig. 8 (a) and (b).
- the PEDTZPSS film of the example was formed almost flat (film thickness of about 60 nm).
- the PEDTZPSS film of the comparative example had irregularities having film thickness peaks of about 8 Onm, about 140 nm, and about 10 nm.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-331027 | 2004-11-15 | ||
JP2004331027 | 2004-11-15 |
Publications (1)
Publication Number | Publication Date |
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WO2006051900A1 true WO2006051900A1 (ja) | 2006-05-18 |
Family
ID=36336574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/020713 WO2006051900A1 (ja) | 2004-11-15 | 2005-11-11 | 有機層形成方法及び有機層形成装置 |
Country Status (2)
Country | Link |
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TW (1) | TWI432083B (ja) |
WO (1) | WO2006051900A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008153185A (ja) * | 2006-11-20 | 2008-07-03 | Toyama Univ | 有機el材料薄膜の形成および装置 |
CN111162202A (zh) * | 2018-11-08 | 2020-05-15 | 陕西坤同半导体科技有限公司 | 改善薄膜封装有机薄膜层平坦度的方法及装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237067A (ja) * | 2000-02-22 | 2001-08-31 | Sharp Corp | 有機発光素子の製造方法 |
JP2003139934A (ja) * | 2001-11-02 | 2003-05-14 | Seiko Epson Corp | 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置 |
JP2004103496A (ja) * | 2002-09-12 | 2004-04-02 | Seiko Epson Corp | 成膜方法、成膜装置、光学素子、有機エレクトロルミネッセンス素子、半導体素子および電子機器 |
JP2004253370A (ja) * | 2003-01-28 | 2004-09-09 | Seiko Epson Corp | 発光体とその製造方法及び製造装置、電気光学装置並びに電子機器 |
-
2005
- 2005-11-11 WO PCT/JP2005/020713 patent/WO2006051900A1/ja not_active Application Discontinuation
- 2005-11-15 TW TW094140145A patent/TWI432083B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237067A (ja) * | 2000-02-22 | 2001-08-31 | Sharp Corp | 有機発光素子の製造方法 |
JP2003139934A (ja) * | 2001-11-02 | 2003-05-14 | Seiko Epson Corp | 基板のパターン製造方法及び製造装置、カラーフィルタの製造方法及び製造装置、並びに電界発光装置の製造方法及び製造装置 |
JP2004103496A (ja) * | 2002-09-12 | 2004-04-02 | Seiko Epson Corp | 成膜方法、成膜装置、光学素子、有機エレクトロルミネッセンス素子、半導体素子および電子機器 |
JP2004253370A (ja) * | 2003-01-28 | 2004-09-09 | Seiko Epson Corp | 発光体とその製造方法及び製造装置、電気光学装置並びに電子機器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008153185A (ja) * | 2006-11-20 | 2008-07-03 | Toyama Univ | 有機el材料薄膜の形成および装置 |
CN111162202A (zh) * | 2018-11-08 | 2020-05-15 | 陕西坤同半导体科技有限公司 | 改善薄膜封装有机薄膜层平坦度的方法及装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200631461A (en) | 2006-09-01 |
TWI432083B (zh) | 2014-03-21 |
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