WO2006048918A1 - Integrated micro-interferometer and method of making the same - Google Patents
Integrated micro-interferometer and method of making the same Download PDFInfo
- Publication number
- WO2006048918A1 WO2006048918A1 PCT/IT2005/000651 IT2005000651W WO2006048918A1 WO 2006048918 A1 WO2006048918 A1 WO 2006048918A1 IT 2005000651 W IT2005000651 W IT 2005000651W WO 2006048918 A1 WO2006048918 A1 WO 2006048918A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fact
- lithium niobate
- substrate
- integrated micro
- realisation
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 4
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 24
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000005468 ion implantation Methods 0.000 claims abstract description 16
- 150000002500 ions Chemical class 0.000 claims abstract description 15
- 229910003327 LiNbO3 Inorganic materials 0.000 claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 7
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 7
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 7
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 238000002513 implantation Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 11
- 230000005684 electric field Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000000137 annealing Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000008030 elimination Effects 0.000 claims description 3
- 238000003379 elimination reaction Methods 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 14
- 239000010936 titanium Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 230000010363 phase shift Effects 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001658 differential optical absorption spectrophotometry Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005588 protonation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/134—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms
- G02B6/1347—Integrated optical circuits characterised by the manufacturing method by substitution by dopant atoms using ion implantation
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/21—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference
- G02F1/225—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
Definitions
- the present invention concerns an integrated micro-interferometer with wave guides reproducing a Mach-Zehnder configuration type on a substrate of LiNbO 3 (Lithium Niobate), and a method for its realization by means of the ion implantation technique with high energy of medium-light ions.
- the invention is to be used as scanning interferometer for Fourier interferometry and spectral analysis, as sensor of gas in trace (DOAS techniques), as detector of electromagnetic field.
- DOAS techniques gas in trace
- the main aim of the present invention is that to overcome the difficulties present in the state of the art. Moreover, applying the proposed method of making the present invention permits to obtain a device of small dimensions and weight (some gram for a single chip), with reduced consumptions (some mW), to have the possibility to be equipped with compact electronic parts (lay-outs smd) and with spectral resolution comparable to that of analogous conventional instruments.
- Figure 1 represents a scheme of integrated micro-interferometer, object of the present invention.
- Figure 2 represents a series of micro-interferometers, object of the present invention, integrated on a unique substrate.
- Figure 3 represents a transversal section of an integrated channel guide, object of the present invention, when it is realized by means of ion implantation using a single-layer mask.
- Figure 4 represents a transversal section of an integrated channel guide, object of the present invention, when it is realized by means of ion implantation using a multi-layer mask.
- the waveguides (2) are obtained on a LiNbO 3 (Lithium Niobate) (1) substrate.
- the waveguides are realized using the technique of ion implantation with high energy of medium-light ions by means of particle accelerator.
- the waveguides form reproduces a Mach-Zehnder type configuration, constituted by an input waveguide (3) which presents a first "Y" bifurcation (4), two parallel waveguides (5) which accord with a second overturned "Y” bifurcation (6) to output waveguide (7).
- pilot electrodes (8) for a tension ramp application are placed on the sides of at least one of the two parallel waveguides (5).
- phase shift on the Lithium Niobate substrate (1) is realized making use of electro-optical properties of the material the waveguides (2) are made of.
- the phase shift of the optical paths is realized applying to at least one of the arms of the interferometer an electrical field which modifies the refraction index of the waveguide.
- the obtained phase shift is proportional to applied tension: therefore, in order to perform a scanning, a tension ramp which amplitude depends on the dimensions of the pilot electrodes and spectral resolution to obtain is applied.
- the angle of the "Y" bifurcations (4)(6) of the Mach-Zehnder geometry can be even inferior to 2°, therefore, on the same substrate more than one device can be realized (for example, even more than 20 devices on a 3" commercial wafer).
- the ion implantation is performed using a mask realized by one or more layers, at least one of which is constituted by a metal (11) which density is > 2g/cm 3 .
- a metal (11) which density is > 2g/cm 3 .
- These layers make so that the ions which pass through the metal terminate their path on a precisely established depth (10) (more near to the substrate surface), different from the depth (13) achieved by the ions which make incidence in the points of the substrate where the mask does not cover the niobate surface.
- choosing the opportune thicknesses according to the implanted ions and implantation energy the lateral definition and at the same time the horizontal definition (parallel to the surface) of the channel guides are obtained, by means of the ion implantation process.
- the total thickness of such layers depends not only on the incident ions and their atomic weight, but also on the density of the elements which constitute them. Usually if gold, platinum or elements with elevated densities (e.g. >10 g/cm3) are used, then such thicknesses vary from some hundred of nanometers to two-three microns according to the used energy and, hence, to the implantation depth. For less dense materials such thicknesses are normally of the order of some micron.
- a layer of the material (12) of few tens of nanometers having direct contact with the Lithium Niobate substrate (1) is used.
- the main characteristics of this layer is that to realize a good adhesive between substrate and subsequent mask layers.
- noble metals (Au, Pt) are used as subsequent layers, examples of such material are represented by titanium, Ni-Cr alloys ecc. The usage of such layer is functional to the adhesion properties of the subsequent layers and, hence, it is not necessarily requested.
- the accessory adhesive deposition will not be necessary.
- An example on this regard can be given by materials like niobium and tantalum, able to be deposited directly on the Lithium Niobate surface to which they adhere without difficulties.
- the channel guides (and, therefore, a certain number of integrated devices) are realized by means of a unique implantation process in the Lithium Niobate substrate (the mask defines all the guide walls) according to the requested geometry and used mask.
- such mask may be a) or maintained to realise the pilot electrodes (8) directly, b) or eliminated and followed by further process of deposition and masking in case a different configuration of pilot electrodes is requested (8).
- the embodiment of integrated micro-interferometer previews the following steps: a) As substrates a 3" LiNbO 3 wafer (1) with an "X-cut” orientation such that the guides are directed along the Y axis and the electric field is directed along the Z axis, or a wafer Of LiNbO 3 (1) with an "Y-cut” orientation such that the guides are directed along the X axis and the electric field is directed along the Z axis are used. b) The mask deposition which in the case of Ti - Au mask has one Titanium layer with thickness comprised between IOOA and 5000A and one golden layer with thickness comprised between 5000A and 30000A is performed.
- Ti - Au mask is defined by means of photolithographic techniques according to negative mask (the part of the material which will act as waveguide is not covered)
- the high energy ion implantation of medium-light ions of one of the following species: B, C, N, F, Al, Si, P and Cl is performed;
- the ions are implanted with energy values comprised between 500keV and 10MeV with fluences comprised between l*10 12 ioni/cm 2 and l*10 17 ioni/cm 2 , and with flow comprised between l*10 7 ioni/cm 2 *s and l*10 14 ioni/cm 2 *s.
- This production method permits the maintaining of a good electro-optical coefficient, near to the nominal value of the virgin material.
- the conventional techniques of channel waveguides realization by means of ion exchange reduce such coefficient to values inferior to the half of the initial value of the material. With conventional techniques only with very long annealing processes (efficient, by the way, only in the case of the protonation) such coefficient value will be higher.
- the guides produced with implantation don't present preferential polarizations, they are, namely, able to guide both TE and TM modes, what makes them particularly suitable for the launch in fibre of polychromatic light, avoiding the losses due to polarization states of injected light and making unuseful the usage of polarization maintaining fibres, with evident advantages during the fibre insertion processes.
- the invention certainly, is not limited, to the representation of the figures, but can receive perfections and modifications from men skilled in the art, without going out of the patent frame.
- the present invention permits numerous advantages and, particularly, allows to overcome the difficulties that could not be superated using the systems that are actually in commerce
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITCZ20040017 ITCZ20040017A1 (en) | 2004-11-08 | 2004-11-08 | INTEGRATED MICRO-INTERFEROMETER AND METHOD OF REALIZATION |
ITCZ2004A000017 | 2004-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006048918A1 true WO2006048918A1 (en) | 2006-05-11 |
Family
ID=35695605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IT2005/000651 WO2006048918A1 (en) | 2004-11-08 | 2005-11-08 | Integrated micro-interferometer and method of making the same |
Country Status (2)
Country | Link |
---|---|
IT (1) | ITCZ20040017A1 (en) |
WO (1) | WO2006048918A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101943768A (en) * | 2010-08-02 | 2011-01-12 | 山东大学 | Method for preparing KTP rib optical waveguide by combining ion implantation with ion beam etching |
CN104142534A (en) * | 2014-08-01 | 2014-11-12 | 北京世维通科技发展有限公司 | Method for preparing Y-cut Z-propagation lithium niobate waveguide with 1310 nm wavelength and adjustable birefringence difference |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2144868A (en) * | 1983-08-09 | 1985-03-13 | Standard Telephones Cables Ltd | Integrated optic arrangement |
JPS63307406A (en) * | 1987-06-10 | 1988-12-15 | Matsushita Electric Ind Co Ltd | Production of light guide |
US4938836A (en) * | 1987-03-25 | 1990-07-03 | Etat Francais Represente Par Le Ministre Delegue Aux Postes Et Telecommunications | Process for locally increasing the refractive indexes of an electrooptical material usable in guided optics and material obtained by this process |
EP0433859A1 (en) * | 1989-12-18 | 1991-06-26 | Forschungszentrum Jülich Gmbh | Optical element and method for its production |
US5491768A (en) * | 1994-07-27 | 1996-02-13 | The Chinese University Of Hong Kong | Optical waveguide employing modified gallium arsenide |
GB2373635A (en) * | 2000-11-15 | 2002-09-25 | Nec Corp | Structure of IGFET gate electrode sidewall |
CN1434551A (en) * | 2003-03-04 | 2003-08-06 | 山东大学 | Method for preparing neodymium doped yttrium vanadate crystal waveguide laser by ion implantation |
US20040091225A1 (en) * | 2000-12-26 | 2004-05-13 | Stephane Serand | Optically active waveguide device comprising a channel on an optical substrate |
JP2004302191A (en) * | 2003-03-31 | 2004-10-28 | Sumitomo Osaka Cement Co Ltd | Light control element |
-
2004
- 2004-11-08 IT ITCZ20040017 patent/ITCZ20040017A1/en unknown
-
2005
- 2005-11-08 WO PCT/IT2005/000651 patent/WO2006048918A1/en active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2144868A (en) * | 1983-08-09 | 1985-03-13 | Standard Telephones Cables Ltd | Integrated optic arrangement |
US4938836A (en) * | 1987-03-25 | 1990-07-03 | Etat Francais Represente Par Le Ministre Delegue Aux Postes Et Telecommunications | Process for locally increasing the refractive indexes of an electrooptical material usable in guided optics and material obtained by this process |
JPS63307406A (en) * | 1987-06-10 | 1988-12-15 | Matsushita Electric Ind Co Ltd | Production of light guide |
EP0433859A1 (en) * | 1989-12-18 | 1991-06-26 | Forschungszentrum Jülich Gmbh | Optical element and method for its production |
US5491768A (en) * | 1994-07-27 | 1996-02-13 | The Chinese University Of Hong Kong | Optical waveguide employing modified gallium arsenide |
GB2373635A (en) * | 2000-11-15 | 2002-09-25 | Nec Corp | Structure of IGFET gate electrode sidewall |
US20040091225A1 (en) * | 2000-12-26 | 2004-05-13 | Stephane Serand | Optically active waveguide device comprising a channel on an optical substrate |
CN1434551A (en) * | 2003-03-04 | 2003-08-06 | 山东大学 | Method for preparing neodymium doped yttrium vanadate crystal waveguide laser by ion implantation |
JP2004302191A (en) * | 2003-03-31 | 2004-10-28 | Sumitomo Osaka Cement Co Ltd | Light control element |
Non-Patent Citations (8)
Title |
---|
BENTINI G G ET AL: "Damage effects produced in the near-surface region of x-cut LiNbO3 by low dose, high energy implantation of nitrogen, oxygen, and fluorine ions", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 96, no. 1, 1 July 2004 (2004-07-01), pages 242 - 247, XP012067958, ISSN: 0021-8979 * |
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 15 March 1996 (1996-03-15), DAVIS G M ET AL: "Planar and channel waveguide fabrication in LiB3O5 using MeV He<+> ion implantation", XP002366289, Database accession no. 5234576 * |
FENG CHEN ET AL.: "Opitcal Waveguide in X-cut LiNbO3 Crystals by MeV P+ Ion Implantation with Low Dose", PHYSICA STATUS SOLIDI, vol. 187, no. 2, 2001, pages 543 - 548, XP009061050 * |
HU HUI ET AL: "Monomode optical waveguide in lithium niobate formed by MeV Si+ ion implantation", JOURNAL OF APPLIED PHYSICS, AMERICAN INSTITUTE OF PHYSICS. NEW YORK, US, vol. 89, no. 9, 1 May 2001 (2001-05-01), pages 5224 - 5226, XP012053425, ISSN: 0021-8979 * |
JOURNAL OF APPLIED PHYSICS AIP USA, vol. 79, no. 6, 15 March 1996 (1996-03-15), pages 2863 - 2867, ISSN: 0021-8979 * |
PATENT ABSTRACTS OF JAPAN vol. 013, no. 141 (P - 853) 7 April 1989 (1989-04-07) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) * |
SHI-LING LI ET AL.: "Monomode optical waveguide excited at 1540 nm in LiNbO3 formed by MeV carbon ion implantation at low doses", OPTICS EXPRESS, vol. 12, no. 5, 8 March 2004 (2004-03-08), pages 747 - 752, XP002366001 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101943768A (en) * | 2010-08-02 | 2011-01-12 | 山东大学 | Method for preparing KTP rib optical waveguide by combining ion implantation with ion beam etching |
CN104142534A (en) * | 2014-08-01 | 2014-11-12 | 北京世维通科技发展有限公司 | Method for preparing Y-cut Z-propagation lithium niobate waveguide with 1310 nm wavelength and adjustable birefringence difference |
Also Published As
Publication number | Publication date |
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ITCZ20040017A1 (en) | 2005-02-08 |
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