WO2006038335A1 - 電気化学的析出方法、電気化学的析出装置及び微細構造体 - Google Patents
電気化学的析出方法、電気化学的析出装置及び微細構造体 Download PDFInfo
- Publication number
- WO2006038335A1 WO2006038335A1 PCT/JP2005/008038 JP2005008038W WO2006038335A1 WO 2006038335 A1 WO2006038335 A1 WO 2006038335A1 JP 2005008038 W JP2005008038 W JP 2005008038W WO 2006038335 A1 WO2006038335 A1 WO 2006038335A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrochemical
- potential
- electrochemical deposition
- working electrode
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00126—Static structures not provided for in groups B81C1/00031 - B81C1/00119
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/0038—Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0197—Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
Definitions
- Electrochemical deposition method electrochemical deposition apparatus and microstructure
- the present invention provides a surface of a working electrode by applying a voltage or passing a current between a plurality of electrodes immersed in a solution dissolved in a material force ion state capable of electrochemical deposition such as metal.
- the present invention relates to an electrochemical deposition method, an electrochemical deposition apparatus, and a lattice having a scale of several tens to several hundreds of micrometers.
- nano-periodic structures such as metals, semiconductors, and conductive polymers have been actively researched in various fields due to various functions based on their periodic structures, such as giant magnetoresistance, tunneling magnetoresistance, and photonics. It is going on.
- a thin film forming method such as a vapor deposition method has been established as a method for producing a nano-periodic structure. These are multi-step methods in which the target substances are alternately stacked.
- the structure formed by the former is a thermal equilibrium structure, that is, a static ordered structure. , Determined by the principles of intermolecular forces (atomic forces) and equilibrium thermodynamics.
- the structure formed by the latter is a pattern formed spontaneously in the flow of energy, that is, in a non-equilibrium system. This is an ordered structure that has various temporal and spatial structures.
- Dynamic self-organization has features such as the appearance of pull-in phenomenon, self-repair function, and long-range interaction that are not found in static self-organization, and controls dynamic self-organization. If it is possible, a microstructure having a desired structure can be manufactured.
- Patent Document 1 a conductive support is immersed in an aqueous solution containing metal ions, the potential of the conductive support is vibrated using the conductive support as an electrode, and a metal layer is formed on the conductive support. And a method for producing a laminated film by alternately depositing metal oxide layers.
- Patent Document 1 JP 2002-129374 A
- the present inventor has produced a microstructure using electrochemical vibration (current vibration or potential vibration). Based on the electrochemical oscillation waveform (period, amplitude, etc.), the knowledge that the structure to be constructed is determined was obtained. Electrochemical reactions are easy to control, and even when energy is interrupted, the structure is accumulated as a history (precipitate), immobilizing and remembering traces of dynamic spatiotemporal order Therefore, the constructed structure will not be lost.
- the present inventor is able to control the autocatalytic process of the waveform of electrochemical vibration by the type of substance that is electrochemically deposited (for example, electrolytic deposition), the potential of the working electrode, and the current. Obtained knowledge.
- the present invention has been made on the basis of the above-mentioned knowledge, and electrochemical analysis such as metal is performed.
- Material force that can be released Electrochemistry is performed by applying a voltage or applying a current between multiple electrodes immersed in a solution dissolved in the S ion state, and controlling the potential or current of one electrode (called the working electrode) with respect to the solution.
- the purpose is to provide an electrochemical deposition method that determines the structure of a substance deposited on the surface of a working electrode based on the waveform of electrochemical vibration by generating vibration, that is, current vibration or potential vibration. To do.
- the present invention mixes reaction-inhibiting species, and controls electrochemical vibrations by causing an autocatalytic process by coupling negative differential resistance induced by the reaction-inhibiting species with a potential drop in the solution. It is an object of the present invention to provide an electrochemical deposition method.
- the present invention determines the structure of the substance deposited on the surface of the working electrode by adjusting the concentration of the reaction-inhibiting species to control the potential or current of the working electrode where electrochemical oscillation occurs. It is an object to provide an electrochemical deposition method.
- the present invention uses a cationic surfactant having a carbon chain of 10 or more as a reaction-inhibiting species, and adjusts the carbon chain to control the potential or current at which electrochemical vibrations occur, thereby controlling the working electrode.
- the purpose is to provide an electrochemical deposition method that determines the structure of the material deposited on the surface.
- Another object of the present invention is to provide an electrochemical deposition method that determines the structure of a substance deposited on the surface of a working electrode by controlling the waveform of electrochemical vibration by adjusting the concentration of the substance.
- the composition ratio of a structure having a plurality of substance forces is determined by controlling a waveform of electrochemical vibration.
- the purpose is to provide a deposition method.
- the thickness of each layer of the multilayer structure and the Z or Z is controlled by controlling the waveform of the electrochemical vibration. Is intended to provide an electrochemical deposition method for determining the composition ratio of each layer.
- the present invention controls the potential or current of the working electrode so that the electrochemical deposition proceeds to be diffusion-dominated to generate the electrochemical vibration, and thereby the action based on the waveform of the electrochemical vibration.
- the purpose is to provide an electrochemical deposition method for determining the structure of the material deposited on the electrode surface.
- the present invention detects the upper end potential or the lower end potential for each oscillation of the electrochemical vibration, and controls the current of the working electrode based on the detected fluctuation of the upper end potential or the lower end potential, thereby gradually increasing the current density. It is an object of the present invention to provide an electrochemical deposition method and an electrochemical deposition apparatus capable of preventing the spontaneous vibration from stopping from being out of the region where the spontaneous vibration occurs when it becomes small.
- the shape of the fine structure grown on the surface of the working electrode is made uniform and uniform. It is an object of the present invention to provide an electrochemical deposition method capable of obtaining a fine lattice structure with excellent properties.
- the present invention is configured to control the current of the working electrode so that the current density at which spontaneous vibration occurs is generated, so that the region force at which spontaneous vibration occurs is also reduced as the current density gradually decreases.
- the purpose of the present invention is to provide an electrochemical deposition apparatus that can continue the spontaneous vibration without stopping the spontaneous vibration.
- the present invention uses a substance deposited by each of the electrochemical deposition methods described above as a three-dimensional basic skeleton, and deposits another substance on the surface of the substance, for example, crystallographically stable. It is an object of the present invention to provide a microstructure that can be used as an electrode having a very large surface area with high strength and exposed surface.
- the present invention provides a microstructure having a porous structure formed therein by polymerizing another substance on the surface of the substance deposited by each of the electrochemical deposition methods described above and removing the deposited substance. For the purpose of provision.
- the electrochemical deposition method according to the first invention is a method in which a voltage is applied or a current is applied between a plurality of electrodes immersed in a solution in which a substance capable of electrochemical deposition is dissolved in an ionic state, and the surface of the working electrode.
- the potential or current of the working electrode with respect to the solution is controlled to generate electrochemical vibration, and based on the waveform of the electrochemical vibration, It is characterized by determining the structure of the substance.
- a plurality of electrodes are immersed in a solution in which a substance capable of electrochemical deposition (such as a metal, a semiconductor, and a conductive polymer) is dissolved in an ionic state, and an electrode is interposed between the plurality of electrodes.
- a substance capable of electrochemical deposition such as a metal, a semiconductor, and a conductive polymer
- an electrode is interposed between the plurality of electrodes.
- the dissolved substance is electrochemically deposited on the surface of one of the electrodes (working electrode).
- spontaneous electrochemical oscillation is generated by controlling the potential or current of the working electrode with respect to the solution.
- the waveform (for example, period) of the electrochemical vibration can be controlled, so that the structure of the substance deposited on the surface of the working electrode can be determined according to the waveform of the electrochemical vibration. Can be determined. Since the structure is self-assembled by the self-organized vibration phenomenon, the structure to be constructed is sequentially laminated to reflect the history of the vibration phenomenon. Therefore, since the structure is accumulated as a history and the trace of the dynamic spatiotemporal order can be fixed and stored, the constructed structure is not lost.
- the electrochemical deposition method according to the second invention is the method according to the first invention, wherein a reaction inhibiting species is mixed into the solution, and the reaction inhibiting species adheres to the surface of the working electrode! In this case, a state of / slipping and a state of adhesion / lessness is generated alternately and spontaneously, and the electric potential or current of the working electrode in which the electrochemical vibration is generated is controlled.
- reaction-inhibiting species by mixing a reaction inhibiting species into the solution, an autocatalytic process is caused by the coupling between the negative differential resistance induced by the reaction inhibiting species and the potential drop in the solution, In other words, a state in which reaction-inhibiting species are attached to the surface of the working electrode and a state in which the reaction-inhibiting species is not attached are spontaneously and alternately generated to control the potential or current of the working electrode in which electrochemical oscillation occurs.
- This reaction-inhibiting species can be mixed as appropriate depending on the chemical reaction system, and the potential or current region of the working electrode where electrochemical vibration occurs can be adjusted.
- the potential or current of the working electrode at which the electrochemical oscillation occurs is adjusted by adjusting the concentration of the reaction-inhibiting species. It is characterized by controlling.
- the potential or current of the working electrode where electrochemical oscillation occurs can be controlled.
- current oscillation which is a form of electrochemical oscillation
- the potential of the negative differential resistance (the potential of the working electrode at which the current flowing to the working electrode decreases rapidly) is adjusted to the concentration of the reaction-inhibiting species mixed into the solution. By doing so, it can be moved to the positive side or the negative side. Specifically, the potential at which current oscillation occurs can be shifted to the positive side by increasing the concentration of the reaction-inhibiting species.
- the reaction-inhibiting species is a cationic surfactant having 10 or more carbon chains, and the carbon chain By adjusting the electric potential or current of the working electrode in which the electrochemical vibration occurs.
- the potential of the working electrode that causes electrochemical vibration or the like by adjusting the carbon chain or The current can be controlled.
- the potential of the negative differential resistance can be moved to the positive side or the negative side by adjusting the carbon chain.
- the potential at which current oscillation occurs can be shifted to the positive side. Therefore, when the same type of reaction-inhibiting species is used, the potential at which current oscillation occurs can be controlled by adjusting the carbon chain, and the structure of the substance deposited on the surface of the working electrode can be determined.
- the electrochemical deposition method according to the fifth invention is characterized in that, in any one of the first invention to the fourth invention, the waveform of the electrochemical vibration is controlled by adjusting the concentration of the substance.
- the potential or current of the working electrode can be controlled, that is, the waveform of the electrochemical vibration can be controlled.
- the structure of can be determined.
- the electrochemical deposition method according to a sixth aspect of the present invention is the method according to any one of the first to fifth aspects, wherein a plurality of substances are dissolved in an ionic state in the solution.
- the composition ratio of the structure composed of the plurality of substances is determined by controlling the waveform.
- the composition ratio of the structure having a plurality of substance forces can be determined by controlling the waveform of electrochemical vibration. it can.
- each substance The amount of precipitation with respect to the potential of the working electrode varies depending on the difference in the degree of ON tendency.
- the waveform of the electrochemical vibration can be controlled by controlling the potential of the working electrode, the composition ratio of the structure can be determined (controlled) by controlling the amount of precipitation of each substance.
- the composition ratio can be changed.
- the electrochemical deposition method according to a seventh aspect of the present invention is the method according to any one of the first to sixth aspects, wherein the structure of the substance determined based on the waveform of the electrochemical vibration is a multilayer structure. It is characterized by being.
- a substance having a multilayer structure can be deposited on the surface of the working electrode by the above-described electrochemical deposition method.
- the electrochemical deposition method according to the eighth invention is the method according to the seventh invention, wherein the electrochemical oscillation waveform is controlled to determine the film thickness and Z of each layer of the multilayer structure or the composition ratio of each layer. It is characterized by that.
- the potential or current of the working electrode can be controlled, that is, the waveform of the electrochemical vibration can be controlled.
- the amount of precipitation can be controlled.
- the deposition amount of each substance can be adjusted, so that the film thickness of each layer and the composition ratio of Z or each layer can be determined.
- the film thickness of each layer can be determined by adjusting the concentration of each substance while maintaining the concentration ratio of each substance constant.
- An electrochemical deposition method is characterized in that, in any one of the first to eighth inventions, the substance is a metal.
- the metal can be deposited on the surface of the working electrode by the electrochemical deposition method described above.
- the electrochemical deposition method according to a tenth aspect of the present invention is the method according to the first aspect of the present invention, wherein the potential or current of the working electrode is controlled so that the electrochemical deposition is governed by diffusion to generate electrochemical vibrations. It is characterized by the fact that
- electrochemical oscillation is generated by controlling the potential or current of the working electrode so that electrochemical deposition advances to the diffusion control. Electrochemical phenomena occur due to a combination of autocatalytic crystal growth in a specific orientation and autocatalytic surface deactivation on the thermodynamically stable surface. Reflecting this, a fine regular structure grown in the vertical direction of the working electrode is formed. Therefore, the structure is accumulated as a history, and the trace of the dynamic spatiotemporal order can be fixed and stored, so that the constructed structure is not lost.
- the electrochemical deposition method according to the eleventh aspect of the present invention is the method according to the tenth aspect, wherein the upper end potential or the lower end potential for each oscillation of the electrochemical vibration is detected and the detected upper end potential or lower end potential is changed. The current of the working electrode is controlled.
- the upper end potential or the lower end potential for each vibration of the electrochemical vibration is detected, and the current of the working electrode is controlled based on the detected fluctuation of the upper end potential or the lower end potential.
- the oscillation phenomenon starts spontaneous oscillation at the boundary of the current density that becomes the threshold for transition from the reaction-controlled process to the diffusion-controlled process.
- the effective electrode area of the working electrode gradually increases, and when the current density is gradually reduced, the vibration is separated from the region where the spontaneous vibration occurs. Will stop. Therefore, spontaneous vibration can be continued by controlling the current of the working electrode.
- the electrochemical deposition method according to the twelfth invention is characterized in that, in the eleventh invention, the effective current density of the working electrode with respect to the solution is controlled to be substantially constant.
- the shape of the fine structure grown on the surface of the working electrode for example, the lattice spacing
- a fine lattice structure with excellent uniformity can be obtained.
- the waveform of the electrochemical vibration is controlled by adjusting the concentration of the substance. It is characterized by.
- the potential or current of the working electrode can be controlled, that is, the waveform of the electrochemical vibration can be controlled.
- the structure of the material to be released can be determined. For example, by increasing the ion concentration of a substance, the individual structure of the periodic structure of the substance can be increased.
- the electrochemical deposition apparatus causes an electric current to flow between a plurality of electrodes immersed in a solution in which a substance capable of electrochemical deposition is dissolved in an ionic state, thereby generating electrochemical vibrations.
- An electrochemical deposition apparatus for depositing the substance on the surface of the working electrode, the detection means for detecting the upper end potential or the lower end potential for each vibration of the electrochemical vibration, and the upper end detected by the detection means And a control means for controlling a current of the working electrode with respect to the solution based on a potential or a lower end potential.
- a plurality of electrodes are immersed in a solution in which a substance capable of electrochemical deposition (metal, semiconductor, conductive polymer, etc.) is dissolved in an ionic state, and the detection means is electrochemical.
- the upper end potential or lower end potential for each vibration is detected, and the control means controls the current of the working electrode with respect to the solution based on the detected upper end potential or lower end potential.
- the control means controls the current of the working electrode with respect to the solution based on the detected upper end potential or lower end potential.
- An electrochemical deposition apparatus is characterized in that, in the fourteenth invention, the control means controls the current density to generate spontaneous vibration.
- the present invention by controlling the current of the working electrode so as to obtain a current density at which spontaneous vibrations occur, the region force that causes spontaneous vibrations as the current density gradually decreases is eliminated.
- the spontaneous vibration can be continued without stopping the spontaneous vibration.
- the microstructure according to the sixteenth invention is characterized in that the substance deposited by each of the electrochemical deposition methods described above is used as a three-dimensional basic skeleton, and other substances are deposited on the surface of the substance.
- a fine structure for example, a fine lattice structure
- another substance such as platinum is applied to the surface of the fine structure.
- an electrode having a high strength and an extremely large surface area can be obtained. It also has the advantage that a crystallographically stable surface is exposed.
- a porous structure is formed inside by polymerizing another substance on the surface of the substance deposited by each of the electrochemical deposition methods described above and removing the deposited substance. It is characterized by that.
- a fine structure in which the fine structure has a blank pattern can be realized using the fine structure (for example, a fine lattice structure) as a three-dimensional template.
- a fine regular structure is self-assembled vertically from the substrate by a self-organized vibration phenomenon.
- the structures to be constructed are sequentially stacked to reflect the history of vibration phenomena.
- the electrochemical vibration phenomenon itself is controlled, the resulting regular structure can be controlled.
- the current at the working electrode so that the current density at which spontaneous vibration occurs is generated, the current density gradually decreases, and the spontaneous vibration stops outside the region where the spontaneous vibration occurs.
- the obtained regular structure itself is used as a template, it is possible to construct a three-dimensional regular structure such as metal, semiconductor and conductive polymer. Furthermore, in principle, it can be applied to the electrochemical deposition reaction of a desired substance by appropriately selecting the reaction-inhibiting species, and therefore, it is expected to be applied to the formation of various functional materials. In addition, since the configuration of the apparatus for that purpose is extremely simple, it is possible to produce a predetermined fine structure at an extremely low cost, and thus an excellent effect can be obtained.
- FIG. 1 is an explanatory diagram for explaining an electrochemical deposition method according to Embodiment 1 of the present invention.
- FIG. 2 is a graph showing current oscillation.
- FIG. 3 is an explanatory diagram for explaining a thin film evaluation method.
- FIG. 4 shows an electron micrograph and an Auger spectroscopic result showing an evaluation result of a multilayer film formed by the electrochemical deposition method according to Embodiment 1 of the present invention.
- FIG. 5 is a graph showing the deposition current of Cu and Sn with respect to the potential of the working electrode.
- FIG. 6 is a graph showing the correspondence between the waveform of electrical vibration and the composition ratio of precipitates.
- FIG. 8 is a graph showing the deposition current with respect to the working electrode potential when C12TAC is used.
- FIG. 9 is an explanatory diagram for explaining the electrochemical deposition method according to the second embodiment of the present invention.
- FIG. 11 is an electron micrograph showing an example of a microstructure formed by the electrochemical deposition method according to Embodiment 2 of the present invention.
- FIG. 12 is an explanatory diagram for explaining a periodic structural change synchronized with the potential oscillation of Sn.
- FIG. 13 is an explanatory diagram for explaining a periodic structural change synchronized with the potential oscillation of Sn.
- FIG. 14 is a graph showing potential oscillation in Sn.
- FIG. 15 is an electron micrograph showing a microstructure constructed by changing the current value of the working electrode.
- FIG. 16 is a graph showing potential oscillation in Zn.
- FIG. 17 is an electron micrograph showing a microstructure that is constructed when the Zn ion concentration is changed.
- FIG. 18 is a graph showing the relationship between potential and current density.
- FIG. 20 is an electron micrograph at points A and B in FIG. 19 (a).
- FIG. 22 is an explanatory diagram for explaining control of a current value by a control unit.
- FIG. 23 is a graph showing an example of current value control by the control unit.
- FIG. 1 is an explanatory diagram for explaining an electrochemical deposition method according to Embodiment 1 of the present invention.
- the case where the current oscillation as one form of the electrochemical oscillation is controlled will be described.
- solution t an electrolytic (acidic) solution (hereinafter referred to as solution t) dissolved in a force ion state of a plurality of substances (herein referred to as Cu and Sn) with the anode 1 and the cathode 2 which are conductive metal substrates facing each other.
- solution t an electrolytic (acidic) solution
- Cu and Sn a force ion state of a plurality of substances
- reaction inhibiting species are mixed in Solution 4, and spontaneous electrochemical vibration (here, current oscillation) is generated in the electrochemical deposition reaction of Cu and Sn in the presence of the reaction inhibiting species.
- the reaction-inhibiting species is, for example, a cationic surfactant, such as Amiet—320 (Chemical Formula 1), C H N (CH) CI (Chemical Formula
- TritonX-100 (Chemical Formula 3) can be used.
- citrate as a smoothing agent in solution 4
- Solution 4 is considered to be a conductor
- a strong electric field is applied to each ion on the surface of Cathode 2, which causes dehydration, and each ion receives electrons from Cathode 2 and is adsorbed.
- the adsorbed atoms diffuse on the cathode surface and reach the formation point of the crystal lattice to form crystals. Attachment and desorption of reaction-inhibiting species to cathode 2 occur alternately and spontaneously, and a vibration phenomenon appears with the attachment and desorption of reaction-inhibiting species.
- the cathode 2 functions as a working electrode, and a thin film having excellent smoothness composed of Cu and Sn is deposited on the cathode 2 on the surface of the cathode 2 based on the waveform of the vibration phenomenon that appears.
- the smoothness is attributed to the incorporation of citrate, and in the absence of citrate, irregularities remain on the film surface.
- FIG. 3 is an explanatory diagram for explaining the thin film evaluation method.
- the thin film 21 processed in this way was also observed with an electron microscope on the upper surface force, and as shown in FIG. 4 (a), the presence of concentric contrast (brightness ratio) was confirmed.
- the grown thin film had a multilayer structure.
- the side surface of the multilayer film was analyzed by scanning Auge spectroscopy, and as a result, the composition ratio changed periodically as shown in Fig. 4 (b). And confirmed that.
- the multilayer film grows on the surface of the cathode 2, for example, by making the shape of the cathode 2 cylindrical, a multilayer film having excellent smoothness can be formed inside the cylinder.
- Electrochemical deposition methods can grow precipitates on the surface without depending on the shape of the electrode, so a multilayer film with excellent smoothness can be formed on the surface of any shape of electrode. Can be formed.
- a multilayer film having a desired shape can be formed on the surface of the electrode by applying the electrochemical deposition method of the present invention using an electrode previously processed into a desired shape.
- the multilayer film is a thin film (an alloy of Cu and Sn) deposited by the occurrence of current oscillation.
- the composition ratio, film thickness, and number of layers (lamination of layers) The number of times is controlled as follows.
- the potential of the cathode (working electrode) where current oscillation occurs has a range, and by adjusting the potential of the working electrode, the waveform of the current oscillation is controlled to adjust the composition ratio of the multilayer film and the film thickness of each layer. Can be adjusted. In other words, the potential of the working electrode may be adjusted in order to obtain a multilayer film having a desired composition ratio.
- the potential of the working electrode can be set to a desired value by changing the voltage applied between the anode 1 and the cathode 2.
- FIG. 5 is a graph showing Cu and Sn deposition currents with respect to the potential of the working electrode.
- Cu and Sn if the potential of the working electrode is lowered (when the potential is made more negative), the deposition current increases. However, Sn also causes a deposition current with a more negative potential than Cu. Therefore, if the potential of the working electrode is high and current oscillation is set to occur in the state, the amount of Sn precipitation can be reduced compared to the amount of Cu precipitation, that is, the Cu composition ratio (CuZ (Cu + Sn )) Can be increased. On the contrary, current oscillation is generated with the working electrode at a low potential. If set to, the composition ratio of Cu can be reduced. In other words, the composition ratio of the precipitate can be controlled by adjusting the potential of the cathode according to the difference in ionization tendency of substances contained in the solution. For example, Cu Sn / Cu Sn force ⁇ multilayered as unit structure
- a film can be formed.
- the film thickness of each layer can be adjusted by controlling the waveform (for example, the period) of current oscillation. For example, the film thickness of each layer can be increased by lowering the potential of the working electrode, and conversely, the film thickness can be decreased by increasing and decreasing the potential.
- the composition ratio can be determined (controlled) by adjusting the deposition amount of each substance.
- the Cu composition ratio can be increased by increasing the Cu concentration.
- each layer can be adjusted by adjusting the concentrations of Cu and Sn in conjunction with the concentration ratio of Sn and Cu kept constant.
- Fig. 6 is a graph showing the correspondence between the waveform of electrical vibration and the yield ratio of the precipitates.
- Figures (a) and (b) show CuSO and SnSO.
- the concentration of 4 4 is 0.15M and 0.10M, respectively.
- the period of vibration can be shortened, and a multilayer film corresponding to the period of vibration can be deposited.
- the concentration is 0.15M
- the thickness of each layer is 90 nm
- the thickness of each layer is 38 nm.
- reaction-inhibiting species When reaction-inhibiting species are attached to a single location on the substrate due to fluctuations, the autocatalytic function of the reaction-inhibiting species spreads over the entire surface of the cathode in phase, so that precipitates are deposited on the entire surface of the cathode.
- the cathode potential at which reaction-inhibiting species are attached is determined by the type and concentration of the reaction-inhibiting species, the potential at which current oscillation occurs is controlled by the type and concentration of the reaction-inhibiting species. That is, the waveform of current oscillation can be controlled.
- Figure 7 shows the deposition current versus the potential of the working electrode when C H N (CH) C1 is used.
- (A) shows C10TAC
- (b) shows C12TAC
- (c) shows C16TAC mixed in the solution as reaction-inhibiting species. Since current oscillation occurs at the negative differential resistance potential, when using the same type of reaction-inhibiting species, the potential at which current oscillation occurs is shifted to the positive side by using a reaction-inhibiting species with a long carbon chain. be able to. Therefore, by adjusting the carbon chain of the reaction-inhibiting species, the potential at which current oscillation occurs can be controlled, that is, the waveform of the current oscillation can be controlled, so that a multilayer film having a structure corresponding to the current oscillation can be formed.
- Fig. 8 is a graph showing the deposition current versus the working electrode potential when C12TAC is used.
- Fig. 8 (a) shows the concentration of C12TAC at 2 mM
- Fig. 8 (b) shows the concentration of C12TAC at 3 mM
- C shows the case of C12TAC concentration power mM. Since the current oscillation occurs at the potential of the negative differential resistance, when the same reaction-inhibiting species is used, the potential at which the current oscillation occurs can be shifted to the positive side by increasing its concentration.
- the potential at which current oscillation occurs can be controlled, that is, the waveform of current oscillation can be controlled, so that a multilayer film having a structure corresponding to the current oscillation can be formed.
- a multilayer film can be formed on the entire surface of the working electrode in one step and at a low cost.
- reaction-inhibiting species appropriately, not only metals but also semiconductors (for example, Cu 2 O) and conductors can be used.
- reaction-inhibiting species are mixed in a solution, and dissolved in a force solution that causes a vibration phenomenon by coupling negative differential resistance induced by the reaction-inhibiting species with a potential drop in the solution.
- the potential or current of the working electrode may be controlled so that the deposition of the material on the surface of the working electrode proceeds to the diffusion control of the material.
- FIG. 9 is an explanatory diagram for explaining the electrochemical deposition method according to the second embodiment of the present invention.
- the case where the potential vibration as one form of the electrochemical vibration is controlled will be described.
- an electrolytic solution (hereinafter referred to as a solution) dissolved in a force ion state of a substance (here, a metal such as Sn or Zn) with an anode 11 and a cathode 12 which are conductive metal substrates facing each other.
- a substance here, a metal such as Sn or Zn
- 14 is placed in a liquid tank 15 containing a predetermined current flowing between the cathode 12 and the anode 11.
- a constant current source is connected between the cathode 12 and the anode 11.
- the output current value from the constant current source can be set as appropriate.
- the reference electrode 13 is placed in the liquid tank 15 and the potential between the reference electrode 13 and the cathode 12 is measured.
- solution 14 Since solution 14 is considered a conductor, the potential V2 of cathode 12 with respect to solution 14 can be determined. .
- the current is controlled so as to proceed to diffusion control under the diffusion-controlled condition of the substance, thereby generating a spontaneous electrochemical oscillation (here, a potential oscillation).
- a solution 14 in which 0.2 M Sn 2+ and 4 M NaOH were mixed was used.
- the vibration phenomenon occurs due to a combination of autocatalytic crystal growth in a specific orientation and self-catalytic surface deactivation in a thermodynamically stable plane, and thus the surface of the cathode 12 functioning as a working electrode.
- a fine regular structure that grows in the vertical direction of the working electrode is formed, reflecting the history of potential oscillation.
- the material is Sn or Zn, as shown in FIGS. 11 (a) and 11 (b), a lattice structure and a structure in which hexagonal plates are overlapped are constructed.
- the type of material is not limited.
- a three-dimensionally stretched fine network structure is constructed.
- the deposited structure depends on the crystal structure of the deposited substance itself.
- the cathode 12 (working electrode) is pulled up from the solution 14 at each potential of the potential oscillation, and the surface of the working electrode is observed with an electron microscope. Observation was performed using a microscope and an optical microscope.
- FIGS. 12 and 13 are explanatory diagrams for explaining the periodic structural change synchronized with the potential oscillation of Sn.
- FIG. 12 (a) shows the waveform of the potential oscillation of Sn
- FIG. 12 (b) The crystal plane and orientation of Sn are shown.
- Figs. 13 (a), (b), and (c) show the electron microscope (SEM) of the cathode surface at the potentials A, B, and C in Fig. 12 (a). It is a photograph, an optical microscope (OM) photograph, and a schematic diagram.
- the constant current source was set so that a current density of ⁇ 36 mAZcm 2 would flow between the cathode 12 and the anode 11.
- Fig. 14 is a graph showing the potential oscillation in Sn.
- the horizontal axis shows the passage of time and the vertical axis shows the potential.
- a constant current of 12 mA flows between the working electrode, that is, the cathode 12 and the anode 11 until 62 seconds
- a constant current of 20 mA flows between the cathode 12 and the anode 11 after 62 seconds.
- the structure constructed by changing the current value of the working electrode can control the structural parameters of the formed lattice, as shown in FIG.
- the lattice spacing can be changed by changing the current value.
- the fact that the spacing of the crystal C-force lattice at the time when the current value was changed changed.
- the current value at which the potential oscillation occurs has a range, and by adjusting the current value, the waveform of the potential oscillation is controlled to control the structural parameters of the structure to be formed.
- Fig. 16 is a graph showing the potential oscillation in Zn, and the horizontal axis shows the passage of time.
- (A), (b), and (c) show the Zn ion concentrations of 0.1M and 0.2M, respectively. , 0.5 M, respectively. The period of oscillation can be lengthened by increasing the ion concentration of Zn.
- Fig. 17 is an electron micrograph showing the microstructure constructed when the ion concentration of Zn is changed.
- Figures (a), (b), and (c) show the ion concentrations of 0.1 M and 0, respectively. 2M and 0.5M are shown, and it can be seen that the size of the hexagonal plate formed can be increased according to the ion concentration.
- the waveform of the potential oscillation can also be controlled by adjusting the concentration of the substance contained in the solution, the structural parameter of the structure to be formed is controlled in the same manner as described above. be able to.
- a microstructure unique to the deposited substance is formed on the entire surface of the working electrode in one step and at a low cost. can do.
- a predetermined microstructure can be manufactured at a very low cost.
- the potential oscillation is described as one form of the electrochemical oscillation.
- the potential vibration starts to spontaneously vibrate with the current density as a boundary at a threshold jdl (approximately ⁇ 25 mAZcm 2 ).
- the threshold jdl at which electrochemical oscillation does not occur when the current density is small can be said to be a boundary that shifts to the reaction-controlled process force.
- FIG. 19 is a graph showing changes in potential oscillation with time, with the horizontal axis indicating the passage of time and the vertical axis indicating the potential.
- Fig. 19 (a) shows the case where a constant current is applied between the working electrode (ie, cathode 12) and anode 11, and when approximately 250 seconds (approximately 75 times in terms of number of vibrations) have elapsed, the potential oscillation is reduced. It will stop. This is because a fine structure grows on the surface of the working electrode, so that the effective electrode area of the working electrode gradually increases, and as the current density gradually decreases, the region force that generates spontaneous vibration is also removed. is there. In addition, as shown in FIG.
- Damaged. 20A and 20B are electron micrographs at points A and B in FIG. 19A, respectively.
- an effective increase in the electrode area is taken into consideration, and the effect of the increased calorie is offset between the working electrode (ie, cathode 12) and anode 11.
- Current to It is preferable to control (increase gradually) and continue the spontaneous vibration so that the effective current density does not change.
- FIG. 21 is an explanatory diagram for explaining the configuration of the electrochemical deposition apparatus according to Embodiment 3 of the present invention. In this example, the case of controlling the potential oscillation as one form of the electrochemical oscillation will be described.
- a dissolved electrolytic solution (hereinafter referred to as a solution) 14 is placed in a liquid tank 15 containing a solution, and current is passed between the cathode 12 and the anode 11.
- the reference electrode 13 is placed in the liquid tank 15 in place of the two electrodes 11 and 12 described above, the potential between the reference electrode 13 and the cathode 12 is measured, and the upper end potential for each vibration of the electrochemical vibration or A detection unit 16 that detects the lower end potential and a control unit 10 that controls the current of the working electrode with respect to the solution based on the upper end potential or the lower end potential detected by the detection unit 16 are provided. Since the solution 14 is considered to be a conductor, the potential V2 of the cathode 12 with respect to the solution 14 is obtained, and the control unit 10 controls the current flowing between the cathode 12 and the anode 11 based on the potential V2.
- a constant current source is connected between the cathode 12 and the anode 11, and the control unit 10 controls the output current value.
- the upper end potential is an extreme value (maximum value) in the positive direction of vibration
- the lower end potential is an extreme value (minimum value) in the negative direction of vibration.
- FIG. 22 is an explanatory diagram for explaining the control of the current value by the control unit.
- (A) shows the potential waveform when potential oscillation occurs, where A is the nth oscillation waveform, B is the n + 1st oscillation waveform, and C is the n + 2nd oscillation waveform.
- the solution resistance is R, according to Ohm's law, when current I flows, a potential loss of IXR occurs.
- FIG. 5B in the growth process from the nth generation to the (n + 1) th generation, a potential loss corresponding to an increase in electrode area ⁇ A occurs.
- k X R is a parameter that depends on the experimental system, such as electrode arrangement and concentration, and is a constant value. Therefore, ⁇ is detected, and ⁇ is calculated from Equation (3) based on this ⁇ , the current value flowing between cathode 12 and anode 11 is controlled, and the waveform of potential oscillation in the next generation is controlled. .
- FIG. 23 is a graph showing an example of current value control by the control unit, where the horizontal axis indicates the passage of time, and the vertical axis indicates the current value flowing between the working electrode (ie, cathode 12) and anode 11. .
- the current value flowing between the working electrode (that is, the cathode 12) and the anode 11 increases with time. This is because the effective current density is gradually increased to account for the increase in effective electrode area over time and to offset the effect of the increase.
- Spontaneous vibration can be continued without change. Therefore, even if approximately 250 seconds elapse, the potential oscillation does not stop. In this example, it was confirmed that the potential oscillation continued even after more than about 2000 seconds (about 600 times in terms of vibrations).
- a Balta material with a microscopic microstructure was obtained.
- a fine structure for example, a fine lattice structure
- a conductor such as platinum is plated on the surface of the fine structure.
- copper oxide can be considered other than platinum, which can be selected according to the application.
- a fine structure in which the fine structure has a blank pattern can be manufactured using the fine structure (for example, a fine lattice structure) as a three-dimensional template.
- the fine structure for example, a fine lattice structure
- Sn is removed (etched) with an etching solution such as hydrochloric acid, so that the shape of the microstructure is hollow (a A high molecular polymer having a nest-like shape can be produced. Since such a high molecular polymer has a porous structure, it can be expected to be used as a filter.
- the lattice spacing can be adjusted by controlling the waveform of electrochemical vibration, it is possible to form a plurality of structures with different spacings in the polymer.
- the upper end potential or the lower end potential for each oscillation of the electrochemical vibration is detected, and the current that the control unit 10 passes between the cathode 12 and the anode 11 based on the upper end potential or the lower end potential is detected.
- the upper electrode potential or the lower electrode potential force is controlled, and the period for each vibration of the electrochemical vibration is calculated. Based on the calculated period, the working electrode with respect to the solution is obtained so that the current density at which spontaneous vibration occurs is obtained. You may want to control the current.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006539150A JPWO2006038335A1 (ja) | 2004-10-01 | 2005-04-27 | 電気化学的析出方法、電気化学的析出装置及び微細構造体 |
| US11/731,242 US20070240993A1 (en) | 2004-10-01 | 2007-03-30 | Electrochemical deposition method, electrochemical deposition apparatus, and microstructure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-290637 | 2004-10-01 | ||
| JP2004290637 | 2004-10-01 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/731,242 Continuation US20070240993A1 (en) | 2004-10-01 | 2007-03-30 | Electrochemical deposition method, electrochemical deposition apparatus, and microstructure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006038335A1 true WO2006038335A1 (ja) | 2006-04-13 |
Family
ID=36142423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/008038 Ceased WO2006038335A1 (ja) | 2004-10-01 | 2005-04-27 | 電気化学的析出方法、電気化学的析出装置及び微細構造体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20070240993A1 (ja) |
| JP (1) | JPWO2006038335A1 (ja) |
| WO (1) | WO2006038335A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011137224A (ja) * | 2009-12-03 | 2011-07-14 | Hitachi Chem Co Ltd | 銅鍍金液のフィルド性評価方法、鍍金液のフィルド性評価装置、及びフィルド性評価用基板、並びにフィルド性評価用電極群及びその再利用方法 |
| AP3463A (en) * | 2008-10-30 | 2015-11-30 | Gaudfrin | Device for extracting cakes resulting from pressurised disc filtration, and associated extraction method. |
| JPWO2020226116A1 (ja) * | 2019-05-08 | 2020-11-12 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3485068B1 (en) | 2016-07-13 | 2026-04-08 | Iontra Inc | Electrochemical methods, devices and compositions |
| CN111579621B (zh) * | 2020-05-27 | 2023-07-14 | 四川国康药业有限公司 | 一种化学振荡指纹图谱检测黄芪片的方法 |
| CN114894860B (zh) * | 2022-04-14 | 2024-03-22 | 哈尔滨理工大学 | 一种面向基于电化学的金属微构件操作的过程监控方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234196A (ja) * | 1999-02-15 | 2000-08-29 | Japan Steel Works Ltd:The | 耐食性・耐摩耗性クロムめっき及びその製造方法 |
| JP2002129374A (ja) * | 2000-10-23 | 2002-05-09 | Seiichiro Nakabayashi | 積層膜の製造方法および積層膜 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005039142A (ja) * | 2003-07-18 | 2005-02-10 | Nec Electronics Corp | 半導体装置の製造方法 |
| US7736474B2 (en) * | 2004-01-29 | 2010-06-15 | Ebara Corporation | Plating apparatus and plating method |
-
2005
- 2005-04-27 JP JP2006539150A patent/JPWO2006038335A1/ja active Pending
- 2005-04-27 WO PCT/JP2005/008038 patent/WO2006038335A1/ja not_active Ceased
-
2007
- 2007-03-30 US US11/731,242 patent/US20070240993A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000234196A (ja) * | 1999-02-15 | 2000-08-29 | Japan Steel Works Ltd:The | 耐食性・耐摩耗性クロムめっき及びその製造方法 |
| JP2002129374A (ja) * | 2000-10-23 | 2002-05-09 | Seiichiro Nakabayashi | 積層膜の製造方法および積層膜 |
Non-Patent Citations (3)
| Title |
|---|
| LEOPOLD S. ET AL: "Spontaneous Potential Oscillations in the CU(II)Tartrate and Lactate Systems, Aspects of Mechanism and Film Deposition.", J.ELECTROCHEM.SOC., vol. 148, no. 8, 2001, pages C513 - C517, XP002989894 * |
| NAKANISHI S. ET AL: "New Autocatalytic Mechanism for Metal Electrodeposition Leading to Oscillations and Fern-Leaf-Shaped Deposits.", CHEMISTRY LETTERS., 2002, pages 636 - 637, XP002989896 * |
| SAKAI S. ET AL: "Oscilation-Induced Layer-by-Layer Electrodeposition Producting Alternate Metal and Metal-Alloy Multilayers on a Nanometer Scale.", CHEMISTRY LETTERS., 2002, pages 640 - 641, XP002989895 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AP3463A (en) * | 2008-10-30 | 2015-11-30 | Gaudfrin | Device for extracting cakes resulting from pressurised disc filtration, and associated extraction method. |
| JP2011137224A (ja) * | 2009-12-03 | 2011-07-14 | Hitachi Chem Co Ltd | 銅鍍金液のフィルド性評価方法、鍍金液のフィルド性評価装置、及びフィルド性評価用基板、並びにフィルド性評価用電極群及びその再利用方法 |
| JPWO2020226116A1 (ja) * | 2019-05-08 | 2020-11-12 | ||
| JP7659899B2 (ja) | 2019-05-08 | 2025-04-10 | 石原ケミカル株式会社 | 銅メッキ層又は銅合金メッキ層を備えた構造体、及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070240993A1 (en) | 2007-10-18 |
| JPWO2006038335A1 (ja) | 2008-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Nasirpouri et al. | An investigation on the effect of surface morphology and crystalline texture on corrosion behavior, structural and magnetic properties of electrodeposited nanocrystalline nickel films | |
| Debiemme-Chouvy | Template-free one-step electrochemical formation of polypyrrole nanowire array | |
| Kowalik et al. | Electrodeposition of ZnSe | |
| Hasegawa et al. | Orientation-controlled nanotwinned copper prepared by electrodeposition | |
| EP2229472B1 (en) | Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and/or stoichiometry | |
| Rosso | Electrodeposition from a binary electrolyte: new developments and applications | |
| Wu et al. | A simple and efficient combined AC–DC electrodeposition method for fabrication of highly ordered Au nanowires in AAO template | |
| Park et al. | Template-free and filamentary growth of silver nanowires: application to anisotropic conductive transparent flexible electrodes | |
| Kowalik et al. | Analysis of tellurium thin films electrodeposition from acidic citric bath | |
| US20070240993A1 (en) | Electrochemical deposition method, electrochemical deposition apparatus, and microstructure | |
| Song et al. | Reducing the residual stress in micro electroforming layer by megasonic agitation | |
| Prună et al. | Influence of deposition potential on structure of ZnO nanowires synthesized in track-etched membranes | |
| Kilani et al. | Toward Precision Deposition of Conductive Charge‐Transfer Complex Crystals Using Nanoelectrochemistry | |
| Safari et al. | Electrochemical growth of high-aspect ratio nanostructured silver chloride on silver and its application to miniaturized reference electrodes | |
| Leopold et al. | Electrochemical deposition of cylindrical Cu/Cu2O microstructures | |
| Fukami et al. | Self-organized periodic growth of stacked hexagonal wafers in synchronization with a potential oscillation in zinc electrodeposition | |
| Kim et al. | A continuous process for Si nanowires with prescribed lengths | |
| Tang et al. | Selective etching of ZnO films on an ITO substrate using a scanning electrochemical microscope | |
| JW Cheng et al. | Electrodeposited copper micropillar surfaces with pulse reverse voltammetry for enhanced heat dissipation | |
| Tang et al. | Fabrication of Pyramid-Like Structured Cu Coatings by Pulse-Reverse Current Electrodeposition | |
| Teller et al. | Morphological study of branched Sn structure formed under selected electrochemical conditions | |
| Yu et al. | Patterned tailored hydrophobic films designed by synergy effect of electrochemical deposition and chemical deposition | |
| Yang et al. | Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process | |
| Cerquido et al. | Tailoring the cap’s morphology of electrodeposited gold micro-mushrooms | |
| Kruglikov et al. | Analyzing the conditions for the electrolytic formation of ensembles from metal nanowires in the pores of track membranes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| WWE | Wipo information: entry into national phase |
Ref document number: 2006539150 Country of ref document: JP |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 11731242 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWP | Wipo information: published in national office |
Ref document number: 11731242 Country of ref document: US |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 05736671 Country of ref document: EP Kind code of ref document: A1 |
