WO2006013066A3 - Resin-encapsulated light emitting diode and method for encapsulating light emitting diode - Google Patents

Resin-encapsulated light emitting diode and method for encapsulating light emitting diode Download PDF

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Publication number
WO2006013066A3
WO2006013066A3 PCT/EP2005/008247 EP2005008247W WO2006013066A3 WO 2006013066 A3 WO2006013066 A3 WO 2006013066A3 EP 2005008247 W EP2005008247 W EP 2005008247W WO 2006013066 A3 WO2006013066 A3 WO 2006013066A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting diode
encapsulated
resin
encapsulating
Prior art date
Application number
PCT/EP2005/008247
Other languages
French (fr)
Other versions
WO2006013066A2 (en
Inventor
Tetsuya Murakami
Gerhard Staiger
Original Assignee
Wacker Chemie Ag
Tetsuya Murakami
Gerhard Staiger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie Ag, Tetsuya Murakami, Gerhard Staiger filed Critical Wacker Chemie Ag
Priority to CN2005800266201A priority Critical patent/CN101432894B/en
Publication of WO2006013066A2 publication Critical patent/WO2006013066A2/en
Publication of WO2006013066A3 publication Critical patent/WO2006013066A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A LED device is provided, in which a LED element is encapsulated in a material less susceptible to damages caused by rapid temperature changes. The LED element is coated with an addition-curable soft silicone and is further encapsulated in a resin-like, addition-curable silicone. The soft silicone is characterized in having a cured hardness of 5 to 75 by a Type E Durometer and being a cured product of a composition comprising of (A) an organopolysiloxane that has an average of at least 1.8 alkenyl groups per molecule bonded to a silicon atom, (B) an organohydrogenpolysiloxane that has an average of at least 4 hydrogen atoms per molecule bonded to a silicon atom, and (C) a hydrosilylation catalyst.
PCT/EP2005/008247 2004-08-04 2005-07-28 Resin-encapsulated light emitting diode and method for encapsulating light emitting diode WO2006013066A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2005800266201A CN101432894B (en) 2004-08-04 2005-07-28 Resin-encapsulated light emitting diode and method for encapsulating light emitting diode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-227410 2004-08-04
JP2004227410A JP2006049533A (en) 2004-08-04 2004-08-04 Resin sealing light emitting diode device and sealing method

Publications (2)

Publication Number Publication Date
WO2006013066A2 WO2006013066A2 (en) 2006-02-09
WO2006013066A3 true WO2006013066A3 (en) 2008-12-11

Family

ID=35115713

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/008247 WO2006013066A2 (en) 2004-08-04 2005-07-28 Resin-encapsulated light emitting diode and method for encapsulating light emitting diode

Country Status (3)

Country Link
JP (1) JP2006049533A (en)
CN (1) CN101432894B (en)
WO (1) WO2006013066A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
JP5233087B2 (en) * 2006-06-28 2013-07-10 日亜化学工業株式会社 LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD, PACKAGE, LIGHT EMITTING DEVICE MOUNTING BOARD
EP2111651A4 (en) 2007-02-13 2011-08-17 3M Innovative Properties Co Led devices having lenses and methods of making same
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
DE102007025749A1 (en) * 2007-06-01 2008-12-11 Wacker Chemie Ag Illuminant-silicone mold part
DE502008001837D1 (en) * 2007-06-01 2010-12-30 Wacker Chemie Ag PHOTOREACTOR
US20090065792A1 (en) 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
US8167674B2 (en) * 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
KR101259887B1 (en) * 2009-08-04 2013-05-02 한국과학기술원 Transparent Siloxane Resin Composition for Optical Applications
CN101702421B (en) * 2009-10-23 2011-03-23 中外合资江苏稳润光电有限公司 Manufacturing method of white light LED
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
JP5921154B2 (en) 2011-11-09 2016-05-24 日東電工株式会社 Optical film, image display device, and method of manufacturing image display device
WO2014019195A1 (en) * 2012-08-02 2014-02-06 Henkel (China) Company Limited Curable compositions for LED encapsulants comprising a polycarbosilane and a hydrosilicone
EP2880082A4 (en) 2012-08-02 2016-03-02 Henkel China Co Ltd Polycarbosilane and curable compositions for led encapsulants comprising same
DE102013215102A1 (en) * 2013-08-01 2015-02-05 Wacker Chemie Ag Silicone resin composition for optical semiconductors
DE102013215105A1 (en) * 2013-08-01 2015-02-05 Wacker Chemie Ag Polyorganosiloxane preparation for optical semiconductors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420629A1 (en) * 1989-09-29 1991-04-03 Mitsui Petrochemical Industries, Ltd. Light-emitting or receiving device and method for preparing the same
JP2001085748A (en) * 1999-09-14 2001-03-30 Matsushita Electric Works Ltd Light-emitting device
WO2004021464A1 (en) * 2002-08-23 2004-03-11 Siemens Aktiengesellschaft Organic light emitting diode (oled) and/or display, method for the sealing and use thereof
EP1424363A1 (en) * 2002-11-29 2004-06-02 Shin-Etsu Chemical Co., Ltd. Silicone resin composition for led devices
JP2004231824A (en) * 2003-01-31 2004-08-19 Wacker Asahikasei Silicone Co Ltd Organopolysiloxane composition and cured product thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420629A1 (en) * 1989-09-29 1991-04-03 Mitsui Petrochemical Industries, Ltd. Light-emitting or receiving device and method for preparing the same
JP2001085748A (en) * 1999-09-14 2001-03-30 Matsushita Electric Works Ltd Light-emitting device
WO2004021464A1 (en) * 2002-08-23 2004-03-11 Siemens Aktiengesellschaft Organic light emitting diode (oled) and/or display, method for the sealing and use thereof
EP1424363A1 (en) * 2002-11-29 2004-06-02 Shin-Etsu Chemical Co., Ltd. Silicone resin composition for led devices
JP2004231824A (en) * 2003-01-31 2004-08-19 Wacker Asahikasei Silicone Co Ltd Organopolysiloxane composition and cured product thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 200460, Derwent World Patents Index; Class A26, AN 2004-618783, XP002351301 *
DATABASE WPI Section PQ Week 200172, Derwent World Patents Index; Class P85, AN 2001-619617, XP002351300 *

Also Published As

Publication number Publication date
CN101432894B (en) 2011-03-16
WO2006013066A2 (en) 2006-02-09
CN101432894A (en) 2009-05-13
JP2006049533A (en) 2006-02-16

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