WO2006011791A3 - Method for encapsulating an electronic component using a plastic object, and plastic object - Google Patents

Method for encapsulating an electronic component using a plastic object, and plastic object Download PDF

Info

Publication number
WO2006011791A3
WO2006011791A3 PCT/NL2005/000544 NL2005000544W WO2006011791A3 WO 2006011791 A3 WO2006011791 A3 WO 2006011791A3 NL 2005000544 W NL2005000544 W NL 2005000544W WO 2006011791 A3 WO2006011791 A3 WO 2006011791A3
Authority
WO
WIPO (PCT)
Prior art keywords
plastic object
electronic component
encapsulating
plastic
relates
Prior art date
Application number
PCT/NL2005/000544
Other languages
French (fr)
Other versions
WO2006011791A2 (en
Inventor
Vries Franciscus Bernardus De
Wilhelmus Gerardus Jozef Gal
Original Assignee
Fico Bv
Vries Franciscus Bernardus De
Wilhelmus Gerardus Jozef Gal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Vries Franciscus Bernardus De, Wilhelmus Gerardus Jozef Gal filed Critical Fico Bv
Priority to CN200580030617.7A priority Critical patent/CN101040373B/en
Publication of WO2006011791A2 publication Critical patent/WO2006011791A2/en
Publication of WO2006011791A3 publication Critical patent/WO2006011791A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

The invention relates to a method for encapsulating an electronic component in a mould by the processing steps of: placing the component into a mould cavity, feeding encapsulating material, and curing the encapsulating material, wherein the electronic component is shielded by an object. The invention also relates to an object
PCT/NL2005/000544 2004-07-30 2005-07-26 Method for encapsulating an electronic component using a plastic object, and plastic object WO2006011791A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200580030617.7A CN101040373B (en) 2004-07-30 2005-07-26 Method for encapsulating an electronic component using a plastic object, and plastic object

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1026749 2004-07-30
NL1026749A NL1026749C2 (en) 2004-07-30 2004-07-30 Method of enclosing an electronic component with the aid of a plastic object and a plastic object.

Publications (2)

Publication Number Publication Date
WO2006011791A2 WO2006011791A2 (en) 2006-02-02
WO2006011791A3 true WO2006011791A3 (en) 2006-09-14

Family

ID=34974386

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2005/000544 WO2006011791A2 (en) 2004-07-30 2005-07-26 Method for encapsulating an electronic component using a plastic object, and plastic object

Country Status (5)

Country Link
CN (1) CN101040373B (en)
MY (1) MY151694A (en)
NL (1) NL1026749C2 (en)
TW (1) TWI373830B (en)
WO (1) WO2006011791A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02252781A (en) * 1989-03-27 1990-10-11 Sekisui Chem Co Ltd Release liner
WO2000053682A1 (en) * 1999-03-09 2000-09-14 Minnesota Mining And Manufacturing Company Fluorine-containing releasing sheet and process of production of same
US20010016257A1 (en) * 1998-03-30 2001-08-23 3M Innovative Properties Company Semiconductor wafer processing tapes
WO2003096408A1 (en) * 2002-05-14 2003-11-20 Fico B.V. Method for encapsulating an electronic component using a foil layer
US20040018659A1 (en) * 2002-07-26 2004-01-29 Kazuhito Hosokawa Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW311927B (en) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02252781A (en) * 1989-03-27 1990-10-11 Sekisui Chem Co Ltd Release liner
US20010016257A1 (en) * 1998-03-30 2001-08-23 3M Innovative Properties Company Semiconductor wafer processing tapes
WO2000053682A1 (en) * 1999-03-09 2000-09-14 Minnesota Mining And Manufacturing Company Fluorine-containing releasing sheet and process of production of same
WO2003096408A1 (en) * 2002-05-14 2003-11-20 Fico B.V. Method for encapsulating an electronic component using a foil layer
US20040018659A1 (en) * 2002-07-26 2004-01-29 Kazuhito Hosokawa Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 582 (C - 0792) 26 December 1990 (1990-12-26) *

Also Published As

Publication number Publication date
MY151694A (en) 2014-06-30
WO2006011791A2 (en) 2006-02-02
TW200614453A (en) 2006-05-01
NL1026749C2 (en) 2005-08-19
CN101040373B (en) 2010-06-23
TWI373830B (en) 2012-10-01
CN101040373A (en) 2007-09-19

Similar Documents

Publication Publication Date Title
EP1862491A4 (en) Thermoplastic resin, method for producing same and molding material
TW200733326A (en) Method of resin sealing electronic part
TW200507042A (en) Process for fabricating electronic components using liquid injection molding
WO2009076579A3 (en) Overmolded circuit board and method
EP1759823A4 (en) Mold, method of manufacturing the same, injection molding device, and injection molding method
PL2487018T3 (en) Vented mold and method for producing molded article
WO2010056705A3 (en) Method of manufacturing co-molded inserts
WO2010101744A3 (en) Tool sleeve for mold die and method of molding parts using the same
HK1106066A1 (en) Method of forming a leaded molded array package
AU2003275819A1 (en) Molded part removing apparatus and method for an injection molding machine
EP1849573A4 (en) Method and device for feeding molten resin, and method of manufacturing molded part by using the fed molten resin
WO2008051504A3 (en) Rfid collar
EP1752272A4 (en) Mold designing method, mold, and molded piece
WO2013060568A3 (en) Method of manufacturing a coil support member and coil support member
AU2003221013A1 (en) Method for producing sintered powder molding, sintered powder molding, method for producing injection powder molding, injection powder molding and die for injection powder molding
EP1591487A4 (en) Resin composition and process for producing resin molding
MY161050A (en) Method for encapsulating electronic components with a controllable closing force
WO2008100146A3 (en) Method and device for encapsulating electronic components using underpressure
PL1563931T3 (en) Process for joining inorganic part produced by injection moulding with inorganic parts produced by another process
TW200944093A (en) Case of an electronic device and method of fabricating the same
WO2008059380A3 (en) Method of fabricating an entily and corresponding device
WO2008153336A3 (en) Case for electronic apparatus and method of manufacturing case for electronic apparatus
MY164298A (en) Method and device for encapsulating electronic components, wherein the encapsulating material is cooled
AU2003211606A1 (en) Method for producing recycled resin, and resin material containing recycled resin produced by that method
WO2008012694A3 (en) Process for making a framed electrode

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 200580030617.7

Country of ref document: CN

122 Ep: pct application non-entry in european phase