1373830 九、發明說明： 【發明所屬之技術領域】 本發明關於一種如申請專利範圍第丨項之前言部分所 述的方法。本發明也關於一種如申請專利範圍第13項之 前言部分所述的熱塑性塑膠物體。 【先前技術】 在封入通常是放在例如特別是半導體電路之載體上之 電子7C件時，兀件及/或載體的一部分可能會被保護而免受 所要安置之封入材料的傷害。此處利用依據先前技術的點 性箱片材料，其係被黏到用於封入的產品。於此’落片層 Z 乂至y在配置泊片層之前具有永久的黏性，或者黏性通 ㊉可以在配置条片之前不久藉由例如增加箔片的溫度而增 強。另-選擇是利用無黏性材料（也 : W料與—^於封人鑄模之中的產品放在1 置，：二:片材料係藉由施加的壓力而被固持在保護位 二，片材料對於要被封閉之凹入於 有阻隔效應。在封入操作之 丨刀八 的方…片處移除，而不會有產品能夠以簡單 品上的危險j 劑殘餘物留在封入產 本的缺點1二二無黏性箱片材料確實具有增加成 夠高，用二次的箱片材料畢竟的品質必須 此種落片材料是昂貴的。 &生的極&狀況下作用。 【發明内容】 用於將電子 本發明的目的是要提供-種改良的方法， 5 1373830 疋件封入鑄模及要被施加於其中的遮蓋材料之中，此方法 在使用時的成本較小而同時保有先前技術的優點。 本發明為了此目的而提供一種敘述於前言部分之方 法，其特徵在於，至少用於將可釋放物體連接至電子元件 的接觸側係在此物體與用於封入的電子元件接觸之前會被 修改，俾使鏈結係被安排於塑膠的分子鍵中。此處，塑夥 較佳為熱塑性塑谬。雖然只有數微米之很薄的表面層可能 已經足夠，此修改必須發生在物體之厚度的至少一部分 上。此外’修改必須使得在修改以前係低於封入期間發生 在鎮模中溫度之熱.塑性塑膠的熔點不再出現於發生在禱模 中之此等溫度之間的溫度範圍内。此實際上係代表了已修 改7熱塑性塑膠的熔點會增加到至少i6(rc，但是較佳為 至少Π5 C’或者修改會導致㈣完全消失。將鏈結安排 於（大★分子的）分子之間也稱為分子的交又鏈結；熔點（或 炫化範圍）之所欲的消失將藉此在這些發生於鎮模中的溫 度發生。由於在修改期間熱塑性塑膠的分子間之鏈結數目 的增加’熱塑性材料的性質係可以被影響，以便於獲得材 料之更加妖固性的杆失β从0 …U技的仃為。於是’所欲的保護係可以使用相 對為不叩貝的塑膠（與依據先前技術所施加的無黏性釋放 绪片相比’此種無黏性釋放荡片為從例如pTFE及etfe 的含氟聚合物製造）而實頊 頁現。另一優點是會產生至少一個 另夕的自由度’用於決定物體之最需要的性質。照射時期、 施加的轄射強度、輕射方向等等）。又另-選擇是改變物 體内1體的性質。此意指：例如照射小於材料之一個中 6 央網狀部分& - h t e & 的一相對長條是可能的，使得在物體邊緣的行 為在中央位置及在更被強烈照射的網狀部分處更具熱塑 另外左忍，在此申請案中，用語“電子元件”也應被 理解為由—載體連同一個或更多個連接至此載體的電子元 件所：且成的複合產品。此載體也稱為“引導框架’或 板 可以選擇以箔片層至少部分地保護實際的電子元 件及/或載體’以便於因而使得遮蓋的材料部分地保持在 無封入材料或封入材料的部分（像是被稱為像是流失封入 材料的較薄部分）之&能 ^ ^ )之狀i·'。此在封入安置於具有連續開口 之載體上的電子元祙 牛糸特別有利，此載體的一側必須在封 入程序的執行期間被遮蓋住（其例子為例如Μ 無鉛封裝）。 』：物體可以藉由允許像是7輻射形式的離子化輻射 4用在泊片層及/或藉由引導在物體處的電子束而被修 改》熱塑性塑膠猪片展人 Β 刀子，，口構的修改是藉著於熱塑膠 =大分子鏈之間安排更多鏈結（交又鏈結）而組成。額外 的鏈結將有助於在發生於鑄槿 鱗摈中的&度之溫度範圍中消除 炼點/軟化範圍。藉由允許 使用在7照射工廠中當作能 源的放射性同位素鈷60而產生的r輻射作用在落片層上， ^以U地獲传此種分子結構的修改。達成增加在塑谬分 :間之所需之鏈結數目的另一種方法係由於落片層引導一 ^ 通常在问度真空下及使用加熱 陰極而產生。當同時照射較大數量的箱片材料時，此種賴 射係因此導致每單位箔片材料 何枓之最小投入。使用離子化輻 7 1373830 射的一個優點是開始的材料可以極為簡單， 射的作用對於現有方法來說是唯一的改變。 子化輕 塑膠物體也可以藉由在物體中安置一添加物（材料) 而被修改，因而在熱塑性塑膠 ’ 卞鍵之中或之間的鐘结 是以化學方式形成。適用於此目的之材料的例子是把本形 成的物質，像是過氡化物及碎、产疋根本形 孔化物及矽烷。導致塑膠分子之間之赫 結數目增加的化學方法具有的優點是不需要使用輕射源， 且可以用一種可控制的方式產生塑膠的溶點/炫化範圍之 所須的增加或消失。 藉由在預定的時期中處理更大的數量，此等修改㈣ 以整批的方式有利地執行。於是，一落片層的修改能夠在 可以被最佳化來執行修改的—個位置處獨立於處理步驟 Α)到C)而發生。相反地，熱塑性塑膠物體的修改也可 能以連續的方式發生。在此狀況中，化學物品之輻射或添 加至物體可以藉著-較佳為精巧的“贈物（〜叫，，而 與生產機器或封入裝置一致地執行。 在一較佳變型中，修改的熱塑性塑膠物體包含一箔片 層。此洛片層適於單次或多次使用’且將箱片材料施加於 封入裝置中不需要是問題的起因。另一方面，也可以設想 出其他物體，像是較厚材料部分的形式，例如，塊狀物。 此種塊狀物特別適用於多次使用。一種可能是將塊狀物與 一封入裝置整合在.一起，使得當用於封入的元件夾在鑄模 部分之間時，塊狀物可釋放地接合在元件/元件的载體 上，不必限定在額外處理密封材料（在此狀況是塊狀物）。 8 丄川㈣ 為了以足夠的廢力將落片層壓抵住電子元件以用於封 二：：的是在處理步驟B)期間，將用於封入的電子元 . 鑄模部分之間。此等鑄模（具備至少二個可 •以相對於彼此移動的铸模部分）是大規模施加。 本發明也提供一種熱塑性塑膠物體， ::::電子元件期間，至少部分地保護電子元二 載體，其特徵為塑谬物體之至少接觸側的 大二 pe X。聚烯烴，例如聚乙烯、聚丙烯及，或 料當作二止的封 些材料衍生的共聚物與混合物，其中此等材 些材料(共一合物)也―1373830 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method as described in the preamble of the scope of the claims. The invention also relates to a thermoplastic plastic object as described in the preamble of claim 13 of the scope of the patent application. [Prior Art] When encapsulating an electronic 7C member which is usually placed on a carrier such as a semiconductor circuit in particular, a part of the member and/or the carrier may be protected from the enclosed material to be placed. Here, the point box material according to the prior art is used, which is adhered to the product for sealing. Here, the <RTI ID=0.0>>>></RTI>>''''''''''' Another-choice is to use a non-stick material (also: W material and - ^ in the product of the mold is placed in 1 set: 2: the sheet material is held in the protection position by the applied pressure, the film The material has a barrier effect on the recess to be closed. It is removed at the square of the sealing operation, and there is no product that can be left in the cost of the simple product. Disadvantages 1 22 The non-adhesive box material does have a high enough to increase the quality of the secondary box material. After all, the quality of the falling material is expensive. & The role of the raw pole & The purpose of the present invention is to provide an improved method in which the 5 1373830 element is enclosed in a mold and a covering material to be applied thereto, which is less expensive to use while retaining the previous Advantages of the Invention The present invention provides, for this purpose, a method as described in the preamble, characterized in that at least the contact side for connecting a releasable object to the electronic component is in contact with the electronic component for encapsulation. It will be modified so that the chain is arranged in the molecular bonds of the plastic. Here, the plastic is preferably a thermoplastic plastic. Although only a few micrometers of a thin surface layer may be sufficient, this modification must occur in the object. At least a portion of the thickness. Further, the modification must be such that the temperature before the modification is lower than the temperature occurring in the mold during the encapsulation. The melting point of the plastic plastic no longer occurs between the temperatures occurring in the prayer mode. In the range, this actually means that the melting point of the modified 7 thermoplastic will increase to at least i6 (rc, but preferably at least Π5 C' or the modification will cause (4) to completely disappear. Arrange the chain at (large ★ molecular The inter-molecules are also called the cross-links of the molecules; the desired disappearance of the melting point (or simplification range) will occur at these temperatures occurring in the town mold. Due to the intermolecularity of the thermoplastic during the modification The increase in the number of links 'the nature of the thermoplastic material can be affected in order to obtain a more enchanting rod loss of the material from the 0 ... U technology. So the 'protective system can be The use of relatively non-mussel plastic (compared to the non-adhesive release sheet applied according to the prior art) is made from fluoropolymers such as pTFE and etfe. Another advantage is that at least one degree of freedom 'is used to determine the most desirable properties of the object. Irradiation period, applied temperament intensity, light direction, etc.). Another option is to change the object. The nature of a body. This means that, for example, a relatively long strip of 6 central mesh portions & - hte & is less than one of the materials, so that the behavior at the edge of the object is more central and more intense. The irradiated mesh portion is more thermoplastic and otherwise left. In this application, the term "electronic component" is also to be understood to mean by the carrier together with one or more electronic components connected to the carrier: Composite product. This carrier, also referred to as a "guide frame" or plate, may optionally have at least partially protected the actual electronic component and/or carrier with a foil layer so as to thereby partially retain the material of the cover in the portion of the material that is not enclosed or enclosed ( For example, it is referred to as a thinner portion of the material that is to be enclosed, and can be used to enclose an electron element yak placed on a carrier having a continuous opening. This carrier is particularly advantageous. One side must be covered during the execution of the encapsulation procedure (examples such as Μ lead-free packages). 』: Objects can be used in the parking layer by allowing ionizing radiation 4 in the form of 7 radiation and/or by The electron beam guided at the object is modified. "The thermoplastic plastic pig piece exhibits a knife. The modification of the mouth structure is made up by arranging more links (cross links and links) between the hot plastic = macromolecular chains. The extra link will help eliminate the refining/softening range in the temperature range that occurs in the cast scale, by allowing the use of the radioisotope cobalt 60 as an energy source in a 7-illumination plant. Production The r-radiation acts on the falling layer, and the modification of the molecular structure is obtained in U. Another way to achieve the increase in the number of links required between the plastics is due to the falling layer guiding Usually produced under vacuum and using a heated cathode. When a large amount of box material is irradiated at the same time, this type of radiation system thus results in a minimum input per unit of foil material. Using ionized radiation 7 1373830 One advantage is that the starting material can be extremely simple, and the effect of the shot is the only change to the existing method. The sub-lighted plastic object can also be modified by placing an additive (material) in the object, thus being thermoplastic The bells in or between the plastic 'keys are chemically formed. An example of a material suitable for this purpose is the material formed, such as over-mash and shreds, basal pores and decane. The chemical method of increasing the number of Hex junctions between molecules has the advantage of not requiring the use of a light source, and can produce a melting point/stunning range of the plastic in a controlled manner. The addition or disappearance. By processing a larger quantity in a predetermined period of time, such modifications (4) are advantageously performed in a batch manner. Thus, a layer-by-layer modification can be performed in an optimization that can be optimized. - a position occurs independently of the processing steps Α) to C). Conversely, modifications of the thermoplastic plastic object may also occur in a continuous manner. In this case, the radiation or addition of the chemical to the object may be A finely crafted "good thing" is performed in concert with the production machine or the enclosure. In a preferred variant, the modified thermoplastic object comprises a foil layer. This layer is suitable for single or multiple The use of 'sub-use' and the application of the box material to the enclosing device need not be the cause of the problem. On the other hand, other objects, such as the form of thicker material parts, for example, blocks, are also conceivable. Such a block is particularly suitable for multiple use. One possibility is to integrate the block with the in-line device so that when the component for sealing is sandwiched between the mould parts, the block is releasably joined to the carrier of the component/component, not necessarily limited to Additional treatment of the sealing material (in this case a block). 8 丄川(四) In order to laminate the tabs against the electronic components with sufficient waste force for sealing:: during the processing step B), the electrons will be used for sealing. Between the mold parts. These molds (having at least two mold portions that can be moved relative to each other) are applied on a large scale. The present invention also provides a thermoplastic plastic object, at least partially protecting the electronic element carrier during the :::: electronic component, characterized by a second pe X of at least the contact side of the plastic object. Polyolefins, such as polyethylene, polypropylene, and copolymers and mixtures derived from these materials, of which these materials (co-compounds) are also
撑二：…。此A 聚°物（例如聚醋，像是一種聚乙埽對 二：）。相反地，此支樓層也可以從非塑膠材料形 可二^物體而言，用於釋放材料之所需性質（無點性） =物體的其他所需性質結合在-起，例如，像是機械 負載承文月匕力方面的最小需求。如果，例如是支 轴向上被強化的話，則後者可以增加。 又 在：較佳變型中，熱塑性塑膠物體是 ;:也：片材料的施加本身是已知的，且其中所需的= 裝備也可於市場上取得。要注意的是，已使用的無黏性落 9Support two: .... This A poly (such as poly vinegar, like a polyacetamidine pair two:). Conversely, this floor can also be used to release the desired properties of the material (no point) from the non-plastic material. The other desired properties of the object are combined, for example, like mechanical The minimum demand for the load of the contract. If, for example, the support is strengthened axially, the latter can be increased. Also in the preferred variant, the thermoplastic plastic object is: : Also: the application of the sheet material is known per se, and the required = equipment is also available on the market. It should be noted that the non-adhesive drop that has been used 9
丄 J / JOJVJ 片是由高級材料製造，例如 ,,.θ ^ 像疋叩貴的氟聚合物。這些 材料具有比處理溫度更高的炫 一 冷_Η_無點性。盔黏性 解為在W與基材之間至 ‘“、㈣應被理 妹1 夏買上不會發生極性的結合； 然而，除了沒有（分子）極性έ士人 灿ν τ Ό 〇以外，在無黏性材料的 狀況下，可能有所謂“阻隔” , 1且隔疋一種指示以無黏性 方式連接的材料之間發生竇皙麼 务“、 貫貝摩擦阻力的現象。阻隔的現 象也將以預定的程度發生在依墟太 依·據本發明之修改的塑膠物體 中，且甚至增強塑膠物體的良 民計在封作用。阻隔發生的程 度邛伤地依賴溫度狀況。 除了塑膠羯片材料之可能施加以外，熱塑性塑膠物體 也可以由-塑膠塊形成。此塑膠塊可以例如是形成了一封 入裝置之鑄模部分的一部分，田 丨刀因此可以再使用很多次，以 钕供所需的密封效果’而在封 八裝置的操作方面，此不會 導致更複雜的準備工作。 【實施方式】 圖1顯示許多捲的_片材料2,其被放在托板i »上，且其被載運通過-輻射源3。輻射源3由一容器4组 成，容器4中安置有鈷的放射性同位素。如果輻射源3的 作用必須被中斷，則它可以下降到一水盆$中。 -捲被輻射的塑膠領片材料6係接著被放在一封入裝 置7附近。-裝設在載體10上的電子元件"被放在封入 裝置7的鑄模部分8、9之間，使得上鑄模部分8中的— 鑄模空間12可以封閉元件u。載體1〇之遠離元件"的 側邊係停留在從捲6展開之被輻射的箱片材料13上。在 已執行封入操作之後’所轄射㈣片材料13 得—封入的電子元# 14移動於封入農置外側。—曰，使 的電子元件14連同相關載體17P6 〜封入 戟•骽17已自被輻射的箔片材姑 移除，現在使用之ϋ射的^材料15係纏繞在捲ΐ6^ 15丄 J / JOJVJ sheets are made of high-grade materials, for example, .θ^ like expensive fluoropolymers. These materials have a higher cooling temperature than the processing temperature. The viscous solution of the helmet is between the W and the substrate to the '', (4) should be the combination of the polarity of the sister-in-law 1 summer; however, except that there is no (molecular) polarity gentleman ν τ Ό 〇 , In the case of non-adhesive materials, there may be a so-called "barrier", 1 and there is a phenomenon in which a sinus sinus is caused between materials that are connected in a non-adhesive manner. The phenomenon of obstruction will also occur to a predetermined extent in the plastic object modified by Yixuyi according to the present invention, and even enhance the goodness of the plastic object. The extent to which the blockage occurs depends on the temperature. In addition to the possible application of plastic crepe materials, thermoplastic plastic objects can also be formed from - plastic blocks. The plastic block can, for example, be formed as part of a mold portion of the device, which can be reused many times to provide the desired sealing effect. Complex preparations. [Embodiment] Figure 1 shows a plurality of rolls of sheet material 2 placed on a pallet i» and carried through a radiation source 3. The radiation source 3 is composed of a container 4 in which a radioactive isotope of cobalt is placed. If the action of the radiation source 3 has to be interrupted, it can be lowered into a basin of $. - The roll of irradiated plastic collar material 6 is then placed adjacent to an incoming device 7. - The electronic component mounted on the carrier 10 is placed between the molding portions 8, 9 of the sealing device 7, so that the molding space 12 in the upper molding portion 8 can close the component u. The side of the carrier 1 away from the element' rests on the irradiated box material 13 unrolled from the roll 6. After the encapsulation operation has been performed, the enclosed (four) sheet material 13 is sealed and the electronic element # 14 is moved outside the enclosure. - 曰, the electronic component 14 together with the associated carrier 17P6 ~ enclosed 戟•骽17 has been removed from the irradiated foil sheet, and the currently used squirting material 15 is wound around the coil 6^15
圖2Α顯示一捲20輻射的熱塑性塑膠箔片材料21，。 的-部分已被展開。清楚顯示的是箔片材_ Η由m二它 料層組成。圖2B顯示-捲2Q幅射的熱塑性㈣ 23,其係由二材料層24、25組成。上材料層^係^ 疋聚乙稀製造’下_ 25係由例如是聚乙烯對笨二甲 酸醋製造。為了互相連接這些層，一非常薄而因此未：干 在圖中的黏劑層可以被塗佈在二材料層24、h之間，= 黏劑層由例如是丙烯酸膠所組成。 此 圖 U也,.》員示if過具備二個可互相移動之禱模部 分31、32之封入裝置30的剖面一模穴33係凹入上鑄 模邛刀32中安置在下鑄模部分3ι中的是一凹部μ，其 中放有-依據本發明的塑膠，鬼35。藉由放一引導框架（： 顯7Γ於圖中）於塊35上，此塊35將在封入裝置操作 期間及㈣模部分31、32 Μ閉之後突出，Μ封被放在 塊35上的引導框架，而塊35不會黏結至引導框架。 【圖式簡單說明】 將根據顯示在下列圖中的非限制性示範實施例，進一 步闡釋本發明。其中： 圖1顯示依據本發明之方法的示意圖； 圖2Α顯示依據本發明之單層箔片的例子 1373830 圖2B顯示依據本發明之多層箔片的例子；及 圖3顯示依據本發明之單材料塑膠塊的例子。 【主要元件符號說明】 1 托板 2 塑膠结片材料 3 輻射源 4 容器 5 水盆 6 塑膠箔片材料 7 封入裝置 8 鑄模部分 9 鑄模部分 10 載體 11 電子元件 12 鑄模空間 13 ί#片材料 14 封入的電子元件 15 被幸δ射的·落片材料 16 捲 17 載體 20 捲 21 熱塑性塑膠箔片材料2 1 23 熱塑性塑膠箔片材料 24 材料層 12 1373830 25 材料層 30 封入裝置 31 鑄模部分 32 鑄模部分 33 模穴 34 凹部 35 塑膠塊Figure 2A shows a roll of 20-radiated thermoplastic plastic foil material 21,. The - part has been expanded. It is clearly shown that the foil sheet _ 组成 consists of m two layers. Figure 2B shows a -roll 2Q radiation thermoplastic (tetra) 23 consisting of two material layers 24, 25. The upper material layer is made of polyethylene. The lower layer 25 is made of, for example, polyethylene to picolinic acid vinegar. In order to interconnect the layers, a very thin and therefore not: the adhesive layer in the figure can be applied between the two material layers 24, h, = the adhesive layer consists of, for example, acrylic glue. This figure U also shows that a section 33 of the sealing device 30 having two mutually movable prayer parts 31, 32 is recessed in the upper mold part 32 in the upper mold part 32. It is a recess μ in which the plastic according to the invention, Ghost 35, is placed. By placing a guide frame (: shown in the figure) on block 35, this block 35 will protrude during the operation of the enclosure and after the (4) die portions 31, 32 are closed, and the seal is placed on the block 35. Frame, while block 35 does not stick to the guide frame. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be further explained in accordance with a non-limiting exemplary embodiment shown in the following figures. 1 shows a schematic view of a method according to the invention; FIG. 2A shows an example 1373830 of a single-layer foil according to the invention; FIG. 2B shows an example of a multilayer foil according to the invention; and FIG. 3 shows a single material according to the invention. An example of a plastic block. [Description of main components] 1 Pallet 2 Plastic sheet material 3 Radiation source 4 Container 5 Basin 6 Plastic foil material 7 Encapsulation device 8 Mold part 9 Mold part 10 Carrier 11 Electronic component 12 Mold space 13 ί#片材料14 Enclosed electronic component 15 is fortunately blasted · falling film material 16 roll 17 carrier 20 roll 21 thermoplastic plastic foil material 2 1 23 thermoplastic plastic foil material 24 material layer 12 1373830 25 material layer 30 encapsulation device 31 mold part 32 mold Part 33 Cavity 34 Recess 35 Plastic Block
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