WO2006004869A3 - Heat exchange apparatus with parallel flow - Google Patents

Heat exchange apparatus with parallel flow Download PDF

Info

Publication number
WO2006004869A3
WO2006004869A3 PCT/US2005/023174 US2005023174W WO2006004869A3 WO 2006004869 A3 WO2006004869 A3 WO 2006004869A3 US 2005023174 W US2005023174 W US 2005023174W WO 2006004869 A3 WO2006004869 A3 WO 2006004869A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchange
exchange apparatus
heat exchanger
parallel flow
intake manifold
Prior art date
Application number
PCT/US2005/023174
Other languages
French (fr)
Other versions
WO2006004869A2 (en
Inventor
Nicholas J Teneketges
Tarzen Kwok
Original Assignee
Teradyne Inc
Nicholas J Teneketges
Tarzen Kwok
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc, Nicholas J Teneketges, Tarzen Kwok filed Critical Teradyne Inc
Priority to JP2007519411A priority Critical patent/JP4903139B2/en
Priority to EP05768761A priority patent/EP1779427A2/en
Publication of WO2006004869A2 publication Critical patent/WO2006004869A2/en
Publication of WO2006004869A3 publication Critical patent/WO2006004869A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Details Of Heat-Exchange And Heat-Transfer (AREA)

Abstract

In at least one embodiment, the present invention is a heat exchange apparatus which includes at least one heat exchanger, an intake manifold, and at least one multichip module. Where the intake manifold is in fluid communication with each heat exchanger and where the intake manifold is capable of providing the heat exchange medium separately to each heat exchanger. Where the each multichip module is positioned at least adjacent to at least one heat exchanger, such that heat can transfer between each multichip module and at least one heat exchanger.
PCT/US2005/023174 2004-06-30 2005-06-30 Heat exchange apparatus with parallel flow WO2006004869A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007519411A JP4903139B2 (en) 2004-06-30 2005-06-30 Parallel flow heat exchanger
EP05768761A EP1779427A2 (en) 2004-06-30 2005-06-30 Heat exchange apparatus with parallel flow

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/882,433 2004-06-30
US10/882,433 US7187549B2 (en) 2004-06-30 2004-06-30 Heat exchange apparatus with parallel flow

Publications (2)

Publication Number Publication Date
WO2006004869A2 WO2006004869A2 (en) 2006-01-12
WO2006004869A3 true WO2006004869A3 (en) 2006-06-08

Family

ID=35385364

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/023174 WO2006004869A2 (en) 2004-06-30 2005-06-30 Heat exchange apparatus with parallel flow

Country Status (6)

Country Link
US (2) US7187549B2 (en)
EP (1) EP1779427A2 (en)
JP (1) JP4903139B2 (en)
CN (1) CN100555612C (en)
SG (1) SG138621A1 (en)
WO (1) WO2006004869A2 (en)

Families Citing this family (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US20060256526A1 (en) * 2004-10-13 2006-11-16 Qnx Cooling Systems Inc. Liquid cooling system
US20060171117A1 (en) * 2004-10-13 2006-08-03 Qnx Cooling Systems, Inc. Cooling system
US7408775B2 (en) * 2004-10-19 2008-08-05 Honeywell International Inc. Electrical module and support therefor with integrated cooling
DE102004054337B4 (en) * 2004-11-09 2007-01-11 Rittal Res Electronic Systems Gmbh & Co. Kg cooling arrangement
US20060231237A1 (en) * 2005-03-21 2006-10-19 Carlos Dangelo Apparatus and method for cooling ICs using nano-rod based chip-level heat sinks
JP2006308368A (en) * 2005-04-27 2006-11-09 Hitachi Global Storage Technologies Netherlands Bv Test chamber for electronic device and testing method
US7515418B2 (en) * 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7298618B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
US7298617B2 (en) * 2005-10-25 2007-11-20 International Business Machines Corporation Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
US7365973B2 (en) 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method
AU2007207648B2 (en) * 2006-01-19 2012-06-14 American Power Conversion Corporation Cooling system and method
US8672732B2 (en) 2006-01-19 2014-03-18 Schneider Electric It Corporation Cooling system and method
US7832461B2 (en) * 2006-04-28 2010-11-16 Hewlett-Packard Development Company, L.P. Cooling systems and methods
US7511957B2 (en) * 2006-05-25 2009-03-31 International Business Machines Corporation Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
US20070291452A1 (en) * 2006-06-14 2007-12-20 Gilliland Don A Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack
US9568206B2 (en) 2006-08-15 2017-02-14 Schneider Electric It Corporation Method and apparatus for cooling
US8327656B2 (en) 2006-08-15 2012-12-11 American Power Conversion Corporation Method and apparatus for cooling
US8322155B2 (en) 2006-08-15 2012-12-04 American Power Conversion Corporation Method and apparatus for cooling
US20080093054A1 (en) * 2006-08-29 2008-04-24 Tilton Charles L Manifold for a Two-Phase Cooling System
US7285851B1 (en) 2006-09-29 2007-10-23 Teradyne, Inc. Liquid immersion cooled multichip module
US7408776B2 (en) * 2006-10-10 2008-08-05 International Business Machines Corporation Conductive heat transport cooling system and method for a multi-component electronics system
US7641101B2 (en) * 2006-10-10 2010-01-05 International Business Machines Corporation Method of assembling a cooling system for a multi-component electronics system
US7420808B2 (en) * 2006-10-10 2008-09-02 International Business Machines Corporation Liquid-based cooling system for cooling a multi-component electronics system
US7681404B2 (en) 2006-12-18 2010-03-23 American Power Conversion Corporation Modular ice storage for uninterruptible chilled water
US7751918B2 (en) * 2007-01-05 2010-07-06 International Business Machines Corporation Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates
US8425287B2 (en) 2007-01-23 2013-04-23 Schneider Electric It Corporation In-row air containment and cooling system and method
CN101755495B (en) 2007-05-15 2013-10-16 美国能量变换公司 Methods and systems for managing facility power and cooling
US7450385B1 (en) * 2007-06-15 2008-11-11 International Business Machines Corporation Liquid-based cooling apparatus for an electronics rack
US20090086432A1 (en) * 2007-09-27 2009-04-02 International Business Machines Corporation Docking station with closed loop airlfow path for facilitating cooling of an electronics rack
US9025330B2 (en) * 2007-09-30 2015-05-05 Alcatel Lucent Recirculating gas rack cooling architecture
US7757506B2 (en) * 2007-11-19 2010-07-20 International Business Machines Corporation System and method for facilitating cooling of a liquid-cooled electronics rack
US8387249B2 (en) * 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US8351200B2 (en) * 2007-11-19 2013-01-08 International Business Machines Corporation Convergence of air water cooling of an electronics rack and a computer room in a single unit
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US8701746B2 (en) 2008-03-13 2014-04-22 Schneider Electric It Corporation Optically detected liquid depth information in a climate control unit
US7898799B2 (en) * 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US7508676B1 (en) * 2008-04-11 2009-03-24 International Business Machines Corporation Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
JP5412511B2 (en) * 2008-06-18 2014-02-12 ブルサ エレクトロニック アーゲー Cooling device for electronic elements
US7639499B1 (en) * 2008-07-07 2009-12-29 International Business Machines Corporation Liquid cooling apparatus and method for facilitating cooling of an electronics system
JP2010091438A (en) * 2008-10-09 2010-04-22 Yokogawa Electric Corp Semiconductor testing apparatus
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) * 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US7885070B2 (en) 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US8209056B2 (en) 2008-11-25 2012-06-26 American Power Conversion Corporation System and method for assessing and managing data center airflow and energy usage
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
US9811097B2 (en) * 2009-04-16 2017-11-07 Darpa Environmental control of liquid cooled electronics
FI20095436A (en) * 2009-04-21 2010-10-22 Abb Oy Electric power
US8219362B2 (en) 2009-05-08 2012-07-10 American Power Conversion Corporation System and method for arranging equipment in a data center
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
WO2010130993A2 (en) * 2009-05-12 2010-11-18 Iceotope Limited Cooled electronic system
CN101902895A (en) * 2009-05-27 2010-12-01 鸿富锦精密工业（深圳）有限公司 Cooling system
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
US7907406B1 (en) 2009-09-28 2011-03-15 International Business Machines Corporation System and method for standby mode cooling of a liquid-cooled electronics rack
JP5651972B2 (en) * 2010-03-17 2015-01-14 富士電機株式会社 Stack structure of water-cooled semiconductor cooling unit
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
EP2407228B1 (en) * 2010-07-14 2016-09-07 General Electric Technology GmbH Gas cleaning unit and method for cleaning gas
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US8274790B2 (en) 2010-11-16 2012-09-25 International Business Machines Corporation Automatically reconfigurable liquid-cooling apparatus for an electronics rack
US8514575B2 (en) 2010-11-16 2013-08-20 International Business Machines Corporation Multimodal cooling apparatus for an electronic system
TWI404904B (en) * 2010-11-19 2013-08-11 Inventec Corp Separable liquid-cooling heat-dissipation module
CN102478931A (en) * 2010-11-23 2012-05-30 英业达股份有限公司 Detachable liquid cooling heat dissipation module
US8688413B2 (en) 2010-12-30 2014-04-01 Christopher M. Healey System and method for sequential placement of cooling resources within data center layouts
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US9874413B2 (en) 2011-05-25 2018-01-23 International Business Machines Corporation Data center with dual radiator cabinets for redundant operation
US9854715B2 (en) 2011-06-27 2017-12-26 Ebullient, Inc. Flexible two-phase cooling system
TWI445289B (en) * 2011-08-19 2014-07-11 Inventec Corp Coolant pipe of sever rack
TW201311127A (en) * 2011-08-30 2013-03-01 Hon Hai Prec Ind Co Ltd Airflow guiding hood
US9326430B2 (en) * 2011-10-26 2016-04-26 Hewlett Packard Enterprise Development Lp Device for cooling an electronic component in a data center
US8817474B2 (en) 2011-10-31 2014-08-26 International Business Machines Corporation Multi-rack assembly with shared cooling unit
US8760863B2 (en) 2011-10-31 2014-06-24 International Business Machines Corporation Multi-rack assembly with shared cooling apparatus
JP5729261B2 (en) * 2011-11-04 2015-06-03 トヨタ自動車株式会社 Power module
US9295182B2 (en) 2011-11-14 2016-03-22 International Business Machines Corporation Dual coil with adapter to move between redundant and non-redundant high performance heat exchanger
US9830410B2 (en) 2011-12-22 2017-11-28 Schneider Electric It Corporation System and method for prediction of temperature values in an electronics system
CN104137105B (en) 2011-12-22 2017-07-11 施耐德电气It公司 Impact analysis on temporal event to the temperature in data center
US10123464B2 (en) 2012-02-09 2018-11-06 Hewlett Packard Enterprise Development Lp Heat dissipating system
US9472487B2 (en) * 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US20130267160A1 (en) * 2012-04-09 2013-10-10 Chun Long Technology Co., Ltd. Air distribution structure of industrial cabinet
KR101457937B1 (en) * 2012-04-24 2014-11-07 이청종 Oil cooling system and method for server
JP6003423B2 (en) * 2012-09-07 2016-10-05 富士通株式会社 Cooling unit and electronic device
DE202012008739U1 (en) * 2012-09-12 2013-12-16 Abb Technology Ag Cooling circuit with sufficiently tight heat exchanger
US8925333B2 (en) 2012-09-13 2015-01-06 International Business Machines Corporation Thermoelectric-enhanced air and liquid cooling of an electronic system
WO2014051604A1 (en) 2012-09-28 2014-04-03 Hewlett-Packard Development Company, L.P. Cooling assembly
US9261311B2 (en) * 2012-12-27 2016-02-16 Teradyne, Inc. Test system having liquid containment chambers over connectors
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
CN104919914B (en) 2013-01-31 2017-10-27 慧与发展有限责任合伙企业 Component, system and the method for removing heat for providing liquid cooling
US9449895B2 (en) * 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
US9526191B2 (en) * 2013-05-15 2016-12-20 Dy 4 Systems Inc. Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module
DE102013010088A1 (en) * 2013-06-18 2014-12-18 VENSYS Elektrotechnik GmbH Cooling device for a power converter module
US9736967B2 (en) * 2013-08-07 2017-08-15 Abb S.P.A. Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
CN103487739A (en) * 2013-09-27 2014-01-01 昆山迈致治具科技有限公司 PCB performance detection jig with heat dissipation function and impurity removal function
US10201116B1 (en) * 2013-12-02 2019-02-05 Amazon Technologies, Inc. Cooling system for data center rack
US9439322B1 (en) * 2014-01-09 2016-09-06 Nautilus Data Technologies, Inc. Modular data center deployment method and system for waterborne data center vessels
US10405650B2 (en) * 2014-01-16 2019-09-10 Bi-Polar Holdings Company, LLC Heating and cooling system for a food storage cabinet
JP6318668B2 (en) * 2014-02-10 2018-05-09 日産自動車株式会社 Semiconductor device
KR20150111422A (en) * 2014-03-21 2015-10-06 엘에스산전 주식회사 Electronic component case for a vehicle
US9490188B2 (en) * 2014-09-12 2016-11-08 International Business Machines Corporation Compute intensive module packaging
US10576589B2 (en) 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
US9861012B2 (en) 2014-10-21 2018-01-02 International Business Machines Corporation Multifunction coolant manifold structures
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US10184699B2 (en) 2014-10-27 2019-01-22 Ebullient, Inc. Fluid distribution unit for two-phase cooling system
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US20160120065A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Manifold for a cooling system
US9721870B2 (en) 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards
FR3030708B1 (en) * 2014-12-22 2018-02-16 Airbus Operations Sas COLD PLATE, IN PARTICULAR A STRUCTURAL PART OF A HEAT-GENERATING COMPONENT EQUIPMENT
WO2016133492A1 (en) * 2015-02-17 2016-08-25 Hewlett Packard Enterprise Development Lp Fluid manifold
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
US9655281B2 (en) * 2015-06-26 2017-05-16 Seagate Technology Llc Modular cooling system
JP6426595B2 (en) * 2015-12-24 2018-11-21 Ｎｅｃプラットフォームズ株式会社 Cooling system
DE102016109280A1 (en) * 2016-05-20 2017-11-23 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Cooling device for cooling electronic components
JP6717080B2 (en) * 2016-06-30 2020-07-01 富士通株式会社 Information processing device and cooling unit
JP6907592B2 (en) 2017-02-28 2021-07-21 富士通株式会社 Cooling system and electronic equipment system
CN107124853A (en) * 2017-05-17 2017-09-01 加弘科技咨询(上海)有限公司 Liquid cooling apparatus and its electronic equipment of application
US10349560B2 (en) * 2017-10-19 2019-07-09 Hewlett Packard Enterprise Development Lp Cooling module
US11145570B2 (en) * 2017-12-29 2021-10-12 Celestica Technology Consultancy (Shanghai) Co. Ltd Closed loop liquid cooler and electronic device using the same
US10667437B2 (en) * 2018-04-12 2020-05-26 Baidu Usa Llc Liquid distribution unit design for liquid cooling of electronic racks of a data center
TWI684743B (en) * 2019-01-04 2020-02-11 雙鴻科技股份有限公司 Rotatable water cooling tube and electronic device having the same
CN109637989B (en) * 2019-01-30 2020-08-14 大禹电气科技股份有限公司 Parallel pipeline liquid cooling radiator for radiating high-power IGBT
JP6930794B2 (en) * 2019-11-13 2021-09-01 Ｎｅｃプラットフォームズ株式会社 Cooling system, electronic equipment
JP7156706B2 (en) * 2019-11-13 2022-10-19 Ｎｅｃプラットフォームズ株式会社 Cooling system, electronics
CN112954949B (en) * 2019-12-10 2024-05-03 台达电子工业股份有限公司 Network equipment power supply and heat dissipation system for network equipment power supply
DE102019135101A1 (en) * 2019-12-19 2021-06-24 Interplex NAS Electronics GmbH Cooling device for cooling a large number of electronic components which are arranged on a circuit board and emit heat, and a system comprising the cooling device
JP7501257B2 (en) 2020-09-09 2024-06-18 富士通株式会社 Cooling device, electronic device, and cooling method
US20220276008A1 (en) * 2021-02-26 2022-09-01 Teradyne, Inc. Thermal plate having a fluid channel
US11864305B2 (en) * 2021-09-14 2024-01-02 Baidu Usa Llc Connector module with mobile plate for servers
US20240130088A1 (en) * 2022-10-13 2024-04-18 Polinke International Co., Ltd. Fluid cooling system for computer cabinets

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1491570A (en) * 1975-10-18 1977-11-09 Amp Inc Fluid cooling systems for electrical components
GB1517650A (en) * 1975-07-02 1978-07-12 Honeywell Inf Systems Cooling of electronic devices
US5218515A (en) * 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5871042A (en) * 1997-11-04 1999-02-16 Teradyne, Inc. Liquid cooling apparatus for use with electronic equipment
US20040189280A1 (en) * 2003-03-24 2004-09-30 Ray Mirkhani Hybrid cooling system for automatic test equipment

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3917370A (en) * 1974-08-29 1975-11-04 Amp Inc Interconnect device for use in closed fluid circulating systems
US4698728A (en) * 1986-10-14 1987-10-06 Unisys Corporation Leak tolerant liquid cooling system
JPH0714020B2 (en) * 1987-02-04 1995-02-15 株式会社日立製作所 Electronic device cooling method
JPS6484700A (en) * 1987-09-28 1989-03-29 Hitachi Ltd Electronic computer
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
JPH03208365A (en) * 1990-01-10 1991-09-11 Hitachi Ltd Cooling mechanism for electronic device and usage thereof
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
JPH0563385A (en) * 1991-08-30 1993-03-12 Hitachi Ltd Electronic apparatus and computer provided with heat pipe
JPH0595064A (en) * 1991-10-01 1993-04-16 Hitachi Ltd Semiconductor cooling device
US5477160A (en) * 1992-08-12 1995-12-19 Fujitsu Limited Module test card
JP2500757B2 (en) * 1993-06-21 1996-05-29 日本電気株式会社 Integrated circuit cooling structure
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor
US5441102A (en) * 1994-01-26 1995-08-15 Sun Microsystems, Inc. Heat exchanger for electronic equipment
JP3506166B2 (en) * 1996-04-15 2004-03-15 株式会社デンソー Cooling system
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
US6282675B1 (en) * 1997-08-06 2001-08-28 Macronix International Co., Ltd. Fault-tolerant architecture for in-circuit programming
US5823005A (en) * 1997-01-03 1998-10-20 Ncr Corporation Focused air cooling employing a dedicated chiller
JP3495224B2 (en) * 1997-06-06 2004-02-09 アルプス電気株式会社 Magnetic head device and method of manufacturing the same
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6042388A (en) * 1999-01-19 2000-03-28 Unisys Corporation Electromechanical module having a thin springy plate for establishing pressed electrical connections
US6198630B1 (en) * 1999-01-20 2001-03-06 Hewlett-Packard Company Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
US6208510B1 (en) * 1999-07-23 2001-03-27 Teradyne, Inc. Integrated test cell cooling system
JP2001053205A (en) * 1999-08-05 2001-02-23 Hitachi Ltd Sealing and cooling device for multichip module
US6212074B1 (en) * 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
US6519955B2 (en) * 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6888720B2 (en) * 2002-06-18 2005-05-03 Sun Microsystems, Inc. Distributed graphitic foam heat exchanger system
JP3725106B2 (en) * 2002-08-30 2005-12-07 株式会社東芝 Electronics
US6714412B1 (en) * 2002-09-13 2004-03-30 International Business Machines Corporation Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
JP4199018B2 (en) * 2003-02-14 2008-12-17 株式会社日立製作所 Rack mount server system
US6724629B1 (en) * 2003-04-29 2004-04-20 Hewlett-Packard Development Company, L.P. Leaf spring load plate with retained linear cam slide
US6930884B2 (en) * 2003-06-11 2005-08-16 Hewlett-Packard Development Company, L.P. Land grid array assembly using a compressive liquid
US20050067147A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Loop thermosyphon for cooling semiconductors during burn-in testing
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
US7031162B2 (en) * 2003-09-26 2006-04-18 International Business Machines Corporation Method and structure for cooling a dual chip module with one high power chip
JP4371210B2 (en) * 2003-12-05 2009-11-25 日本電気株式会社 Electronic unit and heat dissipation structure
US20050128705A1 (en) * 2003-12-16 2005-06-16 International Business Machines Corporation Composite cold plate assembly
US7342789B2 (en) * 2005-06-30 2008-03-11 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
JP2007066480A (en) * 2005-09-02 2007-03-15 Hitachi Ltd Disk array device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1517650A (en) * 1975-07-02 1978-07-12 Honeywell Inf Systems Cooling of electronic devices
GB1491570A (en) * 1975-10-18 1977-11-09 Amp Inc Fluid cooling systems for electrical components
US5218515A (en) * 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5871042A (en) * 1997-11-04 1999-02-16 Teradyne, Inc. Liquid cooling apparatus for use with electronic equipment
US20040189280A1 (en) * 2003-03-24 2004-09-30 Ray Mirkhani Hybrid cooling system for automatic test equipment

Also Published As

Publication number Publication date
US20060002086A1 (en) 2006-01-05
JP2008509542A (en) 2008-03-27
EP1779427A2 (en) 2007-05-02
US7187549B2 (en) 2007-03-06
WO2006004869A2 (en) 2006-01-12
JP4903139B2 (en) 2012-03-28
SG138621A1 (en) 2008-01-28
CN100555612C (en) 2009-10-28
US20070159797A1 (en) 2007-07-12
CN101010801A (en) 2007-08-01

Similar Documents

Publication Publication Date Title
WO2006004869A3 (en) Heat exchange apparatus with parallel flow
EP1136782A4 (en) Plate type heat exchanger and method of manufacturing the heat exchanger
SE0500816L (en) plate heat exchangers
WO2006052317A3 (en) Liquid cold plate heat exchanger
WO2004042303A3 (en) Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
MY155988A (en) Port opening of heat exchanger
WO2006111941A3 (en) High efficiency fluid heat exchanger and method of manufacture
DE60331685D1 (en) DUPLEX EVAPORATION AGAINST HEAT EXCHANGE
TW200714196A (en) Systems for integrated cold plate and heat spreader
WO2006006170A3 (en) Heat-exchanger device and cooling sysatem
TW200727121A (en) Multi-element heat exchange assemblies and methods of fabrication for a cooling system
WO2004074755A3 (en) Three-fluid evaporative exchanger
WO2006042190A3 (en) Air-conditioning and heating system utilizing thermo-electric solid state devices
SG142246A1 (en) Hybrid heat exchanger
WO2005114061A3 (en) Electrokinetic pump driven heat transfer system
EP2299228A3 (en) Apparatus and method for equalizing hot fluid exit plane plate temperatures in heat exchangers
WO2006083449A3 (en) Heat exchanger with fluid expansion in header
PL1929232T3 (en) Stacked-plate heat exchanger, in particular charge-air cooler
MY147233A (en) Heat exchanger design for natural gas liquefaction
TW200519347A (en) Plate heat exchanger
WO2007114913A3 (en) Multi device cooling
WO2008029185A3 (en) Heat exchanger
WO2008054199A3 (en) Method for coupling two adjacent heat exchangers and coupling unit for use therein
HK1092865A1 (en) A plate-type heat exchanger
DE60232731D1 (en) MICROELECTRONIC SYSTEM WITH INTEGRATED CRYSTATIC COOLER

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2007519411

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

WWE Wipo information: entry into national phase

Ref document number: 2005768761

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200580029138.3

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2005768761

Country of ref document: EP