WO2005101940A2 - Boitier de reception de cartes electroniques - Google Patents
Boitier de reception de cartes electroniques Download PDFInfo
- Publication number
- WO2005101940A2 WO2005101940A2 PCT/FR2005/000812 FR2005000812W WO2005101940A2 WO 2005101940 A2 WO2005101940 A2 WO 2005101940A2 FR 2005000812 W FR2005000812 W FR 2005000812W WO 2005101940 A2 WO2005101940 A2 WO 2005101940A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- ribs
- series
- electronic cards
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Definitions
- the present invention relates to a housing for receiving electronic cards comprising at least one component generating heat such as an electronic power component (bone).
- a housing for receiving electronic cards comprising at least one component generating heat such as an electronic power component (bone).
- the bottom of the housing in line with the part in front of which the electronic component is positioned, a range on which a layer of resin is deposited allowing to facilitate the heat exchange between the interior and the exterior of the housing .
- the housings are generally made of molded plastic. It sometimes happens that the architecture of the electronic card has to be changed so that the component (s) generating heat are no longer placed in the same place, which requires manufacturing a new housing, the bottom of which is arranged according to the new architecture.
- the present invention aims to provide a housing which can adapt to all the architectures of electronic cards.
- the box according to the invention is intended for the reception of electronic cards comprising at least one component generating heat and of the type comprising side walls and a bottom, said box being characterized in that the bottom comprises series of ribs providing spaces between them for receiving, placement corresponding to the position of the component generating heat, a resin intended to facilitate the heat exchange between the interior and exterior of the housing. Thanks to this arrangement, depending on the location of the components generating heat, the corresponding boxes are filled without the housing undergoing modifications. According to a constructive detail, the housing has a generally rectangular shape and comprises, on its bottom, a first series of ribs parallel to the longitudinal sides and a second series of ribs parallel to the transverse sides.
- Figure 1 is a perspective view of a housing according to the invention.
- Figure 2 is also a perspective view of the housing according to the invention.
- Figure 4 is a sectional view along line 4-4 of Figure 3.
- FIG. 1 there is shown a housing 1 having a generally parallelepiped shape with two longitudinal sides 2 and 3, two transverse sides 4 and 5 and a bottom 6. On the bottom 6 extends a first series of ribs 7 parallel to each other and parallel to the long sides 2 and 3, the ribs being equidistant from each other.
- a second series of ribs 8 parallel to each other and to the transverse sides 4 and 5, said ribs 8 being equidistant.
- the ribs 7 and 8 delimit between them rectangular boxes 9.
- the housing 1 is intended to receive an electronic card 10 comprising electronic power components 11.
- the housing 1 is made of molded plastic and can be closed off with a cover or optionally with a layer of plastic.
- the boxes 9 are filled with a resin 13 which makes it possible to promote the heat exchange between the housing and the exterior (see FIGS. 2 and 4).
- the corresponding boxes 9 can be filled with resin.
- the boxes filled with resin may exceed the dimensions of said component.
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0403588 | 2004-04-06 | ||
FR0403588A FR2868662B1 (fr) | 2004-04-06 | 2004-04-06 | Boitier de reception de cartes electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005101940A2 true WO2005101940A2 (fr) | 2005-10-27 |
WO2005101940A3 WO2005101940A3 (fr) | 2006-01-12 |
Family
ID=34944407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2005/000812 WO2005101940A2 (fr) | 2004-04-06 | 2005-04-04 | Boitier de reception de cartes electroniques |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2868662B1 (fr) |
WO (1) | WO2005101940A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3358924A1 (fr) * | 2017-02-01 | 2018-08-08 | Thomson Licensing | Appareil de fourniture d'une interface thermique |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1365877A (en) * | 1971-10-19 | 1974-09-04 | Sperry Rand Ltd | Electronic circuit assemblies |
DE2345626A1 (de) * | 1973-09-10 | 1975-03-20 | Siemens Ag | Einrichtung zum kuehlen elektronischer geraete |
US4520426A (en) * | 1982-12-21 | 1985-05-28 | Siemens Aktiengesellschaft | Cooling subrack for logic cards |
US5706171A (en) * | 1995-11-20 | 1998-01-06 | International Business Machines Corporation | Flat plate cooling using a thermal paste retainer |
-
2004
- 2004-04-06 FR FR0403588A patent/FR2868662B1/fr not_active Expired - Fee Related
-
2005
- 2005-04-04 WO PCT/FR2005/000812 patent/WO2005101940A2/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1365877A (en) * | 1971-10-19 | 1974-09-04 | Sperry Rand Ltd | Electronic circuit assemblies |
DE2345626A1 (de) * | 1973-09-10 | 1975-03-20 | Siemens Ag | Einrichtung zum kuehlen elektronischer geraete |
US4520426A (en) * | 1982-12-21 | 1985-05-28 | Siemens Aktiengesellschaft | Cooling subrack for logic cards |
US5706171A (en) * | 1995-11-20 | 1998-01-06 | International Business Machines Corporation | Flat plate cooling using a thermal paste retainer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3358924A1 (fr) * | 2017-02-01 | 2018-08-08 | Thomson Licensing | Appareil de fourniture d'une interface thermique |
Also Published As
Publication number | Publication date |
---|---|
FR2868662A1 (fr) | 2005-10-07 |
FR2868662B1 (fr) | 2006-06-23 |
WO2005101940A3 (fr) | 2006-01-12 |
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