FR2868662B1 - Boitier de reception de cartes electroniques - Google Patents
Boitier de reception de cartes electroniquesInfo
- Publication number
- FR2868662B1 FR2868662B1 FR0403588A FR0403588A FR2868662B1 FR 2868662 B1 FR2868662 B1 FR 2868662B1 FR 0403588 A FR0403588 A FR 0403588A FR 0403588 A FR0403588 A FR 0403588A FR 2868662 B1 FR2868662 B1 FR 2868662B1
- Authority
- FR
- France
- Prior art keywords
- box
- electronic cards
- receiving electronic
- receiving
- cards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0403588A FR2868662B1 (fr) | 2004-04-06 | 2004-04-06 | Boitier de reception de cartes electroniques |
PCT/FR2005/000812 WO2005101940A2 (fr) | 2004-04-06 | 2005-04-04 | Boitier de reception de cartes electroniques |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0403588A FR2868662B1 (fr) | 2004-04-06 | 2004-04-06 | Boitier de reception de cartes electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2868662A1 FR2868662A1 (fr) | 2005-10-07 |
FR2868662B1 true FR2868662B1 (fr) | 2006-06-23 |
Family
ID=34944407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0403588A Expired - Fee Related FR2868662B1 (fr) | 2004-04-06 | 2004-04-06 | Boitier de reception de cartes electroniques |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2868662B1 (fr) |
WO (1) | WO2005101940A2 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180220522A1 (en) * | 2017-02-01 | 2018-08-02 | Thomson Licensing | Apparatus providing a thermal interface |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1365877A (en) * | 1971-10-19 | 1974-09-04 | Sperry Rand Ltd | Electronic circuit assemblies |
DE2345626C3 (de) * | 1973-09-10 | 1978-05-24 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Einrichtung zum Kühlen elektronischer Geräte |
ATE26520T1 (de) * | 1982-12-21 | 1987-04-15 | Siemens Ag | Baugruppentraeger. |
US5706171A (en) * | 1995-11-20 | 1998-01-06 | International Business Machines Corporation | Flat plate cooling using a thermal paste retainer |
-
2004
- 2004-04-06 FR FR0403588A patent/FR2868662B1/fr not_active Expired - Fee Related
-
2005
- 2005-04-04 WO PCT/FR2005/000812 patent/WO2005101940A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2005101940A2 (fr) | 2005-10-27 |
WO2005101940A3 (fr) | 2006-01-12 |
FR2868662A1 (fr) | 2005-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20091231 |