WO2005098971A1 - A light emitting diode device, a light emitting diode dispersing heat device and an illuminating apparatus in which including aforesaid device - Google Patents

A light emitting diode device, a light emitting diode dispersing heat device and an illuminating apparatus in which including aforesaid device Download PDF

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Publication number
WO2005098971A1
WO2005098971A1 PCT/CN2005/000460 CN2005000460W WO2005098971A1 WO 2005098971 A1 WO2005098971 A1 WO 2005098971A1 CN 2005000460 W CN2005000460 W CN 2005000460W WO 2005098971 A1 WO2005098971 A1 WO 2005098971A1
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Prior art keywords
emitting diode
light emitting
heat
light
heat sink
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PCT/CN2005/000460
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French (fr)
Chinese (zh)
Inventor
Yu-Chao Wu
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Yu-Chao Wu
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Publication of WO2005098971A1 publication Critical patent/WO2005098971A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • Light emitting diode device light emitting diode heat sink, and lighting device including the same
  • the present invention relates to a light emitting diode device, and more particularly, to a light emitting diode device having a heat dissipation structure.
  • Light Emitting Diode (LED for short) has the advantages of high brightness, small size, light weight, not easy to break, low power consumption and long life. Therefore, it is widely used in various display products.
  • the light emitting principle is as follows : Applying a voltage to the diode drives the electrons in the diode to combine with the holes and further generates light.
  • a general commercial light-emitting diode 10 please refer to FIG. 1, which has a light-emitting diode chip 11 placed on a lead frame 14, and the light-emitting diode chip 11 is electrically connected to the lead frame 14 by a lead 12.
  • the light-emitting diode 10 further includes a packaging material 13 covering the light-emitting diode chip 11 and the lead frame 14 and exposing pins 15 for protecting the light-emitting diode chip 11 and the lead 12.
  • the light emitting diode is called a cold light source, since the wafer emits some energy while converting into heat, the temperature of the central light emitting layer can reach about 400 degrees.
  • the packaging material used to package the diode is usually a resin compound with a thermal insulation effect, and its thermal conductivity is not good. Therefore, the heat cannot be conducted upward by the epoxy resin and dissipated to the air. It can only be conducted slowly by the wire. .
  • the packaging material 13 covering the light emitting diode 10 When the heat accumulation in the light emitting diode 10 is too high, it is easy for the packaging material 13 covering the light emitting diode 10 to have different degrees of expansion due to different heat, resulting in the lead frame 14 and the packaging material. There is a gap between 13 and it is easy for air or moisture to infiltrate and affect the use and shorten the life. In severe cases, the solder joints or wires 12 may fall off.
  • a light emitting diode device array 50 is shown, which is a further application of the light emitting diode.
  • the light emitting diode device array 50 includes a plurality of light emitting diodes 10 adhered to a substrate 60 in the form of a high-density array. Because its heat source is more concentrated, the above-mentioned phenomenon of deterioration of the LED grains due to heat is caused in the light emitting diode device array 50 More obvious.
  • the most successful example is the Luxeon® light emitting diode 100 from the American company LumiLeds. Please refer to FIG. 3, which specifically uses a large-area metal base 110 and uses an aluminum substrate 130 as a heat sink to generate the wafer 120.
  • the heat transmitted to the air requires only 18 pieces which can be equivalent to the brightness of 100 traditional LEDs.
  • the operating current of the light-emitting diode 100 is limited to about 20 mA at an appropriate operating temperature, and has not been widely adopted due to the high production cost.
  • an object of the present invention is to provide a light emitting diode device with a heat dissipation structure, which includes a heat conductor, and the heat conductor is a heat dissipation column or a heat dissipation base.
  • a heat conductor is a heat dissipation column or a heat dissipation base.
  • one end of the heat conductor is used as a bearing seat of the LED chip, and the other end of the heat conductor is directly extended to a heat dissipation body, and the heat dissipation body is a high-efficiency cooling cavity.
  • the heat generated when the light emitting diode die emits light can be quickly transferred to the outside of the light emitting diode die through the heat conductor and the heat dissipation body. In this way, even if the light emitting diode is further improved Operating current to improve the brightness, the LED light emitting grains can still be pushed at a suitable operating temperature, which effectively prevents the phenomenon of grain degradation.
  • Another object of the present invention is to provide a light emitting diode heat dissipation device, which combines one or more light emitting diode devices and one or more cooling liquid supply devices to form a liquid-cooled circulating heat dissipation device, which can more effectively improve light emitting diodes.
  • the problem of heat dissipation is to provide a light emitting diode heat dissipation device, which combines one or more light emitting diode devices and one or more cooling liquid supply devices to form a liquid-cooled circulating heat dissipation device, which can more effectively improve light emitting diodes.
  • Another object of the present invention is to provide a lighting device with high light emitting efficiency, wherein the lighting device includes the light emitting diode device with a heat dissipation structure according to the present invention.
  • a light emitting diode device with a heat dissipation structure includes: a heat dissipation body having an open end; a substrate disposed on the heat dissipation body and having a first surface and A second surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one The heat conductor is disposed on the substrate in a manner penetrating the substrate, and the heat conductor has an extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and at least one light emitting diode die is disposed on the substrate.
  • the heat-carrying body is on a bearing portion.
  • the light emitting diode device having a heat dissipation structure is It can also cover the tongue: a heat-dissipating body with an opening; a bearing seat disposed on the heat-dissipating body, having a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface And the abutment is in contact with the opening of the heat dissipation body, and an empty space is formed between the second surface and the heat dissipation body; at least one light emitting diode die is disposed on the first surface of the bearing base, and a cooling: filling In the cavity.
  • the present invention provides a light emitting diode heat dissipating device.
  • the light emitting diode dissipating device includes: one or more cooling liquid supply devices; and one or more light emitting diode devices having a heat dissipating structure having the heat dissipating structure.
  • the light emitting diode device is in communication with the cooling liquid supply device.
  • the light-emitting diode devices having a heat-dissipating structure each include: a heat-dissipating body having an open end and communicating with the cooling liquid supply device; a substrate disposed on the heat-dissipating body having a first surface and a second A surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat sink body, and a first cavity is formed between the second surface and the heat sink, wherein the cooling liquid is supplied
  • the device supplies a cooling liquid into the first cavity; at least one heat conductor is disposed on the substrate in a manner penetrating the substrate, and the conductor has an extension portion and a bearing portion, wherein the extension portion is located in the The first cavity; and at least one light emitting diode die are disposed on the bearing portion of the thermal conductor.
  • the light-emitting diode device having a heat-dissipating structure wherein the plurality of light-emitting diode devices having a heat-dissipating structure utilize at least one circulation pipeline and the cooling coil supply device (various types of water tanks, buckets, water tanks, and steam) , Locomotive cooling water tank).
  • the cooling liquid supply is arranged as a cooling liquid tank containing a pressure pump or an injection type cooling liquid tank, and can also be a closed type self-circulation without external power caused by pressurized kinetic energy caused only by heat energy absorbed by the cooling liquid. system.
  • the present invention provides a lighting device.
  • the lighting device includes: a control unit; and at least one light emitting diode device having a heat dissipation structure, which is electrically connected to the control unit.
  • the light emitting diode device with a heat dissipation structure includes: a heat dissipation body having an open end; a substrate disposed on the heat dissipation body, having a first surface and a second surface, wherein the second surface is located at On the opposite side of the first surface, JL is in abutment with the open end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one heat conductor is disposed in a manner penetrating the substrate.
  • the heating body has an extending portion and a supporting portion, wherein the extending portion is located in the first cavity; and at least one light emitting diode die is arranged on the supporting portion of the thermal conductor, wherein the The control unit turns on or off the LED chip.
  • the present invention provides a light emitting diode heat sink, including: a cooling liquid tank; and at least one light emitting diode device in communication with the cooling liquid tank; wherein the light emitting diode device includes: a heat sink The body has an opening; a bearing seat is disposed on the heat dissipating body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and is in contact with the opening of the heat dissipating body; Then, a cavity is formed between the second watch and the heat-dissipating body; at least one light emitting diode die is disposed on the first surface of the socket; and a cooling is filled in the cavity.
  • the light emitting diode device with a heat dissipation structure according to the present invention may further include a cooling liquid filled in the cavity.
  • at least a part of the extension of the heat conductor may be in contact with the cooling liquid.
  • the light emitting diode device with a heat dissipation structure according to the present invention may further include a lens formed on the first surface, wherein the lens and the first surface form a second cavity, and The second cavity includes at least one LED chip.
  • the light-emitting diode device with a heat-dissipating structure according to the present invention further includes a predetermined printing, high-thickness, high-conductivity pattern coated with pure silver or pure copper, formed on the first surface of the substrate and emitting light.
  • the diode is electrically connected.
  • FIG. 1 is a schematic cross-sectional structure diagram of a conventional light emitting diode device.
  • FIG. 2 is a view showing a conventional light emitting diode device array.
  • FIG. 3 is a schematic cross-sectional structure diagram of a conventional light emitting diode device with a heat dissipation structure.
  • 4a to 41 are schematic cross-sectional structural diagrams of a light emitting diode device according to the preferred embodiment of the present invention.
  • 5a to 5h are schematic diagrams showing the relative relationship between the heat dissipation column and the substrate of the light emitting diode device according to the present invention. Sectional view.
  • FIGS. 6a to 6y are cross-sectional views of the heat dissipation body with a geometric shape described in FIGS. 6a to 6y.
  • FIG. 8 is a three-dimensional assembly view of the array-type light-emitting diode device according to the first embodiment of the present invention.
  • FIG. 9a and FIG. 9b illustrate the steps of fixing the LED chip on the bearing surface of the heat dissipation column according to Embodiment 1 of the present invention.
  • FIG. 10 is a three-dimensional assembly diagram of the array J type LED device according to the second embodiment of the present invention.
  • Fig. 11a shows a block diagram of a light emitting diode heat sink according to a preferred embodiment of the present invention.
  • Figure lib shows a perspective view of a light emitting diode heat sink according to a preferred embodiment of the present invention.
  • FIG. 12 is a block diagram of a display device according to a preferred embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a display device according to a preferred embodiment of the present invention.
  • FIG. 14 is a schematic perspective view of a vehicle light system according to a preferred embodiment of the present invention.
  • 15 to 18 are cross-sectional structural diagrams of the light emitting diode device according to the preferred embodiment of the present invention.
  • 19 and 20 are block diagrams of a light emitting diode heat sink according to a preferred embodiment of the present invention. Best Practice:
  • the invention discloses a light-emitting diode device with a heat-dissipating structure, which has excellent heat-dissipating ability, which can avoid the light-emitting effect caused by the poor heat conduction efficiency of the conventional light-emitting diode device.
  • the rate is too low ⁇ photodiode grain degradation and other problems.
  • the light emitting diode device 200 includes a light emitting diode die 210, a plurality of heat conductors 220, a base plate 230, a heat dissipation body 240, and an optical lens 250.
  • the heat-conducting body 220 is divided into a bearing portion 222 and an extension portion 224.
  • the extending portion 224 is a portion of the thermal conductor 220 protruding downward from the second surface 233 of the substrate 230, please refer to FIG. 5a.
  • the supporting portion 222 is used for placing the LED chip 210.
  • the substrate 230 has a first surface 231 and a second surface 233, and the second surface 233 is located on the opposite side of the first surface 231.
  • the substrate 230 further includes a through hole 234, and the through hole 234 penetrates from a first surface 231 of the substrate to the second surface 233.
  • the guide body 220 passes through the substrate 230 through the through hole 234, and is disposed on the substrate 230 in a manner penetrating the substrate 230, with the extension portion 224 on the same side as the second surface 233 of the substrate.
  • the light-emitting diode device 200 may have a single or multiple light-emitting diode dies 210.
  • the heat conducting body 220 may be designed as a long heat conducting post (as shown in Figs. 4a to 4c), a ring-shaped conducting post (as shown in Figs. 4d to 4f), a metre-shaped conducting post (as shown in Figs. 4g to 4i), or A long thermally conductive post (as shown in Figures 4j to 41).
  • the thermally conductive body 220 is a ring-shaped thermally conductive post, a m-shaped thermally conductive post, or a long-shaped thermally conductive post, the thermally conductive body 220 may have multiple light-emitting diode grains at the same time.
  • 210 is arranged in a linear array (one-dimensional array) on a bearing surface 227 of the bearing portion 222.
  • the substrate 230 is used to fix the heat conductor 220, and the first surface 231 of the substrate 230 may have a patterned circuit 236, and may be electrically connected to the LED chip 210 by using a wire as its Drive circuit.
  • the substrate 230 abuts against the heat dissipation body 240 with a second surface 233, and the substrate 230 and the heat dissipation body 240 form a completely closed cavity 260, wherein the extension 224 of the heat conductor 220 is disposed in the cavity 260 .
  • the cavity 260 may further include a fixed amount of the cooling liquid 280, the purpose of which is to accelerate the dissipation of the heat transferred from the diode die 210 to the heat conductor 220 more quickly.
  • the load-bearing portion 222 and the extension portion 224 of the heat-conducting body 220 both have high heat-conducting capability, and can be made of the same or different heat-conducting materials, respectively, wherein the heat-conducting material It can be, for example, a metal such as silver, copper, aluminum or the like, or a ceramic composite material, a metal oxide, or a mixture thereof.
  • the heat-dissipating body can be formed by medium pressure, die casting, powder metallurgy, injection, lathe processing or welding.
  • the bearing portion 222 has a bearing surface 227 with an area of 0.5 to 2 mm 2.
  • the bearing portion 222 may further include a reflective layer 228 formed thereon.
  • the reflective layer may be, Metals such as silver, aluminum, silicon, copper, chromium, titanium, tungsten, or molybdenum, or alloys thereof.
  • the invention does not limit the type of the light emitting diode die 210 used in the device, and it can be blue light, green light, red light, white light, or electroluminescent light emitting diode. Since the main heat dissipation route of the present invention is the heat conductor 220 instead of the substrate 230, there is no limitation on the type of the substrate 230 used in the present invention. It can be a printed circuit board, and the substrate can deposit a reflective layer.
  • a layer of silver For example, a layer of silver.
  • the heat sink is disposed on the substrate in a manner penetrating the substrate, and the relative relationship between the thermal conductor 20 and the substrate 230 is not limited, and can be adjusted as needed, please refer to FIGS. 5a to 5c and 5e. .
  • the width of the extending portion 224 of the heat conducting body 220 may be greater than the width of the through hole, as shown in FIG. 5f and FIG. 5h.
  • the carrier surface 227 may be a flat surface or a concave surface.
  • the heat dissipating body 240 is, for example, a heat dissipating cup, and may further have a plurality of protrusions.
  • the protruding portion may be formed inside or outside the heat dissipation body, wherein the material of the heat dissipation body 240 may be silver, copper, tungsten, nickel, silicon, aluminum, molybdenum, ceramic composite materials, diamond-like carbon materials, metal oxidation Or mixed.
  • J may be a cylinder or a cube having an opening.
  • the geometrical heat dissipation body 240 may further have various high heat dissipation geometry changes to highlight the phonons, free electrons, and air heat transfer energy of metallic materials, and the material may be silver or copper. , Aluminum, ceramic composites, metal oxides or their mixtures.
  • the geometrical heat dissipation body according to the present invention may have a variety of variations, and may be preferably divided into four major types such as KI bucket type, tetrahedron bucket type, polyhedron bucket type, and oval bucket type ( Figures 6a to 6y).
  • the heat dissipation body may have one or more retracted holes. Please refer to FIGS.
  • FIGS. 7a to 7y are cross-sectional views corresponding to FIGS. 6a to 6y.
  • the heat-dissipating body with a geometric shape according to the present invention can be enlarged, reduced, and changed in height due to the working environment and power requirements.
  • the liquid level of the injected cooling liquid 280 in the rear cavity 260 is preferably in contact with the heat dissipation column 220 or various hot seats, and it is more preferable if it is in contact with the second surface 233 of the substrate 230.
  • the applicable cooling liquid 280 may be water, organic solutions, liquid hydrocarbons, liquid helium, liquid; various nitrogen and other endothermic liquids, wherein the organic solution may be, for example, alcohols, alkanes, and ethers. Or ketones.
  • Embodiment 1 is specifically described, and an array-type light-emitting diode device is taken as an example to describe the manufacturing method of the light-emitting diode device with a heat-dissipating structure according to the invention, and further measure the photoelectric properties of the light-emitting diode device in order to make the invention
  • FIG. 8 an assembly diagram of an array type light emitting diode device 300 is shown.
  • First b Take 20 cylindrical aluminum heat conductors 310, and a load-bearing surface 312 on each heat-dissipating column is fixed with a light-emitting diode die 320 (produced by Taiwan Guang Ga Company, model 514).
  • the cylindrical radiating column has a length of 25 mm and a diameter of 1.5 mm.
  • the diameter of the light-emitting diode die 320 is 14 mil.
  • the driving power is 20 mA
  • the light-emitting brightness is 40-50 mcd.
  • the method of fixing the light emitting diode die 320 to the bearing surface 312 on the heat dissipation column includes the following steps: First, a plurality of trenches 313 having a length of about 3 to 6 mils and a width of about 0.1 to 2.0 mils are formed on the bearing surface 312. See Figure 9a. Next, an adhesive (or solder) is formed in the groove, and the LED chip 320 is fixed on the supporting surface 312 with the adhesive (or solder), as shown in FIG. 9b.
  • Using the above steps to fix the light-emitting diode die 320 can not only increase the bonding strength of the die 320 and the bearing surface 312, but also maintain a good thermal conductivity effect.
  • the printed circuit board has a thickness of 2 mm, and has 20 through holes 332 thereon, and each through hole has a diameter of 1.5 mm.
  • the heat dissipation column passes through the substrate 330 through the through hole, and is disposed on the substrate 330 so as to penetrate the substrate 330.
  • the supporting surface 312 of the thermal conductor 310 is approximately aligned with the top 334 of the substrate 330, and the remaining portion of the thermal conductor 310 exposes the bottom 336 of the substrate 330.
  • the light emitting diode die is electrically connected with the circuit pattern by a gold wire.
  • a heat-dissipating body 340 is provided, such as a square-shaped heat-dissipating bucket, which is made of copper, silver, or aluminum, and has an inner volume of 30 ml.
  • a cooling liquid having a volume of 90 to 97% of the volume of the heat dissipating body is added to the heat dissipating body 340, and the heat dissipating body 340 is fixed to the bottom of the substrate 330, so that the exposed portion of the heat conductor 310 is completely covered by the heat dissipating body. Covered by the heat dissipation body 340.
  • a projection-type optical lens 360 is provided on the top 334 of the substrate 330 to cover the light emission.
  • a diode die 320 wherein the optical lens 360 maintains a specific distance from the light emitting diode die, and the specific distance is not less than 0.5 mm. So far, the array type light emitting diode device 300 according to the present invention is completed.
  • the array-type light-emitting diode device obtained from 20 crystal grains in the first embodiment will be illuminated with different operating voltages and currents, respectively. After eight hours, the brightness and the operating temperature of the crystal grains were measured. The results are shown in Table 1.
  • the operating temperature of the LED chip is still within the normal operating temperature range (80 ° C) of the LED, and it can be seen that the LED device with a heat dissipation structure according to the present invention has an advantageous heat dissipation mechanism and can quickly Heat is transferred out of the diode die.
  • Example 2 Performed in the same manner as in Example 1, but replacing the 20 cylindrical aluminum heat conductors 310 with 3 ring-shaped heat conductors (length 25mm to 85mm, diameters 0.5mm, 1.0mm and 1.5mm, The thickness of the ring sheet is 0.1 mm to 0.5 mm), and the bearing surfaces 312 of each of the ring-shaped heat conductors are respectively fixed with 3, 7 and 10 light-emitting diode chips 320.
  • the square heat sink is replaced with a round heat sink, as shown in FIG. 10.
  • the invention also relates to a light-emitting diode heat dissipation device, according to the second law of thermodynamics: the one-way flow rule that heat never automatically flows from a cold object to a hot object, and the basic idea of a heat engine, mechanical heat can be obtained from high temperature to low temperature And the heat engine is here.
  • T e . ld When work is performed between two temperatures, that is, the temperature difference caused by the thermal chirp of the heat dissipation body is used as the theory of internal energy or work of the automatic cycle.
  • the light-emitting diode device uses at least one of the The light-emitting diode device communicates its heat-dissipating body with a cooling liquid supply device through at least one circulation pipeline, so as to achieve the purpose of circulating-cooling the light-emitting diode device.
  • FIG. 11a and FIG. 11b a block diagram of a light emitting diode heat sink 400 according to a preferred embodiment of the present invention is shown.
  • the light emitting diode heat dissipating device includes four light emitting diode devices 300, a cooling liquid circulation pipeline 410, a hot water curved circulation tube 410A pressurized after the temperature is increased, and a cooling liquid supply device.
  • the cooling liquid supply device 420 provides a cooling liquid 430 in The heat dissipation body 340 and the circulation pipes 410 and 410A of the light emitting diode device 300 circulate in a system.
  • the cooling liquid supply device may be a cooling liquid tank containing a pressure pump, an injection cooling liquid tank, or a closed type self-circulating system without external power that generates pressurized kinetic energy only by heat energy absorbed by the cooling liquid.
  • the hot water curved circulation pipe 410A which is pressurized after the temperature is raised, can control the energy points required for pressurization and heating during circulation, and has the special function of being able to circulate while cooling.
  • the light-emitting diode heat dissipation device of the present invention can be further applied to the integration of vehicle light-emitting diode lighting equipment, such as a headlight, a fog lamp, and a direction lamp designed according to the light-emitting diode device having a heat dissipation structure according to the present invention.
  • vehicle light-emitting diode lighting equipment such as a headlight, a fog lamp, and a direction lamp designed according to the light-emitting diode device having a heat dissipation structure according to the present invention.
  • the brake lights or enter the home, the people's livelihood lighting system only need to be combined with a pressurized water tank, or the use of cooling fluid thermal expansion of pressurized kinetic energy to create an automatic circulation system.
  • the light emitting diode device 300 with a heat dissipation structure according to the present invention may further be electrically connected with a control unit 520 by using a circuit 510 to form a lighting device 500, which may be, for example, an indoor light or a large outdoor light. , Spotlights, traffic lights, street lights and car lights.
  • the control unit is used to light up or extinguish the light-emitting diode crystals of the light-emitting diode device, such as an electric switch.
  • FIG. 13 is a schematic diagram of a preferred embodiment of a lighting device 500 according to the present invention.
  • the lighting device 500 may be, for example, a car light.
  • a control unit 520 is electrically connected to the light emitting diode device 300 by a circuit 510.
  • the lighting device 500 has a wide-angle lampshade 530 with a plurality of convex lens portions 540 thereon, which can increase the irradiation angle of the light-emitting diode devices 300.
  • a knot is shown A light-emitting diode device 300 and a vehicle lamp system 600 of a mesh-type vehicle radiator water tank 610 are combined.
  • the light-emitting diode device with a heat-dissipating device structure of the present invention uses various heat-conducting seats or thermal-conducting posts as the bearing seats of the LED chip.
  • the cooling liquid absorbs the heat generated by the light emitting diode chip, and then transfers the heat to the heat dissipation body to be directly radiated to the environment. In this way, under the premise of keeping the light emitting diode at a normal operating temperature, the light emitting diode can be driven at a higher current to exert higher power.
  • the conventional light-emitting diode device uses a large-area metal substrate as a heat-dissipating component of the light-emitting diode device.
  • the substrate also has a plurality of wires (generally gold wires) electrically connected to the LED chip. Therefore, when the substrate absorbs the heat generated by the crystal grains and causes the temperature to rise, an excessively high temperature will cause the wires on the substrate to fall off or even break.
  • the light-emitting diode device with a heat-dissipating structure according to the present invention uses multiple components to perform multiple types of heat conduction or heat dissipation, so the problems caused by the conventional technology can be avoided.
  • the light-emitting diode device 700 has a heat-dissipating body 701, a carrier 702, a cavity 703, a plurality of light-emitting diode dies 704, and a cooling liquid 705.
  • the heat dissipating body 701 has an opening, and the supporting base has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface.
  • the support base 702 is disposed on the heat dissipation body 701 and is connected to the opening of the heat dissipation body 701.
  • a cavity 703 is formed between the second surface of the support base 702 and the heat dissipation body, and the cooling liquid 705 is filled.
  • the method of injecting the cooling liquid 705 is not particularly limited, and it may be injected through the opening at first, or it may be additionally provided by the heat dissipation body 701 Injection port.
  • the heat dissipation body 701 may have a plurality of engaging portions 708 to fix the supporting base 702.
  • the heat dissipating body 701 and the supporting base 702 can also be integrally formed.
  • the plurality of LED chips 704 are disposed on a first surface of the supporting base 702. It is worth noting that the first surface of the supporting base 702 may be a flat surface (as shown in FIG. 15), and the first surface is also There may be a recessed portion (as shown in FIG. 16) or a protruding portion (as shown in FIG. 17 b), and the complex light emitting diode die 704 may be disposed on the recessed portion or the surface of the protruding portion.
  • the plurality of LED chips 704 can be electrically connected to a circuit board 706 by a wire 707.
  • the heat sink body is U-shaped in design. Even if the heat sink body 701 extends from below the carrier 702 to above the periphery of the LED chip 704, The reason for increasing the heat dissipation efficiency is that when the light-transmitting cover covers and seals the light-emitting diode die, since the thermal energy will be concentrated around the light-emitting diode die 704 instead of below the carrier 702, it extends to the light-emitting diode die.
  • the cooling liquid in the main body 701 above and around 704 can absorb heat more quickly and effectively.
  • a through hole 710 may be provided directly below the light emitting diode die 704, penetrating the carrier 702, and the light emitting diode die 704 completely covers the through hole (that is, the through hole). 710 disturbs the LED chip 704).
  • the purpose of designing the through hole is to make the bottom of the LED chip contact with the cooling liquid through the through hole, and increase the heat dissipation efficiency.
  • the conductive part can be made on the upper part, or the bottom part of the diode die (such as a silicon substrate) can be made non-conductive, so it will not affect the light emitting efficiency of the LED die.
  • the light-emitting diode heat sink 800 houses the light-emitting diode device 700, a coolant circulation line 730, and a coolant tank. 720, and the cooling liquid tank communicates with the light emitting diode device 700 through the cooling liquid circulation pipe 730.
  • the cooling liquid tank 720 uses the principle of thermal convection, so that the heat dissipation body of the light emitting diode device 700 and the circulation pipeline 730 form an internal circulation system. It is worth noting that the cooling liquid tank 720 is preferably arranged higher than the light emitting diode device in order to facilitate the convection of heat and increase the heat dissipation efficiency.
  • the light-emitting diode device 900 having a heat dissipation structure according to the present invention may be further equipped with a pressure pump or a self-circulating system 740 without external power, and communicates with the cooling liquid tank and the light-emitting diode device. In this way, the heat dissipation efficiency can be greatly increased.
  • the cavity of the heat-dissipating body in each of the above embodiments can be filled with 5% -50% of air, and the preferred embodiment is 5% -20%.
  • the heat dissipation body cavity when there is air in the heat dissipation body cavity extending above the periphery of the light emitting diode, in addition to accelerating the heat circulation speed of the coolant, the heat dissipation body cavity can also be prevented from being absorbed by the coolant The resulting thermal expansion bursts.
  • Light-emitting diode die 210
  • Cooling body 240
  • Body wall of the cooling body 241 Lens: 250
  • Array light-emitting diode device 300 various thermally conductive bases or columns: 310 Load-bearing surface: 312
  • LED die 320
  • Printed circuit board 330
  • Printed circuit board top 334 Bottom of printed circuit board: 336 Thermal body: 340
  • Light-emitting diode heat sink 400 circulation pipe: 410
  • Coolant supply unit 420 Coolant: 430
  • Wide-angle lampshade 530
  • Cooling water tank 720
  • Booster pump or self-circulating system without external power 740 LED heat sink: 800, 900

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The purpose of the present invention is to provide a light emitting diode device and a light emitting diode dispersing heat device. A light emitting diode device is composed of a dispersing heat body which having an opening; a support base which is located on the dispersing heat body, a support base has a first side and a second side, wherein the second side is opposite to the first side, and which is tied to opening of a dispersing heat body, and that constructing a cavity between the second side and the dispersing heat body; At least one die of light emitting diode is disposed on the first side of support base, and a cooling fluid is filled into the cavity.

Description

发光二极管装置、 发光二极管散热装置及包含其的照明装置 技术领域：  Light emitting diode device, light emitting diode heat sink, and lighting device including the same
本发明是有关于一种发光二极管装置， 特别是有关于一种具有散热 结构的发光二极管装置。 背景技术：  The present invention relates to a light emitting diode device, and more particularly, to a light emitting diode device having a heat dissipation structure. Background technique:
发光二极管（Light Emitting Diode, 简称 LED )因其具有高亮度、 体积小、 重量轻、 不易破损、 低耗电量和寿命长等优点， 所以被广泛地 应用各式显示产品中， 其发光原理如下： 施加一电压于二极管上， 驱使 二极管里的电子与空穴结合， 并进一步产生光。  Light Emitting Diode (LED for short) has the advantages of high brightness, small size, light weight, not easy to break, low power consumption and long life. Therefore, it is widely used in various display products. The light emitting principle is as follows : Applying a voltage to the diode drives the electrons in the diode to combine with the holes and further generates light.
一般商品化的发光二极管 10, 请参照图 1， 其具有一发光二极管晶 片 11置于一导线架 14上， 且该发光二极管晶片 11以导线 12与该导线 架 14进行电性连结。此外该发光二极管 10更包含一封装材料 13包覆于 该发光二极管晶片 11及导线架 14并露出接脚 15, 用以保护该发光二极 管晶片 11及导线 12。 发光二极管虽被称为冷光源， 但由于其晶片在发 光同时亦有部分能量转换成热， 其中心发光层的温度可达到约高达四百 度左右。 然而， 封装二极管所用的封装材料， 通常为具有断热效果的树 脂类化合物， 其热导效果不佳， 因此热量无法向上由环氧树脂传导而散 发至空气， 只能由导线慢慢向下传导。  A general commercial light-emitting diode 10, please refer to FIG. 1, which has a light-emitting diode chip 11 placed on a lead frame 14, and the light-emitting diode chip 11 is electrically connected to the lead frame 14 by a lead 12. In addition, the light-emitting diode 10 further includes a packaging material 13 covering the light-emitting diode chip 11 and the lead frame 14 and exposing pins 15 for protecting the light-emitting diode chip 11 and the lead 12. Although the light emitting diode is called a cold light source, since the wafer emits some energy while converting into heat, the temperature of the central light emitting layer can reach about 400 degrees. However, the packaging material used to package the diode is usually a resin compound with a thermal insulation effect, and its thermal conductivity is not good. Therefore, the heat cannot be conducted upward by the epoxy resin and dissipated to the air. It can only be conducted slowly by the wire. .
当发光二极管 10内的热量蓄积过高， 易使包覆发光二极管 10的封 装材料 13因受热不同而有不同的膨胀程度， 导致导线架 14与封装材料 13间有间隙产生， 易使空气或湿气渗入而影响使用及缩短寿命， 严重时 更导致焊点或导线 12脱落。 When the heat accumulation in the light emitting diode 10 is too high, it is easy for the packaging material 13 covering the light emitting diode 10 to have different degrees of expansion due to different heat, resulting in the lead frame 14 and the packaging material. There is a gap between 13 and it is easy for air or moisture to infiltrate and affect the use and shorten the life. In severe cases, the solder joints or wires 12 may fall off.
另一方面， 若二极管晶片所产生的热量没有散发出去而持续积累， 过高的工作温度导致发光二极管 p-n接面发光 的能隙（ junction )崩溃， 如此一来， 单位电流所能使发光二极管产生的亮度将大幅下降， 因此发 光效率即因而降低甚至破坏。 由于热量限制了发光二极管所能注入的更 大电流， 使得发光二极管无法达到真正设定规格的标准。  On the other hand, if the heat generated by the diode chip is not emitted and continues to accumulate, an excessively high operating temperature causes the junction of the light emitting diode pn junction to break down. In this way, a unit current can cause the light emitting diode to generate The brightness will be greatly reduced, so the luminous efficiency is reduced or even destroyed. Because the heat limits the greater current that the LED can inject, the LED cannot meet the true set standards.
请参照图 2, 显示一发光二极管装置阵列 50, 其为发光二极管的进 一步应用。 该发光二极管装置阵列 50包含多个发光二极管 10以高密度 阵列形式粘着于一基材 60, 由于其热源更为集中， 因此上述因热所造成 的发光二极管晶粒劣化现象在发光二极管装置阵列 50中更为明显。  Referring to FIG. 2, a light emitting diode device array 50 is shown, which is a further application of the light emitting diode. The light emitting diode device array 50 includes a plurality of light emitting diodes 10 adhered to a substrate 60 in the form of a high-density array. Because its heat source is more concentrated, the above-mentioned phenomenon of deterioration of the LED grains due to heat is caused in the light emitting diode device array 50 More obvious.
为了解决上述问题， 以获得更高亮度的发光二极管， 许多改善的方 法已纷纷被业界所提出。 其中最成功的典型即为美国 LumiLeds公司的 Luxeon®发光二极管 100, 请参照图 3, 其特 在于利用较大面积的金属 底座 110, 并采用铝质基板 130作为散热片， 以将晶片 120所产生的热 传导至空气中，仅需 18颗可相当于 100颗传统发光二极管的亮度。然而， 该发光二极管 100在适当的工作温度下，其操作电流局限在 20mA左右， 且因生产成本过高而尚未被广泛采用。  In order to solve the above problems and obtain higher-brightness light emitting diodes, many improved methods have been proposed by the industry. The most successful example is the Luxeon® light emitting diode 100 from the American company LumiLeds. Please refer to FIG. 3, which specifically uses a large-area metal base 110 and uses an aluminum substrate 130 as a heat sink to generate the wafer 120. The heat transmitted to the air requires only 18 pieces which can be equivalent to the brightness of 100 traditional LEDs. However, the operating current of the light-emitting diode 100 is limited to about 20 mA at an appropriate operating temperature, and has not been widely adopted due to the high production cost.
为符合目前市场上的需求， 突破发光二捉管操作电流的限制， 以提 高发光二极管装置的发光效率是势在必行的。 因此， 发展出具有更高散 热效能的发光二极管装置， 即成为发光二极管 待解决的课题。 发明内容： In order to meet the current market demand, it is imperative to break through the limitation of the operating current of the light-emitting diode-capture tube to improve the light-emitting efficiency of the light-emitting diode device. Therefore, the development of light emitting diode devices with higher heat dissipation efficiency has become a problem to be solved by light emitting diodes. Summary of the invention:
有鉴于此， 本发明的目就在于提供一种具有散热绪构的发光二极管 装置， 包含一导热体， 该导热体为一散热柱或散热座。 其中， 该导热体 的一端作为发光二极管晶粒的承载座， 而该导热体的另一端则直接延伸 至一散热本体， 而该散热本体为一高效能致冷腔体。 由于晶粒与散热本 体温差的关系， 该发光二极管晶粒发光时所产生的热量可藉由该导热体 及该散热本体迅速传至该发光二极管晶粒外， 如此一来， 即使进一步提 高发光二极管的操作电流以提高亮度， 该二极管发光晶粒仍可推持在一 合适的工作温度下， 有效避免晶粒劣化的现象发生。  In view of this, an object of the present invention is to provide a light emitting diode device with a heat dissipation structure, which includes a heat conductor, and the heat conductor is a heat dissipation column or a heat dissipation base. Wherein, one end of the heat conductor is used as a bearing seat of the LED chip, and the other end of the heat conductor is directly extended to a heat dissipation body, and the heat dissipation body is a high-efficiency cooling cavity. Due to the temperature difference between the die and the heat dissipation body, the heat generated when the light emitting diode die emits light can be quickly transferred to the outside of the light emitting diode die through the heat conductor and the heat dissipation body. In this way, even if the light emitting diode is further improved Operating current to improve the brightness, the LED light emitting grains can still be pushed at a suitable operating temperature, which effectively prevents the phenomenon of grain degradation.
本发明的另一目的为提供一种发光二极管散热装置， 其结合一或多 个发光二极管装置与一或多个冷却液供给装置而形成一液冷式循环散热 装置， 可更有效的改善发光二极管散热的问题。  Another object of the present invention is to provide a light emitting diode heat dissipation device, which combines one or more light emitting diode devices and one or more cooling liquid supply devices to form a liquid-cooled circulating heat dissipation device, which can more effectively improve light emitting diodes. The problem of heat dissipation.
本发明又一目的为提供一种高发光效率的照明装置， 其中该照明装 置包含本发明所述的具有散热结构的发光二极管装置。  Another object of the present invention is to provide a lighting device with high light emitting efficiency, wherein the lighting device includes the light emitting diode device with a heat dissipation structure according to the present invention.
为达上述目的， 本发明所述的一种具有散热结构的发光二极管装置， 包括： 一散热本体， 该散热本体具有一开口端； 一基板， 设置于该散热 本体上， 具有一第一表面及一第二表面， 其中该第二表面位于该第一表 面的相反侧， 且与该散热本体的开口端抵接， 而该第二表面与该散热本 体之间构成一第一空腔； 至少一导热体， 以贯穿该基板的方式设置于该 基板上， 且该导热体具有一延伸部及一承载部， 其中该延伸部位于该第 一空腔中； 以及至少一发光二极管晶粒， 设置于该导热体的承载部上。  To achieve the above object, a light emitting diode device with a heat dissipation structure according to the present invention includes: a heat dissipation body having an open end; a substrate disposed on the heat dissipation body and having a first surface and A second surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one The heat conductor is disposed on the substrate in a manner penetrating the substrate, and the heat conductor has an extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and at least one light emitting diode die is disposed on the substrate. The heat-carrying body is on a bearing portion.
此外， 根据本发明一较佳实施例， 该具有散热结构的发光二极管装 置， 亦可包 舌： 一散热本体， 具有一开口； 一承载座， 设置于该散热本 体上， 具有一第一表面及一第二表面， 其中该第二表面位于该第一表面 的相反侧， 卫与该散热本体的开口抵接， 而该第二表面与该散热本体之 间构成一空月空； 至少一发光二极管晶粒， 设置于该承载座的第一表面上， 以及一冷却: 填充于该空腔中。 In addition, according to a preferred embodiment of the present invention, the light emitting diode device having a heat dissipation structure is It can also cover the tongue: a heat-dissipating body with an opening; a bearing seat disposed on the heat-dissipating body, having a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface And the abutment is in contact with the opening of the heat dissipation body, and an empty space is formed between the second surface and the heat dissipation body; at least one light emitting diode die is disposed on the first surface of the bearing base, and a cooling: filling In the cavity.
为达本发明的另一目的， 本发明提供一发光二极管散热装置， 该发 光二极管散 装置包括： 一或多个冷却液供给装置； 以及一至多个具有 散热结构的发光二极管装置， 该具有散热结构的发光二极管装置与该冷 却液供给装置连通。 其中， 该具有散热结构的发光二极管装置分别包括： 一散热本体， 具有一开口端， 并与该冷却液供给装置连通; 一基板， 设 置于该散热本体上， 具有一第一表面及一第二表面， 其中该第二表面位 于该第一表面的相反侧， 且与该散热本体的开口端抵接， 而该第二表面 与该散热本 之间构成一第一空腔， 其中该冷却液供给装置供給一冷却 液至该第一空腔中； 至少一导热体， 以贯穿该基板的方式设置于该基板 上， 且该导 ^体具有一延伸部及一承载部， 其中该延伸部位于该第一空 腔中； 以及至少一发光二极管晶粒， 设置于该导热体的承载部上。  In order to achieve another object of the present invention, the present invention provides a light emitting diode heat dissipating device. The light emitting diode dissipating device includes: one or more cooling liquid supply devices; and one or more light emitting diode devices having a heat dissipating structure having the heat dissipating structure. The light emitting diode device is in communication with the cooling liquid supply device. Wherein, the light-emitting diode devices having a heat-dissipating structure each include: a heat-dissipating body having an open end and communicating with the cooling liquid supply device; a substrate disposed on the heat-dissipating body having a first surface and a second A surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat sink body, and a first cavity is formed between the second surface and the heat sink, wherein the cooling liquid is supplied The device supplies a cooling liquid into the first cavity; at least one heat conductor is disposed on the substrate in a manner penetrating the substrate, and the conductor has an extension portion and a bearing portion, wherein the extension portion is located in the The first cavity; and at least one light emitting diode die are disposed on the bearing portion of the thermal conductor.
根据本发明所述的具有散热结构的发光二极管装置， 其中该多个具 有散热结构的发光二极管装置利用至少一循环管路与该冷却涣供给装置 (各种类形水箱、 水桶、 水槽, 例汽、 机车散热水箱）连通。 此外， 该 冷却液供给莱置为含加压泵的冷却液槽或是注入式冷却液槽， 亦可为密 闭式仅藉令却液所吸收的热能造成加压动能的无外来动力的自循环系 统。 为达本发明的又一目的， 本发明提供一种照明装置， 该照明装 包 括： 一控制单元； 以及至少一具有散热结构的发光二极管装置， 与 控 制单元电性连结。 其中， 该具有散热结构的发光二极管装置分别包拾： 一散热本体， 具有一开口端； 一基板， 设置于该散热本体上， 具有一第 一表面及一第二表面， 其中该笫二表面位于该第一表面的相反侧， JL与 该散热本体的开口端抵接， 而该第二表面与该散热本体之间构成一第一 空腔； 至少一导热体， 以贯穿该基板的方式设置于该基板上， 且该爭热 体具有一延伸部及一承载部， 其中该延伸部位于该笫一空腔中； 以 ^至 少一发光二极管晶粒， 设置于该导热体的承载部上， 其中该控制单元点 亮或熄灭该发光二极管晶粒。 According to the present invention, the light-emitting diode device having a heat-dissipating structure, wherein the plurality of light-emitting diode devices having a heat-dissipating structure utilize at least one circulation pipeline and the cooling coil supply device (various types of water tanks, buckets, water tanks, and steam) , Locomotive cooling water tank). In addition, the cooling liquid supply is arranged as a cooling liquid tank containing a pressure pump or an injection type cooling liquid tank, and can also be a closed type self-circulation without external power caused by pressurized kinetic energy caused only by heat energy absorbed by the cooling liquid. system. To achieve another object of the present invention, the present invention provides a lighting device. The lighting device includes: a control unit; and at least one light emitting diode device having a heat dissipation structure, which is electrically connected to the control unit. Wherein, the light emitting diode device with a heat dissipation structure includes: a heat dissipation body having an open end; a substrate disposed on the heat dissipation body, having a first surface and a second surface, wherein the second surface is located at On the opposite side of the first surface, JL is in abutment with the open end of the heat dissipation body, and a first cavity is formed between the second surface and the heat dissipation body; at least one heat conductor is disposed in a manner penetrating the substrate. On the substrate, and the heating body has an extending portion and a supporting portion, wherein the extending portion is located in the first cavity; and at least one light emitting diode die is arranged on the supporting portion of the thermal conductor, wherein the The control unit turns on or off the LED chip.
为达本发明的另一目的， 本发明提供一种发光二极管散热装置， 包 括： 一冷却液槽； 以及至少一发光二极管装置， 与该冷却液槽连通； 其 中， 该发光二极管装置包括： 一散热本体， 具有一开口； 一承载座， 设 置于该散热本体上， 具有一第一表面及一第二表面， 其中该第二表 位 于该第一表面的相反侧， 且与该散热本体的开口抵接， 而该第二表 与 该散热本体之间构成一空腔； 至少一发光二极管晶粒， 设置于该承我座 的第一表面上； 以及一冷却 ， 填充于该空腔中。  To achieve another object of the present invention, the present invention provides a light emitting diode heat sink, including: a cooling liquid tank; and at least one light emitting diode device in communication with the cooling liquid tank; wherein the light emitting diode device includes: a heat sink The body has an opening; a bearing seat is disposed on the heat dissipating body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and is in contact with the opening of the heat dissipating body; Then, a cavity is formed between the second watch and the heat-dissipating body; at least one light emitting diode die is disposed on the first surface of the socket; and a cooling is filled in the cavity.
根据本发明所述的具有散热结构的发光二极管装置， 可更包括一冷 却液， 填充于该空腔中。 此夕卜， 该导热体的延伸部可至少一部份与该冷 却液接触。  The light emitting diode device with a heat dissipation structure according to the present invention may further include a cooling liquid filled in the cavity. In addition, at least a part of the extension of the heat conductor may be in contact with the cooling liquid.
根据本发明所述的具有散热结构的发光二极管装置， 可更包括一透 镜形成于该第一表面上， 其中该透镜与该第一表面形成一第二空腔， 且 该第二空腔包含至少一该发光二极管晶粒。 The light emitting diode device with a heat dissipation structure according to the present invention may further include a lens formed on the first surface, wherein the lens and the first surface form a second cavity, and The second cavity includes at least one LED chip.
根据本发明所述的具有散热结构的发光二极管装置， 更包括一预定 的印刷、 涂覆纯银或纯铜的高厚度、 高导 路图形， 形成于该基板的第 一表面上并与该发光二极管电性连结。  The light-emitting diode device with a heat-dissipating structure according to the present invention further includes a predetermined printing, high-thickness, high-conductivity pattern coated with pure silver or pure copper, formed on the first surface of the substrate and emitting light. The diode is electrically connected.
以下藉由数个实施例及比较实施例并 合所附图式， 以更进一步说 明本发明的方法、 特征及优点， 但并非用来限制本发明的范围， 本发明 的范围应以所附的权利要求书为准。 附图说明：  In the following, several embodiments and comparative examples are combined with the accompanying drawings to further explain the methods, features, and advantages of the present invention, but it is not intended to limit the scope of the present invention. The claims shall prevail. Brief description of the drawings:
图 1绘示一习知发光二极管装置的剖面结构示意图。  FIG. 1 is a schematic cross-sectional structure diagram of a conventional light emitting diode device.
图 2绘示习知发光二极管装置阵列的 视图。  FIG. 2 is a view showing a conventional light emitting diode device array.
图 3绘示一习知具散热结构的发光二 管装置的剖面结构示意图。 图 4a ~ 41绘示符合本发明较佳实施例声斤述的发光二极管装置的剖面 结构示意图。  FIG. 3 is a schematic cross-sectional structure diagram of a conventional light emitting diode device with a heat dissipation structure. 4a to 41 are schematic cross-sectional structural diagrams of a light emitting diode device according to the preferred embodiment of the present invention.
图 5a ~ 5h绘示本发明所述的发光二极管装置其散热柱与基板的相 对关示意图。 剖面图。  5a to 5h are schematic diagrams showing the relative relationship between the heat dissipation column and the substrate of the light emitting diode device according to the present invention. Sectional view.
图 7a ~ 7y绘示对应图 6a ~ 6y所述的 有几何形状的散热本体的剖 面图。  7a to 7y are cross-sectional views of the heat dissipation body with a geometric shape described in FIGS. 6a to 6y.
图 8绘示本发明实施例 1所述的阵列弍发光二极管装置的立体组装 图。 图 9a和图 9b绘示本发明实施例 1 ^"述将该发光二极管晶粒固合于 该散热柱上的承载面的步骤。 FIG. 8 is a three-dimensional assembly view of the array-type light-emitting diode device according to the first embodiment of the present invention. FIG. 9a and FIG. 9b illustrate the steps of fixing the LED chip on the bearing surface of the heat dissipation column according to Embodiment 1 of the present invention.
图 10绘示本发明实施例 2所述的阵歹' J式发光二极管装置的立体组装 图。  FIG. 10 is a three-dimensional assembly diagram of the array J type LED device according to the second embodiment of the present invention.
图 11a显示本发明的一较佳实施例 述的发光二极管散热装置的方 块图。  Fig. 11a shows a block diagram of a light emitting diode heat sink according to a preferred embodiment of the present invention.
图 lib显示本发明的一较佳实施例^"述的发光二极管散热装置的立 体图。  Figure lib shows a perspective view of a light emitting diode heat sink according to a preferred embodiment of the present invention.
图 12绘示本发明的一较佳实施例所 id 的显示装置的方块图。  FIG. 12 is a block diagram of a display device according to a preferred embodiment of the present invention.
图 13绘示本发明的一较佳实施例所逸的显示装置的示意图。  FIG. 13 is a schematic diagram of a display device according to a preferred embodiment of the present invention.
图 14绘示本发明的一较佳实施例所逸的车灯系统的立体示意图。 图 15 ~ 18绘示符合本发明较佳实;^例所述的发光二极管装置的剖 面结构示意图。  FIG. 14 is a schematic perspective view of a vehicle light system according to a preferred embodiment of the present invention. 15 to 18 are cross-sectional structural diagrams of the light emitting diode device according to the preferred embodiment of the present invention.
图 19和图 20绘示符合本发明较佳 施例所述的发光二极管散热装 置的方块图。 最佳实施方式：  19 and 20 are block diagrams of a light emitting diode heat sink according to a preferred embodiment of the present invention. Best Practice:
为让本发明的上述和其他目的、 特征、 和优点能更明显易懂， 下文 特举出较佳实施例， 并配合所附图式， 作 细说明如下：  In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments in combination with the accompanying drawings for detailed descriptions as follows:
具有散热结构的发光二极管装置  Light emitting diode device with heat dissipation structure
本发明揭露一种具有散热结构的发光二极管装置， 其具有优良的散 热能力， 可免除习知发光二极管装置因热传导效率差， 所导致的发光效 率偏低 ^^光二极管晶粒劣化等问题。 The invention discloses a light-emitting diode device with a heat-dissipating structure, which has excellent heat-dissipating ability, which can avoid the light-emitting effect caused by the poor heat conduction efficiency of the conventional light-emitting diode device. The rate is too low ^^ photodiode grain degradation and other problems.
首先， 请参照图 4a、 4b, 显示一符合本发明的一单一晶片型发光二 极管装置 200 (即 200A ~ 200E )， 用来说明本发明 ^基本结构。 该发光 二极管装置 200包含有一发光二极管晶粒 210、 多条导热体 220、 一基 板 230、 一散热本体 240、 及一光学透镜 250。  First, referring to FIGS. 4a and 4b, a single-chip light-emitting diode device 200 (ie, 200A to 200E) according to the present invention is shown to explain the basic structure of the present invention. The light emitting diode device 200 includes a light emitting diode die 210, a plurality of heat conductors 220, a base plate 230, a heat dissipation body 240, and an optical lens 250.
该导热体 220分为一承载部 222及一延伸部 224。 该延伸部 224为 该导热体 220向下突出于该基板 230的第二表面 233的部分， 请参照图 5a。 而该承载部 222用于置放该发光二极管晶粒 210。 该基板 230具有 一第一表面 231及一第二表面 233, 而该第二表面 233位于该第一表面 231的相反侧。 该基板 230更包括一贯孔 234, 而 贯孔 234由该基板 的一第一表面 231贯穿至该第二表面 233。 而该导 ^体 220经由该贯孔 234穿越该基板 230,并以贯穿该基板 230的方式设置于该基板 230上， 并使其延伸部位 224于与该基板的第二表面 233的同一侧。 该发光二极 管装置 200可具有单一或多个发光二极管晶粒 210。 该导热体 220在设 计上可为一长条形导热柱（如图 4a ~ 4c )、一环状导 柱（如图 4d ~ 4f)、 一米字形导热柱（如图 4g ~ 4i )、 或一长条形导热柱 （如图 4j ~ 41 ), 若 导热体 220为环状导热柱、 米字形导热柱、 或长条形导热柱时， 该导热 体 220可同时具有多个发光二极管晶粒 210以线性 列方式（一维阵列） 配置于其承载部 222的一承载面 227上。  The heat-conducting body 220 is divided into a bearing portion 222 and an extension portion 224. The extending portion 224 is a portion of the thermal conductor 220 protruding downward from the second surface 233 of the substrate 230, please refer to FIG. 5a. The supporting portion 222 is used for placing the LED chip 210. The substrate 230 has a first surface 231 and a second surface 233, and the second surface 233 is located on the opposite side of the first surface 231. The substrate 230 further includes a through hole 234, and the through hole 234 penetrates from a first surface 231 of the substrate to the second surface 233. The guide body 220 passes through the substrate 230 through the through hole 234, and is disposed on the substrate 230 in a manner penetrating the substrate 230, with the extension portion 224 on the same side as the second surface 233 of the substrate. The light-emitting diode device 200 may have a single or multiple light-emitting diode dies 210. The heat conducting body 220 may be designed as a long heat conducting post (as shown in Figs. 4a to 4c), a ring-shaped conducting post (as shown in Figs. 4d to 4f), a metre-shaped conducting post (as shown in Figs. 4g to 4i), or A long thermally conductive post (as shown in Figures 4j to 41). If the thermally conductive body 220 is a ring-shaped thermally conductive post, a m-shaped thermally conductive post, or a long-shaped thermally conductive post, the thermally conductive body 220 may have multiple light-emitting diode grains at the same time. 210 is arranged in a linear array (one-dimensional array) on a bearing surface 227 of the bearing portion 222.
该基板 230的主要功用之一用来固定该导热体 220, 且该基板 230 的第一表面 231可具有一图案化的电路 236， 可利用导线与该发光二极 管晶粒 210电性连结， 作为其驱动电路。 在该发光二极管装置 200中， 该基板 230以第二表面 233与该散热本体 240抵接，且该基板 230与该 散热本体 240构成一完全密闭的空腔 260, 其中上述导热体 220的延伸 部 224设置于该空腔 260内。本发明所述的发光二极管装里，其空腔 260 内可更包含一固定量的冷却液 280, 其目的在于加速由二极管晶粒 210 传至导热体 220的热量更快速的散逸。 One of the main functions of the substrate 230 is used to fix the heat conductor 220, and the first surface 231 of the substrate 230 may have a patterned circuit 236, and may be electrically connected to the LED chip 210 by using a wire as its Drive circuit. In this light emitting diode device 200, The substrate 230 abuts against the heat dissipation body 240 with a second surface 233, and the substrate 230 and the heat dissipation body 240 form a completely closed cavity 260, wherein the extension 224 of the heat conductor 220 is disposed in the cavity 260 . In the light-emitting diode package of the present invention, the cavity 260 may further include a fixed amount of the cooling liquid 280, the purpose of which is to accelerate the dissipation of the heat transferred from the diode die 210 to the heat conductor 220 more quickly.
根据本发明所述的发光二极管装置， 该导热体 220的该承载部 222 及该延伸部 224皆具有高导热的能力， 可分别由相同或不同的热导材料 所制成， 其中该热导材料可例如为银、 铜、 铝等金属或其洽金， 亦可为 陶瓷复合材料、 金属氧化物或其混合物。 该散热本体可以 中压、 压铸、 粉末冶金、 注射、 车床加工或焊的方式所形成。 该承载部 222具有一承 载面 227, 面积可为 0.5 ~ 2mm2, 该承载部 222可更包含一反射层 228 形成于其上， 倩参照图 5d和图 5g, 其中该反射层的可为 、 银、 铝、 硅、 铜、 铬、 钛、 钨或钼等金属或其合金材料。 本发明对子所使用的发 光二极管晶粒 210种类并无限制， 可为蓝光、 绿光、 红光、 白光或是电 射发光二极管。 由于本发明的主要散热途径为该导热体 220而非该基板 230, 因此本发明在基板 230的种类选用上并无限制，为一 的印刷电路 板即可， 且该基板可沉积一反射层， 例如一银层。 该散热 主以一贯穿该 基板的方式设置于该基板上 , 且该导热体 20与该基板 230的相对关系 并无限定， 可视需要而加以调整， 请参照图 5a ~ 5c及图 5e所示。 此外， 该导热体 220延伸部 224的宽度可大于该贯孔的宽度，请参照图 5f及图 5h所示。 该^载面 227, 可为平面或一凹面。 According to the light-emitting diode device of the present invention, the load-bearing portion 222 and the extension portion 224 of the heat-conducting body 220 both have high heat-conducting capability, and can be made of the same or different heat-conducting materials, respectively, wherein the heat-conducting material It can be, for example, a metal such as silver, copper, aluminum or the like, or a ceramic composite material, a metal oxide, or a mixture thereof. The heat-dissipating body can be formed by medium pressure, die casting, powder metallurgy, injection, lathe processing or welding. The bearing portion 222 has a bearing surface 227 with an area of 0.5 to 2 mm 2. The bearing portion 222 may further include a reflective layer 228 formed thereon. Referring to FIGS. 5d and 5g, the reflective layer may be, Metals such as silver, aluminum, silicon, copper, chromium, titanium, tungsten, or molybdenum, or alloys thereof. The invention does not limit the type of the light emitting diode die 210 used in the device, and it can be blue light, green light, red light, white light, or electroluminescent light emitting diode. Since the main heat dissipation route of the present invention is the heat conductor 220 instead of the substrate 230, there is no limitation on the type of the substrate 230 used in the present invention. It can be a printed circuit board, and the substrate can deposit a reflective layer. For example, a layer of silver. The heat sink is disposed on the substrate in a manner penetrating the substrate, and the relative relationship between the thermal conductor 20 and the substrate 230 is not limited, and can be adjusted as needed, please refer to FIGS. 5a to 5c and 5e. . In addition, the width of the extending portion 224 of the heat conducting body 220 may be greater than the width of the through hole, as shown in FIG. 5f and FIG. 5h. The carrier surface 227 may be a flat surface or a concave surface.
此外， 该散热本体 240, 例如为一散热杯， 可进一步 有多个突出 部， 该突出部可形成于散热本体之内侧或外侧， 其中该散热本体 240 的 材质可为银、 铜、 钨、 镍、 硅、 铝、 钼、 陶瓷复合材料、 类钻碳材科、 金属氧化物或其混合。 本发明对该散热本体的形状并无进一步的限帝， J , 可为具有一开口的圆柱体或立方体。 In addition, the heat dissipating body 240 is, for example, a heat dissipating cup, and may further have a plurality of protrusions. The protruding portion may be formed inside or outside the heat dissipation body, wherein the material of the heat dissipation body 240 may be silver, copper, tungsten, nickel, silicon, aluminum, molybdenum, ceramic composite materials, diamond-like carbon materials, metal oxidation Or mixed. In the present invention, there is no further restriction on the shape of the heat-dissipating body, and J may be a cylinder or a cube having an opening.
此外， 该几何状散热本体 240, 例如为一散热桶， 可进一步具有各 种高散热几何形体的变化， 以突出金属材料的声子、 自由电子、 空 的 传热能量， 材质可为银、 铜、 铝、 陶瓷复合材料、 金属氧化物或其混 。 本发明所述的该几何散热本体可具有非常多种的变化， 较佳可分为 KI桶 型、 四面体桶型、 多面体桶型、 椭圆桶型等四大形种（图 6a ~ 6y )， 且 散热本体亦可具一或多个内缩的孔洞。 请参照图 6a ~ 6y, 列举出 25 种 符合本发明所述的具有几何形状的散热本体的立体剖面图， 再请参,暇图 7a ~ 7y, 为图 6a ~ 6y对应的剖面图。 本发明所述的具有几何形状 ^散 热本体并可因工作环境及功率需求放大、 缩小、 高低变化。 此外， 後空 腔 260内的所注入的冷却液 280其液面较佳与该散热柱 220或各形 ^"热 座接触， 若与该基板 230的第二表面 233接触则为更佳。 于本发明^ , 适用的冷却液 280可为水、 有机溶液、 液态的烃化物、 液态氦、 液； &氮 等各种高吸热液体， 其中该有机溶液可例如为醇类、 烷类、 醚类或酮类。  In addition, the geometrical heat dissipation body 240, for example, a heat dissipation barrel, may further have various high heat dissipation geometry changes to highlight the phonons, free electrons, and air heat transfer energy of metallic materials, and the material may be silver or copper. , Aluminum, ceramic composites, metal oxides or their mixtures. The geometrical heat dissipation body according to the present invention may have a variety of variations, and may be preferably divided into four major types such as KI bucket type, tetrahedron bucket type, polyhedron bucket type, and oval bucket type (Figures 6a to 6y). In addition, the heat dissipation body may have one or more retracted holes. Please refer to FIGS. 6a to 6y, and enumerate three kinds of three-dimensional cross-sectional views of the cooling body with geometric shapes according to the present invention. Please refer to FIGS. 7a to 7y, which are cross-sectional views corresponding to FIGS. 6a to 6y. The heat-dissipating body with a geometric shape according to the present invention can be enlarged, reduced, and changed in height due to the working environment and power requirements. In addition, the liquid level of the injected cooling liquid 280 in the rear cavity 260 is preferably in contact with the heat dissipation column 220 or various hot seats, and it is more preferable if it is in contact with the second surface 233 of the substrate 230. According to the present invention, the applicable cooling liquid 280 may be water, organic solutions, liquid hydrocarbons, liquid helium, liquid; various nitrogen and other endothermic liquids, wherein the organic solution may be, for example, alcohols, alkanes, and ethers. Or ketones.
以下特举实施例 1, 并以阵列式发光二极管装置为例，用以说明^发 明所述的具有散热结构的发光二极管装置的制作方式， 并进一步量^ 1其 光电性质， 以期使本发明的特征及优点更为清楚：  In the following, Embodiment 1 is specifically described, and an array-type light-emitting diode device is taken as an example to describe the manufacturing method of the light-emitting diode device with a heat-dissipating structure according to the invention, and further measure the photoelectric properties of the light-emitting diode device in order to make the invention Features and benefits are clearer:
实施例 1:  Example 1:
请参照图 8, 显示一阵列式发光二极管装置 300的組装图。 首 b, 取 20条圆柱状的铝质导热体 310,每一散热柱上的承载面 312固合一发 光二极管晶粒 320 (为台湾广镓公司生产， 型号 514 )。 该圆柱状的散热 柱的长为 25mm, 直径为 1.5mm。 该发光二极管晶粒 320 的直径为 14mil, 当其驱动功率为 20mA时， 其发光亮度为 40 ~ 50mcd。 将该发 光二极管晶粒 320固合于该散热柱上的承载面 312的方式包括以下步骤： 首先在该承载面 312上形成多条长约 3 ~ 6mil,宽约 0.1 ~ 2.0mil的沟槽 313, 请见图 9a。 接着， 将粘着剂 （或焊料）形成于该沟槽内， 并将该 发光二极管晶粒 320以该粘着剂 （或焊料） 固合于该承载面 312上， 请 见图 9b。利用上述步骤固合发光二极管晶粒 320不但可增加晶粒 320与 承载面 312的固合强度， 且仍能维持不错的导热效果。 Referring to FIG. 8, an assembly diagram of an array type light emitting diode device 300 is shown. First b, Take 20 cylindrical aluminum heat conductors 310, and a load-bearing surface 312 on each heat-dissipating column is fixed with a light-emitting diode die 320 (produced by Taiwan Guang Ga Company, model 514). The cylindrical radiating column has a length of 25 mm and a diameter of 1.5 mm. The diameter of the light-emitting diode die 320 is 14 mil. When the driving power is 20 mA, the light-emitting brightness is 40-50 mcd. The method of fixing the light emitting diode die 320 to the bearing surface 312 on the heat dissipation column includes the following steps: First, a plurality of trenches 313 having a length of about 3 to 6 mils and a width of about 0.1 to 2.0 mils are formed on the bearing surface 312. See Figure 9a. Next, an adhesive (or solder) is formed in the groove, and the LED chip 320 is fixed on the supporting surface 312 with the adhesive (or solder), as shown in FIG. 9b. Using the above steps to fix the light-emitting diode die 320 can not only increase the bonding strength of the die 320 and the bearing surface 312, but also maintain a good thermal conductivity effect.
接着， 取一 40x40mm的印刷电路板 330, 其上已完成一电路图形。 该印刷电路板的厚度为 2mm, 其上具有 20个贯孔 332, 而每一贯孔的 直径为 1.5mm。 接着， 将上述散热柱经由该贯孔穿越该基板 330， 并以 贯穿该基板 330的方式设置于该基板 330上。 其中， 该导热体 310的承 载面 312约与该基板 330的顶部 334切齐，该导热体 310的其余部分露 出该基板 330的底部 336。 完成散热柱的设置后， 用金线将该发光二极 管晶粒与该电路图形作电性连结。  Next, take a 40x40mm printed circuit board 330, on which a circuit pattern has been completed. The printed circuit board has a thickness of 2 mm, and has 20 through holes 332 thereon, and each through hole has a diameter of 1.5 mm. Then, the heat dissipation column passes through the substrate 330 through the through hole, and is disposed on the substrate 330 so as to penetrate the substrate 330. The supporting surface 312 of the thermal conductor 310 is approximately aligned with the top 334 of the substrate 330, and the remaining portion of the thermal conductor 310 exposes the bottom 336 of the substrate 330. After the setting of the heat dissipation column is completed, the light emitting diode die is electrically connected with the circuit pattern by a gold wire.
接着， 提供一散热本体 340, 例如为一方型散热桶， 为铜、 银、 铝 材质， 其内容积为 30ml。接着，取体积为该散热本体的容积的 90 ~ 97% 的冷却液加入该散热本体 340中，并将该散热本体 340固合于该基板 330 的底部，使导热体 310的露出部分完全被该散热本体 340所覆盖。最后， 提供一投射型光学透镜 360形成于该基板 330的顶部 334以覆盖该发光 二极管晶粒 320, 其中， 该光学透镜 360与该发光二极管晶粒保持一特 定距离， 而该特定距离不小于 0.5mm。 至此， 完成本发明所述的阵列式 发光二极管装置 300。 Next, a heat-dissipating body 340 is provided, such as a square-shaped heat-dissipating bucket, which is made of copper, silver, or aluminum, and has an inner volume of 30 ml. Next, a cooling liquid having a volume of 90 to 97% of the volume of the heat dissipating body is added to the heat dissipating body 340, and the heat dissipating body 340 is fixed to the bottom of the substrate 330, so that the exposed portion of the heat conductor 310 is completely covered by the heat dissipating body. Covered by the heat dissipation body 340. Finally, a projection-type optical lens 360 is provided on the top 334 of the substrate 330 to cover the light emission. A diode die 320, wherein the optical lens 360 maintains a specific distance from the light emitting diode die, and the specific distance is not less than 0.5 mm. So far, the array type light emitting diode device 300 according to the present invention is completed.
为进一步验证本发明所述的具有散热结构的发光二极管装置 300其 优良的散热能力， 以下将实施例一由 20颗晶粒所得的阵列式发光二极管 装置， 以不同的操作电压及电流分别点亮八小时后， 测量其亮度及晶粒 的操作温度， 结果如表 1所示。 In order to further verify the excellent heat dissipation capability of the light-emitting diode device 300 with a heat-dissipating structure according to the present invention, the array-type light-emitting diode device obtained from 20 crystal grains in the first embodiment will be illuminated with different operating voltages and currents, respectively. After eight hours, the brightness and the operating temperature of the crystal grains were measured. The results are shown in Table 1.
Figure imgf000014_0001
Figure imgf000014_0001
Figure imgf000014_0002
Figure imgf000014_0002
当发光二极管晶粒在多颗组合时， 容易因热源过度集中及各二极管 晶粒平均散热面积减少等原因， 导致发光二极管晶粒的工作温度过高， 进而引起发光效率的降低， 甚至造成发光二极管晶粒的劣化。 实施例 1 所使用的单一颗发光二极管晶粒其原本的最大适用电流范围为 20mA。 而在上述试验中， 当操作电压提升至 3.6V时， 平均每颗晶粒以正常状况 下的 2 倍电流量 （ 40mA ) 被点亮， 因此表 1 的操作电流可达 20x40=800mA。 此时， 该发光二极管晶粒的工作温度仍在发光二极管正 常工作温度范围 （80°C ) 内， 由此可知， 本发明所述的具有散热结构的 发光二极管装置具有优点的散热机制， 可迅速将热传致二极管晶粒外。 When the light emitting diode crystals are in a plurality of combinations, it is easy to cause the excessively concentrated heat source and the average heat dissipation area of each diode crystal to reduce the operating temperature of the light emitting diode crystals. Grain degradation. The maximum applicable current range of the single LED chip used in Example 1 was 20 mA. In the above test, when the operating voltage was increased to 3.6V, each crystal grain was in a normal condition. The double current amount (40mA) is lit, so the operating current of Table 1 can reach 20x40 = 800mA. At this time, the operating temperature of the LED chip is still within the normal operating temperature range (80 ° C) of the LED, and it can be seen that the LED device with a heat dissipation structure according to the present invention has an advantageous heat dissipation mechanism and can quickly Heat is transferred out of the diode die.
实施例 2:  Example 2:
以如实施例 1 的相同方式进行， 但将该 20条圆柱状的铝质导热体 310置换为 3个环状导热体（长为 25mm ~ 85mm,直径分别为 0.5mm, 1.0mm及 1.5mm, 且环片厚 0.1mm ~ 0.5mm )， 且每一环状导热体的 承载面 312分别固合 3、 7及 10个发光二极管晶粒 320。 此外， 将该方 型散热桶置换为一圆型散热桶， 如图 10所示。  Performed in the same manner as in Example 1, but replacing the 20 cylindrical aluminum heat conductors 310 with 3 ring-shaped heat conductors (length 25mm to 85mm, diameters 0.5mm, 1.0mm and 1.5mm, The thickness of the ring sheet is 0.1 mm to 0.5 mm), and the bearing surfaces 312 of each of the ring-shaped heat conductors are respectively fixed with 3, 7 and 10 light-emitting diode chips 320. In addition, the square heat sink is replaced with a round heat sink, as shown in FIG. 10.
发光二极管散热装置  Light emitting diode heat sink
本发明亦关于一种发光二极管散热装置， 依据热力学第 2定律： 热 永远不会自动从冷物体流向热物体的单行道流动法则 , 与热机的基本理 念， 热从高温流向低温就可得机械功， 而热机在 。与 Te。ld两个温度之 间运作时作功， 即受制于散热本体的热壑作用后的温度差拿来作自动循 环的内能或功的理论， 其将至少一个本发明所述具有散热装置结构的发 光二极管装置， 以最少一循环管路将其散热本体与一冷却液供给装置连 通， 达到循环冷却发光二极管装置的目的。 请参照图 11a及图 lib, 显 示本发明所述的发光二极管散热装置 400的一较佳实施例的方块图。 在 此较佳实施例中， 该发光二极管散热装置包含四个发光二极管装置 300、 一冷却液循环管路 410及一温度提升后加压了的热水弯形循环管 410A 及一冷却液供给装置 420, 而冷却液供给装置 420提供一冷却液 430在 该发光二极管装置 300的散热本体 340及循环管路 410与 410A内构成 的系统内循环。 其中该冷却液供给装置可为一含加压泵的冷却液槽或是 注入式冷却液槽或密闭式仅借冷却液所吸收的热能造成加压动能的无外 来动力的自循环系统。其中该温度提升后加压了的热水弯形循环管 410A 可控制循环时所须加压与加温的能量点， 具有可一面循环一面冷却的特 殊作用。 The invention also relates to a light-emitting diode heat dissipation device, according to the second law of thermodynamics: the one-way flow rule that heat never automatically flows from a cold object to a hot object, and the basic idea of a heat engine, mechanical heat can be obtained from high temperature to low temperature And the heat engine is here. With T e . ld When work is performed between two temperatures, that is, the temperature difference caused by the thermal chirp of the heat dissipation body is used as the theory of internal energy or work of the automatic cycle. It uses at least one of the The light-emitting diode device communicates its heat-dissipating body with a cooling liquid supply device through at least one circulation pipeline, so as to achieve the purpose of circulating-cooling the light-emitting diode device. Referring to FIG. 11a and FIG. 11b, a block diagram of a light emitting diode heat sink 400 according to a preferred embodiment of the present invention is shown. In this preferred embodiment, the light emitting diode heat dissipating device includes four light emitting diode devices 300, a cooling liquid circulation pipeline 410, a hot water curved circulation tube 410A pressurized after the temperature is increased, and a cooling liquid supply device. 420, and the cooling liquid supply device 420 provides a cooling liquid 430 in The heat dissipation body 340 and the circulation pipes 410 and 410A of the light emitting diode device 300 circulate in a system. The cooling liquid supply device may be a cooling liquid tank containing a pressure pump, an injection cooling liquid tank, or a closed type self-circulating system without external power that generates pressurized kinetic energy only by heat energy absorbed by the cooling liquid. Among them, the hot water curved circulation pipe 410A, which is pressurized after the temperature is raised, can control the energy points required for pressurization and heating during circulation, and has the special function of being able to circulate while cooling.
本发明所述的发光二极管散热装置， 可进一步应用于车用发光二极 管照明设备的整合， 像是将依照本发明所述的具有散热结构的发光二极 管装置所设计的头灯、 雾灯、 方向灯及剎车灯或进入家用、 民生用照明 系统只须与一加压水箱结合， 或利用冷却液热胀的加压动能造成自动循 环体系。  The light-emitting diode heat dissipation device of the present invention can be further applied to the integration of vehicle light-emitting diode lighting equipment, such as a headlight, a fog lamp, and a direction lamp designed according to the light-emitting diode device having a heat dissipation structure according to the present invention. And the brake lights or enter the home, the people's livelihood lighting system only need to be combined with a pressurized water tank, or the use of cooling fluid thermal expansion of pressurized kinetic energy to create an automatic circulation system.
照明装置  Lighting
请参照图 12, 本发明所述的具有散热结构的发光二极管装置 300, 可进一步利用一电路 510与一控制单元 520电性连结， 形成一照明装置 500, 可例如为一室内灯、 大型室外灯、 投射灯、 交通号志灯、 路灯及车 灯。 其中， 该控制单元用以点亮或熄灭该发光二极管装置的发光二极管 晶粒， 例如为一电闸。 请参照图 13, 为本发明所述的照明装置 500—较 佳实施例的示意图， 该照明装置 500可例如为一车灯， 其具有多个具散 热装置结构的发光二极管装置 300, 并设置于一控制单元 520上， 而该 控制单元 520以电路 510电性连结该发光二极管装置 300。 此外该照明 装置 500具有一广角灯罩 530, 其上具有多个凸起的透镜部 540, 可增 加该些发光二极管装置 300的照射角度。 此外， 请参照图 14, 显示一结 合发光二极管装置 300及一网片式车用散热水箱 610的车灯系统 600。 综上所述， 本发明所述的具有散热装置结构的发光二极管装置， 无 论是利用密闭式或循环式的液冷系统， 其藉由作为发光二极管晶片的承 载座的各形导热座或导热柱， 在第一时间内以冷却液吸收该发光二极管 晶片所产生的热， 再将热量传至该散热本体， 直接散发至环境中。 如此 一来， 在保持该发光二极管在一正常的操作温度的前提下， 可使该发光 二捉管以更高的电流来驱动， 发挥更高的功率。 Please refer to FIG. 12. The light emitting diode device 300 with a heat dissipation structure according to the present invention may further be electrically connected with a control unit 520 by using a circuit 510 to form a lighting device 500, which may be, for example, an indoor light or a large outdoor light. , Spotlights, traffic lights, street lights and car lights. The control unit is used to light up or extinguish the light-emitting diode crystals of the light-emitting diode device, such as an electric switch. Please refer to FIG. 13, which is a schematic diagram of a preferred embodiment of a lighting device 500 according to the present invention. The lighting device 500 may be, for example, a car light. A control unit 520 is electrically connected to the light emitting diode device 300 by a circuit 510. In addition, the lighting device 500 has a wide-angle lampshade 530 with a plurality of convex lens portions 540 thereon, which can increase the irradiation angle of the light-emitting diode devices 300. In addition, referring to FIG. 14, a knot is shown A light-emitting diode device 300 and a vehicle lamp system 600 of a mesh-type vehicle radiator water tank 610 are combined. In summary, the light-emitting diode device with a heat-dissipating device structure of the present invention, regardless of whether it is a closed or circulating liquid-cooling system, uses various heat-conducting seats or thermal-conducting posts as the bearing seats of the LED chip. In the first time, the cooling liquid absorbs the heat generated by the light emitting diode chip, and then transfers the heat to the heat dissipation body to be directly radiated to the environment. In this way, under the premise of keeping the light emitting diode at a normal operating temperature, the light emitting diode can be driven at a higher current to exert higher power.
此外， 传统的发光二极管装置利用一大面积的金属基板作为发光二 极管装置散热部件， 然而， 该基板亦具有多条的导线 （一般为金线）与 发光二极管晶粒作电性连结。 因此， 当基板吸收了晶粒所产生的热而导 致温度上升时， 过高的温度将导致该基板上的导线脱落， 甚至断裂。 本 发明所述的具有散热结构的发光二极管装置， 利用不同的部件进行多重 式导热或散热， 因此可避免习知技术所产生的问题。  In addition, the conventional light-emitting diode device uses a large-area metal substrate as a heat-dissipating component of the light-emitting diode device. However, the substrate also has a plurality of wires (generally gold wires) electrically connected to the LED chip. Therefore, when the substrate absorbs the heat generated by the crystal grains and causes the temperature to rise, an excessively high temperature will cause the wires on the substrate to fall off or even break. The light-emitting diode device with a heat-dissipating structure according to the present invention uses multiple components to perform multiple types of heat conduction or heat dissipation, so the problems caused by the conventional technology can be avoided.
请参照图 15， 显示符合本发明另一较佳实施例的具有散热结构的发 光二极管装置 700。 该发光二极管装置 700具有一散热本体 701、 一承 载座 702、 一空腔 703、 多个发光二极管晶粒 704、 及一冷却液 705。 其 中， 该散热本体 701具有一开口， 而该承载座具有一第一表面及一第二 表面， 其中该第二表面位于该笫一表面的相反侧。  Referring to FIG. 15, a light emitting diode device 700 having a heat dissipation structure according to another preferred embodiment of the present invention is shown. The light-emitting diode device 700 has a heat-dissipating body 701, a carrier 702, a cavity 703, a plurality of light-emitting diode dies 704, and a cooling liquid 705. The heat dissipating body 701 has an opening, and the supporting base has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface.
该承载座 702设置于该散热本体 701上， 并与该散热本体 701的开 口牴接， 而该承载座 702的第二表面与该散热本体之间构成一空腔 703, 而该冷却液 705注满于该空腔 703中。 在本发明中， 冷却液 705的注入 方式并不特别限定，可为一开始利用该开口注入，或另外由散热本体 701 的注入口注入。 在此， 该散热本体 701可具有多个卡合部 708, 以固定 该承载座 702。 此外， 在设计上， 该散热本体 701与该承载座 702亦可 一体成型。 该多个发光二极管晶粒 704配置于该承载座 702的第一表面 上，值得注意的是，该承载座 702的第一表面可为一平面（如图 15所示）， 该第一表面亦可具有一凹陷部（如图 16所示）或一凸出部（如图 17b所 示）， 而该复光二极管晶粒 704可配置于该凹陷部或该凸出部表面上。 该 多个发光二极管晶粒 704可利用导线 707与一电路板 706电性连结。 The support base 702 is disposed on the heat dissipation body 701 and is connected to the opening of the heat dissipation body 701. A cavity 703 is formed between the second surface of the support base 702 and the heat dissipation body, and the cooling liquid 705 is filled. In the cavity 703. In the present invention, the method of injecting the cooling liquid 705 is not particularly limited, and it may be injected through the opening at first, or it may be additionally provided by the heat dissipation body 701 Injection port. Here, the heat dissipation body 701 may have a plurality of engaging portions 708 to fix the supporting base 702. In addition, in design, the heat dissipating body 701 and the supporting base 702 can also be integrally formed. The plurality of LED chips 704 are disposed on a first surface of the supporting base 702. It is worth noting that the first surface of the supporting base 702 may be a flat surface (as shown in FIG. 15), and the first surface is also There may be a recessed portion (as shown in FIG. 16) or a protruding portion (as shown in FIG. 17 b), and the complex light emitting diode die 704 may be disposed on the recessed portion or the surface of the protruding portion. The plurality of LED chips 704 can be electrically connected to a circuit board 706 by a wire 707.
请参照图 17a及图 17b, 在本发明某些较佳实施例中， 该散热本体 在设计上呈现 U型， 亦即使散热本体 701 自承载座 702下方延伸至发光 二极管晶粒 704周围上方， 以增加散热效率， 其原因在于当透光罩覆盖 并密封住发光二极管晶粒时， 由于热能将会集中于发光二极管晶粒 704 周围上方而非承载座 702下方， 因此藉由延伸至发光二极管晶粒 704周 围上方的散^本体 701内的冷却液， 可以更快速有效的吸收热量。 此夕卜， 请参照图 18, 该发光二极管晶粒 704的正下方更可具有一贯孔 710, 贯 穿该承载座 702, 且该发光二极管晶粒 704完全覆盖该贯孔之上（即该 贯孔 710扰该发光二极管晶粒 704所封闭）。设计该贯孔的目的在于使该 发光二极管晶粒的底部可藉由该贯孔与该冷却液接触， 增加散热效率。 而在二极管晶粒的设计上， 可将导电部做在上部， 或使二极管晶粒的底 部 （例如硅基底） 不导电， 因此不会影响发光二极管晶粒的发光效能。  Please refer to FIG. 17a and FIG. 17b. In some preferred embodiments of the present invention, the heat sink body is U-shaped in design. Even if the heat sink body 701 extends from below the carrier 702 to above the periphery of the LED chip 704, The reason for increasing the heat dissipation efficiency is that when the light-transmitting cover covers and seals the light-emitting diode die, since the thermal energy will be concentrated around the light-emitting diode die 704 instead of below the carrier 702, it extends to the light-emitting diode die. The cooling liquid in the main body 701 above and around 704 can absorb heat more quickly and effectively. In addition, referring to FIG. 18, a through hole 710 may be provided directly below the light emitting diode die 704, penetrating the carrier 702, and the light emitting diode die 704 completely covers the through hole (that is, the through hole). 710 disturbs the LED chip 704). The purpose of designing the through hole is to make the bottom of the LED chip contact with the cooling liquid through the through hole, and increase the heat dissipation efficiency. In the design of the diode die, the conductive part can be made on the upper part, or the bottom part of the diode die (such as a silicon substrate) can be made non-conductive, so it will not affect the light emitting efficiency of the LED die.
请参照图 19, 显示符合本发明另一较佳实施例的具有散热结构的发 光二极管装置 800的方块图。 在此较佳实施例中， 该发光二极管散热装 置 800包舍发光二极管装置 700、 一冷却液循环管路 730及一冷却液槽 720,而该冷却液槽利用该冷却液循环管路 730与该发光二极管装置 700 连通。 冷却液槽 720利用热的对流原理， 使得该发光二极管装置 700的 散热本体及循环管路 730内构成一内循环系统。 值得注意的是， 该冷却 液槽 720在配置上较佳配置在较该发光二极管装置高的位置， 以利热的 对流， 增加散热效率。 Referring to FIG. 19, a block diagram of a light emitting diode device 800 with a heat dissipation structure according to another preferred embodiment of the present invention is shown. In this preferred embodiment, the light-emitting diode heat sink 800 houses the light-emitting diode device 700, a coolant circulation line 730, and a coolant tank. 720, and the cooling liquid tank communicates with the light emitting diode device 700 through the cooling liquid circulation pipe 730. The cooling liquid tank 720 uses the principle of thermal convection, so that the heat dissipation body of the light emitting diode device 700 and the circulation pipeline 730 form an internal circulation system. It is worth noting that the cooling liquid tank 720 is preferably arranged higher than the light emitting diode device in order to facilitate the convection of heat and increase the heat dissipation efficiency.
此外， 请参照图 20， 本发明所述的具有散热结构的发光二极管装置 900， 可进一步搭配一加压泵、 或无外动力的自循环系统 740, 与该冷却 液槽及该发光二极管装置连通， 如此一来可大幅增加散热效率。  In addition, please refer to FIG. 20. The light-emitting diode device 900 having a heat dissipation structure according to the present invention may be further equipped with a pressure pump or a self-circulating system 740 without external power, and communicates with the cooling liquid tank and the light-emitting diode device. In this way, the heat dissipation efficiency can be greatly increased.
此外， 于上述各实施例的散热本体的空腔中， 另可填充 5% ~ 50%的 空气， 较佳的实施例则为 5% ~ 20%。 以图 17a、 图 17b为例， 当延伸至 发光二极管周围上方的散热本体空腔内存在空气时， 除可加速冷却液的 热循环速度外， 还可避免散热本体空腔因冷却液吸热所产生的热膨胀而 爆裂。  In addition, the cavity of the heat-dissipating body in each of the above embodiments can be filled with 5% -50% of air, and the preferred embodiment is 5% -20%. Taking FIG. 17a and FIG. 17b as an example, when there is air in the heat dissipation body cavity extending above the periphery of the light emitting diode, in addition to accelerating the heat circulation speed of the coolant, the heat dissipation body cavity can also be prevented from being absorbed by the coolant The resulting thermal expansion bursts.
虽然本发明已通过较佳实施例说明如上， 但该较佳实施例并非用以 限定本发明。 本领域的技术人员， 在不脱离本发明的精神和范围内， 应 有能力对该较佳实施例做出各种更改和补充， 因此本发明的保护范围以 权利要求书的范围为难。  Although the present invention has been described above with reference to the preferred embodiment, the preferred embodiment is not intended to limit the present invention. Those skilled in the art should be able to make various modifications and additions to the preferred embodiment without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention is difficult to cover the scope of the claims.
附图中符号的简卑说明如下：  The brief description of the symbols in the drawings is as follows:
发光二极管装置： 200  Light-emitting diode device: 200
发光二极管晶粒： 210  Light-emitting diode die: 210
散热柱: 220  Cooling post: 220
承载部： 222 延伸部： 224 承载面： 227 Carrying Department: 222 Extension: 224 Bearing surface: 227
反射层： 228 Reflective layer: 228
基板： 230 Substrate: 230
第一表面： 231 First Surface: 231
第二表面： 233 Second surface: 233
贯孔： 234 Through holes: 234
图案化电路： 236 Patterned circuit: 236
散热本体： 240 Cooling body: 240
散热本体的本体壁： 241 透镜： 250 Body wall of the cooling body: 241 Lens: 250
空腔： 260 Cavities: 260
冷却液： 280 Coolant: 280
阵列式发光二极管装置： 300 各形导热座或导热柱： 310 承载面： 312 Array light-emitting diode device: 300 various thermally conductive bases or columns: 310 Load-bearing surface: 312
沟槽： 313 Groove: 313
粘着剂： 314 Adhesive: 314
发光二极管晶粒： 320 印刷电路板： 330 LED die: 320 Printed circuit board: 330
贯孔： 332 Through holes: 332
印刷电路板顶部： 334 印刷电路板底部： 336 散热本体： 340 Printed circuit board top: 334 Bottom of printed circuit board: 336 Thermal body: 340
光学透镜： 360 Optical lens: 360
发光二极管散热装置： 400 循环管路： 410 Light-emitting diode heat sink: 400 circulation pipe: 410
冷却液供给装置： 420 冷却液： 430 Coolant supply unit: 420 Coolant: 430
照明装置： 500 Lighting: 500
电路： 510 Circuit: 510
控制单元： 520 Control unit: 520
广角灯罩： 530 Wide-angle lampshade: 530
透镜部： 540 Lens section: 540
车灯系统： 600 Headlight system: 600
网片式车用散热水箱： 610 发光二极管装置： 700 散热本体： 701  Mesh car cooling water tank: 610 LED device: 700 Radiating body: 701
承载座： 702 Bearing Block: 702
空腔： 703  Cavity: 703
发光二极管晶粒： 704 冷却液： 705 LED chip: 704 Coolant: 705
电路板： 706  Circuit board: 706
导线： 707 卡合部： 708 Wire: 707 Snap section: 708
贯孔： 710 Through holes: 710
冷却水槽： 720 Cooling water tank: 720
循环管路： 730 Circulating pipeline: 730
加压泵或无外动力的自循环系统： 740 发光二极管散热装置： 800、 900 Booster pump or self-circulating system without external power: 740 LED heat sink: 800, 900

Claims

权利要求 Rights request
1、 一种发光二极管装置， 其特征在于包括： 1. A light emitting diode device, comprising:
一散热本体， 具有一开口端；  A heat dissipation body having an open end;
一基板， 设置于该散热本体上， 具有一第一表面及一第二表面， 其 中该第二表面位于该第一表面的相反侧， 且与该散热本体的开口端抵接， 而该第二表面与该散热本体之间构成一第一空腔；  A substrate is disposed on the heat dissipating body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat dissipating body, and the second surface A first cavity is formed between the surface and the heat dissipation body;
至少一导热体， 以贯穿该基板的方式设置于该基板上， 且该导热体 具有一延伸部及一承载部， 其中该延伸部位于该第一空腔中； 以及  At least one thermal conductor is disposed on the substrate in a manner penetrating the substrate, and the thermal conductor has an extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and
至少一发光二极管晶粒， 设置于该导热体的承载部上。  At least one light emitting diode die is disposed on the bearing portion of the thermal conductor.
2、 根据权利要求 1所述的发光二极管装置， 其特征在于： 更包括一 冷却液， 填充于该空腔中。  2. The light emitting diode device according to claim 1, further comprising a cooling liquid filled in the cavity.
3、 根据权利要求 2所述的发光二极管装置， 其特征在于： 该导热体 的延伸部至少一部份与该冷却液接触。  3. The light emitting diode device according to claim 2, wherein at least a part of the extension of the heat conductor is in contact with the cooling liquid.
4、 根据权利要求 1所述的发光二极管装置， 其特征在于： 更包括一 透镜形威于该第一表面上， 其中该透镜与该第一表面形成一第二空腔， 且至少一发光二极管晶粒设置于该第二空腔内的第一表面上。  4. The light-emitting diode device according to claim 1, further comprising a lens shape on the first surface, wherein the lens and the first surface form a second cavity, and at least one light-emitting diode The crystal grains are disposed on the first surface in the second cavity.
5、 根据权利要求 1所述的发光二极管装置， 其特征在于： 更包括一 电路图案， 形成于该基板的第一表面上以与该发光二极管电性连结。  5. The light emitting diode device according to claim 1, further comprising a circuit pattern formed on the first surface of the substrate to be electrically connected to the light emitting diode.
6、 根据权利要求 1所述的发光二极管装置， 其特征在于： 更包括一 反射层设置于该导热体的承载部上。  6. The light emitting diode device according to claim 1, further comprising a reflective layer disposed on the bearing portion of the heat conductor.
7、 根据权利要求 1所述的发光二极管装置， 其特征在于： 该导热体 为一导热柱， 材质为银、 铜、 铝、 陶瓷复合材料、 金属氧化物或其组合。 7. The light emitting diode device according to claim 1, wherein: the heat conductor It is a thermally conductive pillar made of silver, copper, aluminum, ceramic composite material, metal oxide, or a combination thereof.
8、根据权利要求 1所述的发光二极管装置， 其特征在于： 该散热本 体为银、 铜、 铝、 陶瓷复合材料、 金属氧化物或其组合。  8. The light-emitting diode device according to claim 1, wherein the heat-dissipating body is silver, copper, aluminum, a ceramic composite material, a metal oxide, or a combination thereof.
9、根据权利要求 1所述的发光二极管装置， 其特征在于： 该散热本 体以冲压、 压铸、 粉末^金、 注射、 车床加工或焊的方式所形咸。  9. The light-emitting diode device according to claim 1, wherein the heat-dissipating body is shaped by stamping, die-casting, powder metal, injection molding, lathe processing, or welding.
10、 一种发光二极管散热装置， 其特征在于包括：  10. A light emitting diode heat dissipation device, comprising:
一冷却液供给装置； 以及  A coolant supply device; and
多个具有散热结构^ 7发光二极管装置， 与该冷却液供给装置连通； 其中， 该具有散热^构的发光二极管装置分别包括：  A plurality of light emitting diode devices having a heat dissipation structure are communicated with the cooling liquid supply device; wherein the light emitting diode devices having a heat dissipation structure include:
一散热本体， 与该令却液供给装置连通， 其中该散热本体具有一开 口端；  A heat-dissipating body communicating with the cooling fluid supply device, wherein the heat-dissipating body has an opening end;
一基板， 设置于该散热本体上， 具有一第一表面及一笫二表面， 其 中该第二表面位于该第一表面的相反侧 , 且与该散热本体的开口端抵接， 而该第二表面与该散热 体之间构成一第一空腔， 且该冷却液供给装置 供给一冷却液至该第一空腔中；  A substrate is disposed on the heat dissipation body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and abuts the open end of the heat dissipation body, and the second surface A first cavity is formed between the surface and the heat sink, and the cooling liquid supply device supplies a cooling liquid into the first cavity;
至少一导热体， 以 穿该基板的方式设置于该基板上， 且该导热体 具有一延伸部及一承载 , 其中该延伸部位于该第一空腔中； 以及  At least one heat conductor is disposed on the substrate in a manner that penetrates the substrate, and the heat conductor has an extension portion and a bearing, wherein the extension portion is located in the first cavity; and
至少一发光二极管 H¾粒， 设置于该导热体的承载部上。 At least one light-emitting diode H ¾ is disposed on the bearing portion of the thermal conductor.
11、根据权利要求 lO所述的发光二极管散热装置， 其特征在于： 该 冷却液供给装置利用一循环管路与多个散热本体连通。  11. The light emitting diode heat sink according to claim 10, wherein the cooling liquid supply device communicates with a plurality of heat sink bodies through a circulation pipe.
12、根据权利要求 10所述的发光二极管散热装置， 其特农在于： 该 导热体的延伸部至少一部份与该冷却液接触。 12. The light-emitting diode heat sink according to claim 10, wherein the special farm is: at least a part of the extension of the heat conductor is in contact with the cooling liquid.
13、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 具有散热结构的发先二极管装置更包括一透镜形成于基板该第一表面 上， 而该透镜与该第一表面形成一第二空腔， 且至少一发光二极管晶粒 设置于该第二空腔! ¾的第一表面上。 13. The light-emitting diode heat sink according to claim 10, wherein the hair-emitting diode device having a heat dissipation structure further comprises a lens formed on the first surface of the substrate, and the lens and the first surface form a The second cavity, and at least one LED chip is disposed on the first surface of the second cavity.
14、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 更 包括一电路图案， 形成于该基板的第一表面上以与该发光二极管电性连 结。  14. The light emitting diode heat sink according to claim 10, further comprising a circuit pattern formed on a first surface of the substrate to be electrically connected to the light emitting diode.
15、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 具有散热结构的发光二极管装置更包括一反射层设置于该导热体的承载 部上。  15. The light emitting diode heat dissipation device according to claim 10, wherein the light emitting diode device having a heat dissipation structure further comprises a reflective layer disposed on a bearing portion of the heat conductor.
16、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 导热体为一导热柱， 材质为银、 铜、 铝、 陶瓷复合材料、 金属氧化物或 其组合。  16. The light emitting diode heat sink according to claim 10, wherein the thermal conductor is a thermally conductive post made of silver, copper, aluminum, ceramic composite material, metal oxide, or a combination thereof.
17、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 散热本体为银、 铜、 铝、 陶瓷复合材料、 金属氧化物或其组合。  17. The light emitting diode heat sink according to claim 10, wherein the heat sink body is silver, copper, aluminum, ceramic composite material, metal oxide, or a combination thereof.
18、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 散热本体以冲压、 铸、 粉末冶金、 注射、 车床加工或焊的方式所形成。  18. The light emitting diode heat sink according to claim 10, wherein the heat sink body is formed by stamping, casting, powder metallurgy, injection molding, lathe machining or welding.
19、根据权利要求 10所述的发光二极管散热装置， 其特征在于： 该 冷却液供给装置为一冷却液槽。  19. The light emitting diode heat sink according to claim 10, wherein the cooling liquid supply device is a cooling liquid tank.
20、根据权利要求 19所述的发光二极管散热装置， 其特征在于： 该 冷却液槽具有一加 泵、 或无外动力的自循环系统，  20. The light-emitting diode heat sink according to claim 19, wherein the cooling liquid tank has a pump or a self-circulating system without external power,
21、 一种照明裝置， 其特征在于包括： 一控制单元； 以及 21. A lighting device, comprising: A control unit; and
至少一具有散热结构的发光二极菅装置， 与该控制单元电性连结； 其中， 该具有散热结构的发光二极管装置分别包括：  At least one light emitting diode device having a heat dissipation structure is electrically connected to the control unit; wherein the light emitting diode devices having a heat dissipation structure include:
一散热本体， 其中该散热本体具有一开口端；  A heat dissipation body, wherein the heat dissipation body has an open end;
一基板， 设置于该散热本体上， 具有一第一表面及一第二表面， 其 中该第二表面位于该第一表面的相反倜!] , 且与该散热本体的开口端抵接， 而该第二表面与该散热本体之间构成一第一空腔；  A substrate is disposed on the heat dissipating body and has a first surface and a second surface, wherein the second surface is located opposite to the first surface!], And is in contact with the open end of the heat dissipating body, and A first cavity is formed between the second surface and the heat dissipation body;
至少一导热体， 以贯穿该基板的方式设置于该基板上， 且该导热体 具有一延伸部及一承载部， 其中该延^ ^部位于该第一空腔中； 以及  At least one heat conductor is disposed on the substrate in a manner penetrating the substrate, and the heat conductor has an extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and
至少一发光二极管晶粒， 设置于该导热体的承载部上， 其中该控制 单元点亮或熄灭该发光二极管晶粒。  At least one light emitting diode die is disposed on the bearing portion of the heat conductor, wherein the control unit turns on or off the light emitting diode die.
22、 一种发光二极管装置， 其特征在于包括：  22. A light emitting diode device, comprising:
一散热本体， 具有一开口；  A heat dissipation body having an opening;
一承载座， 设置于该散热本体上， 具有一第一表面及一第二表面， 其中该第二表面位于该第一表面的相反侧， 且与该散热本体的开口抵接， 而该第二表面与该散热本体之间构成一空腔；  A carrier is disposed on the heat dissipation body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and abuts the opening of the heat dissipation body, and the second surface A cavity is formed between the surface and the heat dissipation body;
至少一发光二极管晶粒， 设置于该承载座的第一表面上； 以及 一冷却液, 填充于该空腔中。  At least one light-emitting diode die is disposed on the first surface of the carrier; and a cooling liquid is filled in the cavity.
23、根据权利要求 22所述的发 二极管装置， 其特征在于： 该散热 本体具有多个卡合部， 以固定该承载座。  23. The diode device according to claim 22, wherein the heat-dissipating body has a plurality of engaging portions to fix the supporting base.
24、根据权利要求 22所述的发 二极管装置， 其特征在于： 更包括 一电路板， 该电路板电性连结该发光二极管晶粒。 24. The diode device according to claim 22, further comprising a circuit board, the circuit board is electrically connected to the LED chip.
25、根据权利要求 22所述的发光二极管装置， 其特征在于： 该承载 座位于该发光二极管晶粒的正下方处具有一贯孔， 该发光二极管晶粒完 全覆盖该贯孔之上， 且该发光二极管晶粒的底部藉由该贯孔与该冷却液 接触。 25. The light emitting diode device according to claim 22, wherein: the bearing seat has a through hole directly below the light emitting diode die, the light emitting diode die completely covers the through hole, and the light emitting The bottom of the diode die is in contact with the cooling liquid through the through hole.
26、根据权利要求 22所述的发光二极管装置， 其特征在于： 该承载 座的第一表面为平面。  26. The light emitting diode device according to claim 22, wherein the first surface of the supporting base is a flat surface.
27、根据权利要求 22所述的发光二极管装置， 其特征在于： 该承载 座的第一表面具有一凹陷部， 而该发光二极管晶粒位于该凹陷部上。  27. The light emitting diode device according to claim 22, wherein: the first surface of the supporting base has a recessed portion, and the LED chip is located on the recessed portion.
28、根据权利要求 22所述的发光二极管装置， 其特征在于： 该承载 座的第一表面具有一凸出部， 而该发光二极管晶粒位于该凸出部上。  28. The light emitting diode device according to claim 22, wherein: the first surface of the supporting base has a protruding portion, and the LED chip is located on the protruding portion.
29、根据权利要求 22所述的发光二极管装置， 其特征在于： 该散热 本体自该承载座下方延伸至该发光二极 晶粒周围的上方。  29. The light-emitting diode device according to claim 22, wherein the heat-dissipating body extends from below the supporting base to above the periphery of the light-emitting diode grains.
30、根据权利要求 29所述的发光二极管装置， 其特征在于： 该散热 本体的空腔内存在 5% ~ 20%的空气。  30. The light emitting diode device according to claim 29, wherein 5% to 20% of air exists in the cavity of the heat dissipation body.
31、根据权利要求 22所述的发光二极管散热装置， 其特征在于： 该 散热本体与该承载座为一体成型。  31. The light emitting diode heat sink according to claim 22, wherein the heat sink body and the supporting base are integrally formed.
32、根据权利要求 22所述的发光二极管装置， 其特征在于： 该散热 本体的空腔内存在 5% ~ 50%的空气。  32. The light emitting diode device according to claim 22, wherein 5% to 50% of air exists in the cavity of the heat dissipation body.
33、 一种发光二极管散热装置， 其特征在于包括：  33. A light emitting diode heat dissipation device, comprising:
一冷却液槽； 以及  A coolant tank; and
至少一发光二极管装置， 与该冷却液槽连通；  At least one light emitting diode device in communication with the cooling liquid tank;
其中， 该发光二极管装置包括： 一散热本体， 具有一开口； The light emitting diode device includes: A heat dissipation body having an opening;
一承载座， 设置于该散热本体上， 具有一第一表面及一第二表面， 其中该第二表面位于该笫一表面的相反侧， 且与该银热本体的开口抵接， 而该第二表面与该散热本体之间构成一空腔；  A bearing seat is disposed on the heat dissipation body and has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and abuts the opening of the silver heat body, and the first A cavity is formed between the two surfaces and the heat dissipation body;
至少一发光二极管晶粒， 设置于该承载座的笫一表面上； 以及 一冷却液， 填充于该空腔中。  At least one light-emitting diode die is disposed on the first surface of the carrier; and a cooling liquid is filled in the cavity.
34、根据权利要求 33所述的发光二极管散热裝置， 其特征在于： 该 冷却液槽配置在较该发光二极管装置高的位置。  34. The light emitting diode heat sink according to claim 33, wherein the cooling liquid tank is disposed at a position higher than the light emitting diode device.
35、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 该 冷却液槽利用一循环管路与该散热本体连通。  35. The light emitting diode heat sink according to claim 33, wherein the cooling liquid tank communicates with the heat sink body through a circulation pipe.
36、根据权利要求 33所述的发光二极管散热裝置， 其特征在于： 更 包括一加压泵、 或无外动力的自循环系统， 与该^却液槽及该发光二极 管装置连通。  36. The light emitting diode heat sink according to claim 33, further comprising a pressure pump or a self-circulating system without external power, which is in communication with the cooling tank and the light emitting diode device.
37、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 该 散热本体具有多个卡合部， 以固定该承载座。  37. The light emitting diode heat sink according to claim 33, wherein the heat sink body has a plurality of engaging portions to fix the supporting base.
38、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 更 包括一电路板， 该电路板电性连结该发光二极管晶粒。  38. The light emitting diode heat sink according to claim 33, further comprising a circuit board, the circuit board is electrically connected to the light emitting diode chip.
39、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 该 发光二极管晶粒的正下方具有一贯孔贯穿该承载座， 该发光二极管晶粒 完全覆盖该贯孔之上， 且该发光二极管晶粒的底邦藉由该贯孔与该冷却 液接触。  39. The light-emitting diode heat sink according to claim 33, wherein: a light-emitting diode die directly has a through hole penetrating through the supporting seat, the light-emitting diode die completely covers the through hole, and the light-emitting The bottom state of the diode die contacts the cooling liquid through the through hole.
40、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 该 承载座的第一表面为平面。 40. The light emitting diode heat sink according to claim 33, wherein: The first surface of the bearing seat is a flat surface.
41、根据权利要求 33所述的发光二极管散热装置， 其嚇征在于： 该 承载座的第一表面具有一凹陷部， 而该发光二极管晶粒位 f该凹陷部上。  41. The light emitting diode heat sink according to claim 33, wherein the first surface of the supporting base has a recessed portion, and the light emitting diode crystal grains are located on the recessed portion.
42、根据权利要求 33所述的发光二极管散热装置， 其 4征在于： 该 承载座的第一表面具有一凸出部， 而该发光二极管晶粒位 f该凸出部上。  42. The light emitting diode heat sink according to claim 33, wherein: the first surface of the supporting base has a protruding portion, and the light emitting diode crystal grains are located on the protruding portion.
43、根据权利要求 33所述的发光二极管散热装置， 其嚇征在于： 该 散热本体自该承载座下方延伸至该发光二极管晶粒周围的 方。  43. The light-emitting diode heat sink according to claim 33, wherein the heat-dissipating body extends from below the supporting base to a side around the light-emitting diode die.
44、根据权利要求 43所述的发光二极管散热装置， 其 4令征在于： 该 散热本体的空腔内存在 5% ~ 20%的空气。  44. The light emitting diode heat sink according to claim 43, wherein the four command signs are: 5% to 20% air exists in the cavity of the heat sink body.
45、根据权利要求 33所述的发光二极管散热装置， 其嚇征在于： 该 散热本体与该承载座为一体成型。  45. The light emitting diode heat sink according to claim 33, wherein the heat sink body is integrally formed with the supporting base.
46、根据权利要求 33所述的发光二极管散热装置， 其特征在于： 该 散热本体的空腔内存在 5% ~ 50%的空气。  46. The light emitting diode heat sink according to claim 33, wherein 5% to 50% of air exists in the cavity of the heat sink body.
PCT/CN2005/000460 2004-04-08 2005-04-08 A light emitting diode device, a light emitting diode dispersing heat device and an illuminating apparatus in which including aforesaid device WO2005098971A1 (en)

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