200534518 九、發明說明： 【發明所屬之技術領域】 種具有散熱結構 本發明關於一種發光二極體裝置，特別關於一 之發光二極體裝置。 【先前技術】200534518 IX. Description of the invention: [Technical field to which the invention belongs] A kind of light emitting diode device The present invention relates to a light emitting diode device, and more particularly to a light emitting diode device. [Prior art]
毛光二極體（Light Einittlng Diode，簡稱l剛因盆且 有高亮度、體積小、重量輕、不易破損、低耗電量㈣命長等 優點’所以被廣泛地應用各式顯示產品中，其發光原理如；. Γ:】壓於二極體上’驅使二極體裡的電子與電洞結合，並 一奴肉。口化的發光二極體10,請參照第工圖，苴且 光二極體晶片11置於一導線架14上，且該發光二、s 係以導線丨2與該導線架14進行電性連結。此外好光 =包含-封裝材料13包覆於該發光二極體晶片u及導線加 义 出接腳15 ’用以保護該發光二極體晶片u及導線12了 雖被稱為冷光源’但由於其晶片在發光同時亦有呷 ::二轉換成熱’其中心發光層之溫度可達到約高達四百度； 之樹脂類化合物，絲η *為具有所熱效果 樹脂傳導致而散發至、：：、二此熱度無法向上由環氧 木 成七至工乳，，、此由導線慢慢向下傳導。 當發光二極體10内之熱量蓄積過高，易使 !〇的封裝材料13因受熱不同而有 導：：體 14與《材㈣間有間隙產生，易使空氣或致導線架 使用及:短壽命，嚴重時更導致銲點或導線12脫落:入而影響 另方面，若二極體晶片所產生的熱量沒有散發出去而持 5 200534518 蓄積累，過高的工作溫度導致發光二極體p_n接面發光層之能 隙（細cticm)崩潰，如此—來，單位電流所能使發光二極體產 生的売度將大幅下降，因此發光效率即因而降低甚至破壞。由 於熱量限制了發光二極體所能注入的更大電流，使得發光二極 體無法達到真正設定規格之標準。 声睛參照第2圖，係顯示一發光二極體裝置陣列5〇，其為發 光二極體的進-步應用。該發光二極體裝置陣列5。包含複數個 發光二極體10以高密度陣列型式黏著於—基材⑽，由於其熱源 更為集中，因此上述因熱所造成之發光二極體晶粒劣化現象在 發光一極體裝置陣列5 0中更為明顯。 為了解決上述問題，以獲致更高亮度的發光二極體，許多 改善的方法已紛紛被業界所提出。其中最成功的 一 S公司之LUW發光二極請，請參照第3 = 占在於利用較大面積的金屬底座m，並採用紹質基板⑽作為 散熱片，以將晶片12〇所產生的熱傳導至空氣中，僅需顆可 相當於100顆傳統發光二極體的亮度。然而，該發光二極體⑽ 在適當的工作溫度下，其操作電流偈限在2〇mA左右，且因生 成本過高而尚未被廣泛採用。 而求，犬破發光二極體操作電流的限 置的發光效率是勢在必行的。因此， 的發光二極體裝置，即成為發光二極 為符合目前市場上的 制，以提高發光二極體裝 發展出具有更高散熱效能 體亟待解決的課題。 【發明内容】 有鑑於此’本發明的目就在於提供一種具有散熱結構之發 極體裝置：包含一導熱體，該導熱體係為一熱散柱或熱散 丄。其中’戎導熱體之-端係作為發光二極體晶粒的承載座， 200534518 而該導熱體之另_端則直接延伸至 係-高效能致冷胪體内“… ^而该散熱本體 卫體内。由於日日粒與散熱本體溫差 發光二極體晶粒時所產座沾舶旦叮*丄 扪關係，该 了斤產生的熱虿可错由該導熱體及 迅速傳至該發光-朽鰣a心从， ^文熱本體 光1繪：： 一來’即使進-步提高發 先一極體的刼作電流以提高亮度， 在一合適的工作㈤声π 士4、立 7耻毛先日日叔仍可推持 /皿又下，有效避免晶粒劣化的現象發生。 本發明之另-目的為提供一種發光二極體散熱系統，其結 Ρ或複數個發光二極體裝置與一或複數冷卻液供給裝置而妒 成一液冷式循環散熱系統，可更有效的改善發光二極體散熱的 問題。 本1明又一目的係提供一種高發光效率的照明裝置，其中 該照明裝置係包含本發明所述之具有散熱結構之發光二極體裝 置。 ^ 為達上述目的，本發明所述之一種具有散熱結構之發光二 極體裝置，包括：一散熱本體，該散熱本體具有-開口端；_ 基板，設置於該散熱本體上，具有一第一表面及一第二表面， _其中該第二表面位於該第一表面之相反側，且與該散熱本體之 開口端抵接，而該第二表面與該散熱本體之間係構成一第一空 腔，至少一導熱體，以貫穿該基板的方式設置於該基板上，且 。玄V熱體具有一延伸部及一承載部，其中該延伸部位於該第一 二月jc中，以及至y 發光一極體晶粒，設置於該導熱體之承载 部上。 此外，根據本發明一較佳實施例，該具有散熱結構之發光 一極體裝置，亦可包括：一散熱本體，具有一開口； 一承載座， 設置於該散熱本體上，具有一第一表面及一第二表面，其中該 7 200534518 rt:;!:表面之相反側，且與該散熱本體之開口抵 先一極體晶粒，設置於該承載座 ^ 液，填充於該空腔中。 丨纟面上’以及一冷卻 /為達本發明之另一目的，本發明係提供—發光 系統，該發光二極體散埶夺統包括.^ 1…、 晋或錢個冷卻液供給裝 置，以及一至複數個具有散熱結構之發光二極體裝置，續 散熱結構之發光二極體裝置與該冷卻液供給裝置連通。㈠， 該等具有散熱結構之發光二極體裝置分別包括··_散執本體， 具有-開Π端’並與該冷卻液供給裝置連通；_芙板， 該散熱本體上，具有-第一表面及一第二表面，ς中該第又二表 面位於該第-表面之相反側，且與該散熱本體之開口端抵接，、 而該第二表面與該散熱本體之間係構成一第一空腔，其中該冷 卻液供給裝置係供給-冷卻液至該第_空腔中，·至少、一導7Light Einittlng Diode (abbreviated as l) is widely used in various display products because of its advantages such as high brightness, small size, light weight, not easy to break, low power consumption and long life. The principle of light emission is as follows: Γ:] pressing on the diode 'drives the electrons in the diode to combine with the holes, and a slave. The light-emitting diode 10 is shown in the drawing. The polar chip 11 is placed on a lead frame 14, and the light-emitting diodes 2 and s are electrically connected to the lead frame 14 by wires. In addition, the light = contains-encapsulating material 13 covers the light-emitting diode. The chip u and the lead pin 15 are used to protect the light-emitting diode chip u and the lead 12. Although it is called a cold light source, but because its chip emits light, it also has 呷 :: 二 turns into heat 'its The temperature of the central light-emitting layer can reach up to about four hundred degrees; For resin compounds, the silk η * is caused by the resin that has the heat effect and is radiated to :::, Second, the heat cannot be raised from epoxy wood to seven to work milk, , This is slowly conducted down by the wire. When the heat inside the light emitting diode 10 If the accumulation is too high, it is easy to make the package material 13 conductive due to different heating: the body 14 and the gap between the material are generated, it is easy to make air or lead frame use and: short life, and even lead to solder joints in severe Or the wire 12 falls off, which affects the other side. If the heat generated by the diode chip is not released, it will accumulate. 5 200534518 Accumulated, the excessively high operating temperature will cause the energy gap of the light-emitting layer p_n junction (fine) cticm) collapse, in this way, the unitary current can greatly reduce the intensity of light-emitting diodes, so the luminous efficiency is reduced or even destroyed. Because heat limits the greater current that light-emitting diodes can inject, This makes the light-emitting diode unable to reach the standard for truly setting the specifications. Referring to FIG. 2, a light-emitting diode device array 50 is shown, which is a further application of the light-emitting diode. The light-emitting diode device Array 5. Contains a plurality of light-emitting diodes 10 adhered to the substrate 以 in a high-density array type. Because its heat source is more concentrated, the above-mentioned phenomenon of light-emitting diode grain degradation due to heat is occurring. An array of polar devices is more obvious in 50. In order to solve the above-mentioned problems to obtain higher brightness light-emitting diodes, many improved methods have been proposed by the industry. One of the most successful one is the company's LUW light-emitting diode. Please refer to No. 3 = Zhan lies in the use of a large area of the metal base m and uses a high-quality substrate ⑽ as a heat sink to conduct the heat generated by the chip 120 to the air. Only one can be equivalent to 100 The brightness of traditional light-emitting diodes. However, at the appropriate operating temperature, the operating current of the light-emitting diodes is limited to about 20 mA, and due to the high cost, it has not been widely used. It is imperative to break the limited luminous efficiency of the operating current of the light-emitting diode. Therefore, the light-emitting diode device, which becomes the light-emitting diode, is in line with the current market system, in order to improve the development of the light-emitting diode device. Problems with higher heat dissipation efficiency need to be solved urgently. [Summary of the Invention] In view of this, the object of the present invention is to provide an emitter device with a heat dissipation structure: it includes a heat conductor, and the heat conduction system is a heat dissipating column or a heat dissipating tube. Among them, the Rong heat-conductor-end system is used as the light-emitting diode die carrier, 200534518, and the other end of the heat-conductor is directly extended to the system-high-performance refrigerating body. Inside the body. Due to the relationship between the temperature and the temperature difference of the light-emitting diode grains of the heat sink body, the heat generated by the load can be mistakenly transferred from the heat conductor and quickly to the light. -鲥 鲥 心心 从 ， ^ 文 热 本体 光 1 绘 1 ： 一一 即使 'Even if you further-increase the working current of the leading polar body to increase the brightness, at a suitable working sound π 士 4, 立 7 Uncle pubic hair can still be pushed / unloaded, which can effectively prevent the phenomenon of grain degradation. Another object of the present invention is to provide a light emitting diode heat dissipation system, which has a junction or multiple light emitting diode devices. It is jealous to be a liquid-cooled circulating heat-dissipation system with one or more cooling liquid supply devices, which can more effectively improve the problem of light-emitting diodes' heat dissipation. Another object of the present invention is to provide a lighting device with high luminous efficiency, wherein the lighting The device includes a heat dissipation structure according to the present invention. Light diode device. ^ In order to achieve the above purpose, a light emitting diode device with a heat dissipation structure according to the present invention includes: a heat dissipation body, the heat dissipation body having an open end; and a substrate disposed on the heat dissipation body. Has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface and is in contact with the open end of the heat dissipation body, and the second surface and the heat dissipation body are in between A first cavity is formed, and at least one heat conductor is disposed on the substrate in a manner penetrating the substrate, and the Xuan V heat body has an extension portion and a bearing portion, wherein the extension portion is located in the first February jc. And the y-light emitting polar crystal grains are disposed on the bearing portion of the heat-conducting body. In addition, according to a preferred embodiment of the present invention, the light-emitting polar device having a heat dissipation structure may also include: a heat sink The body has an opening; a bearing seat is disposed on the heat dissipating body and has a first surface and a second surface, wherein the 7 200534518 rt:;!: Opposite sides of the surface and abutting against the opening of the heat dissipating bodyA polar body crystal is firstly arranged on the bearing seat and filled in the cavity. The surface and a cooling / to achieve another object of the present invention, the present invention provides a light-emitting system, which emits light. Diode dispersal includes ^ 1 ..., Jin or Qian cooling liquid supply device, and one to a plurality of light emitting diode devices with heat dissipation structure, light emitting diode device with continuous heat dissipation structure and the cooling liquid supply The device is connected. Well, these light-emitting diode devices with heat-dissipation structure include a diffuser body with an open end and communicate with the cooling liquid supply device; A first surface and a second surface, wherein the second and second surfaces are located on opposite sides of the first surface and are in contact with the open end of the heat dissipation body, and the second surface and the heat dissipation body are connected Forming a first cavity, wherein the cooling liquid supply device is to supply-cooling liquid to the _th cavity, at least one guide 7
體’以貫穿該基板的方式設置於該基板上，且該導熱體具有I 延伸部及一承載部，其中該延伸部位於該第一空腔中；以及至 少一發光二極體晶粒，設置於該導熱體之承載部上。 根據本發明所述之具有散熱結構之發光二極體裝置，其中 該複數個具有散熱結構之發光二極體裝置係利用至少一循環管 路與該冷卻液供給裝置（各種類形水箱、水桶、水槽，例汽、機 車散熱水箱）連通。此外，該冷卻液供給裝置係為含加壓果之冷 卻液槽或是注入式冷卻液槽，亦可為密閉式僅藉冷卻液所吸收 之熱能造成加壓動能之無外來動力的自循環系統。 為達本發明之又-目的，本發明係提供一種照明裝置，該 照明裝置包括：-控制單元；以及至少—具有散熱結構之發光 200534518 二極體裝置，與該控制單元電性連結。其中，該具有散熟社 之發光二極體裝置分別包括··一散熱本體，具有一開口端·〜構 板，設置於該散熱本體上，具有一第一表面及一第二表:基 該第二表面位於該第一表面之相反側，且與該散熱本體之開口、： 抵接，而该第二表面與該散熱本體之間係構成一第一空腔·、 一導熱體，以貫穿該基板的方式設置於該基板上，且該導2J 具有-延伸部及-承载部，其中該延伸部位於該第_空^中、體 以及至少一發光二極體晶/粒，設置於該導熱體之承载部上， 中該控制單元係點亮或熄滅該發光二極體晶粒。 ，其 根據本杳明所述之具有散熱結構之發光二極體裝置， 包括-冷卻液，填充於該空腔中。此外，該導熱體之延伸2更 至少一部份與該冷卻液接觸了 根據本發明所述之具有散熱結構之發光二極體裝置，^ 匕括透鏡形成於該第一表面上，其中該透鏡係盘該第—^更 :成一第二空腔，且該第二空腔係包含至少一該發光二拖體： 根據本發明所述之具有散熱結構之發光二極體褒置，上 ^、預疋之印刷 '塗覆純銀或純銅之高厚度、高導電 ^ >成於該基板之第-表面上並與該發光二極體電性連結。^ h 、以下藉由數個實施例及比較實施例並配合所附圖 圍^兄明本發明之特徵及優點，但並非用來限制 ^ 圍，本發明少# & <乾 之乾圍應以所附之申請專利範圍為準。 L貫施方式】 200534518 下： 具有散熱益後兔壁 本毛月係揭鉻種具有散熱結構之發光二極體裝置，其具 有優良的散熱能力，可免除習知發光二極體裝置因熱傳導效率 差，所導致之發光效率偏低及發光二極體晶粒劣化等問題。 首先，明苓照第4a、4b圖，係顯示一符合本發明之一單 一晶片型發光二極體裝置2〇〇,用來說明本發明之基本結構。該 發光-極體裝置2GG包含有—發光二極體晶粒21Q、複數條導熱 體220、一基板230、一散熱本體24〇、及一光學透鏡25〇。 該導熱體220分為一承載部222及一延伸部224。該延伸 部224係為該導熱體22〇向下突出於該基板23〇之第二表面2抑 的部分，請參照第5a圖。而該承載部222剌於置放該發光二 極體晶粒2丨0。該基板230係具有一第一表面231及一第二表面 233,而該第二表面233係位於該第一表面231之相反侧。該基 板230更包括一貫孔234，而該貫孔2料係由該基板之一第一表 面231貫穿至該第二表面233。而該導熱體22〇經由該貫孔2料 牙越該基板230,並以貫穿該基板230的方式設置於該基板23〇 上，並使其延伸部位224於與該基板之第二表面233之同一側。 该發光二極體裝置2〇〇可具有單一或複數個發光二極體晶粒 210°该導熱體220在設計上可為一長條形導熱柱（如第“至4c 圖）、一環狀導熱柱（如第4d至4f圖）、一米字形導熱柱（如第 4g至4ι圖）、或一長條形導熱柱（如第至4丨圖），若導熱體 220為環狀導熱柱、米字形導熱柱、或長條形導熱柱時，該導熱 體220可同時具有複數個發光二極體晶粒21()以線性排列方式The body is disposed on the substrate in a manner penetrating the substrate, and the thermal conductor has an I extension portion and a bearing portion, wherein the extension portion is located in the first cavity; and at least one light emitting diode crystal is provided. On the bearing portion of the thermal conductor. According to the light-emitting diode device having a heat-dissipating structure according to the present invention, the plurality of light-emitting diode devices having a heat-dissipating structure use at least one circulation pipeline and the cooling liquid supply device (various types of water tanks, buckets, Water tanks, such as steam and locomotive cooling water tanks). In addition, the cooling liquid supply device is a cooling liquid tank containing a pressurized fruit or an injection type cooling liquid tank, and it can also be a closed type self-circulating system without external power that generates pressurized kinetic energy only by the thermal energy absorbed by the cooling liquid. . To achieve another object of the present invention, the present invention provides a lighting device, which includes:-a control unit; and at least-a light-emitting 200534518 diode device with a heat dissipation structure, which is electrically connected to the control unit. Wherein, the light-emitting diode device with a Sanshu company includes a heat-dissipating body with an open end. A structural plate is disposed on the heat-dissipating body and has a first surface and a second table. The second surface is located on the opposite side of the first surface and is in contact with the opening of the heat sink body, and a first cavity and a heat conductor are formed between the second surface and the heat sink body to penetrate The method of the substrate is disposed on the substrate, and the guide 2J has an extension portion and a bearing portion, wherein the extension portion is located in the _th hollow body, and at least one light-emitting diode crystal / grain is disposed on the substrate. On the bearing part of the heat conductor, the control unit lights or extinguishes the light-emitting diode grains. According to the light-emitting diode device having a heat dissipation structure described in this document, the cooling device is filled in the cavity. In addition, at least a part of the extension 2 of the heat-conducting body is in contact with the cooling liquid according to the light-emitting diode device having a heat dissipation structure according to the present invention. The second plate is formed into a second cavity, and the second cavity includes at least one light-emitting diode body: according to the present invention, a light-emitting diode with a heat-dissipating structure is arranged. The pre-printed printing is coated with high thickness and high conductivity of pure silver or pure copper on the first surface of the substrate and is electrically connected to the light-emitting diode. ^ h. The following uses several examples and comparative examples in conjunction with the drawings to illustrate the features and advantages of the present invention, but is not intended to limit the scope of the present invention. # & The scope of the attached patent application shall prevail. L method of application] 200534518 Bottom: Chromium type radiating diode device with heat-dissipating structure has excellent heat-dissipation ability, which can eliminate the conventional light-emitting diode device due to heat conduction efficiency. Poor, resulting in low luminous efficiency and degradation of light-emitting diode grains. First, according to Figures 4a and 4b, Mingling shows a single wafer-type light emitting diode device 200 in accordance with the present invention, which is used to explain the basic structure of the present invention. The light-emitting-pole device 2GG includes a light-emitting diode die 21Q, a plurality of heat conductors 220, a substrate 230, a heat-dissipating body 24o, and an optical lens 25o. The heat-conducting body 220 is divided into a supporting portion 222 and an extending portion 224. The extending portion 224 is a portion where the heat conductor 22o protrudes downward from the second surface 2 of the substrate 23o. Please refer to FIG. 5a. The supporting portion 222 is used for placing the light-emitting diode crystals 2 丨 0. The substrate 230 has a first surface 231 and a second surface 233, and the second surface 233 is located on the opposite side of the first surface 231. The base plate 230 further includes a through hole 234, and the through hole 2 is penetrated from a first surface 231 of the base plate to the second surface 233. The thermal conductor 22 passes through the through hole 2 and passes over the substrate 230, and is disposed on the substrate 23 in a manner penetrating the substrate 230, and the extension portion 224 of the thermal conductor 22 is in contact with the second surface 233 of the substrate. On the same side. The light-emitting diode device 200 may have a single or a plurality of light-emitting diode grains 210 °, and the heat-conducting body 220 may be designed as a long-shaped heat-conducting post (as shown in FIG. 4 to 4c) and a ring shape. Thermally conductive pillars (as shown in Figures 4d to 4f), one-meter-shaped thermally conductive pillars (as shown in Figures 4g to 4ι), or a long-shaped thermally conductive pillar (as shown in Figures 4 to 4 丨), if the thermal conductor 220 is a ring-shaped thermally conductive pillar , M-shaped heat-conducting pillars, or long heat-conducting pillars, the heat-conducting body 220 may simultaneously have a plurality of light-emitting diode crystal grains 21 () in a linear arrangement
200534518 (一維陣列）配置於其之承載部222的一承載面227上。 該基板230之主要功用之一係用來固定該 該基謂之第-表請可具有一圖案化的電路236，可0利用且 導線237與該發光二極體晶纟21〇 f性連結，作為其驅動電路。 在該發光二極體裝置200申，該基板230係以第二表面2犯與 該散熱本體240抵接，且該基板23()與該散熱本體24()係構成 —完全密閉的空腔260,其中上述導熱體22〇之延伸部224係設 置於該空腔260内。本發明所述之發光二極體裝置，其空腔 内可更包含-固^量之冷卻液280，其目的在於加速由二極體晶 粒210傳至導熱體220的熱量更快速的散逸。 根據本發明所述之發光二極體裝置，該導熱體22〇之該承 載部222及該延伸部224皆具有高導熱的能力，可分別由相同 或=同的熱導材料所製成，其中該熱導材料可例如為銀、銅、 銘等金屬或其合金’亦可為陶究複合材料、金屬氧化物或1混 合物。該散熱本體可以沖壓、壓鑄、粉末冶金、注射、車床加 工或烊之方式所形成。該承載部222具有一承載面227，面積可 為〇.5~2腿2’該承載部222可更包含一反射層2找形成於1上， 請參照第5d及5§圖，其中該反射層之可為金、銀、紹、石夕、 銅鉻、鈦、鶴或銦等金屬或其合金材料。本發明對於所使用 之發光二極體晶粒21G種類並無限制，可為藍光、綠光、紅光、 2或是電射發光二極體。由於本發明之主要散熱途徑係為該 導二體220而非該基板23〇’因此本發明在基板23〇之種類選用 上並無限制’為一般之印刷電路板即可，且該基板可沈積-反 射層’例如-銀層。該散熱柱係以一貫穿該基板的方式設置於 遠基板上’且該導熱體22〇與該基板23〇之相對關係並無限定， 11 200534518 可視需要而加以調整，請參照第5a七及5e圖所示。此外，該 導熱體2 2 0延仲部9 9 λα & + p 224的覓度可大於該貫孔的寬度，請參照第 5f及5h圖所示。該承載面m，可為平面或一凹面。 此:卜，該散熱本體240，例如為一散熱杯，可進一步具有 、出卩ϋ亥犬出部可形成於散熱本體之内側或外侧，盆 中該散熱本體240之材質可為銀、銅、鎢、鎳、石夕、銘、钥： 陶竞複合材料、類鑽碳材料、金屬氧化物或其混合。本發明對 該散熱本體的型狀並益；隹 本> 體或立方體。無進一步之限制’可為具有-開口之圓柱 卜該成何狀散熱本體24〇，例如為一散熱桶，可進一 ^、有各種高散熱幾何形體之變化，以突出金屬村料之聲子、 i由：：：電洞之傳熱能量材質可為銀、銅、鋁、陶竞複合材 右非〜氧化物或其混合。本發明所述之該幾何散熱本體可具 f吊夕種的變化，較佳可分為圓桶型(第6a至6e圖）、四面 :雨型? “至6〇圖）、多面體桶型（第6P至圖）、橢圓桶 形種(第㈣圖)，且散熱本體亦可具-或複數個 W孔洞。請夢照第63至⑪圖，係列舉出25種符合本發明 所述之具有幾何型狀之散熱本體之立體剖面圖， 係為第63至6"對應之剖面圖。本發明所述’之具有 成何型狀之散熱本體並可因工作環境及功率财放大、縮小、 。此外，該空腔260内之所注入之冷卻液28〇其液面 ^土 U散熱柱220或各形導熱座接觸，若與該基板23〇之 弟-表面233接觸則為更佳。於本發明中，適用之冷卻液28〇 可為水、有機溶液、液態之烴化物、液態氨、液態氮…各種古 吸熱液體，其中該有機溶液可例如為醇類、院類喝類或剩類二 以下特舉實施例1，並以陣列式發光二極體 以說明本發明所述之具有散熱結構之發光二極Μ置之製作 12 200534518 m \方式，亚進一步量測其光電性質，以期使本發明之特徵及優 點更為清楚： 實施例1 : 士請參照第8圖，係顯示一陣列式發光二極體裝置3〇〇的組 裝圖。首先，取20條圓柱狀之鋁質導熱體31〇，每一散熱柱上 之承載面312固合一發光二極體晶粒32〇(為台灣廣鎵公司生 產，型號514)。該圓柱狀之散熱柱之長為25mm，直徑為i 5·。 言《光二極體晶粒32〇之直徑為14mU，當其驅動功率為2〇mA φ時，其發光亮度為40〜50mcd。將該發光二極體晶粒320固合於 该散熱柱上之承載面312的方式包括以下步驟··首先在該承載面 312上形成複數條長約3〜6mil，寬約〇•卜2· 〇mii的溝槽， 清見第9a圖。接著，將黏著劑（或銲料）形成於該溝槽内，並將 口玄毛光一極體Ba粒320以該黏著劑（或銲料）固合於該承載面 312上，請見第9b圖。利用上述步驟固合發光二極體晶粒32〇 不但可增加晶粒320與承載面312之固合強度，且仍能維持不 錯的導熱效果。 接著，取一 40x40匪的印刷電路板330，其上已完成一電 •路圖形。該印刷電路板之厚度為2mra，其上具有20個貫孔332， :母一貫孔之直徑為1.5議。接著，將上述散熱柱經由該貫孔 穿越該基板330,並以貫穿該基板33〇的方式設置於該基板33〇 上。其中，該導熱體310之承載面312約與該基板33〇之頂部 334切齊，該導熱體31〇之其餘部分係露出該基板33〇之底部 336。完成散熱柱之設置後，用金線將該發光二極體晶粒與該電 路圖形作電性連結。 接著，提供一散熱本體340，例如為一方型散熱桶，係為 銅銀、鋁材質，其内容積為30ml。接著，取體積為該散熱本 體之容積之90〜97%的冷卻液加入該散熱本體34〇中，並將該散 13 200534518 熱本體340固合於該基板330之底部，使導熱體31〇之露出部 分完全被該散熱本體340所覆蓋。最後，提供一投射型光學透 鏡3 6 0形成於該基板3 3 0之頂部3 3 4以覆蓋該發光二極體晶粒 320 ’其中，該光學透鏡360係與該發光二極體晶粒保持一特定 距離，而該特定距離係不小於〇·5_。至此，完成本發明所述之 陣列式發光二極體裝置300。 為進一步驗註本發明所述之具有散熱結構之發光二極體 裝置300其優良之散熱能力，以下將實施例一所得之陣列式發 光二極體裝置，以不同之操作電壓及電流分別點亮八小時後， 測量其亮度及晶粒之操作溫度，結果如表1所示。200534518 (one-dimensional array) is disposed on a bearing surface 227 of the bearing portion 222 thereof. One of the main functions of the substrate 230 is to fix the first form of the base term. It may have a patterned circuit 236, may be used, and the wire 237 is sexually connected to the light-emitting diode crystal 21f. As its driving circuit. In the light emitting diode device 200, the substrate 230 is in contact with the heat dissipation body 240 with the second surface 2 and the substrate 23 () and the heat dissipation body 24 () are constituted-a completely enclosed cavity 260. Wherein, the extending portion 224 of the heat conducting body 22 is disposed in the cavity 260. The light-emitting diode device according to the present invention may further include a -solid amount of cooling liquid 280 in its cavity, the purpose of which is to accelerate the dissipation of the heat transferred from the diode particles 210 to the heat conductor 220 more quickly. According to the light-emitting diode device of the present invention, the load-bearing portion 222 and the extension portion 224 of the heat-conducting body 22 have high heat-conducting capabilities, and can be made of the same or equal heat-conducting materials, respectively, wherein The thermally conductive material may be, for example, a metal such as silver, copper, or a metal or an alloy thereof, or may be a ceramic composite material, a metal oxide, or a mixture. The heat-dissipating body can be formed by stamping, die-casting, powder metallurgy, injection, lathe machining or osmium. The bearing portion 222 has a bearing surface 227 with an area of 0.5 to 2 legs 2 ′. The bearing portion 222 may further include a reflection layer 2 formed on the 1 portion. Please refer to FIGS. 5d and 5§, where the reflection The layers can be metals such as gold, silver, shaw, shixi, copper-chrome, titanium, crane, or indium, or alloy materials thereof. The invention does not limit the type of the light-emitting diode crystal 21G used, and it can be blue light, green light, red light, 2 or electroluminescent light-emitting diode. Since the main heat dissipation route of the present invention is the conductive body 220 instead of the substrate 23 ′, the present invention has no limitation on the selection of the substrate 23 ′, which is a general printed circuit board, and the substrate can be deposited. -Reflective layer ', for example, a silver layer. The heat dissipating column is arranged on the far substrate in a way that penetrates the substrate, and the relative relationship between the thermal conductor 22o and the substrate 23o is not limited. 11 200534518 It can be adjusted as needed, please refer to 5a7 and 5e As shown. In addition, the degree of search of the heat conduction body 2 2 0 extension section 9 9 λα & + p 224 can be greater than the width of the through hole, please refer to the figures 5f and 5h. The bearing surface m may be a flat surface or a concave surface. This: Bu, the heat-dissipating body 240, for example, may be a heat-dissipating cup, which may further have an outlet portion formed on the inside or outside of the heat-dissipating body. The material of the heat-dissipating body 240 in the basin may be silver, copper, Tungsten, nickel, Shi Xi, Ming, Key: Tao Jing composite materials, diamond-like carbon materials, metal oxides or mixtures thereof. The present invention benefits the shape of the heat-dissipating body; the body or cube. Without further restrictions, it can be a cylindrical body with an opening. The heat dissipation body 24 can be, for example, a heat dissipation barrel, which can be further modified with various high heat dissipation geometries to highlight the metal phonons, i ::: The heat transfer energy material of the hole can be silver, copper, aluminum, ceramics, or non-oxide or a mixture thereof. The geometrical heat dissipation body according to the present invention may have various variations, and is preferably classified into a barrel type (Figures 6a to 6e), four sides: rain type? "To Figure 60", and a polyhedron barrel type ( Figure 6P to Figure), elliptical barrel type (Figure ㈣), and the heat sink body can also have-or a plurality of W holes. Please dream according to Figures 63 to ，, a series of 25 kinds of The three-dimensional sectional view of the geometrical shape of the heat-dissipating body is the corresponding sectional view of Nos. 63 to 6. The shape of the heat-dissipating body described in the present invention can be enlarged, reduced, and reduced due to the working environment and power consumption. In addition, the injected cooling liquid 28 in the cavity 260 has a liquid level ^ U heat dissipation column 220 or various heat conducting seats, and it is better to contact the brother-surface 233 of the substrate 23. In this case In the invention, the suitable cooling liquid 28 may be water, organic solution, liquid hydrocarbon, liquid ammonia, liquid nitrogen, etc., various ancient endothermic liquids, among which the organic solution may be, for example, alcohols, hospital drinks, or leftovers. Example 1 is given below, and an array-type light-emitting diode is used to illustrate the present invention. The structure of the light-emitting diode M of the structure is 12 200534518 m, and the photoelectric properties are further measured in order to make the features and advantages of the present invention clearer. Example 1: Please refer to FIG. 8 for an array Assembly diagram of a light-emitting diode device 300. First, take 20 cylindrical aluminum heat conductors 31, and the bearing surface 312 on each heat-dissipating column fixes a light-emitting diode grain 32 (for Produced by Taiwan Guang Ga Company, model 514). The cylindrical heat sink has a length of 25 mm and a diameter of i 5 ·. The diameter of the photodiode crystal grain 32 is 14 mU, when its driving power is 20 mA φ At the time, its luminous brightness is 40 ~ 50mcd. The method of fixing the light-emitting diode die 320 to the bearing surface 312 on the heat dissipation column includes the following steps: First, a plurality of strips with a length of about 3 are formed on the bearing surface 312. A groove with a width of ~ 6mil and a width of about 0 · 2mi. See Figure 9a. Next, an adhesive (or solder) is formed in the groove, and the mouth-light hair-polar body Ba particles 320 are formed in the groove. Adhesive (or solder) is fixed on the bearing surface 312, see Figure 9b. Use the above steps The combined light-emitting diode die 32 can not only increase the bonding strength of the die 320 and the bearing surface 312, but also maintain a good thermal conductivity effect. Next, take a 40x40 band printed circuit board 330, which has been completed. Electrical circuit pattern. The thickness of the printed circuit board is 2mra, and there are 20 through holes 332, the diameter of the female through hole is 1.5. Then, the heat dissipation column passes through the substrate 330 through the through hole, and A method of penetrating the substrate 33 is provided on the substrate 33. The bearing surface 312 of the thermal conductor 310 is approximately aligned with the top 334 of the substrate 33, and the rest of the thermal conductor 31 is exposed to the substrate 33. 〇 的 bottom 336. After the setting of the heat dissipation column is completed, the light emitting diode grains are electrically connected to the circuit pattern with gold wires. Next, a heat-dissipating body 340 is provided, such as a square-type heat-dissipating barrel, which is made of copper, silver, or aluminum, and has an inner volume of 30 ml. Next, take 90 ~ 97% of the cooling fluid with a volume of 90 to 97% of the volume of the heat sink body, and add the heat sink body 34 to the heat sink body 34. The exposed portion is completely covered by the heat dissipation body 340. Finally, a projection-type optical lens 3 6 0 is formed on the top 3 3 4 of the substrate 3 3 0 to cover the light-emitting diode crystals 320 ′, wherein the optical lens 360 is held by the light-emitting diode crystals. A specific distance, and the specific distance is not less than 0.5. So far, the array type light emitting diode device 300 according to the present invention is completed. In order to further verify the excellent heat dissipation capability of the light-emitting diode device 300 with a heat-dissipating structure according to the present invention, the array type light-emitting diode device obtained in Example 1 will be separately lit with different operating voltages and currents. After eight hours, the brightness and the operating temperature of the crystal grains were measured. The results are shown in Table 1.
表1 當發光二極體晶粒在多顆組合時，容易因熱源過度集中及 個-極體晶粒平均散熱面積減少等原因，導致發光二極體晶粒 之工作’里度過鬲，進而引起發光效率的降低，甚至造成發光二 極體晶粒的劣化。實施例1所使用之發光二極體晶粒其原本之 ，大適用電乾為係為20mA。而在上述試驗中，當操作電壓提 昇至3. 6V時，平均每顆晶粒係以正常狀況下的2倍電流量 (40⑷被點亮。此時，該發光二極體晶粒之工作溫度仍在發光 二極^正常工作溫度範圍⑽。C)内，由此可知，本發明所述之 ’、有政熱、、、口構之發光二極體裝置具有優點的散熱機制，可迅速 14 200534518 將熱傳致二極體晶粒外。 實施例2 : ^ , ^ ^ 八運仃，但將該20條20條圓柱狀 之鋁質導熱體310置換為3袍俨处、首土 ^ ^ ν丄 個衣狀導熱體（長為25mm〜85画，直 從分別為XX mm、1 · 〇mm乃1 e n且環片厚mo.5腦）， 且母一裱狀導熱體之承载面八 ,^ 執1^ d12分別固合3、7及10個發光二 極體晶粒3 2 0。此外，將今古荆此上 外Λ 肘忒方型散熱桶置換為一圓型散熱桶，如 弟10圖所示。 豐立二極體散熱系％ 本么明亦關於-種發光二極體散熱系統依據熱功學第2定 熱水遠不會自動從冷物體流向熱物體的單行道流動法則，與 …機的基本理念，熱從高溫流向低温就可得機械功，而熱機在Τ :契Te°ld兩個脈度之間運作時作功，δρ受制於散熱本體的熱壑 作用後的溫度差拿來作自動循環的内能或功之理論，其係將至 少-個本發明所述具有散熱系統結構之發光二極體裝置，以最 ^-循環管路將其散熱本體與—冷卻液供給$置連通，達到循 %冷部發光二極體裝置的目的。請參照第lu圖及第爪圖， φ係顯示本發明所述之發光二極體散熱系統之一較佳實施例 的方塊圖。在此較佳實施例中，該發光二極體散熱系統包含四 個發光二極體裝置300、一冷卻液循環管路41〇及一溫度提升後 加堡了的熱水彎形循環管侧及一冷卻液供給裝置42〇，而冷 部液供給裝置42G係提供-冷卻液·在該發光二極體裝置_ 之散熱本體340及循環管路41〇與舰内構成之系統内循環。 其甲該冷卻液供給裝i可為一含加麼泵之冷卻液槽或是注入式 冷部液槽或密閉式僅借冷卻液所吸收之熱能造成加壓動能之無 外來動力的自循環系統。其中該溫度提升後加麼了的熱水彎形 循裱管410A可控制循環時所須加壓與加溫的能量點，具有可—面 15 200534518 ， 循環一面冷卻之特殊作用。 本每明所述之發光二極體散熱系統，可進一步應用於車用 赉光一極體照明設備之整合，像是將依照本發明所述之具有散 熱結構之發光二極體裝置所設計的頭燈、霧燈、方向燈^剎^ 燈或進入家用、民生用照明系統只須與一加壓水箱結合，或利 用冷卻液熱脹之加壓動能造成自動循環體系。 照明裝置 凊芩照第12圖，本發明所述之具有散熱結構之發光二極 體裝置300，可進一步利用一電路51〇肖一控制單元⑽電性 連結，形成一照明裝置500,可例如為一室内燈、大型室外燈、 投射燈、交通號諸燈、路燈及車燈。#中，該控制單元係用且以 點亮或熄滅該發光二極體裝置之發光二極體晶粒，例如為一電 =。請翏照第13 ®，係為本發明所述之照明裝置5〇〇 一較佳 實施例的示意圖，該照明裝置5〇〇可例如為一車燈，其具有^ 數個具散熱系統結構之發光二極體裝置3〇〇，並設置於一控制 單元520上，而該控制單元52〇係以電路51〇電性連結該發光 二極體裝置300。此外該照明裝置5〇〇具有一廣角燈罩53〇， 鲁其上具有複數個凸起之透鏡部54〇，可增加該些發光二極 置300的照射角度。此外，請參照帛14圖，係顯示一结合^ 光二極體裝置300及一網片式車用散熱水箱61〇的車燈㈣ 綜上所述，本發明所述之具有散熱系統結構之發光二極體 裝置，無論是利用密閉式或循環式的液冷系統，其藉由作為發 光二極體晶片的承載座的各形導熱座或導熱柱，在第—時間内 以冷卻液吸收該發光二極體晶片所產生的熱，再料量傳至續 散熱本體’直接散發至環境中。如此—來，在保持該發光二極 體在-正常之刼作溫度的前提下，可使該發光二極體以更高的 16 200534518 電流來驅動，發揮更高的功率。 此外，傳統的發光二極體裝置係制 板作為發光二極體裝置散熱部件， 7積之孟屬基 之導線金線)與發光二極體二=有： =:=，—_度上昇=:度 献Γί 導線㈣，甚至斷裂。本發明所述之具有散 ϊ;Γ:Γ極體裝置，係利用不同的部件進行多重式導-或放熱，因此可避免習知技術所產生的問題。 ¥'，、、 請參照第15圖，係顯示符合本發明另一較佳實施例之呈 ，構之發光二極體裝置700。該發光二極體裝置係具 極體體701、一承载座702、一空腔703、複數之發光二 才玉體日日粒7 〇 4、及一；人名R、'右7 η = 3+ * _ 7 夜705。其中，該散熱本體701係具有 :，口 ’而該承載座係係具有一第一表面及一第二表面，其中 該第二表面位於該第一表面之相反側。 /、 雕該承載I 702係設置於該散熱本豸7〇1上，並與該散熱本 版之開口抵接，而該承載座7G2之第二表面係與該散熱本 體之間構成一空腔703，而該冷卻液705係注滿於該空腔7〇3 中在本發明中，該冷卻液7〇5之注入方式並不特別限定，可 =開始利用該開π注人，或另外由該散熱本體加之一注入 口 =入。在此，該散熱本體701可具有複數之卡合部70δ，以 口 =該承載座702。此外，在設計上，該散熱本體7〇1與該承 载座702亦可為一體成型。該複數之發光二極體晶粒704係配 ;°亥承載座7〇2之第一表面上，值得注意的是，該承載座了〇2 之第一表面可為一平面（如第15圖所示），該第一表面亦可具 凹陷部C如第16圖所示）或一凸出部（如第17b圖所示）， 而ϋ亥發光二極體晶粒704可配置於該凹陷部或該凸出部表面 17 200534518 ~ 上。該複數之發光二極體晶粒704可利用導線707以與一電路 板7 0 6電性連結。 請參照第1 7a圖及1 7b圖，在本發明某些較佳實施例中， 該散熱本體在設計上係呈現ϋ型，亦即使散熱本體7〇1自承载 座702下方延伸至發光二極體晶粒7〇4周圍上方，以增加散熱 效率，其原因在於當透光罩覆蓋並密封住發光二極體晶粒時，' 由於熱能將會集中於發光二極體晶粒7〇4周圍上方之而非承载 座702下方，因此藉由延伸至發光二極體晶粒7〇4周圍上方之 •散熱本體701内之冷卻液，可以更快速有效的吸收熱量。此外， 請茶照第18圖，該發光二極體晶粒704之正下方更可具有一 貫孔710，貫穿該承載座7〇2，且該發光二極體晶粒7〇4係完 王復盍該貫孔之上（即該貫孔71〇係被該發光二極體晶粒 所封閉）。叹计该貝孔之目的在於使該發光二極體晶粒之底部 可藉由該貫孔與該冷卻液接觸，增加散熱效率。而在二極體晶 氺之叹计上，可將導電部做在上部，或使二極體晶粒之底部（例 如石夕基底）不導電，因此不會影響發光二極體晶粒之發光效能。 鲁请參照第19圖，係顯示符合本發明另一較佳實施例之具 有散熱結構之發光二極體裝置800的方塊圖。在此較佳實施例 中"亥毛光一極體散熱系統800包含發光二極體裝置7〇〇、一冷 ,Ρ液循％ g路730及一冷卻液槽720,而該冷卻液槽係利用該冷 部液循裱管路730與該發光二極體裝置7〇〇連通。冷卻液槽72〇 #'^，的對流原理’使得該發光二極體裝置700之散熱本體 及循¥吕路730内構成一内循環系統。值得注意的是，該冷卻 、槽720在配置上較佳係配置在較該發光二極體裝置高的位 置，以利熱的對流，增加散熱效率。 此外’ 5月參照第20圖，本發明所述之具有散熱結構之發光 18 200534518 二極體裝置900，可進一 系統740，與該冷卻液槽 大幅增加散熱效率。 步备配一加壓泵、或無外動力之自循環 及σ亥發光一極體裝置連通，如此一來可 太菸日:…、本毛明已以較佳實施例揭露如上，然其並非用以限定 \ ’任何熟習此技藝者，在不脫離本發明之精神和範圍 附之申睛專利範圍所界定者為準。 【圖式簡單說明】Table 1 When the light-emitting diode grains are in multiple combinations, it is easy to cause excessive work in the work of the light-emitting diode grains due to the excessive concentration of heat sources and the decrease in the average heat dissipation area of the individual-pole crystal grains. Causes a decrease in luminous efficiency, and even causes deterioration of the light-emitting diode grains. The light-emitting diode grains used in Example 1 are originally 20 mA, which is suitable for electric drying. In the above test, when the operating voltage was increased to 3.6 V, each crystal grain was lit at twice the normal current amount (40 ° under normal conditions. At this time, the operating temperature of the light-emitting diode crystal grains). It is still within the normal operating temperature range of the light-emitting diode (C). From this, it can be seen that the light-emitting diode device described in the present invention has a favorable heat dissipation mechanism, which can quickly 200534518 Causes heat transfer outside the diode grain. Example 2: ^, ^ ^ Eighth, 将该, but replaced the 20 20 cylindrical aluminum heat conductors 310 with 3 robes, the first soil ^ ^ ν 衣 clothing-like heat conductors (length 25mm ~ 85 paintings, straight from XX mm, 1.0 mm are 1 en and the thickness of the ring is mo.5 brain), and the bearing surface of the mother-mounted heat-conducting body eight, ^ 1 1 d12 fixed 3, 7 respectively And 10 light-emitting diode grains 3 2 0. In addition, replace the ancient 荆 elbow square heat sink with a round one, as shown in Figure 10. Feng Li Diode Radiating System% Ben Meming is also about a kind of light-emitting diode cooling system based on the second law of thermodynamics. Hot water will not automatically flow from cold objects to hot objects on the one-way flow rule, and ... The basic idea is that mechanical work can be obtained from heat flowing from high temperature to low temperature, and the heat engine works when it operates between two pulses of T: Te ° ld, and δρ is controlled by the temperature difference caused by the heat of the cooling body. The theory of internal energy or work of automatic circulation is to connect at least one light-emitting diode device with a heat-dissipating system structure according to the present invention, and connect its heat-dissipating body to the cooling-fluid supply unit through the most circulating pipeline. , To achieve the purpose of the% cold section light emitting diode device. Please refer to the lu diagram and the claw diagram. Φ is a block diagram showing a preferred embodiment of the light emitting diode heat dissipation system according to the present invention. In this preferred embodiment, the light-emitting diode heat dissipation system includes four light-emitting diode devices 300, a cooling liquid circulation pipe 41, and a heated hot water curved circulation pipe side after the temperature increase and A cooling liquid supply device 42o, and the cold part liquid supply device 42G is provided-coolant · circulates in a system constituted by the heat dissipation body 340 and the circulation pipeline 41 of the light emitting diode device. The cooling liquid supply device i can be a cooling liquid tank containing a pump or an injection-type cold-port liquid tank or a closed type self-circulating system without external power that generates pressurized kinetic energy only by the heat energy absorbed by the cooling liquid. . Among them, the hot-water curved pipe 410A that has been added after the temperature rise can control the energy point of pressurization and heating during circulation, and has the special function of cooling on the side of the circulation 15 200534518. The light-emitting diode heat dissipation system described in the present invention can be further applied to the integration of automotive light-emitting diode lighting equipment, such as a head designed according to the light-emitting diode device having a heat dissipation structure according to the present invention. Lights, fog lights, direction lights ^ brake ^ lights or enter the home, civilian life lighting system only need to be combined with a pressurized water tank, or the use of cooling fluid thermal expansion of pressurized kinetic energy to create an automatic circulation system. The lighting device according to FIG. 12 shows that the light-emitting diode device 300 having a heat dissipation structure according to the present invention can be further electrically connected by a circuit 51 and a control unit to form a lighting device 500, which can be, for example, An indoor light, large outdoor light, projection light, traffic light, street light and car light. In #, the control unit is used to light up or extinguish the light-emitting diode grains of the light-emitting diode device, for example, an electric =. Please refer to No. 13®, which is a schematic diagram of a preferred embodiment of the lighting device 5000 according to the present invention. The lighting device 500 may be, for example, a car light, which has several structures with a heat dissipation system. The light-emitting diode device 300 is disposed on a control unit 520, and the control unit 52 is electrically connected to the light-emitting diode device 300 by a circuit 51. In addition, the lighting device 500 has a wide-angle lampshade 53 and a plurality of convex lens portions 54o thereon, which can increase the irradiation angle of the light emitting diodes 300. In addition, please refer to 帛 14, which shows a vehicle light combining ^ photodiode device 300 and a mesh-type vehicle radiator water tank 61. In summary, the light-emitting diode 2 with a heat dissipation system structure according to the present invention is described. Polar device, whether it is a closed or circulating liquid cooling system, it uses the various heat conducting bases or pillars as the supporting base of the light emitting diode wafer to absorb the light emitting diode with the cooling liquid in the first time. The amount of heat generated by the polar body wafer is transferred to the continuous heat sink body, which is directly dissipated to the environment. In this way, the light-emitting diode can be driven at a higher current of 16 200534518 under the premise of maintaining the normal operating temperature of the light-emitting diode to exert higher power. In addition, the traditional light-emitting diode device system board is used as the heat-dissipating component of the light-emitting diode device, and the product is a gold wire of the lead of the Mengsi group. : Degree Xian Γί Conductor ㈣, even broken. The Γ: Γ polar body device described in the present invention uses multiple components to conduct multiple conductions or heat releases, so the problems caused by the conventional technology can be avoided. ¥ ',,, Please refer to FIG. 15, which shows a light emitting diode device 700 according to another preferred embodiment of the present invention. The light-emitting diode device is provided with a polar body 701, a supporting base 702, a cavity 703, a plurality of light-emitting two-tasty jade bodies, the sun and grains 704, and one; the person's name R, 'right 7 η = 3+ * _ 7 nights 705. Wherein, the heat-dissipating body 701 has an opening, and the supporting base has a first surface and a second surface, wherein the second surface is located on the opposite side of the first surface. / 、 Carving the bearing I 702 is arranged on the heat sink book 701 and abuts the opening of the heat sink book, and the second surface of the bearing seat 7G2 forms a cavity 703 between the heat sink body and the heat sink body. The cooling liquid 705 is filled in the cavity 703. In the present invention, the injection method of the cooling liquid 705 is not particularly limited. It can be used to start using the open π injection or otherwise The heat dissipation body plus one injection port = in. Here, the heat-dissipating body 701 may have a plurality of engaging portions 70δ, and the opening = the bearing seat 702. In addition, in design, the heat-dissipating body 701 and the support base 702 may be integrally formed. The plurality of light-emitting diode crystal grains 704 are matched; on the first surface of the bearing base 702, it is worth noting that the first surface of the bearing base 02 may be a flat surface (as shown in FIG. 15). (Shown), the first surface may also have a recessed portion C as shown in FIG. 16) or a protruding portion (as shown in FIG. 17b), and the light-emitting diode chip 704 may be disposed in the recess Or the surface of the protrusion 17 200534518 ~. The plurality of light-emitting diode dies 704 can be electrically connected to a circuit board 706 by a wire 707. Please refer to FIG. 17a and FIG. 17b. In some preferred embodiments of the present invention, the heat dissipating body is designed to be ϋ-shaped, even if the heat dissipating body 701 extends from below the supporting base 702 to the light emitting diode. Around the bulk crystal grains 704 to increase heat dissipation efficiency, the reason is that when the light-transmitting cover covers and seals the light-emitting diode grains, 'the thermal energy will be concentrated around the light-emitting diode grains 704 The upper part is not the lower part of the bearing seat 702, so by using the cooling liquid in the heat dissipation body 701 that extends above and around the light emitting diode chip 704, heat can be absorbed more quickly and efficiently. In addition, please tea according to FIG. 18, there may be a through hole 710 directly below the light-emitting diode die 704, penetrating the carrier 702, and the light-emitting diode die 704 is completed by Wang Fuzheng. Above the through-hole (that is, the through-hole 710 is closed by the light-emitting diode grains). The purpose of the bevel hole is to make the bottom of the light-emitting diode grains contact the cooling liquid through the through hole, and increase the heat dissipation efficiency. On the diode sigh meter, the conductive part can be made on the upper part, or the bottom of the diode grain (such as the Shixi substrate) is not conductive, so it will not affect the light-emitting diode grain. efficacy. Please refer to FIG. 19, which is a block diagram showing a light emitting diode device 800 having a heat dissipation structure according to another preferred embodiment of the present invention. In this preferred embodiment, " Hai Maoguang Unipolar Heat Dissipation System 800 includes a light emitting diode device 700, a cold, P liquid circulation% g road 730, and a cooling liquid tank 720, and the cooling liquid tank system The cold liquid is used to communicate with the light emitting diode device 700 through the mounting pipeline 730. The convection principle of the cooling liquid tank 72 ° # 'makes the heat-dissipating body of the light-emitting diode device 700 and the circulation path 730 constitute an internal circulation system. It is worth noting that the cooling groove 720 is preferably arranged at a higher position than the light emitting diode device in order to facilitate heat convection and increase heat dissipation efficiency. In addition, referring to FIG. 20 in May, the light emitting device with a heat dissipation structure according to the present invention 18 200534518 diode device 900 can be added to a system 740, and the cooling liquid tank greatly increases the heat dissipation efficiency. Step by step equipped with a booster pump, or self-circulation without external power and sigma light emitting polar device communication, so it can be too smokey day: ..., this Mao Ming has been disclosed above in a preferred embodiment, but it is not It is used to limit \ 'Any person skilled in this art shall be defined within the scope of the patent application attached to the invention without departing from the spirit and scope of the present invention. [Schematic description]
f1圖係繪示-習知發光二極體裝置的剖面結構示意圖。 第2圖為係繪示習知發光二極體裝置陣列的上視圖。 第3圖係緣示-習知具散熱結構之發光二極體裝置的剖面 結構示意圖。FIG. f1 is a schematic cross-sectional structure diagram of a conventional light-emitting diode device. FIG. 2 is a top view of a conventional light emitting diode device array. Fig. 3 is a schematic diagram showing a cross-sectional structure of a conventional light emitting diode device having a heat dissipation structure.
"弟4a圖至帛41圖係綠示符合本發明較佳實施例所述之發 光二極體裝置的剖面結構示意圖。 X 第5a~5h圖係!會示本發明所述之發光二極體裝置其散熱 柱與基板之相對關係示意圖。 第6a至圖係繪示符合本發明所述之具有幾何型狀之散 φ 熱本體之立體剖面圖。 第Μ至7y圖係繪示對應第6己至Sy圖所述之具有幾何型 狀之散熱本體的剖面圖。 第8圖係繪示本發明實施例丄所述之陣列式發光二極體裝 置之立體組裝圖。 、 第9 a圖及第9b圖係繪示本發明實施例丄所述將該發光二 極體晶粒固合於該散熱柱上之承載面的步驟。 弟1 0圖係繪示本發明實施例2所述之陣列式發光二極體 裝置之立體組裝圖。 趾 第1 la圖係顯示本發明之一較佳實施例所述之發光二極體 19 200534518 散熱系統的方塊圖。 第1 lb圖係顯示本發明之— — 散熱系統的立體圖。 土貝施例所述之發光二極體 弟12圖係繪示本發明之 方塊圖。 弟13圖係繪示本發明之一 意圖。 一較佳實施例所述之顯示裝置的 較佳實施例所述之顯示裝置的示" Figures 4a to 41 are green schematic diagrams showing the cross-sectional structure of a light emitting diode device according to the preferred embodiment of the present invention. X Figures 5a to 5h are schematic diagrams showing the relative relationship between the heat dissipation column and the substrate of the light emitting diode device according to the present invention. Figures 6a to 6 are three-dimensional cross-sectional views of a scattered φ thermal body having a geometric shape according to the present invention. Figures M to 7y are cross-sectional views of the heat-dissipating body having the geometric shape described in Figures 6 to Sy. FIG. 8 is a three-dimensional assembly diagram of the array type light emitting diode device according to the embodiment (2) of the present invention. Figures 9a and 9b show the steps of fixing the light-emitting diode crystal grains to the bearing surface of the heat-dissipating pillar according to the embodiment (1) of the present invention. Figure 10 is a three-dimensional assembly diagram of the array type light emitting diode device described in Embodiment 2 of the present invention. Figure 1a shows a block diagram of a light emitting diode according to a preferred embodiment of the present invention. Figure 1 lb is a perspective view showing the heat dissipation system of the present invention. The figure 12 of the light-emitting diode described in the Tube example is a block diagram of the present invention. Figure 13 illustrates one of the intentions of the present invention. A display device according to a preferred embodiment
第14圖係緣示本發明之 體示意®。 賴奴車n统的立 第15~18圖係身示符合本發明較佳實施例所述之發光二極 體裝置的剖面結構示意圖。 第I9及2G圖騎示符合本發明較佳f施例所述之發光二極 體散熱系統的方塊圖。 【主要元件符號說明】 習知技術 毛光一極體〜1 0 ,發光二極體晶片〜11 ;導線〜12 ;封裝材 料~13，導線架〜丄4 ;接腳〜ls ;發光二極體裝置陣列〜5〇； 基材~6〇，發光二極體〜1〇〇 ;金屬底座〜11〇 ;散熱器 ~130 ° 本發明之拮術 發光二極體裝置~2〇〇 ;發光二極體晶粒~210 ;散熱柱 〜22 0 ;承載部〜222 ;延伸部〜224 ;承載面〜227 ;反射層 〜228 ;基板〜230 ;第一表面〜231 ;第二表面~233 ;貫孔 〜234 ;圖案化電路〜236 ;導線~237 ;散熱本體〜240 ;散 熱本體之本體壁〜241 ;透鏡〜250 ;空腔〜26〇 ;冷卻液 20 200534518 〜，P早歹丨】式|务光 ,1〇 . —二肌π此〜…，分取等熱座或導埶柱 〜310，承載面〜312 ;溝槽〜313 ;黏著劑〜314 …、柱 晶粒〜320 ;印刷電路板〜33〇;貫孔〜332 ; :—極體 〜334 ;印刷電路板底部〜336 ;散熱本 .弘，，部 發光二極體散熱系統肩；循環管路~41’。=， 供給裝置〜42〇 ;冷卻液〜43〇 ;照明裝置〜5〇〇 ; 7部次 控制單元~52〇 ;廣角燈罩~530 ;透鏡部~54〇 ; =10‘Figure 14 shows the schematic diagram of the present invention. Figures 15 to 18 of the Lai Nuche system are schematic cross-sectional structure diagrams of a light-emitting diode device according to the preferred embodiment of the present invention. Figures I9 and 2G show block diagrams of a light emitting diode heat dissipation system according to the preferred embodiment f of the present invention. [Description of main component symbols] Conventional technology Maoguang monopole ~ 10, light emitting diode chip ~ 11; lead wire ~ 12; packaging material ~ 13, lead frame ~ 丄 4; pin ~ ls; light emitting diode device Array ~ 50; Substrate ~ 60, Light-emitting diode ~ 100; Metal base ~ 110; Radiator ~ 130 ° The light-emitting diode device of the present invention ~ 200; Light-emitting diode Grain ~ 210; heat dissipation column ~ 22 0; load-bearing portion ~ 222; extension ~ 224; load-bearing surface ~ 227; reflective layer ~ 228; substrate ~ 230; first surface ~ 231; second surface ~ 233; through hole ~ 234; patterned circuit ~ 236; lead wire ~ 237; heat sink body ~ 240; body wall of heat sink body ~ 241; lens ~ 250; cavity ~ 26〇; coolant 20 200534518 ~, P early 歹 丨] type | Wuguang , 1〇. — Two muscles π this ~ ..., divided into isothermal seat or guide column ~ 310, bearing surface ~ 312; groove ~ 313; adhesive ~ 314 ..., pillar grain ~ 320; printed circuit board ~ 33〇; Through hole ~ 332;:-Polar body ~ 334; Printed circuit board bottom ~ 336; Heat dissipation. Hong, the shoulder of the partial light emitting diode heat dissipation system; Circulation pipeline ~ 41 '. =, Supply device ~ 42 °; cooling fluid ~ 43 °; lighting device ~ 500; 7 control units ~ 52 °; wide-angle lampshade ~ 530; lens section ~ 54 °; = 10 ’
~S〇〇;網片式車用散熱水箱410;發光二極體裝置二=^ 散熱本體〜7〇1 ;承載座7〇2 ;空腔7〇3 ;發光二極體B曰立 704 ;冷卻液705 ;電路板〜7〇6 ;導線~7〇7 ;卡合部〜^曰8’. 貫孔~71G ;冷卻水槽~72。；《管路~73。；加觀或無外 動力之自循環㈣~74〇 ;發光二極體散熱n8QQ、则。~ S〇〇; mesh-type vehicle cooling water tank 410; light-emitting diode device II = ^ heat-dissipating body ~ 701; carrier 702; cavity 703; light-emitting diode B stands 704; Coolant 705; circuit board ~ 7〇6; lead ~ 7〇7; engagement part ~ ^ 曰 8 '. Through hole ~ 71G; cooling water tank ~ 72. ; "Pipeline ~ 73. ; Add the concept of self-circulation with or without external power 74 ~ 74〇; light-emitting diode heat dissipation n8QQ, then.
21twenty one