WO2005094280A3 - High-strength backing plates, target assemblies, and methods of forming high-strength backing plates and target assemblies - Google Patents

High-strength backing plates, target assemblies, and methods of forming high-strength backing plates and target assemblies Download PDF

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Publication number
WO2005094280A3
WO2005094280A3 PCT/US2005/010111 US2005010111W WO2005094280A3 WO 2005094280 A3 WO2005094280 A3 WO 2005094280A3 US 2005010111 W US2005010111 W US 2005010111W WO 2005094280 A3 WO2005094280 A3 WO 2005094280A3
Authority
WO
WIPO (PCT)
Prior art keywords
backing plates
microns
less
target assemblies
ksi
Prior art date
Application number
PCT/US2005/010111
Other languages
French (fr)
Other versions
WO2005094280A2 (en
Inventor
Stephane Ferrasse
Frank Alford
Original Assignee
Honeywell Int Inc
Stephane Ferrasse
Frank Alford
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Stephane Ferrasse, Frank Alford filed Critical Honeywell Int Inc
Publication of WO2005094280A2 publication Critical patent/WO2005094280A2/en
Publication of WO2005094280A3 publication Critical patent/WO2005094280A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/129—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding specially adapted for particular articles or workpieces
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets

Abstract

The invention includes backing plates having grain sizes of less than 10 microns and yield strengths of at least 30 ksi. The invention includes methods of producing backing plates by hot-forging, severe plastic deformation utilizing equal channel angular extrusion, and post-deformation processing utilizing at least one of rolling and forging. The backing plates have grain sizes of less than 10 microns and yield strengths of at least 30 ksi. The invention includes a target assembly including a target having a grain size of less than about 10 microns joined to a backing plate having a grain size of less than about 10 microns with a bond strength of at least 10 ksi. The invention includes methods of forming a target assembly by joining a target and a backing plate having an average grain size of less than about 10 microns and a yield strength of at least 30 ksi.
PCT/US2005/010111 2004-03-31 2005-03-24 High-strength backing plates, target assemblies, and methods of forming high-strength backing plates and target assemblies WO2005094280A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55891404P 2004-03-31 2004-03-31
US60/558,914 2004-03-31

Publications (2)

Publication Number Publication Date
WO2005094280A2 WO2005094280A2 (en) 2005-10-13
WO2005094280A3 true WO2005094280A3 (en) 2006-12-28

Family

ID=35064260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/010111 WO2005094280A2 (en) 2004-03-31 2005-03-24 High-strength backing plates, target assemblies, and methods of forming high-strength backing plates and target assemblies

Country Status (2)

Country Link
TW (1) TW200540956A (en)
WO (1) WO2005094280A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106493170A (en) * 2016-09-19 2017-03-15 哈尔滨工程大学 The method of the Mg Li/Al materials manufactured by accumulation ply rolling
JP7411741B2 (en) 2016-09-30 2024-01-11 ハネウェル・インターナショナル・インコーポレーテッド High strength aluminum alloy backing plate and manufacturing method

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5297378B2 (en) 2006-09-12 2013-09-25 トーソー エスエムディー，インク． Sputtering target assembly and method of manufacturing the same
GB2466458B (en) * 2008-12-19 2011-02-16 Siemens Vai Metals Tech Ltd Rolling mill temperature control
CN102303194A (en) * 2011-08-19 2012-01-04 山东塔高矿业机械装备制造有限公司 Postwelding unannealed process for high-strength plate
CN102534518B (en) * 2011-12-29 2013-10-02 宁波江丰电子材料有限公司 Backboard fabricating method
CN108076645A (en) * 2015-07-17 2018-05-25 霍尼韦尔国际公司 The heat treatment method of metal and metal alloy articles
KR102622052B1 (en) 2015-08-03 2024-01-08 허니웰 인터내셔널 인코포레이티드 Frictionless forged aluminum alloy sputtering target with improved properties
CN106399954A (en) * 2016-08-30 2017-02-15 有研亿金新材料有限公司 Processing method of long-service-life copper manganese alloy target material
US10851447B2 (en) 2016-12-02 2020-12-01 Honeywell International Inc. ECAE materials for high strength aluminum alloys
US11649535B2 (en) 2018-10-25 2023-05-16 Honeywell International Inc. ECAE processing for high strength and high hardness aluminum alloys
CN112391563B (en) * 2019-08-19 2021-11-09 南京理工大学 Preparation method of layered nano heterogeneous aluminum magnesium alloy block material
CN112538598B (en) * 2020-12-02 2021-12-24 爱发科电子材料（苏州）有限公司 Manufacturing method of aluminum-silicon target material
CN112935521B (en) * 2021-03-02 2023-03-21 中国工程物理研究院材料研究所 Friction stir welding method for beryllium-aluminum alloy plate
CN113088840A (en) * 2021-03-29 2021-07-09 武汉大学 Preparation method of aluminum alloy
CN113789459B (en) * 2021-09-02 2022-07-12 宁波博威合金材料股份有限公司 Copper-nickel-tin alloy and preparation method and application thereof
CN115584451B (en) * 2022-09-26 2023-07-04 江苏大学 High-performance aluminum alloy material and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011691A1 (en) * 2002-07-16 2004-02-05 Honeywell International Inc. Copper sputtering targets and methods of forming copper sputtering targets

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004011691A1 (en) * 2002-07-16 2004-02-05 Honeywell International Inc. Copper sputtering targets and methods of forming copper sputtering targets

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106493170A (en) * 2016-09-19 2017-03-15 哈尔滨工程大学 The method of the Mg Li/Al materials manufactured by accumulation ply rolling
JP7411741B2 (en) 2016-09-30 2024-01-11 ハネウェル・インターナショナル・インコーポレーテッド High strength aluminum alloy backing plate and manufacturing method

Also Published As

Publication number Publication date
WO2005094280A2 (en) 2005-10-13
TW200540956A (en) 2005-12-16

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