WO2004076706A3 - A method of forming sputtering target assembly and assemblies made therefrom - Google Patents

A method of forming sputtering target assembly and assemblies made therefrom Download PDF

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Publication number
WO2004076706A3
WO2004076706A3 PCT/US2004/005538 US2004005538W WO2004076706A3 WO 2004076706 A3 WO2004076706 A3 WO 2004076706A3 US 2004005538 W US2004005538 W US 2004005538W WO 2004076706 A3 WO2004076706 A3 WO 2004076706A3
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering target
target
target assembly
made therefrom
assemblies
Prior art date
Application number
PCT/US2004/005538
Other languages
French (fr)
Other versions
WO2004076706A2 (en
Inventor
Robert B Ford
Christopher A Michaluk
Charles E Wickersham Jr
Original Assignee
Cabot Corp
Robert B Ford
Christopher A Michaluk
Charles E Wickersham Jr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp, Robert B Ford, Christopher A Michaluk, Charles E Wickersham Jr filed Critical Cabot Corp
Publication of WO2004076706A2 publication Critical patent/WO2004076706A2/en
Publication of WO2004076706A3 publication Critical patent/WO2004076706A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Abstract

A method of forming a sputtering target assembly is described that involves explosively bonding a target grade plate and a backing plate member to form a bonded preform having dimensions such that a large target or several target assemblies can be obtained. The method includes partitioning the bonded preform into a plurality of sputtering target assemblies. An interlayer can optionally be disposed between the target grade plate and the backing plate member before bonding. A bond quality test sample can be produced by the method. The sputtering target assemblies, the bonded preform, and the bond quality test sample are further described.
PCT/US2004/005538 2003-02-25 2004-02-24 A method of forming sputtering target assembly and assemblies made therefrom WO2004076706A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45019603P 2003-02-25 2003-02-25
US60/450,196 2003-02-25

Publications (2)

Publication Number Publication Date
WO2004076706A2 WO2004076706A2 (en) 2004-09-10
WO2004076706A3 true WO2004076706A3 (en) 2005-01-27

Family

ID=32927618

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/005538 WO2004076706A2 (en) 2003-02-25 2004-02-24 A method of forming sputtering target assembly and assemblies made therefrom

Country Status (3)

Country Link
US (1) US20040262157A1 (en)
TW (1) TW200506080A (en)
WO (1) WO2004076706A2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060033013A (en) * 2003-07-14 2006-04-18 토소우 에스엠디, 인크 Sputtering target assembly having low conductivity backing plate and method of making same
ATE474071T1 (en) * 2003-08-11 2010-07-15 Honeywell Int Inc TARGET/SUPPORT PLATE CONSTRUCTIONS AND MANUFACTURING METHODS THEREOF
US20050230244A1 (en) * 2004-03-31 2005-10-20 Hitachi Metals, Ltd Sputter target material and method of producing the same
US8795486B2 (en) * 2005-09-26 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. PVD target with end of service life detection capability
US7891536B2 (en) 2005-09-26 2011-02-22 Taiwan Semiconductor Manufacturing Co., Ltd. PVD target with end of service life detection capability
US20070068796A1 (en) * 2005-09-26 2007-03-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method of using a target having end of service life detection capability
KR20090051215A (en) 2006-09-12 2009-05-21 토소우 에스엠디, 인크 Sputtering target assembly and method of making same
US20080078268A1 (en) 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
RU2478732C1 (en) * 2011-09-13 2013-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Сибирский государственный индустриальный университет" Composite electrically blasted conductor for blast deposition of coatings or metal and alloy surface blast alloying
WO2013049274A2 (en) 2011-09-29 2013-04-04 H.C. Starck, Inc. Large-area sputtering targets and methods of manufacturing large-area sputtering targets
RU2518037C1 (en) * 2013-03-25 2014-06-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Сибирский государственный индустриальный университет" METHOD OF ELECTROEXPLOSIVE SPUTTERING OF COMPOSITE WEAR-RESISTANT COATINGS OF SYSTEM TiC-Mo ON FRICTION SURFACE
US20170287685A1 (en) * 2016-04-01 2017-10-05 Honeywell International Inc. Sputtering target assembly having a graded interlayer and methods of making
KR102503996B1 (en) 2018-03-05 2023-03-02 글로벌 어드밴스드 메탈스 유에스에이, 아이엔씨. Spherical tantalum powder, products containing the same, and methods for producing the same
EP3746239A2 (en) * 2018-03-05 2020-12-09 Global Advanced Metals USA, Inc. Powder metallurgy sputtering targets and methods of producing same
CN108273994B (en) * 2018-03-30 2024-04-19 江苏理成科技有限公司 Preparation device and method of high-density molybdenum-niobium alloy target
US20220310371A1 (en) * 2021-03-26 2022-09-29 Sumitomo Chemical Company, Limited Sputtering target, method of bonding target material and backing plate, and method of manufacturing sputtering target

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166964A (en) * 1985-01-18 1986-07-28 Tokuda Seisakusho Ltd Target for sputtering
JPH04143268A (en) * 1990-10-04 1992-05-18 Fujitsu Ltd Production of target
JPH0681143A (en) * 1992-08-31 1994-03-22 Mitsubishi Kasei Corp Sputtering target and its production
US5372694A (en) * 1992-12-14 1994-12-13 Leybold Aktiengesellschaft Target for cathode sputtering
DE19535845A1 (en) * 1995-09-15 1997-03-20 Interpane Entw & Beratungsges Transition mode reactive d.c. sputtering process
DE19546900C1 (en) * 1995-12-15 1997-04-24 Clearo Coating Glass Inh Adolf Tin@ cathode in magnetron sputtering apparatus
EP1067209A1 (en) * 1999-07-08 2001-01-10 Praxair S.T. Technology, Inc. Method of bonding a sputtering target to a backing plate
WO2002042513A2 (en) * 2000-11-27 2002-05-30 Cabot Corporation Hollow cathode target and methods of making same
WO2004031436A1 (en) * 2002-10-01 2004-04-15 Cabot Corporation Method of bonding sputtering target materials
US20040074770A1 (en) * 2002-07-02 2004-04-22 George Wityak Rotary target
WO2004033748A2 (en) * 2002-10-04 2004-04-22 Cabot Corporation Method to recover spent components of a sputter target

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57145982A (en) * 1981-03-03 1982-09-09 Toshiba Corp Target for sputtering device
CA1180856A (en) * 1981-03-05 1985-01-15 Asahi Kasei Kogyo Kabushiki Kaisha Titanium clad steel plate
ES2038300T3 (en) * 1987-09-18 1993-07-16 Imperial Chemical Industries Plc JOINT UNION OF METAL COMPONENTS.
DE3865303D1 (en) * 1987-12-16 1991-11-07 Ici Plc METHOD FOR PRODUCING AN EXPLOSION-CONNECTED MULTIPLE-LAMINATED COMPOSITE METAL PLATE.
GB8816179D0 (en) * 1988-07-07 1988-09-07 British Aerospace Process for producing composite metallic structures
US5268236A (en) * 1988-11-25 1993-12-07 Vereinigte Aluminum-Werke Ag Composite aluminum plate for physical coating processes and methods for producing composite aluminum plate and target
SE463545B (en) * 1989-11-08 1990-12-10 Exploweld Ab PROCEDURE WILL EXPLOIT WELDING A PLATING MATERIAL TO A BASIC MATERIAL WITH A REFLECTED SHEET
US5009765A (en) * 1990-05-17 1991-04-23 Tosoh Smd, Inc. Sputter target design
US5050789A (en) * 1990-10-02 1991-09-24 The United States Of America As Represented By The United States National Aeronautics And Space Administration Apparatus and method for explosive bonding to edge of flyer plate
GB9026134D0 (en) * 1990-11-30 1991-01-16 British Aerospace Explosive bonding
GB9027802D0 (en) * 1990-12-21 1991-02-13 Ici Plc Method of explosively bonding composite metal structures
US5143590A (en) * 1991-07-10 1992-09-01 Johnson Matthey Inc. Method of manufacturing sputtering target assembly
US5190831A (en) * 1991-11-05 1993-03-02 Explosive Fabricators, Inc. Bonded titanium/steel components
US5226579A (en) * 1992-02-14 1993-07-13 E. I. Du Pont De Nemours And Company Process for explosively bonding metals
US5230459A (en) * 1992-03-18 1993-07-27 Tosoh Smd, Inc. Method of bonding a sputter target-backing plate assembly assemblies produced thereby
US5922176A (en) * 1992-06-12 1999-07-13 Donnelly Corporation Spark eliminating sputtering target and method for using and making same
US5342496A (en) * 1993-05-18 1994-08-30 Tosoh Smd, Inc. Method of welding sputtering target/backing plate assemblies
US5487822A (en) * 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5433835B1 (en) * 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US6033483A (en) * 1994-06-30 2000-03-07 Applied Materials, Inc. Electrically insulating sealing structure and its method of use in a high vacuum physical vapor deposition apparatus
US5522535A (en) * 1994-11-15 1996-06-04 Tosoh Smd, Inc. Methods and structural combinations providing for backing plate reuse in sputter target/backing plate assemblies
US5593082A (en) * 1994-11-15 1997-01-14 Tosoh Smd, Inc. Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby
US6073830A (en) * 1995-04-21 2000-06-13 Praxair S.T. Technology, Inc. Sputter target/backing plate assembly and method of making same
FR2759158B1 (en) * 1997-02-06 1999-02-26 Giat Ind Sa CORE GENERATOR LOAD COMPRISING MEANS OF LINKING THE COATING AND THE ENVELOPE
CA2206035C (en) * 1997-05-23 2006-05-16 Alexander Szecket High energy contoured hermetic seal
US5827414A (en) * 1997-07-25 1998-10-27 International Business Machines Corporation Single piece slotted ferromagnetic sputtering target and sputtering apparatus
CN1144240C (en) * 1998-03-27 2004-03-31 东芝株式会社 Magnet material and its making method, sintered magnet using the same thereof
US6348113B1 (en) * 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6283357B1 (en) * 1999-08-03 2001-09-04 Praxair S.T. Technology, Inc. Fabrication of clad hollow cathode magnetron sputter targets
US20010046610A1 (en) * 2000-02-03 2001-11-29 Barnes John J. Metallurgically bonded layered article having a curved surface
US20020162741A1 (en) * 2001-05-01 2002-11-07 Applied Materials, Inc. Multi-material target backing plate

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166964A (en) * 1985-01-18 1986-07-28 Tokuda Seisakusho Ltd Target for sputtering
JPH04143268A (en) * 1990-10-04 1992-05-18 Fujitsu Ltd Production of target
JPH0681143A (en) * 1992-08-31 1994-03-22 Mitsubishi Kasei Corp Sputtering target and its production
US5372694A (en) * 1992-12-14 1994-12-13 Leybold Aktiengesellschaft Target for cathode sputtering
DE19535845A1 (en) * 1995-09-15 1997-03-20 Interpane Entw & Beratungsges Transition mode reactive d.c. sputtering process
DE19546900C1 (en) * 1995-12-15 1997-04-24 Clearo Coating Glass Inh Adolf Tin@ cathode in magnetron sputtering apparatus
EP1067209A1 (en) * 1999-07-08 2001-01-10 Praxair S.T. Technology, Inc. Method of bonding a sputtering target to a backing plate
WO2002042513A2 (en) * 2000-11-27 2002-05-30 Cabot Corporation Hollow cathode target and methods of making same
US20030019746A1 (en) * 2000-11-27 2003-01-30 Ford Robert B. Hollow cathode target and methods of making same
US20040074770A1 (en) * 2002-07-02 2004-04-22 George Wityak Rotary target
WO2004031436A1 (en) * 2002-10-01 2004-04-15 Cabot Corporation Method of bonding sputtering target materials
US20040129560A1 (en) * 2002-10-01 2004-07-08 Wickersham Charles E. Method of bonding sputtering target materials
WO2004033748A2 (en) * 2002-10-04 2004-04-22 Cabot Corporation Method to recover spent components of a sputter target

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
"EXPLOSION WELDING", WELDING JOURNAL, AMERICAN WELDING SOCIETY. MIAMI, US, vol. 80, no. 5, May 2001 (2001-05-01), pages 50, XP001065972, ISSN: 0043-2296 *
BANKER J G ET AL: "EXPLOSION WELDING", ASM HANDBOOK. WELDING, BRAZING AND SOLDERING, XX, XX, vol. 6, 1993, pages 303 - 305, XP000564083 *
PATENT ABSTRACTS OF JAPAN vol. 0103, no. 73 (C - 391) 12 December 1986 (1986-12-12) *
PATENT ABSTRACTS OF JAPAN vol. 0164, no. 19 (C - 0981) 3 September 1992 (1992-09-03) *
PATENT ABSTRACTS OF JAPAN vol. 0183, no. 44 (C - 1218) 29 June 1994 (1994-06-29) *

Also Published As

Publication number Publication date
WO2004076706A2 (en) 2004-09-10
US20040262157A1 (en) 2004-12-30
TW200506080A (en) 2005-02-16

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