WO2005091916A3 - Flexible microcircuit space transformer assembly - Google Patents

Flexible microcircuit space transformer assembly Download PDF

Info

Publication number
WO2005091916A3
WO2005091916A3 PCT/US2005/006613 US2005006613W WO2005091916A3 WO 2005091916 A3 WO2005091916 A3 WO 2005091916A3 US 2005006613 W US2005006613 W US 2005006613W WO 2005091916 A3 WO2005091916 A3 WO 2005091916A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact pads
circuit board
printed circuit
space transformer
bottom plate
Prior art date
Application number
PCT/US2005/006613
Other languages
French (fr)
Other versions
WO2005091916B1 (en
WO2005091916A2 (en
Inventor
Dean C Mazza
Salvatore Sanzari
Jeff P Ritell
Francis T Mcquade
Original Assignee
Wentworth Lab Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wentworth Lab Inc filed Critical Wentworth Lab Inc
Priority to CN200580011732XA priority Critical patent/CN101166983B/en
Priority to EP05724207A priority patent/EP1751557B1/en
Priority to JP2007502855A priority patent/JP5203697B2/en
Publication of WO2005091916A2 publication Critical patent/WO2005091916A2/en
Priority to KR1020067020926A priority patent/KR101477477B1/en
Priority to HK07107148.9A priority patent/HK1099582A1/en
Publication of WO2005091916A3 publication Critical patent/WO2005091916A3/en
Publication of WO2005091916B1 publication Critical patent/WO2005091916B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A space transformer (50) for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit (54) with device under test contact pads (64) formed on a first side (58) and printed circuit board contact pads (66) formed on a second side (60). Electrically conductive circuit traces (62) extend between device under test contact pads (64) and printed circuit board contact pads (66). A shim plate (56) is fastened to a periphery of first side (58) of flexible multilayer circuit (54) and a bottom plate (52) is fastened to a periphery of second side (60) of flexible multilayer circuit (54). Bottom plate (52) has a plurality of internal apertures (72), which are aligned with printed circuit board contact pads (66) and separated by bottom plate stanchions (74), which are aligned with device under test contact pads (64). A plurality of interconnects (68) are bonded and electrically interconnected to printed circuit board contact pads (66) and extend through internal apertures (72).
PCT/US2005/006613 2004-03-10 2005-03-02 Flexible microcircuit space transformer assembly WO2005091916A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN200580011732XA CN101166983B (en) 2004-03-10 2005-03-02 Flexible microcircuit space transformer assembly
EP05724207A EP1751557B1 (en) 2004-03-10 2005-03-02 Flexible microcircuit space transformer assembly
JP2007502855A JP5203697B2 (en) 2004-03-10 2005-03-02 Flexible space transformer assembly for fine circuits
KR1020067020926A KR101477477B1 (en) 2004-03-10 2006-10-09 Flexible microcircuit space transformer assembly
HK07107148.9A HK1099582A1 (en) 2004-03-10 2007-07-04 Flexible microcircuit space transformer assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55199004P 2004-03-10 2004-03-10
US60/551,990 2004-03-10

Publications (3)

Publication Number Publication Date
WO2005091916A2 WO2005091916A2 (en) 2005-10-06
WO2005091916A3 true WO2005091916A3 (en) 2007-11-22
WO2005091916B1 WO2005091916B1 (en) 2008-01-10

Family

ID=35056680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/006613 WO2005091916A2 (en) 2004-03-10 2005-03-02 Flexible microcircuit space transformer assembly

Country Status (10)

Country Link
US (1) US7282934B2 (en)
EP (1) EP1751557B1 (en)
JP (3) JP5203697B2 (en)
KR (1) KR101477477B1 (en)
CN (1) CN101166983B (en)
CR (1) CR8672A (en)
HK (1) HK1099582A1 (en)
MY (1) MY138645A (en)
TW (1) TWI387979B (en)
WO (1) WO2005091916A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101010675B1 (en) * 2008-12-05 2011-01-24 윌테크놀러지(주) Space transformer and probe card having the same
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
TWI439698B (en) * 2011-09-30 2014-06-01 Hermes Testing Solutions Inc Probe card for circuit-testing and structure of probe substrate thereof
US9335355B2 (en) * 2013-03-06 2016-05-10 Apple Inc. Electronic device with liquid contact sensors
JP6255914B2 (en) * 2013-11-07 2018-01-10 日本電産リード株式会社 Inspection jig
US10156586B2 (en) * 2015-01-16 2018-12-18 Modus Test, Llc Force deflection and resistance testing system and method of use
US11385277B2 (en) 2019-08-05 2022-07-12 Modus Test, Llc Modular electronic testing system with flexible test PCB format
WO2022060964A1 (en) * 2020-09-16 2022-03-24 Google Llc Overlap joint flex circuit board interconnection

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US6274823B1 (en) * 1993-11-16 2001-08-14 Formfactor, Inc. Interconnection substrates with resilient contact structures on both sides
US20040124829A1 (en) * 2002-12-31 2004-07-01 Tim Swettlen Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US6924654B2 (en) * 2003-03-12 2005-08-02 Celerity Research, Inc. Structures for testing circuits and methods for fabricating the structures

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4056773A (en) * 1976-08-25 1977-11-01 Sullivan Donald F Printed circuit board open circuit tester
GB2156532B (en) * 1984-03-24 1988-07-20 Plessey Co Plc Apparatus for testing a printed circuit board
FR2608775B1 (en) * 1986-12-19 1988-12-30 Thomson Csf TEST INTERFACE FOR BARE PRINTED CIRCUITS
JPH0481668A (en) * 1990-07-25 1992-03-16 Taiyo Kogyo Kk Apparatus for inspecting printed board and pitch-converting board
JP2877011B2 (en) * 1994-12-20 1999-03-31 日本電気株式会社 Bare chip test carrier
JP3096234B2 (en) * 1995-10-30 2000-10-10 日東電工株式会社 Method of manufacturing probe structure
US6050829A (en) * 1996-08-28 2000-04-18 Formfactor, Inc. Making discrete power connections to a space transformer of a probe card assembly
JPH10213627A (en) * 1997-01-31 1998-08-11 Hitachi Ltd Chip carrier, and burn-in method and test method for semiconductor device using it
EP0902296A1 (en) * 1997-09-11 1999-03-17 Photo Print Electronic GmbH Adapter devices for testing printed circuit boards
JP3620982B2 (en) * 1998-12-07 2005-02-16 株式会社ルネサステクノロジ Manufacturing method of semiconductor inspection equipment
US6566898B2 (en) * 2000-03-06 2003-05-20 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
US6661244B2 (en) * 2000-03-06 2003-12-09 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
JP4607417B2 (en) * 2001-11-15 2011-01-05 株式会社フジクラ Double-sided contact connector

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5399982A (en) * 1989-11-13 1995-03-21 Mania Gmbh & Co. Printed circuit board testing device with foil adapter
US6274823B1 (en) * 1993-11-16 2001-08-14 Formfactor, Inc. Interconnection substrates with resilient contact structures on both sides
US6762612B2 (en) * 2001-06-20 2004-07-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
US20040124829A1 (en) * 2002-12-31 2004-07-01 Tim Swettlen Embedded voltage regulator and active transient control device in probe head for improved power delivery and method
US6924654B2 (en) * 2003-03-12 2005-08-02 Celerity Research, Inc. Structures for testing circuits and methods for fabricating the structures

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1751557A4 *

Also Published As

Publication number Publication date
KR20060132997A (en) 2006-12-22
EP1751557B1 (en) 2012-08-15
HK1099582A1 (en) 2007-08-17
JP2007529011A (en) 2007-10-18
US20050218429A1 (en) 2005-10-06
CN101166983B (en) 2013-08-14
US7282934B2 (en) 2007-10-16
EP1751557A4 (en) 2010-09-15
MY138645A (en) 2009-07-31
JP2016026298A (en) 2016-02-12
CR8672A (en) 2008-04-21
EP1751557A2 (en) 2007-02-14
JP2012150128A (en) 2012-08-09
CN101166983A (en) 2008-04-23
KR101477477B1 (en) 2014-12-30
JP5203697B2 (en) 2013-06-05
WO2005091916B1 (en) 2008-01-10
TW200534300A (en) 2005-10-16
TWI387979B (en) 2013-03-01
WO2005091916A2 (en) 2005-10-06

Similar Documents

Publication Publication Date Title
WO2005091916A3 (en) Flexible microcircuit space transformer assembly
US5812375A (en) Electronic assembly for selective heat sinking and two-sided component attachment
US7766667B2 (en) Separable electrical connectors using isotropic conductive elastomer interconnect medium
US9535091B2 (en) Probe head, probe card assembly using the same, and manufacturing method thereof
US20130342998A1 (en) Electronic Assembly with Detachable Components
US7074050B1 (en) Socket assembly with incorporated memory structure
WO2008012748A3 (en) Ultrasound transducer featuring a pitch independent interposer and method of making the same
US7549871B2 (en) Connector with dual compression polymer and flexible contact array
SK43298A3 (en) Multichip module
TW200609585A (en) Printed circuit board and display device using the same
KR20080018234A (en) Key sheet module
US7131847B2 (en) Test apparatus having intermediate connection board for package
US20060097370A1 (en) Stepped integrated circuit packaging and mounting
WO2007005516A3 (en) Connector-to-pad pcb translator for a tester and method of fabricatio
US20120285011A1 (en) Embedded components in interposer board for improving power gain (distribution) and power loss (dissipation) in interconnect configuration
CN112394204A (en) Probe head capable of being used for high-frequency and medium-low frequency signal test simultaneously
KR20050077730A (en) Modular integrated circuit chip carrier
KR200450813Y1 (en) Prove card using space transformer printed circuit board
KR100605343B1 (en) Contact film used for devices having ball grid array structure and device mounting structure
WO2006030352A3 (en) Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder
TW200719488A (en) Packaging structure of image-sensing chip
JP3594139B2 (en) Semiconductor tester equipment
TW200730847A (en) Plunger and chip-testing module applying the same
TW200704942A (en) Structure of printed circuit board tester
TH75785A (en) Flexible comma space transformer assembly

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WWE Wipo information: entry into national phase

Ref document number: 2005724207

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007502855

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

WWE Wipo information: entry into national phase

Ref document number: CR2006-008672

Country of ref document: CR

WWE Wipo information: entry into national phase

Ref document number: 1020067020926

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 200580011732.X

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020067020926

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2005724207

Country of ref document: EP