TW200719488A - Packaging structure of image-sensing chip - Google Patents
Packaging structure of image-sensing chipInfo
- Publication number
- TW200719488A TW200719488A TW094139710A TW94139710A TW200719488A TW 200719488 A TW200719488 A TW 200719488A TW 094139710 A TW094139710 A TW 094139710A TW 94139710 A TW94139710 A TW 94139710A TW 200719488 A TW200719488 A TW 200719488A
- Authority
- TW
- Taiwan
- Prior art keywords
- image
- sensing chip
- packaging structure
- connecting points
- sensing
- Prior art date
Links
Abstract
A packaging structure includes a base plate, an image-sensing chip and a flexible plate circuit (FPC). The image-sensing chip has an active surface, plurality of first connecting points and a sensing area on the active surface. The image-sensing chip is disposed on the base plate. The FPC has an opening and plurality of second connecting points. The number of second connecting points are electrically connected to the number of first connecting points via plurality of conductive elements. And the opening corresponds to the sensing area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94139710A TWI298952B (en) | 2005-11-11 | 2005-11-11 | Packaging structure of image-sensing chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94139710A TWI298952B (en) | 2005-11-11 | 2005-11-11 | Packaging structure of image-sensing chip |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719488A true TW200719488A (en) | 2007-05-16 |
TWI298952B TWI298952B (en) | 2008-07-11 |
Family
ID=45069545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94139710A TWI298952B (en) | 2005-11-11 | 2005-11-11 | Packaging structure of image-sensing chip |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI298952B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI558196B (en) * | 2012-08-16 | 2016-11-11 | 鴻海精密工業股份有限公司 | Image sensor module and camera module |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI500317B (en) * | 2011-07-15 | 2015-09-11 | Primax Electronics Ltd | Method for determining amount of planting ball of camera module |
TWI699005B (en) * | 2016-11-02 | 2020-07-11 | 原相科技股份有限公司 | Optical component packaging structure |
-
2005
- 2005-11-11 TW TW94139710A patent/TWI298952B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI558196B (en) * | 2012-08-16 | 2016-11-11 | 鴻海精密工業股份有限公司 | Image sensor module and camera module |
Also Published As
Publication number | Publication date |
---|---|
TWI298952B (en) | 2008-07-11 |
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