TW200719488A - Packaging structure of image-sensing chip - Google Patents

Packaging structure of image-sensing chip

Info

Publication number
TW200719488A
TW200719488A TW094139710A TW94139710A TW200719488A TW 200719488 A TW200719488 A TW 200719488A TW 094139710 A TW094139710 A TW 094139710A TW 94139710 A TW94139710 A TW 94139710A TW 200719488 A TW200719488 A TW 200719488A
Authority
TW
Taiwan
Prior art keywords
image
sensing chip
packaging structure
connecting points
sensing
Prior art date
Application number
TW094139710A
Other languages
Chinese (zh)
Other versions
TWI298952B (en
Inventor
Yi-Tsai Lu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94139710A priority Critical patent/TWI298952B/en
Publication of TW200719488A publication Critical patent/TW200719488A/en
Application granted granted Critical
Publication of TWI298952B publication Critical patent/TWI298952B/en

Links

Abstract

A packaging structure includes a base plate, an image-sensing chip and a flexible plate circuit (FPC). The image-sensing chip has an active surface, plurality of first connecting points and a sensing area on the active surface. The image-sensing chip is disposed on the base plate. The FPC has an opening and plurality of second connecting points. The number of second connecting points are electrically connected to the number of first connecting points via plurality of conductive elements. And the opening corresponds to the sensing area.
TW94139710A 2005-11-11 2005-11-11 Packaging structure of image-sensing chip TWI298952B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94139710A TWI298952B (en) 2005-11-11 2005-11-11 Packaging structure of image-sensing chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94139710A TWI298952B (en) 2005-11-11 2005-11-11 Packaging structure of image-sensing chip

Publications (2)

Publication Number Publication Date
TW200719488A true TW200719488A (en) 2007-05-16
TWI298952B TWI298952B (en) 2008-07-11

Family

ID=45069545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94139710A TWI298952B (en) 2005-11-11 2005-11-11 Packaging structure of image-sensing chip

Country Status (1)

Country Link
TW (1) TWI298952B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558196B (en) * 2012-08-16 2016-11-11 鴻海精密工業股份有限公司 Image sensor module and camera module

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI500317B (en) * 2011-07-15 2015-09-11 Primax Electronics Ltd Method for determining amount of planting ball of camera module
TWI699005B (en) * 2016-11-02 2020-07-11 原相科技股份有限公司 Optical component packaging structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558196B (en) * 2012-08-16 2016-11-11 鴻海精密工業股份有限公司 Image sensor module and camera module

Also Published As

Publication number Publication date
TWI298952B (en) 2008-07-11

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