WO2005087980A1 - 半導体装置、半導体装置の製造方法および配線基板の製造方法 - Google Patents

半導体装置、半導体装置の製造方法および配線基板の製造方法

Info

Publication number
WO2005087980A1
WO2005087980A1 PCT/JP2004/019583 JP2004019583W WO2005087980A1 WO 2005087980 A1 WO2005087980 A1 WO 2005087980A1 JP 2004019583 W JP2004019583 W JP 2004019583W WO 2005087980 A1 WO2005087980 A1 WO 2005087980A1
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
semiconductor device
same
wiring substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/019583
Other languages
English (en)
French (fr)
Other versions
WO2005087980A2 (ja
Inventor
Kenichi Yamamoto
Haruo Akahoshi
Ryosuke Kimoto
Takashi Miwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2006510878A priority Critical patent/JPWO2005087980A1/ja
Publication of WO2005087980A1 publication Critical patent/WO2005087980A1/ja
Publication of WO2005087980A2 publication Critical patent/WO2005087980A2/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

PCT/JP2004/019583 2004-03-15 2004-12-28 半導体装置、半導体装置の製造方法および配線基板の製造方法 Ceased WO2005087980A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006510878A JPWO2005087980A1 (ja) 2004-03-15 2004-12-28 半導体装置、半導体装置の製造方法および配線基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-071982 2004-03-15
JP2004071982 2004-03-15

Publications (2)

Publication Number Publication Date
WO2005087980A1 true WO2005087980A1 (ja) 2005-09-22
WO2005087980A2 WO2005087980A2 (ja) 2005-09-22

Family

ID=34976301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/019583 Ceased WO2005087980A2 (ja) 2004-03-15 2004-12-28 半導体装置、半導体装置の製造方法および配線基板の製造方法

Country Status (3)

Country Link
JP (1) JPWO2005087980A1 (ja)
TW (1) TW200534438A (ja)
WO (1) WO2005087980A2 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5083000B2 (ja) * 2008-04-07 2012-11-28 富士通株式会社 電子部品装置及び電子部品装置の製造方法
US8581225B2 (en) 2010-04-28 2013-11-12 Panasonic Corporation Variable resistance nonvolatile memory device and method of manufacturing the same
JP6025259B2 (ja) * 2013-03-29 2016-11-16 Ｊｘ金属株式会社 めっき物
CN110565058B (zh) * 2019-08-29 2021-07-27 江苏长电科技股份有限公司 一种bga产品的磁控溅射方法
US11842958B2 (en) * 2022-03-18 2023-12-12 Chun-Ming Lin Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure
US12087662B1 (en) 2023-06-12 2024-09-10 Chun-Ming Lin Semiconductor package structure having thermal management structure

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