WO2005086207A1 - Dispositif de transfert dans des centres de manipulation et/ou d'usinage - Google Patents

Dispositif de transfert dans des centres de manipulation et/ou d'usinage Download PDF

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Publication number
WO2005086207A1
WO2005086207A1 PCT/EP2005/002135 EP2005002135W WO2005086207A1 WO 2005086207 A1 WO2005086207 A1 WO 2005086207A1 EP 2005002135 W EP2005002135 W EP 2005002135W WO 2005086207 A1 WO2005086207 A1 WO 2005086207A1
Authority
WO
WIPO (PCT)
Prior art keywords
connection
transfer device
slide
transfer
atmosphere
Prior art date
Application number
PCT/EP2005/002135
Other languages
German (de)
English (en)
Inventor
Klaus HÜGLER
Original Assignee
Asys Automatic Systems Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE200410010599 external-priority patent/DE102004010599B4/de
Priority claimed from DE200420004487 external-priority patent/DE202004004487U1/de
Application filed by Asys Automatic Systems Gmbh & Co. Kg filed Critical Asys Automatic Systems Gmbh & Co. Kg
Publication of WO2005086207A1 publication Critical patent/WO2005086207A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Definitions

  • the invention relates to a transfer device in handling and / or processing centers for substrates, in particular handling and / or processing centers of clean room systems constructed in a cluster construction, according to the preamble of claim 1.
  • Transfer devices of the aforementioned type are known from DE 100 38 168 C2 and are formed in this known embodiment by two memory modules, each of which is arranged as a connecting link between a conveyor station and a storage carousel, substrates being delivered in the form of wafers via transport boxes to be docked to the conveyor station which, furthermore, pass through the handling and processing center set up using the transfer device via the memory modules, the memory carousel and other stations connected to it.
  • locks are assigned to the storage modules with regard to their inlet and outlet-side loading openings in order to achieve a corresponding partitioning, and also to avoid impairments of the clean room atmosphere required for the storage carousel as far as possible by corresponding pressure adjustment in the partitioned transfer chambers when the loading openings opening onto the storage carousel are released.
  • a transfer device between two clean rooms operating at different clean room levels is also known from DE 199 05 882 CI.
  • the clean rooms are assigned to successive storeys of a building in a space-saving manner and are connected via the transfer device.
  • the transfer device comprises a vertical conveyor running in a shaft.
  • the shaft is open to the lower clean room, which has a higher clean room level.
  • the vertical conveyor is to be loaded with containers to be moved between the clean rooms.
  • the loading in the area of the upper clean room takes place in a lock chamber, which is delimited within the shaft by a lower and an upper lock door.
  • the lock chamber is sent from the upper clean room, the upper lock door is opened.
  • the container to be moved becomes from the loaded lock chamber.
  • DE 43 32 657 C2 also relates to the delivery of flat substrates in hermetically sealed transport boxes and the transfer of the substrates from the transport boxes to subsequent stations.
  • the transport boxes consist of a box hood and a box floor and the box hood protruding from the edge above the box floor is lifted from the box floor via a frame below.
  • the height of the frame is adjustable in relation to the independently supported box floor and is part of an enclosure which is closed by the box hood fitted on the frame and which, with an associated wall part, forms a lock gate which is assigned to a loading opening to a downstream station.
  • the loading opening is opened with the height adjustment of the frame for lifting the box hood off the box floor, whereby the atmosphere in the station assigned via the loading opening can remain largely unaffected if the docked transport box is conditioned accordingly, as an atmosphere which is delimited by the housing in front of the loading opening Space is created.
  • the invention has for its object to improve a transfer device of the type mentioned in terms of space and energy requirements and costs.
  • the transfer chambers are combined to form a structural unit in which the transfer chambers assigned to a slide can be delimited from one another by separating floors of the slide and can be made to overlap with the desired loading openings by moving the slide.
  • the slide with two transfer chambers lying one above the other in the direction of adjustment of the slide, it being possible for these transfer chambers to be separated from one another by means of seals located in the region of the partition plates and acting between them and the slide housing, whereby the partitions form the axial boundaries for the transfer chambers which are spaced apart in the direction of displacement of the slide.
  • the dividing plates near the edge with axial seals, to which housing-side mating surfaces formed by flange-like projections projecting radially inward are assigned, so that a structure similar to a double-seat valve results, in the valve body of which shelves are integrated.
  • the support supports by support rings provided with cutouts, it being possible for the trays assigned to the transfer chambers to be loaded via the cutouts with a corresponding overlay to corresponding housing-side loading openings.
  • the transfer chambers in the area of the slide path are assigned loading openings on the housing side in such a way that, by adjusting the slide, each of the transfer chambers with one of the loading openings, and via this with a durcti a subsequent station, a predetermined connection atmosphere, here as designated first and second connection atmosphere to be connected.
  • a predetermined connection atmosphere here as designated first and second connection atmosphere to be connected.
  • the connection to the first or second connection atmosphere is preferably made for a transfer chamber, in each case separately in mutually offset slide positions.
  • a slide designed according to the invention can also be used to connect a transfer chamber to one or the other connection atmosphere with the same slide position.
  • the respective loading openings can each be shut off, in which case corresponding locks can be provided.
  • a functional and A particularly cost-effective solution is that in the case of the second supply opening assigned to the second connection atmosphere, and in the case of a second connection atmosphere lying at a higher vacuum level in relation to the first connection atmosphere, there is no need for a shut-off assigned to this second loading opening, for example by means of a lock ,
  • the arrangement of the slide in a closed housing proves to be expedient, which means that the slide in its respective end position at least in its relative to the respective direction of displacement rear end against the housing, the delimitation of an end space results.
  • a bypass connection proves to be expedient within the scope of the invention, which has a connection cross-section to the respective end space, the transfer chamber lying in the overlap with this connection cross-section being open to this connection cross-section.
  • connection cross sections respectively assigned to the end spaces to one another via a bypass connection, which form a cross connection fertilizer to the second connection atmosphere
  • the cross connection to the bypass connection is expediently designed such that only one of the connection cross sections is to be connected to the second connection atmosphere.
  • a simple linear adjustment can be used for the slide, which preferably has dead positions assigned to the end positions of the slide.
  • FIG. 5 shows a detail from the representation according to FIG. 2, wherein, in addition, and again highly schematic, a controlled connection to a connection atmosphere is shown,
  • FIG. 10 is a representation corresponding to FIG. 5 with a different configuration of the connection to the connection atmosphere, and 11 shows a further position image for the control element provided in the bypass connection in FIG. 10.
  • Fig. 1 to 4 show different working phases of a transfer device 1, as it is, to use in handling and processing centers for substrates, in particular in Cl ⁇ model construction constructed handling and / or machining centers of clean room systems, in which such a system cutout, in DE 100 38 168 C2 is illustrated, namely with a transfer device, which is formed by two separate and spatially separate memory modules with transfer chambers, which are located jointly in the connection of two adjacent stations.
  • FIGS. 1 to 4 A transfer device 1 lying in a corresponding manner between at least two stations to be connected is shown in FIGS. 1 to 4, specifically in an embodiment according to the invention, in which transfer chambers 2 and 3 are provided which form a component of a slide 4 combined into a structural unit, which is arranged axially displaceably in a housing 5, the transfer device 1 with its loading openings 7 to 9 being able to be assigned to different connection atmospheres 10 and 11: n.
  • connection atmospheres 10 and 11 are predetermined by the stations, not shown here, each connected to the feed openings 7, 8 and 9, with the feed openings 7 and 8 being the first feed openings of a first connection atmosphere 10 and the feed opening 9 being the second feed opening one, based on the exemplary embodiment are assigned to the second connection atmosphere 2. Furthermore, the illustrated exemplary embodiment according to the invention assumes that the second connection atmosphere 11 has higher clean room conditions. than the first connection atmosphere 10 is sufficient, the first connection atmosphere 10 thus corresponds, for example, analogously to the depictions in DE 100 38 168 C2, to the atmospheric conditions of a conveyor station, and the second connection atmosphere 11 corresponds to the atmospheric clean room conditions of a storage carousel, via which working under more stringent clean room conditions, docked workstations are to be loaded.
  • the degree of evacuation with respect to the second connection atmosphere 11 is higher than with respect to the first connection atmosphere 10, to which the first loading openings 7 and 8 are assigned, with each of these first loading openings 7 and 8 also being different, for example by connecting to different stations Atmospheric connection conditions can exist, but in each case, in relation to the second connection atmosphere 11, only lower clean room conditions than the second connection atmosphere 11 suffice.
  • the loading openings 7 to 9 are assigned to the housing 5 and, depending on the position of the slide 4, a first loading opening 7, 8 is connected to one of the transfer chambers 2, 3, while the second loading opening 9 alternately with one or the other U - Transfer chamber 2, 3 is connected.
  • the assignment of the loading openings 7 to 9 to the transfer chambers 2, 3 is dependent on the position of the slide 4 such that when the transfer chamber 2 is covered, the transfer chamber 3 is connected to the second loading opening 9 to the first loading opening 7 shown in the illustration, and that, after the slide 4 has been moved into its opposite end position, the transfer chamber 3 overlaps with the lower, first loading opening 8 in the illustration when the transfer chamber 2 is connected to the second loading opening 9.
  • the loading openings 7 and 8 opening out onto the first connection atmosphere 10 are referred to as first loading openings and the loading opening 9 opening out into the second connection atmosphere 11 is referred to as the second loading opening, based on the sliding movement of the slide 4, the second loading opening 9 between the first loading openings 7 and 8.
  • the transfer chambers 2, 3 are axially delimited by partitions 12 to 14 of the slide 4, which in turn radially adjoin the wall of the housing 5 and close to the edge with flange-like radially inwardly projecting projections of the housing corresponding arrangement to the flange-like projections 15, 16 form sealing limits.
  • the separating plates 12 to 14, and possibly also the flange-like projections 15, 16, can be assigned seals 17 in their mutually facing surfaces on the one hand or on both sides, as illustrated for the separating plates 12 to 14.
  • Each successive and a transfer chamber 2 or 3 axially delimiting partitions 12, 13 or 13, 14 are connected via support supports 18, 19, which can be formed by individual supports or by wall elements, for example in the form of support rings, wherein in the training as support rings, these are provided with the feed openings and corresponding to these cutouts, each designated 20 here.
  • the support supports 18, 19 are offset radially inwards in relation to the inner contour of the housing 5 or the circumference of the dividing plates 12 to 14 in coordination with the radial projections 15, 16.
  • the support supports 18, 19 are integrally connected to the middle partition 13, so that the partition 13 forms with the support supports 18, 19, so to speak, a support structure for the axially outer partitions 12, 14.
  • the partition 14 is connected to a lifting rod 21 of a linear actuating device 22. tied, via which the slide 4 is to be axially displaced within the housing 5, with a free end space 23 (FIGS. 1 and 2) or 24 (FIGS. 3 and 4) depending on the end position assumed in each case by the slide 4 ) arises. Terminal cross-sections 25, 26 are assigned to the end spaces 23 and 24, via which the connection of the respectively released end space 23 or 24 to the second connection atmosphere 11 is achieved, a control circuit in this regard being illustrated schematically in FIGS. 5 to 9.
  • connection cross sections 25 and 26 assigned to the end spaces 23 to 24 are connected to one another via a bypass connection 27, in which, to illustrate the principle, a control element 28 is arranged, which is arranged in a cross connection 29 between the second connection atmosphere 11 and the bypass connection 27, the second connection atmosphere being connected via the control element 28 to one of the connection cross-sections 25, 26 or both connection cross-sections 25, 26.
  • the control element 28 is shown for illustration as a rotary slide valve, and the corresponding switching positions of the rotary slide valve, which are shown in FIGS. 6 to 9, correspond in the sequence of the enumeration to the working phases of the transfer device 1 shown in FIGS. 1 to 4 the control element 28 and the connection cross-sections 25, 26 of the bypass connection 27 branches of the bypass connection 27, the end opening onto the connection cross-section 25 is designated 30 and the end opening onto the connection cross-section 26 is designated 31.
  • Corresponding designations are also used in FIGS. 6 to 9, which show that in the working phase according to FIG. 1, both end spaces 23, 24 are connected to the second connection atmosphere 11 (see FIG. 6), in the working phase shown in FIG. 2 but only the end space 23 with the second connection atmosphere 11 is connected.
  • FIG. 6 Corresponding designations are also used in FIGS. 6 to 9, which show that in the working phase according to FIG. 1, both end spaces 23, 24 are connected to the second connection atmosphere 11 (see FIG. 6), in the working phase shown in FIG. 2 but only the
  • a lock 32, 33 as a blocking means, of which the loading opening 7 and the loading opening 8 via the lock 32 and the lock 33 is taxable.
  • An actuator 34, 35 for example in the form of an actuating cylinder, is assigned to each of the locks 32 and 33.
  • the feed opening 9 opening onto the second connection atmosphere 11 can also be assigned a lock, but this is not shown in the exemplary embodiment.
  • the transfer chambers 2, 3 contain trays for substrates 36, for example in the form of wafers, and in the exemplary embodiment shown these are illustrated as trays by supporting surfaces 37 for two wafers one above the other.
  • the actuating device 22, which is only illustrated by way of example, forms a positive guide for the slide 4, which comprises an eccentric disk 39 which is arranged on an axis of rotation 38 and is provided with an annular groove 40 into which a guide pin associated with the lifting rod 21 and not shown here engages.
  • the lifting rod 21 is in turn supported by a column-guided guide slide 41 against the housing 5, so that a tilt-free guidance of the slide 4 relative to the housing 5 is ensured.
  • FIG. 1 to 4 illustrate various working phases, and in the working phase according to FIG. 1, the transfer chamber 2, which is remote from the actuating device 22 and in the exemplary embodiment is shown in its covering position corresponding to the upper end position of the slide 4 to the loading opening 7, both locks 32, 33 are closed.
  • Fig. 1 results from the changeover of the slide 4 from its lower position. The change is made as soon as the lower lock 33 is closed. was.
  • the end space 24 is blocked off from the second connection atmosphere 11 according to FIG. 7, the exemplary embodiment assuming that the second Connection atmosphere - sphere 11 has a higher degree of purity than the first connection atmosphere 10.
  • the lock 32 is closed and also the transfer chamber 2, which was previously open to the first connection atmosphere 10, via the bypass connection 27 according to FIG. 5 in a switch position of the control element 28 according to FIG 8 connected to the second connection atmosphere 11.
  • the slide 4 is then shifted from its upper end position according to FIGS. 1 and 2 into its lower end position according to FIGS.
  • the volume to be sucked off in connection with the changeover of the slide 4 between its end positions is limited to the volume of one transfer chamber despite the changeover of two transfer chambers, so that high switching speeds can be achieved and that for maintaining a high vacuum level with respect to the second connection atmosphere is low.
  • the forces to be intercepted by the actuating device 22 can be achieved by reducing the surfaces of the slide 4 that are acted upon, that is to say the surfaces of the separating floors 12 and 14 facing away from one another.
  • Such a reduction in area can in principle be achieved, for example, by annular spaces 42, 43 delimited by the bellows 44 and 45, onto which the connection cross sections 25, 26 open.
  • connection cross sections 49 , 50 includes.
  • connection cross-sections 49, 50 each lie radially within a sealing limit 51, 52 which, in the respective end position of the slide 4, delimits the associated end space 23 or 24 near the edge, as shown in FIG. 10 for the end position of the slide 4 shown in FIG minimal volume reduced end space 23 is shown.
  • connection cross-sections 49, 50 pass through the end walls 60 and 61 of the housing 5 and are each connected to one of the branches 53 and 54 of the bypass connection 46, in which the control element 55 is located in the connection of the branches 53, 54, which, as before 5, for the sake of simplicity, is symbolized by a rotary slide valve which, in the embodiment shown, has cross connections 56, 57 to the first connection atmosphere 10 and to the second connection atmosphere 2, and via which the first connection atmosphere 10 is occasionally connected via the cross connection 56 or the second connection atmosphere 11 via the cross connection 57 against the branches 53 and 54, as illustrated in FIGS. 10 and 11.
  • both end spaces 23, 24 are connected to the same connection atmosphere 56 and 57, the connection to the clean room or vacuum side - cross connection 57 - to the second connection atmosphere for connection Position of the slide 4 is switched, while the connection to the cross connection 56 - first connection atmosphere 10 - is switched in the respective end positions of the slide 4.
  • the sealing limits 51 and 52 are symbolically illustrated by sealing rings 58, 59, which are assigned over the end faces 47, 48 of the dividing plates 12, 14 and which, in the respective end position of the slide 4 against the end walls 60, 61, abut the connection cross sections 49 and 50, respectively.
  • pressure equalization is provided with respect to the end spaces 23, 24 and the need for evacuation is also minimized, so that high switching speeds can be achieved with low energy consumption.
  • bypass branches 53, 54 can also be supplied in each case via separate control elements; Furthermore, pumps can be provided instead of control elements, which are connected and controlled accordingly.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de transfert pour substrats, composé de plusieurs, en particulier de deux, chambres de transfert superposées en étage dans le corps d'un coulisseau, accessibles par des ouvertures de chargement côté bâti et mises en mouvement par le déplacement du coulisseau par rapport au bâti.
PCT/EP2005/002135 2004-03-02 2005-03-01 Dispositif de transfert dans des centres de manipulation et/ou d'usinage WO2005086207A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004010599.5 2004-03-02
DE200410010599 DE102004010599B4 (de) 2004-03-02 2004-03-02 Übergabeeinrichtung in Handhabungs- und/oder Bearbeitungszentren
DE202004004487.0 2004-03-19
DE200420004487 DE202004004487U1 (de) 2004-03-19 2004-03-19 Übergabeeinrichtung in Handhabungs- und/oder Bearbeitungszentren

Publications (1)

Publication Number Publication Date
WO2005086207A1 true WO2005086207A1 (fr) 2005-09-15

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0935279A2 (fr) * 1998-02-09 1999-08-11 Asm Japan K.K. Dispositif et méthode pour sas de chargement dans la fabrication de semiconducteur
US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
US6338626B1 (en) * 1997-09-10 2002-01-15 Tokyo Electron Limited Load-lock mechanism and processing apparatus
WO2002089185A2 (fr) * 2001-04-30 2002-11-07 Applied Materials, Inc. Sac de chargement a triple chambre

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
US6338626B1 (en) * 1997-09-10 2002-01-15 Tokyo Electron Limited Load-lock mechanism and processing apparatus
EP0935279A2 (fr) * 1998-02-09 1999-08-11 Asm Japan K.K. Dispositif et méthode pour sas de chargement dans la fabrication de semiconducteur
WO2002089185A2 (fr) * 2001-04-30 2002-11-07 Applied Materials, Inc. Sac de chargement a triple chambre

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