WO2005085309A2 - Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement - Google Patents
Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement Download PDFInfo
- Publication number
- WO2005085309A2 WO2005085309A2 PCT/DE2005/000392 DE2005000392W WO2005085309A2 WO 2005085309 A2 WO2005085309 A2 WO 2005085309A2 DE 2005000392 W DE2005000392 W DE 2005000392W WO 2005085309 A2 WO2005085309 A2 WO 2005085309A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser light
- narrow
- band
- photosensitive
- cured
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
Definitions
- the invention relates to a method for curing a photosensitive filling material and a curing device.
- UV light is generated with the aid of a UV lamp, in particular a mercury vapor lamp, or a UV-LED (light-emitting diode) and is brought to the location of the UV radiation via an optical fiber bundle.
- a UV lamp in particular a mercury vapor lamp, or a UV-LED (light-emitting diode)
- UV-LED light-emitting diode
- the object of the invention is to provide an improved method for curing a filler material to be hardened with the aid of UV light and an improved hardening device with which the possible uses of UV light irradiation for hardening photosensitive filler materials are expanded.
- the invention encompasses the idea of using narrow-band UN laser light for irradiating the photosensitive fill material to be hardened in order to harden the photosensitive fill material.
- the narrow-band UV laser light can be provided with a UV laser light source, namely a laser light source that generates UV light, or by using a laser light source that generates laser light outside the UV range and subsequent frequency conversion.
- Filling materials in the sense of the present application are adhesives, casting compounds and sealing materials.
- Narrow-band and coherent UV laser light is radiated onto the photosensitive filling material, so that different species, in particular molecules and / or compounds, can be spectrally selectively excited for curing in the photosensitive filling material.
- Remote curing is possible because the laser light can be transmitted over long distances without significant losses.
- the distance between the laser light source and the photosensitive filler material to be hardened can be up to several hundred meters in length, which enables hardening even in machine locations or danger zones that are difficult to access, for example for purposes of explosion protection.
- Expensive modules such as are provided in optical transfer systems, rotating parts or the like, can be saved.
- the previous lifespan of the UV curing lamps is 500-2000h, maximum 3000h with permanently falling power, which must be checked constantly externally. With the laser light source, 10,000 hours are possible with the same output power.
- An integrated, regulated system can be provided for internal energy monitoring and control. An internal performance measurement can be used as an average value to monitor long-term stability.
- Very long light guides for example light guides with a length of up to several hundred meters, can be used to bring the UV laser light to the photosensitive filling material.
- single-fiber optical fibers for example single-mode optical fibers, which have good flexibility and enable very good focusing of the UV laser light on the photosensitive filler material are used
- the optical fiber used has a cross section of a few ⁇ m to several mm, which supports particularly high flexibility. This enables the placement of the UV laser system far away from the direct place of use at non-critical points. In this way, a thermal see, mechanical and electrical decoupling achieved from the application.
- the use of such light guides also enables the UV laser light to be coupled in with the aid of standard coupling elements, for example also for coupling into vacuum systems and danger zones in which the photosensitive filler material to be cured is located.
- a further development of the invention makes it possible, for example, that the curing process only begins when a certain performance limit has been exceeded.
- the photosensitive filling material to be cured is cured in this way by means of preactivation, the preactivation likewise being able to be carried out using UV laser light or in some other way, for example by supplying thermal energy.
- the punctual curing of small filler volumes is made possible.
- Very high power surface densities can be achieved with a spectral width of the UV laser light of less than approximately 1 nm, for example 200 m W / mm 2 , which corresponds to 20 W / cm 2 .
- This enables selective curing with defined spot sizes with a diameter of a few ⁇ m to a few mm.
- This selective curing has the advantage that the adjacent filler materials are not subjected to any thermal, electrical or optical stress.
- narrow-band laser beams can be used for the radiation, which address different species in the photosensitive filler material to be hardened, for example a combination of narrow-band laser light with a wavelength of 355nm and 532nm.
- a 355nm / 10mW UV laser can be used as the laser light source, which is equipped with the necessary safety devices and a shutter.
- the beam emerges via collimation optics with a preliminary working distance of around 50mm and a beam diameter of around 1 to 2mm.
- the laser light with a wavelength of 532nm available in the laser system is only attenuated to the extent that laser class 2 is reached at the place of use and serves as a monitoring and device system, in particular for adjusting the irradiation device.
- Figure 1 is a schematic representation of a curing device.
- Fig. 2 is a schematic representation of a further curing device.
- Fig. 1 shows a schematic representation of a curing device.
- a diode-pumped 355 nm / 10 MW UV solid-state laser with a frequency conversion is used, which is equipped with the necessary safety devices and an electrical / electronic shutter.
- the beam emerges preferably via a fiber coupler 2 with a standard fiber connection socket, for example an SMA plug (“Stright Medium Adapter”).
- SMA plug Light Medium Adapter
- the additional laser light with a wavelength of 532 nm available in the laser system 1 in the exemplary embodiment is not completely attenuated, but rather serves as a monitoring and setup system, in particular for adjusting the curing device. This further improves safety, since the wavelength-combined laser beam can also be recognized without a fluorescent agent.
- FIG. 2 shows a schematic representation of a further curing device.
- the same reference numerals as in FIG. 1 are used for the same features in FIG. 2.
- a UV laser 1 is again provided. UV light generated by the UV laser 1 is coupled into a UV fiber 3 by means of a fiber coupler 2, which leads to a focusing optics 4. With the aid of a positioning device 6, the focusing optics 4 are displaced relative to the photosensitive filling material 5 to be hardened during irradiation, so that any surface patterns for hardening can be scanned in a targeted manner and with high accuracy.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112005001114T DE112005001114A5 (de) | 2004-03-05 | 2005-03-04 | Verfahren zum Aushärten eines photosensitiven Füllmaterials und Aushärtevorrichtung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004011391 | 2004-03-05 | ||
DE102004011391.2 | 2004-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005085309A2 true WO2005085309A2 (fr) | 2005-09-15 |
WO2005085309A3 WO2005085309A3 (fr) | 2005-11-24 |
Family
ID=34917088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/000392 WO2005085309A2 (fr) | 2004-03-05 | 2005-03-04 | Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE112005001114A5 (fr) |
WO (1) | WO2005085309A2 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5360873A (en) * | 1990-01-12 | 1994-11-01 | Asahi Denka Kogyo K.K. | Actinic radiation-reactive pressure-sensitive adhesive composition |
DE19603962A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Mehrleitungs-Verbinders |
WO2003058677A2 (fr) * | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Systeme de production de circuits de commutation electriques et integres |
-
2005
- 2005-03-04 DE DE112005001114T patent/DE112005001114A5/de not_active Withdrawn
- 2005-03-04 WO PCT/DE2005/000392 patent/WO2005085309A2/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5360873A (en) * | 1990-01-12 | 1994-11-01 | Asahi Denka Kogyo K.K. | Actinic radiation-reactive pressure-sensitive adhesive composition |
DE19603962A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Mehrleitungs-Verbinders |
WO2003058677A2 (fr) * | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Systeme de production de circuits de commutation electriques et integres |
Also Published As
Publication number | Publication date |
---|---|
WO2005085309A3 (fr) | 2005-11-24 |
DE112005001114A5 (de) | 2007-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2596901B1 (fr) | Dispositif de rayonnement optique pour une installation destinée à la fabrication de pièces à usiner tridimensionnelles par rayonnement de couches de pulvérisation d'une poudre de matière brute avec un rayonnement laser | |
DE68903923T2 (de) | Verfahren und vorrichtung zum schweissen innerhalb eines rohres, insbesondere eines dampfgenerators eines atomkraftwerkes, aus der entfernung. | |
EP0565843A1 (fr) | Dispositif pour focalisation et couplage du rayonnement d'un laser à semiconducteur dans des fibres optiques | |
DE102013102880B4 (de) | Laseranordnung | |
DE102017114002B4 (de) | Lichtleitfasereinheit mit Faserendkappe und Verfahren zur Herstellung einer Lichtleitfasereinheit | |
DE60104351T2 (de) | Laser-Photohärtungssystem | |
DE102013103422B4 (de) | Vorrichtung zur Erzeugung von Laserstrahlung mit einer linienförmigen Intensitätsverteilung | |
DE102007053414A1 (de) | Verfahren und Vorrichtung zur Zündung eines Kraftstoff-Luftgemisches in einem Brennraum einer Brennkraftmaschine | |
CN207198375U (zh) | 一种制备光纤布拉格光栅的装置 | |
DE102005035417A1 (de) | Entfernungsmessgerät und Verfahren zum Befestigen einer elektrooptischen Einheit an einer Leiterträgereinheit | |
WO2005085309A2 (fr) | Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement | |
DE102018125237A1 (de) | Ultrakurzpulslaser lichtleitkabel | |
WO2002031562A1 (fr) | Agencement et procede pour bloquer des composants en position dans des cartes de circuits | |
DE10033785C2 (de) | Vorrichtung zum Einkoppeln von Laserstrahlen in eine Lichtleitfaser | |
DE60023558T2 (de) | Uv-härten von beschichtungen auf einer optischen faser mit einem laser | |
DE102017118283A1 (de) | Beleuchtungsvorrichtung und beleuchtungssystem | |
DE112017005790T5 (de) | Laserbearbeitungsvorrichtung | |
DE102007045488A1 (de) | Seitengepumpter Laser | |
WO2000014582A2 (fr) | Embout pour fibres optiques | |
DE102019215689A1 (de) | Wellenfrontmanipulator für eine projektionsbelichtungsanlage sowie projektionsbelichtungsanlage und betriebs- und herstellverfahren hierzu | |
DE102008029776A1 (de) | Faserlaseranordnung | |
DE102013021301A1 (de) | Verfahren zur Montage einer optischen Faser und Faserlaseranordnung | |
DE19927167A1 (de) | Koppelelement zur Kopplung hochintensiver Lichtstrahlung und Verfahren zu dessen Herstellung sowie Anordnung aus Koppelelementen zur Kopplung hochintensiver Lichtstrahlung | |
DE19931944B4 (de) | Umlenkende Auskopplung in einer Leiterplatte eingebetteter Lichtleiter | |
DE102018102527A1 (de) | Vorrichtung zur Bestrahlung von Objekten |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1120050011143 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase | ||
REF | Corresponds to |
Ref document number: 112005001114 Country of ref document: DE Date of ref document: 20070524 Kind code of ref document: P |