WO2005075712A3 - Ecmp system - Google Patents
Ecmp system Download PDFInfo
- Publication number
- WO2005075712A3 WO2005075712A3 PCT/US2005/002433 US2005002433W WO2005075712A3 WO 2005075712 A3 WO2005075712 A3 WO 2005075712A3 US 2005002433 W US2005002433 W US 2005002433W WO 2005075712 A3 WO2005075712 A3 WO 2005075712A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ecmp
- correction
- drop
- electrode
- polishing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006551430A JP2007519830A (en) | 2004-02-02 | 2005-01-27 | ECMP system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/769,936 US20050167266A1 (en) | 2004-02-02 | 2004-02-02 | ECMP system |
US10/769,936 | 2004-02-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005075712A2 WO2005075712A2 (en) | 2005-08-18 |
WO2005075712A3 true WO2005075712A3 (en) | 2006-04-27 |
Family
ID=34808221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/002433 WO2005075712A2 (en) | 2004-02-02 | 2005-01-27 | Ecmp system |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050167266A1 (en) |
JP (1) | JP2007519830A (en) |
TW (1) | TW200604389A (en) |
WO (1) | WO2005075712A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE389739T1 (en) * | 2004-06-30 | 2008-04-15 | Siemens Ag | METHOD AND DEVICE FOR SURFACE TREATMENT OF A COMPONENT |
EP2775918B1 (en) * | 2011-11-07 | 2020-02-12 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods |
CN110528039B (en) * | 2019-07-31 | 2020-11-17 | 浙江大学 | Micro-nano structure local electrodeposition device based on weak ionic current detection monitoring |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838032A (en) * | 1972-02-01 | 1974-09-24 | Technion Res & Dev Foundation | Compensated polarograph |
US4123335A (en) * | 1976-02-03 | 1978-10-31 | Seyl Rogert G | Voltage measurement with spaced reference electrode |
US5980708A (en) * | 1997-02-12 | 1999-11-09 | Champagne; Gilles Y. | High sensitivity multiple waveform voltammetric instrument |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5256565A (en) * | 1989-05-08 | 1993-10-26 | The United States Of America As Represented By The United States Department Of Energy | Electrochemical planarization |
US5180968A (en) * | 1991-03-01 | 1993-01-19 | Research Foundation Of State University Of New York | Method and apparatus for compensation of double layer charging current in electrochemical cells |
US5217586A (en) * | 1992-01-09 | 1993-06-08 | International Business Machines Corporation | Electrochemical tool for uniform metal removal during electropolishing |
US5575706A (en) * | 1996-01-11 | 1996-11-19 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical/mechanical planarization (CMP) apparatus and polish method |
US6990422B2 (en) * | 1996-03-27 | 2006-01-24 | World Energy Labs (2), Inc. | Method of analyzing the time-varying electrical response of a stimulated target substance |
US5807165A (en) * | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
US5911619A (en) * | 1997-03-26 | 1999-06-15 | International Business Machines Corporation | Apparatus for electrochemical mechanical planarization |
WO1999026758A1 (en) * | 1997-11-25 | 1999-06-03 | John Hopkins University | Electrochemical-control of abrasive polishing and machining rates |
US6395152B1 (en) * | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
DE19900173C1 (en) * | 1999-01-05 | 2000-05-31 | Max Planck Gesellschaft | Process for electrochemically processing a workpiece comprises measuring the geometry of the intermediate space between both electrodes so that only the points of the zones to be processed lie within a specified maximum distance |
US6299741B1 (en) * | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
US6368190B1 (en) * | 2000-01-26 | 2002-04-09 | Agere Systems Guardian Corp. | Electrochemical mechanical planarization apparatus and method |
US7059948B2 (en) * | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US6537144B1 (en) * | 2000-02-17 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6375549B1 (en) * | 2000-03-17 | 2002-04-23 | Motorola, Inc. | Polishing head for wafer, and method for polishing |
US6478936B1 (en) * | 2000-05-11 | 2002-11-12 | Nutool Inc. | Anode assembly for plating and planarizing a conductive layer |
US6811680B2 (en) * | 2001-03-14 | 2004-11-02 | Applied Materials Inc. | Planarization of substrates using electrochemical mechanical polishing |
US6592742B2 (en) * | 2001-07-13 | 2003-07-15 | Applied Materials Inc. | Electrochemically assisted chemical polish |
US6951599B2 (en) * | 2002-01-22 | 2005-10-04 | Applied Materials, Inc. | Electropolishing of metallic interconnects |
-
2004
- 2004-02-02 US US10/769,936 patent/US20050167266A1/en not_active Abandoned
-
2005
- 2005-01-27 JP JP2006551430A patent/JP2007519830A/en active Pending
- 2005-01-27 WO PCT/US2005/002433 patent/WO2005075712A2/en active Application Filing
- 2005-02-02 TW TW094103216A patent/TW200604389A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838032A (en) * | 1972-02-01 | 1974-09-24 | Technion Res & Dev Foundation | Compensated polarograph |
US4123335A (en) * | 1976-02-03 | 1978-10-31 | Seyl Rogert G | Voltage measurement with spaced reference electrode |
US5980708A (en) * | 1997-02-12 | 1999-11-09 | Champagne; Gilles Y. | High sensitivity multiple waveform voltammetric instrument |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
Non-Patent Citations (3)
Title |
---|
C. YARNITZKY: "dynamic compensation of the 2over all2 and "uncompensated" cell resistance in a two- or three- electrode system-transient techniques", ANALYTICAL CHEMISTRY, vol. 47, no. 6, 1975, pages 880 - 884, XP002353418 * |
SVANTE ABERG: "a simple model for the measurement of charge transfer resistance of reactions with slow kinetics", JOURNAL OF ELECTROANALYTICAL CHEMISTY, vol. 439, 1997, pages 63 - 71, XP002353419 * |
SVANTE ABERG: "measurement of uncompensated resistance and double layer capacitance during the course of a dynamic measurement: correction for IR drop and charging currents in arbitrary voltammetric techniques", JOURNAL OF ELECTROANALYTICAL CHEMISTRY, vol. 419, 1996, pages 99 - 103, XP002353417 * |
Also Published As
Publication number | Publication date |
---|---|
WO2005075712A2 (en) | 2005-08-18 |
JP2007519830A (en) | 2007-07-19 |
TW200604389A (en) | 2006-02-01 |
US20050167266A1 (en) | 2005-08-04 |
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